JP2746443B2 - Resin-coated bonding wire - Google Patents
Resin-coated bonding wireInfo
- Publication number
- JP2746443B2 JP2746443B2 JP1334487A JP33448789A JP2746443B2 JP 2746443 B2 JP2746443 B2 JP 2746443B2 JP 1334487 A JP1334487 A JP 1334487A JP 33448789 A JP33448789 A JP 33448789A JP 2746443 B2 JP2746443 B2 JP 2746443B2
- Authority
- JP
- Japan
- Prior art keywords
- polycarboxylic acid
- bonding
- resin
- polyisocyanate
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半導体装置の結線に用いられる樹脂被覆ボン
ディングワイヤに関するもので、特に絶縁性樹脂被覆を
施したボンディングワイヤに関するものである。Description: TECHNICAL FIELD The present invention relates to a resin-coated bonding wire used for connecting a semiconductor device, and particularly to a bonding wire coated with an insulating resin.
（従来の技術） 半導体装置の製造過程で結線に用いられるボンディン
グワイヤとして導電性ワイヤ、例えば金，アルミ，銅の
ワイヤが使用されている。従来このようなワイヤは裸の
まま使用されていて、そのため半導体装置に接触した
り、ワイヤ同志が接触してショートを生じる事故がしば
しばある。特に近来、LSI等の開発に伴って多ピン化に
よりショートを生じることが増えてきている。2. Description of the Related Art A conductive wire, for example, a gold, aluminum, or copper wire is used as a bonding wire used for connection in a manufacturing process of a semiconductor device. Conventionally, such wires have been used in a bare state, and therefore, there is often an accident that a short circuit occurs due to contact with a semiconductor device or contact between wires. In particular, in recent years, the occurrence of short circuits due to the increase in the number of pins has been increasing with the development of LSIs and the like.
このようなショートを防止するために、近来導電性ワ
イヤ基材の周囲に絶縁材の被覆を設けたボンディングワ
イヤが種々提案されている。例えば、特開昭62−139217
号公報にはポリイミド系樹脂材料が提案されている。In order to prevent such a short circuit, various types of bonding wires in which an insulating material is provided around a conductive wire substrate have recently been proposed. For example, JP-A-62-139217
In this publication, a polyimide resin material is proposed.
半導体装置の製造過程におけるボンディングワイヤに
よる結線のワイヤの先端を溶融させて導線をボール状に
形成させボンディングを行ういわゆる周知のボールボン
ディング法や、ボンディング工具の加熱と超音波の加振
を併用するウェッジボンディング等種々の方法が知られ
ている。In a semiconductor device manufacturing process, a so-called well-known ball bonding method in which the tip of a wire connected by a bonding wire is melted to form a conductive wire into a ball shape and perform bonding, or a wedge that uses both heating of a bonding tool and ultrasonic vibration. Various methods such as bonding are known.
半導体装置の使用環境からボンディングワイヤの絶縁
被覆材には耐熱性が要求されることは勿論だが、結線時
にワイヤが溶融されボールをつくる時や、ウェッジボン
ディング時には絶縁被覆材は接触面が熱により容易に除
去されることが要求される。Due to the usage environment of the semiconductor device, the insulation coating material of the bonding wire is required to have heat resistance. Must be removed.
従来ボンディングワイヤの被覆材としてポリエチレ
ン，ポリエステル，ナイロン，ポリイミド，ポリアミド
イミド，ポリエステルイミド，エポキシ樹脂，ポリビニ
ルホルマール等多くの樹脂が知られているがいずれも満
足するものは見出されていない。Conventionally, many resins such as polyethylene, polyester, nylon, polyimide, polyamide imide, polyester imide, epoxy resin and polyvinyl formal have been known as coating materials for bonding wires, but none of them have been found to be satisfactory.
