CN210640184U - Improved chip mounting machine capable of enhancing heat dissipation - Google Patents
Improved chip mounting machine capable of enhancing heat dissipation Download PDFInfo
- Publication number
- CN210640184U CN210640184U CN201921609778.7U CN201921609778U CN210640184U CN 210640184 U CN210640184 U CN 210640184U CN 201921609778 U CN201921609778 U CN 201921609778U CN 210640184 U CN210640184 U CN 210640184U
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- Prior art keywords
- heat dissipation
- frame
- mounting platform
- base
- linear guide
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Abstract
The utility model relates to a chip bonding machine field, concretely relates to can strengthen radiating improvement chip bonding machine, including base and soldered connection, the frame is established to the outside cover of base upper end, and the frame bottom can be dismantled with the base through the bolt and be connected, and the base upper end sets up linear guide slip table, and the frame both sides set up first heat dissipation fan, and the frame upper end sets up the pneumatic cylinder, and the actuating lever is connected to the pneumatic cylinder drive end, and the mounting panel is connected to the actuating lever lower extreme, and the soldered connection is installed in the mounting panel lower extreme, and the base upper end sets up mounting platform, and the mounting platform. The utility model discloses set up first heat dissipation fan in welded frame both sides and carry out preliminary heat dissipation, the heat transfer at edge when utilizing the fin that the platform face set up with the chip bonding to the platform inner chamber, cooperation second heat dissipation fan distributes the heat of inner chamber, can reach better radiating effect, prevents the welding edge's of chip melting to welded is firm.
Description
Technical Field
The utility model relates to a chip bonding machine field, concretely relates to can strengthen radiating improvement chip bonding machine.
Background
The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
For example, chinese patent application No. CN201320711406.1 discloses an automatic alignment mechanism for a die bonder, which includes: the alignment platform is provided with positions for placing the chip and the substrate; first, second and third driving units respectively connected to the aligning platform and driving the aligning platform to move along X, Y and Z axis; a fourth driving unit connected to the alignment stage and driving the alignment stage to rotate; the first, second, third and fourth driving units are respectively electrically connected with a control device, the movement of the control device is controlled by the control device, and the control device is also electrically connected with a camera mechanism used for observing the positions of the chip and the substrate on the chip loader.
However, when the existing die bonder is used, a die bonding module in the die bonder sucks the die on the wafer tray and bonds the die onto the lead frame, and the welding edge of the die is melted due to high temperature, so that the bonding is not firm enough.
To the problem that above-mentioned background provided, the utility model designs a can strengthen radiating improvement chip die bonder.
SUMMERY OF THE UTILITY MODEL
The utility model provides a to prior art not enough, the utility model provides a can strengthen radiating improvement chip die bonder, solve above-mentioned problem as far as possible.
The utility model discloses a following technical scheme realizes:
the utility model provides a can strengthen radiating improvement chip die bonder, includes base and soldered connection, the outside cover of base upper end is equipped with the frame, the frame bottom can be dismantled with the base through the bolt and be connected, the base upper end is provided with linear guide slip table, the frame both sides are provided with first heat dissipation fan, the frame upper end is provided with the pneumatic cylinder, the pneumatic cylinder drive end is connected with the actuating lever, the actuating lever lower extreme is connected with the mounting panel, the soldered connection is installed in the mounting panel lower extreme, the base upper end is provided with mounting platform, the mounting platform upper end is provided with the spout, the spout slides and is provided with.
Preferably, the linear guide sliding table is controlled through a control switch, a first sliding block slides on the linear guide sliding table, the upper end of the first sliding block is fixedly connected with the installation platform, the model of the linear guide sliding table is FLS80, and the model of the control switch is MFC-N1.
Preferably, the upper end of the mounting platform is provided with a radiating fin, and the outer side of the mounting platform is provided with a second radiating fan communicated with the inner cavity.
Preferably, the bottom of the fixed frame is fixedly connected with a second sliding block, the second sliding block is arranged in the sliding groove in a sliding mode, a threaded rod is connected to the upper end of the fixed frame in a longitudinal threaded mode, and a chip fixing plate is connected to the lower end of the threaded rod in a rotating mode.
