JP2751534B2 - Positioning device for die bonder - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a die bonder positioning device, and more particularly, to a position shift of a heat sink when eutectic bonding a semiconductor chip to a heat sink mounted on a substrate. The present invention relates to a means for pressing and fixing this.

(Prior Art) A semiconductor chip bonded to a substrate generates heat due to its internal resistance when it is mounted on an electric device and is driven, and when the amount of heat generation becomes large, troubles such as abnormal oscillation and thermal destruction occur. As a countermeasure, it has been known to bond a heat sink such as copper or aluminum to a substrate without directly bonding the semiconductor chip to the substrate, and to perform eutectic bonding of the semiconductor chip on the heat sink. If a heat sink is interposed between the substrate and the semiconductor chip in this manner, the internal heat generated in the semiconductor chip is radiated to the substrate through the heat sink, thereby preventing the above-mentioned trouble such as abnormal oscillation. Can be.

By the way, when a semiconductor chip is subjected to eutectic bonding, it is known to scrub (finely reciprocate) the substrate so that good bonding can be achieved. However, when the substrate is scrubbed, the radiator plate is displaced and the position accuracy of the semiconductor chip is deviated, so conventionally, the semiconductor chip was not automatically bonded by the transfer head,
Means for the operator to manually bond the heat sink on the heat sink mounted on the substrate in advance, or manually bond the semiconductor chip on the heat sink in advance and then mount the heat sink on the substrate Had been implemented.

(Problems to be Solved by the Invention) However, all of the above-mentioned conventional means have a problem in that work efficiency and positional accuracy are not improved because the semiconductor chip is manually bonded to the heat sink.

Therefore, an object of the present invention is to provide a means for automatically bonding a semiconductor chip on a heat sink with good positional accuracy by using a transfer head.

(Means for Solving the Problems) For this purpose, the present invention provides a heat block, a substrate fixing means for pressing and fixing a substrate positioned on the heat block from above, and a heat radiator mounted on the substrate. A positioning device for a die bonder is constituted by fixing means of a heat radiating plate for pressing and fixing the plate from above. A fixing means for fixing the heat sink, a pressing jig exchanged according to the type of the board, a moving means for reciprocating the pressing jig between the heat sink and the side of the board, Lifting means for lifting and lowering the pressing jig so as to press the radiator plate.

(Operation) In the above configuration, the substrate is fixed on the heat block by the substrate fixing means, and the heat sink is bonded to the substrate by the transfer head. Next, after fixing the heat sink on the substrate with a pressing jig, a semiconductor chip is mounted on the heat sink by the transfer head, and the semiconductor chip is eutectic bonded to the heat sink while scrubbing the substrate. .

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a positioning device for a die bonder, FIG. 2 is a side view, and 1 is a substrate on which a semiconductor chip is eutectic-bonded. After being transported in the N1 direction and positioned on the heat block 2 and the bonding operation is completed,
It is transported to the next step. Reference numerals 3 and 4 are guide members for guiding the substrate 1 on the heat block 2. In FIG.
Reference numeral 5 denotes a transfer head for bonding a semiconductor chip 7 on a heat sink 6 which has been eutectic bonded in advance on the substrate 1.

Reference numeral 11 denotes a fixing member for the substrate 1 for pressing the four corners of the substrate 1 from above. The fixing member 11 is attached to an upper end of a vertical rod 12, and the rod 12 is urged downward by a spring member 13 so as to press and fix the substrate 1. Reference numeral 14 denotes a base plate provided below the heat block 2, and an arm 15 attached to a lower portion of the rod 12 extends on the base plate 14. Second
As shown in the figure, the base plate 14 is connected to a rod 17 of a cylinder 16, and when the rod 17 protrudes upward, the base plate 14 rises, and the arm 15 is pushed up by the base plate 14, and the fixing member The fixed state of the substrate 1 by 11 is released,
When the rod 17 is lowered, the fixing member 11 is lowered by the spring force of the spring material 13, and presses and fixes the substrate 1 from above. That is, each of the members 11 to 17 constitutes means for fixing the substrate 1.