またポリウレタンは接着性や半田付性が良く耐摩耗性
もよいため、しばしばワイヤの被覆に使われるが、従来
のポリウレタンで被覆したボンディングワイヤではボン
ディング時にボール部に酸化物や炭化物が付着したり、
樹脂が熱収縮により盛上りボンディング治具であるキャ
ピラリーを詰めたり、耐熱性がありすぎて接着不良を起
したり、反対に耐熱不足による破れが生じたりして満足
なものは得られていない。Polyurethane is often used for wire coating because of its good adhesion and solderability and good abrasion resistance.However, in the case of conventional bonding wires coated with polyurethane, oxides and carbides adhere to the ball during bonding,
Resins have not been obtained because the resin rises due to thermal shrinkage and the capillaries, which are bonding jigs, are filled, adhesiveness is poor due to excessive heat resistance, and conversely, tearing occurs due to insufficient heat resistance.
すなわち、一般にポリウレタンはポリオールとポリイ
ソシアネートより造られるが、絶縁被覆材としてのポリ
ウレタンはポリウエステルポリオールとポリイソシアネ
ートが主体である。このポリエステルポリオール中のポ
リカルボン酸としてはフタル酸，アジピン酸が一般に使
用されるがその他にテレフタル酸，イソフタル酸および
それ等のメチルエステルが使用される。しかしながらこ
れ等のポリウレタンで被覆したボンディングワイヤでは
前述の様な問題点を解決することが出来ない。That is, generally, polyurethane is made of polyol and polyisocyanate, but polyurethane as an insulating coating material is mainly composed of polyester polyol and polyisocyanate. As the polycarboxylic acid in the polyester polyol, phthalic acid and adipic acid are generally used, but terephthalic acid, isophthalic acid and their methyl esters are also used. However, these bonding wires coated with polyurethane cannot solve the above-mentioned problems.
（発明が解決しようとする課題） 本発明の目的は導電性ワイヤ基材の周辺に耐熱性が高
くかつボンディング時に酸化物や炭化物の付着が少く、
更に熱収縮による樹脂の盛上りが少いポリウレタン系樹
脂を被覆したボンディングワイヤを提供することにあ
る。(Problems to be Solved by the Invention) The object of the present invention is to have high heat resistance around the conductive wire base material and to reduce the adhesion of oxides and carbides during bonding,
It is still another object of the present invention to provide a bonding wire coated with a polyurethane resin in which the rise of the resin due to heat shrinkage is small.
（課題を解決するための技術的手段） 斯る本発明のボンディングワイヤは、実質的にポリエ
ステルポリオールとポリイソシアネートからなるポリウ
レタンを被覆したボンディングワイヤにおいて、ポリエ
ステルポリオールの主鎖のポリカルボン酸成分が主とし
て直鎖脂肪族ポリカルボン酸と芳香族ポリカルボン酸か
らなり、直鎖脂肪族ポリカルボン酸と芳香族ポリカルボ
ン酸の重量比が30:70ないし70:30の範囲にあるポリウレ
タンで被覆したことを特徴とする。(Technical Means for Solving the Problems) The bonding wire of the present invention is a bonding wire substantially coated with a polyurethane composed of a polyester polyol and a polyisocyanate, wherein a polycarboxylic acid component of a main chain of the polyester polyol is mainly contained. It is composed of a linear aliphatic polycarboxylic acid and an aromatic polycarboxylic acid, and is coated with a polyurethane having a weight ratio of the linear aliphatic polycarboxylic acid and the aromatic polycarboxylic acid in the range of 30:70 to 70:30. Features.
上記直鎖脂肪族ポリカルボン酸の例としてはアジピン
酸，セバシン酸，グルタール酸，コハク酸，エチレンテ
トラカルボン酸等のポリカルボン酸がある。また芳香族
ポリカルボン酸とはテレフタル酸，イソフタル酸，オル
トフタル酸，ナフタレンジカルボン酸,4,4′ジフェニル
カルボン酸，トリメリット酸等があり、耐熱性を特に要
求する場合はイミド基の導入されたポリカルボン酸等が
使用される。Examples of the linear aliphatic polycarboxylic acids include polycarboxylic acids such as adipic acid, sebacic acid, glutaric acid, succinic acid, and ethylenetetracarboxylic acid. Aromatic polycarboxylic acids include terephthalic acid, isophthalic acid, orthophthalic acid, naphthalenedicarboxylic acid, 4,4'-diphenylcarboxylic acid, trimellitic acid, etc. When heat resistance is particularly required, an imide group is introduced. Polycarboxylic acids and the like are used.