Preferably, the spout internal rotation is provided with the pivot, the pivot outside is provided with two sets of screw threads opposite in direction, and two sets of screw threads opposite in direction respectively with the slider sliding connection of two sets of fixed frame bottoms, the mounting platform outside is provided with the motor, motor power take off end fixed connection pivot one end.
The utility model has the advantages that:
the utility model discloses pass through fixed frame with the chip and install on mounting platform, drive the removal through linear guide slip table and realize counterpoint the connection to chip mounting platform under control switch's drive, cooperation hydraulic pump drive soldered connection welds. When the welding, utilize the first heat dissipation fan of frame both sides to carry out preliminary supplementary heat dissipation, the fin that welded platform face set up carries out the degree of depth with the heat of inner chamber with heat transfer to the platform inner chamber through the second heat dissipation fan and gives off, plays better good radiating effect, prevents the melting of the welding edge of chip, guarantees welding effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the mounting platform structure of FIG. 1 according to the present invention;
fig. 3 is a schematic structural view of the fixing frame of fig. 2 according to the present invention.
In the figure: 1-base, 2-frame, 3-bolt, 4-linear guide rail sliding table, 401-control switch, 402-first sliding block, 5-first heat dissipation fan, 6-hydraulic cylinder, 7-driving rod, 8-mounting plate, 9-welding head, 10-mounting platform, 1001-heat dissipation sheet, 1002-second heat dissipation fan, 11-sliding groove, 12-fixed frame, 1201-second sliding block, 1202-threaded rod, 1203-chip fixed plate, 13-motor and 14-rotating shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1-3, an improved chip die bonder capable of enhancing heat dissipation includes a base 1 and a bonding head 9, a frame 2 is sleeved on an outer side of an upper end of the base 1, a bottom of the frame 2 is detachably connected with the base 1 through a bolt 3, a linear guide sliding table 4 is arranged at an upper end of the base 1, first heat dissipation fans 5 are arranged at two sides of the frame 2, a hydraulic cylinder 6 is arranged at an upper end of the frame 2, a driving rod 7 is connected to a driving end of the hydraulic cylinder 6, a mounting plate 8 is connected to a lower end of the driving rod 7, the bonding head 9 is mounted at a lower end of the mounting plate 8, a mounting platform 10 is arranged at an upper end of the base.
Specifically, the linear guide rail sliding table 4 is controlled by a control switch 401, a first sliding block 402 slides on the linear guide rail sliding table 4, the upper end of the first sliding block 402 is fixedly connected with the installation platform 10, the sliding block 402 is driven by the control switch 401 to slide on the linear guide rail sliding table 4, so that the position of the installation platform 10 is adjusted, the model of the linear guide rail sliding table 4 is FLS80, and the model of the control switch 401 is MFC-N1. The upper end of the mounting platform 10 is provided with a heat sink 1001, and the outer side of the mounting platform 10 is provided with a second heat dissipation fan 1002 communicated with the inner cavity. The bottom of the fixed frame 12 is fixedly connected with a second sliding block 1201, the second sliding block 1201 is arranged in the sliding groove 11 in a sliding mode, the upper end of the fixed frame 12 is longitudinally in threaded connection with a threaded rod 1202, and the lower end of the threaded rod 1202 is rotatably connected with a chip fixing plate 1203. A rotating shaft 14 is rotatably arranged in the sliding groove 11, two sets of threads in opposite directions are arranged on the outer side of the rotating shaft 14, the two sets of threads in opposite directions are respectively in sliding connection with the second sliding blocks 1201 at the bottoms of the two sets of fixed frames 12, a motor 13 is arranged on the outer side of the mounting platform 10, and the power output end of the motor 13 is fixedly connected with one end of the rotating shaft 14.
