CN218331838U - Ceramic chip packaging test machinery crimping platform - Google Patents

Ceramic chip packaging test machinery crimping platform Download PDF

Info

Publication number
CN218331838U
CN218331838U CN202220919924.1U CN202220919924U CN218331838U CN 218331838 U CN218331838 U CN 218331838U CN 202220919924 U CN202220919924 U CN 202220919924U CN 218331838 U CN218331838 U CN 218331838U
Authority
CN
China
Prior art keywords
piece
base
platform
push down
connecting block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220919924.1U
Other languages
Chinese (zh)
Inventor
葛慧宗
杜瑜
邵洪春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nerida Precision Engineering Suzhou Co ltd
Original Assignee
Nerida Precision Engineering Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nerida Precision Engineering Suzhou Co ltd filed Critical Nerida Precision Engineering Suzhou Co ltd
Priority to CN202220919924.1U priority Critical patent/CN218331838U/en
Application granted granted Critical
Publication of CN218331838U publication Critical patent/CN218331838U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The utility model relates to a chip package tests the field, and discloses ceramic chip package test machinery crimping platform, the on-line screen storage device comprises a base, the top fixed mounting of base has water-cooling quick change platform, the top of water-cooling quick change platform is provided with the fine setting press, and the top of base is provided with the push down device that can finely tune the press and adjust, the push down end of push down device is provided with the connection rectangle piece, the below fixed mounting who connects the rectangle piece has the test pressure head, and the reinforcing fine setting press is finely tuned in the equipment improvement nature, equipment and the corresponding test pressure head of test chip, the base of equipment chip test, then place the chip on the base, adjust the fine setting press, then push down the push down device for the test pressure head pushes down, detects the chip, and this scheme is through the push down device that the fine setting press was adjusted to this reaches the fine setting of push down equipment height, makes it can reach the height of complete adaptation when the different chips of test crimping.