ポリエステルポリオールを構成する一方のアルコール
成分も一般に知られたものでよく、例としてはエチレン
グリコール，プロピレングリコール，グリセリン，トリ
メチロールプロパン，ベンタエリスリトール等がある。The one alcohol component constituting the polyester polyol may be a generally known alcohol component, and examples thereof include ethylene glycol, propylene glycol, glycerin, trimethylolpropane, and pentaerythritol.
直鎖脂肪族ポリカルボン酸と芳香族ポリカルボン酸と
併用しポリエステルを構成する時、脂肪族ポリカルボン
酸の量が少いと耐熱性は高いがボールを形成した時に炭
化物が残りボンディングに支障をきたす。また芳香族ポ
リカルボン酸の量が少いと耐熱性が劣る結果となる。従
って要求される耐熱性とボンディング性に応じて量比を
加減することが必要で、実験結果に基づいて、脂肪族ポ
リカルボン酸は全ポリカルボン酸に対し重量比で少くと
も30％を含む必要があることが判明した。When polyester is used in combination with linear aliphatic polycarboxylic acid and aromatic polycarboxylic acid, if the amount of aliphatic polycarboxylic acid is small, heat resistance is high, but carbides remain when balls are formed and hinder bonding. . On the other hand, when the amount of the aromatic polycarboxylic acid is small, the heat resistance becomes poor. Therefore, it is necessary to adjust the amount ratio according to the required heat resistance and bonding property. Based on the experimental results, the aliphatic polycarboxylic acid needs to contain at least 30% by weight based on the total polycarboxylic acid. It turned out that there is.
ポリエステルポリオールの合成は一般的ポリエステル
の合成法で容易に得ることが出来る。芳香族および直鎖
脂肪族ポリカルボン酸の併用において、共重合化，ポリ
マーブレンド何れでも良く、使用されるポリエステルポ
リオールの中、全ポリカルボン酸に対し脂肪族ポリカル
ボン酸が重量比で少くとも30％を含むものであればよ
い。ポリエステルの分子量は溶液の取扱いと被膜強度か
ら1500から10,000通常用いられる。更に好ましくは2000
から5000である。Polyester polyol can be easily obtained by a general polyester synthesis method. In the combined use of aromatic and linear aliphatic polycarboxylic acids, any of copolymerization and polymer blending may be used. Among the polyester polyols used, at least 30 parts by weight of the aliphatic polycarboxylic acid to the total polycarboxylic acid is used. % May be used. The molecular weight of the polyester is usually 1500 to 10,000 depending on the handling of the solution and the film strength. More preferably 2000
From 5000.
ポリウレタン化のためのポリイソシアネートは一般市
販品を使用出来る。例えば、トルイレンジイソシアネー
ト，キシリレンジイソシアネート，ジフェニルメタンジ
イソシアネート，ヘキサメチレンジイソシアネート等が
あり、フェノールの如きもので安定化したもの、三量体
化したイソシアヌレート，トリメチロールプロパン等で
アダクト化物としたものは更に好ましい。A general commercial product can be used as the polyisocyanate for polyurethane formation. For example, there are toluylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, and the like, those stabilized with a substance such as phenol, those adducted with a trimerized isocyanurate, trimethylolpropane, or the like are further added. preferable.
しかしながらポリイソシアネートもポリウレタンの一
成分として耐熱性と炭化による支障の一端の作用を分担
しており、全ポリイソシアネートに対し重量比で少くと
も30％の直鎖脂肪族または脂環族ポリイソシアネートを
含むことは更に好ましい結果を与える（請求項第２
項）。脂環族ポリイソシアネートの例としては、1,4−
シクロヘキサンジイソシアネート,4,4′−ジシクロヘキ
シルメタンジイソシアネート等がある。However, polyisocyanate also plays a part in the problem of heat resistance and carbonization as a component of polyurethane, and contains at least 30% by weight of a linear aliphatic or alicyclic polyisocyanate with respect to the total polyisocyanate. This gives a more favorable result (claim 2
Section). Examples of alicyclic polyisocyanates include 1,4-
Examples include cyclohexane diisocyanate and 4,4'-dicyclohexylmethane diisocyanate.