A moving plate 21 is slidably disposed between the heat block 2 and the base plate 14. A rod 23 of a cylinder 22 is connected to a side wall of the moving plate 21. When the rod 23 projects and retracts, the moving plate 21 reciprocates in the lateral direction N2. A cylinder 24 is provided at the tip of the moving plate 21.
A pressing jig 30 is provided above the rod 25. 26 is a mounting plate on which the jig 30 is removably mounted, and 31 is a connecting screw. At both ends of the mounting plate 26, rods 27 are vertically provided, and the rods 27 are urged downward by spring members. Reference numeral 29 denotes a lifting guide for the rod 27. That is, each of the means 21 to 23 constitutes a moving means for reciprocating the jig 30 between the heat radiating plate 6 and the side of the substrate 1. Means.
The pressing jig 30 is detached and replaced in accordance with the arrangement and type of the heat radiating plate 6 bonded to the substrate 1.

The present apparatus has the above configuration, and the operation will be described next.

When the substrate 1 is transported onto the heat block 2 with the fixing member 11 in the upper position, the rod of the cylinder 16
17 falls. Then, the fixing member 11 descends and the four
Hold down the corners and fix. In this state, the heat sink 6 is eutectic bonded onto the substrate 1 by the transfer head (not shown).

Next, when the rod 23 of the cylinder 22 retreats, the moving plate 21
2 moves rightward in FIG. 2, and the jig 30 reaches above the heat sink 6. Next, when the rod 25 of the cylinder 24 is lowered, the jig 30 is lowered by the spring force of the spring material 28,
And fix it (see the chain line in FIG. 2). Next, the transfer head 5 having sucked the semiconductor chip 7 arrives at the heat radiating plate 6, and mounts the semiconductor chip 7 on the heat radiating plate 6. Next, the substrate 1 is scrubbed by a scrub means (not shown), so that the semiconductor chip 7 is eutectic bonded onto the heat sink 6. When bonding is completed in this way, the rod 25 of the cylinder 24 projects and the jig 30 rises,
The pressing state of the radiator plate 6 is released, the rod 23 of the cylinder 22 projects, and the jig 30 retreats to the side of the substrate 1,
When the rod 17 of the cylinder 16 is raised, the fixing member 11 is raised to release the fixed state of the substrate 1 and the substrate is carried out to the next step.

When the shape, dimensions, and arrangement of the heat radiating plate 6 are changed due to a change in the type of the substrate 1 or the like, the pressing jig 30 is removed from the mounting plate 26, and is replaced with a new pressing jig suitable for this.

(Effect of the Invention) As described above, the present invention provides a heat block, a substrate fixing means for pressing and fixing a substrate positioned on the heat block from above, and a heat sink mounted on the substrate. A radiator plate fixing means for pressing and fixing the radiator plate from above, wherein the radiator plate fixing means is replaced with a pressing jig which is exchanged according to the type of the substrate; and Moving means for reciprocating between the sides of the substrate,
Since the positioning device for the die bonder is constituted by the elevating means for elevating and lowering the pressing jig to press the heat sink, the substrate is scrubbed, and when the semiconductor chip is eutectic bonded on the heat sink, Since the heat radiating plate is pressed and fixed by the pressing jig, the heat radiating plate does not shift and the semiconductor chip can be automatically bonded with high accuracy.

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of a positioning device, and FIG. 2 is a side view. DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Heat block 6 ... Semiconductor chip 7 ... Heat sink 11-17 ... Fixing means of a board 21-23 ... Moving means 24-29 ... Elevating means 30 ... Jig for press

Claims (1)

(57) [Claims] 1. A heat block, means for fixing a substrate positioned on the heat block by pressing the substrate from above, and a heat radiator plate for pressing and fixing a heat radiator mounted on the substrate from above The fixing means of the heat sink is reciprocatingly moved between the heat sink and the side of the substrate with the pressing jig exchanged according to the type of the substrate. A positioning device for a die bonder, comprising: moving means for moving the pressing plate; and elevating means for raising and lowering the pressing jig to press the heat sink.