Description

Ceramic chip packaging test machinery crimping platform
Technical Field
The utility model relates to a chip package test field specifically is ceramic chip package test machinery crimping platform.
Background
Chips or microcircuits, microchips and chips/chips are a way of miniaturizing circuits (mainly including semiconductor devices and also including passive components) in electronics, and are often manufactured on the surface of a semiconductor wafer, and in order to detect and test ceramic chips after production is completed, the ceramic chips are subjected to mechanical crimping.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a ceramic chip encapsulation test machinery crimping platform has solved foretell problem.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: ceramic chip encapsulation test machinery crimping platform, the on-line screen storage device comprises a base, the top fixed mounting of base has water-cooling quick change platform, the top of water-cooling quick change platform is provided with the fine setting press, and the top of base is provided with the push down device that can finely tune the press and adjust, the push down end of push down device is provided with the connection rectangular block, the below fixed mounting of connecting the rectangular block has the test pressure head, and the equipment improves nature reinforcing fine setting press, equipment and the corresponding test pressure head of test chip, the base of equipment chip test, then place the chip on the base, adjust the fine setting press, then push down the push down device for the test pressure head pushes down, detects the chip.
Preferably, the fine setting press includes mount pad, top piece, lead screw and carousel, link together through two pole settings between mount pad and the top piece, threaded connection has the lead screw on the piece of top, the top and the carousel of lead screw link together, the lower extreme swing joint of lead screw has anterior connecting block, the back connecting block is installed at the back of anterior connecting block, and back connecting block and anterior connecting block wrap up two montants inside, and the carousel drives the lead screw rotatory, because the lead screw reciprocates the drive, drives anterior connecting block and back connecting block and reciprocates, because anterior connecting block and back connecting block wrap up the pole setting, therefore the pole setting can provide the direction to reciprocating of anterior connecting block and back connecting block.
Preferably, fixed mounting has two circular posts on the base, integrated into one piece has the arch on the back connecting block corresponds the position of circular post, set up the round hole of run-through on the protruding position that corresponds circular post, the round hole of run-through is in the same place with circular post cup joint.
Preferably, the push-down device is including installation piece, articulated piece, pulling rod and lower compression leg, installation piece fixed mounting is on anterior connecting block, and the installation piece is together articulated with articulated piece, and the free end of articulated piece is in the same place with the pulling rod is articulated, and the one end of pulling rod is in the same place with the top of lower compression leg is articulated, and the lower extreme of lower compression leg passes the installation piece and extends to the below of installation piece, through sliding up and down the pulling rod, and the pulling rod drives the lower compression leg and reciprocates to this drives the test pressure head of lower compression leg below and reciprocates.
Preferably, the top of connecting the rectangle piece corresponds and has seted up circular recess on the compression leg position down, interior groove has been seted up respectively on the both sides inner wall of circular recess, and the inside activity joint in inside groove has the slider, the inside of circular recess is pegged graft to the compression leg lower extreme down, the compression leg corresponds and has seted up the slot on the position of slider down, the slider is in the same place with the slot joint.
Preferably, the top of connecting the rectangular block is seted up and is kept the intercommunication groove that communicates with the inside groove, the slider corresponds integrated into one piece and has the slip handle on the intercommunication groove position, the inside fixed mounting in inside groove has the spring, the spring is in the same place with slider fixed connection, when the assembly connection rectangular block, slides the slip handle of both sides to one side of keeping away from, and the spring shrink this moment, the slider contracts to the inside in inside groove, then with circular recess and lower compression column joint together, loosens the slip handle this moment, the spring kick-backs, the slider is to the inside removal of circular recess, until with the slot joint together, accomplish fixedly.
(III) advantageous effects
Compared with the prior art, the utility model provides a ceramic chip encapsulation test machinery crimping platform possesses following beneficial effect:
1. this ceramic chip encapsulation test machinery crimping platform, equipment improvement nature reinforcing fine setting press, equipment and the corresponding test pressure head of test chip, the base of equipment chip test, then place the chip on the base, adjust the fine setting press, then push down the push down device, make the test pressure head push down, detect the chip, this scheme is through the push down device that the fine setting press was adjusted, reach the fine setting to pushing down equipment height with this, make it can be when the different chips of test crimping, reach the height of complete adaptation.
2. This ceramic chip encapsulates test machinery crimping platform, this scheme is through having set up detachable and connecting rectangular block and test pressure head for this scheme is when testing different chips, the different test pressure heads of change that can be timely, convenient and fast.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is a schematic cross-sectional view of the connection rectangular block of the present invention.
In the figure: 1. a base; 2. water-cooling quick-change platform; 3. a circular column; 4. a mounting base; 5. a top block; 6. a screw rod; 7. a turntable; 8. a back connecting block; 9. a protrusion; 10. a front connecting block; 11. mounting blocks; 12. a hinged block; 13. pulling a rod; 14. pressing the column; 15. connecting the rectangular blocks; 16. testing a pressure head; 17. an inner groove; 18. a slider; 19. a communicating groove; 20. a spring; 21. a slot; 22. the handle is slid.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a crimping platform of a ceramic chip packaging testing machine comprises a base 1, a water-cooling quick-change platform 2 is fixedly mounted at the top of the base 1, a fine-tuning press is arranged above the water-cooling quick-change platform 2, a pressing device capable of being adjusted by the fine-tuning press is arranged above the base 1, a connecting rectangular block 15 is arranged at the pressing end of the pressing device, a testing press head 16 is fixedly mounted below the connecting rectangular block 15, the fine-tuning press is enhanced in assembly improvement, the testing press head 16 corresponding to a testing chip is assembled, the base 1 for testing the chip is assembled, then the chip is placed on the base 1, the fine-tuning press is adjusted, and then the pressing device is pressed down, so that the testing press head 16 is pressed down to detect the chip.