本発明で用いられる脂環族化合物はシス型，トランス
型があり、何れでもよいがトランス型がよく用いられ
る。The alicyclic compound used in the present invention includes a cis type and a trans type, and any of them may be used, but the trans type is often used.
ポリエステルポリオール中のOH残基とイソシアネート
のモル比は0.5ないし4.0好ましくは0.9ないし2.0の被膜
の柔軟性と摩耗強度から選ばれる。The molar ratio of the OH residue to the isocyanate in the polyester polyol is selected from 0.5 to 4.0, preferably 0.9 to 2.0, from the flexibility and abrasion strength of the coating.
本発明によるポリエステルポリオールとポリイソシア
ネートは溶剤、例えばクレゾール，フェノール，キシレ
ン，ナフサ，グリコールエーテル等に溶解し、必要によ
り硬化触媒（オクテン酸亜鉛等）や平滑剤（モダフロ
ー：モンサント製等）等添加剤を加え、ロールコータや
ダイス法により導電性ワイヤに塗布し加熱炉（200〜350
℃,10秒〜10分）で硬化させ巻取ることによりポリウレ
タン被覆ボンディングワイヤとすることが出来る。The polyester polyol and the polyisocyanate according to the present invention are dissolved in a solvent such as cresol, phenol, xylene, naphtha, glycol ether and the like, and if necessary, additives such as a curing catalyst (such as zinc octenoate) and a smoothing agent (Modaflow: manufactured by Monsanto). Is applied to the conductive wire by a roll coater or a die method, and then heated in a heating furnace (200 to 350
(10 ° C., 10 seconds to 10 minutes), and cured to form a polyurethane-coated bonding wire.
（実施例） 脂環族ポリカルボン酸含有ポリエステルポリオールと
ポリイソシアネートをクレゾール35部、フェノール15
部、キシレン50部の容量比のシンナーに溶解し、平滑剤
モダフローを0.1％添加し不揮発分として10％の塗工液
をつくった。(Example) An alicyclic polycarboxylic acid-containing polyester polyol and a polyisocyanate were mixed with 35 parts of cresol and 15 parts of phenol.
Of xylene and 50 parts of xylene by volume, and 0.1% of a smoothing agent Modaflow was added to prepare a coating liquid having a nonvolatile content of 10%.
液をロールコータに移し、直径25μの金線を通してコ
ーティングし、275℃の加熱炉を通してポリウレタン被
覆ボンディングワイヤとした。このコーティング操作を
６〜13回繰返すことで被覆厚みを1.0±0.1μに調整し
た。The solution was transferred to a roll coater, coated with a gold wire having a diameter of 25 μm, and passed through a heating furnace at 275 ° C. to obtain a polyurethane-coated bonding wire. This coating operation was repeated 6 to 13 times to adjust the coating thickness to 1.0 ± 0.1 μm.
ボールボンディングしたあとの観察結果と耐熱性の結
果を下表に示す。耐熱性テストは160℃熱風乾燥機にボ
ンディングワイヤを入れ100時間加熱したあと破壊電圧
を測定し300V以上の電圧に耐えたものを良好とした。The results of observation and heat resistance after ball bonding are shown in the table below. In the heat resistance test, the bonding wire was placed in a 160 ° C. hot air drier and heated for 100 hours, and then the breakdown voltage was measured.
上記表において、試料NO.2〜４及び７〜９は、カルボ
ン酸の脂肪酸と芳香族との重量比が本発明の組成範囲に
入る実施品、試料NO.1,5及び６は本発明の組成範囲から
はずれた比較品であり、そのうちのNO.6は脂肪族成分を
全く含まない従来品である。 In the above table, Samples Nos. 2 to 4 and 7 to 9 are Examples of the present invention in which the weight ratio of the fatty acid of carboxylic acid to aromatic is within the composition range of the present invention. It is a comparative product out of the composition range, of which NO. 6 is a conventional product containing no aliphatic component at all.