The working principle is as follows: the utility model discloses during the use, the staff will need the welded chip to place in the fin 1001 area of mounting platform 10 upper end, and starter motor 13 drives pivot 14 and rotates, and pivot 14 drives second slider 1201 under two sets of opposite direction's screw and realizes moving in opposite directions under the spacing slip of spout 11, and the chip fixing plate 1203 of putting to fixed frame 12 bottom docks in the edge of chip, rotates threaded rod 1202 and promotes chip fixing plate 1203 and descends and fix the chip. The first sliding block 402 is controlled by the control switch 401 to slide on the linear guide rail sliding table 4 to be in butt joint with the welding head 9, and then the hydraulic cylinder 6 is matched with the driving rod 7 to drive the welding head 9 at the lower end of the mounting plate 8 to descend for chip welding. Meanwhile, the temperature of the surface of the chip is preliminarily radiated when the first radiating fan 5 is opened for welding, the heat of the edge welding position of the chip is radiated to the inner cavity of the mounting platform 10 through the radiating fin 1001, and the heat of the inner cavity of the platform is radiated by the second radiating fan 1002, so that the chip welding edge is deeply radiated, the edge is prevented from being melted due to overheating, and the welding stability is ensured.
The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
In the description of the present invention, it is to be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Claims (5)
1. The utility model provides a can strengthen radiating improvement chip die bonder, includes base (1) and soldered connection (9), its characterized in that: the outside cover of base (1) upper end is equipped with frame (2), frame (2) bottom can be dismantled with base (1) through bolt (3) and is connected, base (1) upper end is provided with linear guide slip table (4), frame (2) both sides are provided with first heat dissipation fan (5), frame (2) upper end is provided with pneumatic cylinder (6), pneumatic cylinder (6) drive end is connected with actuating lever (7), actuating lever (7) lower extreme is connected with mounting panel (8), soldered connection (9) are installed in mounting panel (8) lower extreme, base (1) upper end is provided with mounting platform (10), mounting platform (10) upper end is provided with spout (11), spout (11) slip is provided with two sets of fixed frame (12).
2. An improved chip mounter with enhanced heat dissipation capability as recited in claim 1, wherein: linear guide slip table (4) are controlled through control switch (401), and slide on linear guide slip table (4) and have first slider (402), first slider (402) upper end fixed connection mounting platform (10), linear guide slip table (4) model are FLS80, control switch (401) model is MFC-N1.
3. An improved chip mounter with enhanced heat dissipation capability as recited in claim 1, wherein: the mounting platform is characterized in that a radiating fin (1001) is arranged at the upper end of the mounting platform (10), and a second radiating fan (1002) communicated with the inner cavity is arranged on the outer side of the mounting platform (10).
4. An improved chip mounter with enhanced heat dissipation capability as recited in claim 1, wherein: the bottom of the fixed frame (12) is fixedly connected with a second sliding block (1201), the second sliding block (1201) is arranged in the sliding groove (11) in a sliding mode, the upper end of the fixed frame (12) is longitudinally connected with a threaded rod (1202) in a threaded mode, and the lower end of the threaded rod (1202) is rotatably connected with a chip fixing plate (1203).
5. An improved chip mounter with enhanced heat dissipation capability as recited in claim 4, wherein: the improved structure is characterized in that a rotating shaft (14) is arranged in the sliding groove (11) in a rotating mode, two sets of threads in opposite directions are arranged on the outer side of the rotating shaft (14), the two sets of threads in opposite directions are respectively in sliding connection with a second sliding block (1201) at the bottom of two sets of fixed frames (12), a motor (13) is arranged on the outer side of the mounting platform (10), and the power output end of the motor (13) is fixedly connected with one end of the rotating shaft (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921609778.7U CN210640184U (en) | 2019-09-26 | 2019-09-26 | Improved chip mounting machine capable of enhancing heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921609778.7U CN210640184U (en) | 2019-09-26 | 2019-09-26 | Improved chip mounting machine capable of enhancing heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210640184U true CN210640184U (en) | 2020-05-29 |
Family
ID=70797202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921609778.7U Expired - Fee Related CN210640184U (en) | 2019-09-26 | 2019-09-26 | Improved chip mounting machine capable of enhancing heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210640184U (en) |
-
2019
- 2019-09-26 CN CN201921609778.7U patent/CN210640184U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200529 Termination date: 20210926 |
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| CF01 | Termination of patent right due to non-payment of annual fee |