Further, the fine setting press includes mount pad 4, top piece 5, lead screw 6 and carousel 7, link together through two pole settings between mount pad 4 and the top piece 5, threaded connection has lead screw 6 on the top piece 5, the top of lead screw 6 links together with carousel 7, the lower extreme swing joint of lead screw 6 has anterior connecting block 10, back connecting block 8 is installed at the back of anterior connecting block 10, back connecting block 8 and anterior connecting block 10 wrap up two montants in inside, rotary table 7, carousel 7 drives lead screw 6 rotatory, because lead screw 6 reciprocates the drive, it reciprocates to drive anterior connecting block 10 and back connecting block 8, because anterior connecting block 10 and back connecting block 8 wrap up the pole setting, therefore the pole setting can provide the direction to reciprocating of anterior connecting block 10 and back connecting block 8.
Further, fixed mounting has two circular posts 3 on the base 1, and integrated into one piece has arch 9 on the position that back connecting block 8 corresponds circular post 3, sets up the round hole of run-through on the position that arch 9 corresponds circular post 3, and the round hole of run-through cup joints together with circular post 3.
Further, the pushing-down device comprises an installation block 11, a hinged block 12, a pulling rod 13 and a pushing-down column 14, the installation block 11 is fixedly installed on the front connection block 10, the installation block 11 is hinged to the hinged block 12, the free end of the hinged block 12 is hinged to the pulling rod 13, one end of the pulling rod 13 is hinged to the top end of the pushing-down column 14, the lower end of the pushing-down column 14 penetrates through the installation block 11 and extends to the lower portion of the installation block 11, the pulling rod 13 slides up and down, the pulling rod 13 drives the pushing-down column 14 to move up and down, and therefore the testing pressure head 16 below the pushing-down column 14 is driven to move up and down.
Further, the top of connecting rectangular block 15 corresponds and has seted up circular recess on the compression leg 14 position down, has seted up inside groove 17 on the both sides inner wall of circular recess respectively, and the inside activity joint of inside groove 17 has slider 18, and the inside of circular recess is pegged graft to the compression leg 14 lower extreme down, has seted up slot 21 on the compression leg 14 position that corresponds slider 18 down, and slider 18 and slot 21 joint are in the same place.
Further, connect the top of rectangular block 15 and offer the intercommunication groove 19 that keeps the intercommunication with inside groove 17, slider 18 corresponds integrated into one piece and has slip handle 22 on the intercommunication groove 19 position, the inside fixed mounting of inside groove 17 has spring 20, spring 20 is in the same place with slider 18 fixed connection, in assembly connection rectangular block 15, slip handle 22 with both sides is slided one side dorsad, spring 20 contracts this moment, slider 18 retracts to the inside of inside groove 17, then peg graft circular recess and lower pressure post 14 together, loosen slip handle 22 this moment, spring 20 kick-backs, slider 18 is to the inside removal of circular recess, until being in the same place with slot 21 joint, accomplish fixedly.
The working principle is that the assembly improvement performance is enhanced, the testing pressure head 16 corresponding to the testing chip is assembled, the base 1 for testing the chip is assembled, then the chip is placed on the base 1, the fine tuning pressure machine is adjusted, and then the pressing device is pressed down, so that the testing pressure head 16 is pressed down to detect the chip.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. Ceramic chip encapsulates test machinery crimping platform, including base (1), its characterized in that: the top fixed mounting of base (1) has water-cooling quick change platform (2), the top of water-cooling quick change platform (2) is provided with the fine setting press, and the top of base (1) is provided with the push down device that can finely tune the press and adjust, the push down end of push down device is provided with connection rectangular block (15), the below fixed mounting of connection rectangular block (15) has test pressure head (16).
2. The ceramic chip package test mechanical crimp platform of claim 1, wherein: the fine setting press includes mount pad (4), top piece (5), lead screw (6) and carousel (7), link together through two pole settings between mount pad (4) and top piece (5), threaded connection has lead screw (6) on top piece (5), the top and carousel (7) of lead screw (6) link together, the lower extreme swing joint of lead screw (6) has anterior connecting block (10), back connecting block (8) are installed at the back of anterior connecting block (10), and two montant parcels are wrapped up in inside back connecting block (8) and anterior connecting block (10).
3. The ceramic chip package test mechanical crimp platform of claim 2, wherein: fixed mounting has two circular post (3) on base (1), integrated into one piece has arch (9) on the back connecting block (8) corresponds the position of circular post (3), set up the round hole of through-going type on the position of protruding (9) corresponding circular post (3), the round hole of through-going type cup joints together with circular post (3).
4. The ceramic chip package test mechanical crimp platform of claim 3, wherein: the device pushes down is including installation piece (11), articulated piece (12), pulling pole (13) and compression leg (14) down, installation piece (11) fixed mounting is on anterior connecting block (10), and installation piece (11) are together articulated with articulated piece (12), and the free end of articulated piece (12) is in the same place with pulling pole (13) are articulated, and the one end of pulling pole (13) is in the same place with the top of compression leg (14) is articulated, and the lower extreme of compression leg (14) passes installation piece (11) and extends to the below of installation piece (11).
5. The ceramic chip package testing machine crimping platform of claim 1, wherein: the top of connecting rectangle piece (15) corresponds down has seted up circular recess on compression leg (14) position, interior groove (17) have been seted up on the both sides inner wall of circular recess respectively, and the inside activity joint of interior groove (17) has slider (18), the inside of circular recess is pegged graft to compression leg (14) lower extreme down, slot (21) have been seted up on compression leg (14) corresponds the position of slider (18) down, slider (18) and slot (21) joint are in the same place.
6. The ceramic chip package test mechanical crimp platform of claim 5, wherein: connect the top of rectangle piece (15) and offer intercommunication groove (19) that keep the intercommunication with inside groove (17), slider (18) correspond on intercommunication groove (19) position integrated into one piece have slip handle (22), the inside fixed mounting in inside groove (17) has spring (20), spring (20) are in the same place with slider (18) fixed connection.
CN202220919924.1U 2022-04-19 2022-04-19 Ceramic chip packaging test machinery crimping platform Active CN218331838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220919924.1U CN218331838U (en) 2022-04-19 2022-04-19 Ceramic chip packaging test machinery crimping platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220919924.1U CN218331838U (en) 2022-04-19 2022-04-19 Ceramic chip packaging test machinery crimping platform