上記表より、比較品においては、その評価結果にボン
ディング特性又は耐熱性に問題のあることが知られ、本
発明実施品においては評価結果の高いことが知られた。From the above table, it was known that the evaluation result of the comparative product had a problem in bonding characteristics or heat resistance, and the evaluation result of the product of the present invention was high.
又、本発明実施品中、試料NO.7及び８は、全ジイソシ
アネートに対する脂肪族・脂環族ジイソシアネートの重
量比が及ぼす影響をみたものであり、その重量比が30％
以上の試料NO.7（31％）は、それ以下の試料NO.8（19
％）のものより評価結果がさらに改善されることが知ら
れた（請求項第２項）。In the products of the present invention, Samples Nos. 7 and 8 were used to examine the effect of the weight ratio of the aliphatic / alicyclic diisocyanate to the total diisocyanate, and the weight ratio was 30%.
The above sample No. 7 (31%) was less than sample No. 8 (19%).
%), It is known that the evaluation result is further improved (claim 2).
但し、前記脂環族ジイソシアネートの重量比が30％以
上（０％であっても）、評価結果は高く本発明の実施品
である（No.2及び４）。However, when the weight ratio of the alicyclic diisocyanate was 30% or more (even at 0%), the evaluation results were high and the products of the present invention were implemented (Nos. 2 and 4).
（発明の効果） 前記した本発明の半導体装置用被覆ボンディングワイ
ヤによれば、ボンディング時の溶融ボール形成時に樹脂
の酸化や炭化物の付着は少なく、また樹脂収縮によるキ
ャピラリーを通過する時の詰まりを防止することが出
来、信頼性の高いボンディングを得ることが出来る。(Effect of the Invention) According to the above-described coated wire for semiconductor device of the present invention, oxidation of a resin and adhesion of a carbide are small when a molten ball is formed at the time of bonding, and clogging when passing through a capillary due to resin contraction is prevented. And a highly reliable bonding can be obtained.
また加熱・超音波押圧ボンディングでも樹脂は除去さ
れ確実にウェッジボンディングすることが出来る。Also, the resin is removed by heating and ultrasonic pressure bonding, and wedge bonding can be performed reliably.
Claims (2)
ソシアネートからなるポリウレタンを被覆したボンディ
ングワイヤにおいて、ポリエステルポリオールの主鎖の
ポリカルボン酸成分が主として直鎖脂肪族ポリカルボン
酸と芳香族ポリカルボン酸からなり、直鎖脂肪族ポリカ
ルボン酸と芳香族ポリカルボン酸の重量比が30:70ない
し70:30の範囲にあるポリウレタンで被覆した樹脂被覆
ボンディングワイヤ。1. A bonding wire coated with a polyurethane substantially consisting of a polyester polyol and a polyisocyanate, wherein the polycarboxylic acid component of the main chain of the polyester polyol mainly comprises a linear aliphatic polycarboxylic acid and an aromatic polycarboxylic acid. A resin-coated bonding wire coated with polyurethane, wherein the weight ratio of linear aliphatic polycarboxylic acid to aromatic polycarboxylic acid is in the range of 30:70 to 70:30.
ネートとの重量比で少くとも30％の直鎖脂肪族ポリイソ
シアネート及び／又は脂環族ポリイソシアネートを含む
請求項第１項記載の樹脂被覆ボンディングワイヤ。2. The resin-coated bonding wire according to claim 1, wherein said polyisocyanate contains at least 30% by weight of the total polyisocyanate of a linear aliphatic polyisocyanate and / or an alicyclic polyisocyanate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1334487A JP2746443B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1334487A JP2746443B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03192739A JPH03192739A (en) | 1991-08-22 |
| JP2746443B2 true JP2746443B2 (en) | 1998-05-06 |
Family
ID=18277948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1334487A Expired - Lifetime JP2746443B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2746443B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19507942A1 (en) * | 1995-03-07 | 1996-09-12 | Beck & Co Ag Dr | Wire coating agent and process for its preparation |
| DE102005025465B4 (en) | 2005-05-31 | 2008-02-21 | Infineon Technologies Ag | Semiconductor component with corrosion protection layer and method for producing the same |
-
1989
- 1989-12-21 JP JP1334487A patent/JP2746443B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03192739A (en) | 1991-08-22 |
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