Publications (1)

Publication Number Publication Date
CN218331838U true CN218331838U (en) 2023-01-17

Family

ID=84831551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220919924.1U Active CN218331838U (en) 2022-04-19 2022-04-19 Ceramic chip packaging test machinery crimping platform

Country Status (1)

Country Link
CN (1) CN218331838U (en)

Similar Documents

Publication Publication Date Title
CN218331838U (en) Ceramic chip packaging test machinery crimping platform
KR20100001690A (en) Molding apparatus for manufacturing semi-conductor package
CN115980401A (en) Automatic testing device based on down-pressure SOP test seat
CN215815799U (en) Non-contact chip double-sided board flip structure
CN205703150U (en) A kind of BGA mounting system
US7768106B2 (en) Multi-chip stack structure and fabrication method thereof
CN209150059U (en) A kind of suitable Dual-In-Line type device bonding fixture
CN219066776U (en) Semiconductor packaging bonding wire device
CN213765809U (en) Be applied to protection device of automatic bender of high power lead frame
CN217516216U (en) Push-press type station for automatic tray placing machine
CN213519872U (en) Chip pin adjusting device for intelligent LED drive circuit design
CN211218254U (en) Chip processing surface stamping device
CN219457548U (en) Semiconductor package carrier
CN220710251U (en) Packaging limiting jig for electronic component production
CN115602583B (en) Wire bond ball grid array packaging production line for chip
CN214279955U (en) High-power MOS pipe packaging structure
CN216133860U (en) Pin frame's preforming frame and preforming frame integrated configuration
CN114675056B (en) Semi-automatic BGA encapsulation test socket
CN115332095B (en) QFN large substrate packaging mold and method
CN221208711U (en) High-pressure inner core dispensing equipment
CN215453416U (en) Integrated circuit packaging structure
KR100416568B1 (en) punching machine
KR200305640Y1 (en) Semiconductor Package Manufacturing Equipment
JP2751534B2 (en) Positioning device for die bonder
CN111106042A (en) Accurate positioning and transferring mechanism for pressing plate jig of large-pressure flip-chip bonding machine

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant