JP2746442B2 - Resin-coated bonding wire - Google Patents
Resin-coated bonding wireInfo
- Publication number
- JP2746442B2 JP2746442B2 JP1334486A JP33448689A JP2746442B2 JP 2746442 B2 JP2746442 B2 JP 2746442B2 JP 1334486 A JP1334486 A JP 1334486A JP 33448689 A JP33448689 A JP 33448689A JP 2746442 B2 JP2746442 B2 JP 2746442B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- resin
- bonding wire
- polycarboxylic acid
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半導体装置の結線に用いられる樹脂被覆ボン
ディングワイヤに関するもので、特に絶縁性樹脂被覆を
施したボンディングワイヤに関するものである。Description: TECHNICAL FIELD The present invention relates to a resin-coated bonding wire used for connecting a semiconductor device, and particularly to a bonding wire coated with an insulating resin.
（従来の技術） 半導体装置の製造過程で結線に用いられるボンディン
グワイヤとして導電性ワイヤ、例えば金、アルミ、銅の
ワイヤが使用されている。従来このようなワイヤは裸の
まま使用されていて、そのため半導体装置に接触した
り、ワイヤ同志が接触してショートを生じる事故がしば
しばある。特に近来、LSI等の開発に伴って多ピン化に
よりショートを生じることが増えてきている。(Prior Art) A conductive wire, for example, a gold, aluminum, or copper wire is used as a bonding wire used for connection in a manufacturing process of a semiconductor device. Conventionally, such wires have been used in a bare state, and therefore, there is often an accident that a short circuit occurs due to contact with a semiconductor device or contact between wires. In particular, in recent years, the occurrence of short circuits due to the increase in the number of pins has been increasing with the development of LSIs and the like.
このようなショートを防止するために、近来導電性ワ
イヤ基材の周囲に絶縁材の被覆を設けたボンディングワ
イヤが種々提案されている。例えば、特開昭62−139217
号公報にはポリイミド系樹脂材料が提案されている。In order to prevent such a short circuit, various types of bonding wires in which an insulating material is provided around a conductive wire substrate have recently been proposed. For example, JP-A-62-139217
In this publication, a polyimide resin material is proposed.
半導体装置の製造過程におけるボンディングワイヤに
よる結線はワイヤの先端を溶融させて導線をボール状に
形成させボンディングを行ういわゆる周知のボールボン
ディング法や、ボンディング工具の加熱と超音波の加振
を併用するウェッジボンディング等種々の方法が知られ
ている。In the process of manufacturing a semiconductor device, bonding by a bonding wire is performed by melting the tip of the wire to form a conductive wire in a ball shape and performing bonding, or a wedge that uses both heating of a bonding tool and vibration of an ultrasonic wave. Various methods such as bonding are known.
半導体装置の使用環境からボンディングワイヤの絶縁
被覆材には耐熱性が要求されることは勿論だが、結線時
にワイヤが溶融されボールをつくる時や、ウェッジボン
ディング時には絶縁被覆材は接触面が熱により容易に除
去されることが要求される。Due to the usage environment of the semiconductor device, the insulation coating material of the bonding wire is required to have heat resistance. However, when the wire is melted to make a ball at the time of connection, or at the time of wedge bonding, the insulation coating material has a contact surface that is easily heated by heat. Must be removed.
従来ボンディングワイヤの被覆材としてポリエチレ
ン、ポリエステル、ナイロン、ポリイミド、ポリアミド
イミド、ポリエステルイミド、エポキシ樹脂、ポリビニ
ルホルマール等多くの樹脂が知られているがいずれも満
足するものは見出されていない。Conventionally, many resins such as polyethylene, polyester, nylon, polyimide, polyamide imide, polyester imide, epoxy resin and polyvinyl formal have been known as coating materials for bonding wires, but none of them have been found to be satisfactory.
また、ポリウレタンは接着性や半田付性が良く耐摩耗
性もよいため、しばしばワイヤの被覆に使われるが、従
来のポリウレタンで被覆したボンディングワイヤではボ
ンディング時にボール部に酸化物や炭化物が付着した
り、樹脂が熱収縮により盛上りボンディング治具である
キャピラリーを詰めたり、耐熱性がありすぎて接着不良
を起したり、反対に耐熱不足による破れが生じたりして
満足なものは得られていない。Polyurethane is often used for wire coating because of its good adhesion and solderability and good abrasion resistance.However, in the case of conventional bonding wires coated with polyurethane, oxide or carbide may adhere to the ball during bonding. Satisfactory products have not been obtained because the resin rises due to thermal shrinkage and fills the capillary, which is a bonding jig, and the heat resistance is too high, causing poor bonding, and conversely, tearing due to insufficient heat occurs. .
すなわち、一般にポリウレタンはポリオールとポリイ
ソシアネートより造られるが、絶縁被覆材としてのポリ
ウレタンはポリエステルポリオールとポリイソシアネー
トが主体である。このポリエステルポリオール中のポル
カルボン酸としてはフタル酸、アジピン酸が一般に使用
されるがその他にテレフタル酸、イソフタル酸およびそ
れ等のメチルエステルが使用される。しかしながらこれ
等のポリウレタンで被覆したボンディングワイヤでは前
述の様な問題点を解決することが出来ない。That is, polyurethane is generally made of polyol and polyisocyanate, but polyurethane as an insulating coating material is mainly composed of polyester polyol and polyisocyanate. As the carboxylic acid in the polyester polyol, phthalic acid and adipic acid are generally used, but terephthalic acid, isophthalic acid and methyl esters thereof are also used. However, these bonding wires coated with polyurethane cannot solve the above-mentioned problems.
（発明が解決しようとする課題） 本発明の目的は導電性ワイヤ基材の周辺に耐熱性が高
くかつボンディング時に酸化物や炭化物の付着が少く、
更に熱収縮による樹脂の盛上りが少いポリウレタン系樹
脂を被覆したボンディングワイヤを提供することにあ
る。(Problems to be Solved by the Invention) The object of the present invention is to have high heat resistance around the conductive wire base material and to reduce the adhesion of oxides and carbides during bonding,
It is still another object of the present invention to provide a bonding wire coated with a polyurethane resin in which the rise of the resin due to heat shrinkage is small.
（課題を解決するための技術的手段） 斯る本発明のボンディングワイヤは、実質的にポリエ
ステルポリオールとポリイソシアネートからなるポリウ
レタンを被覆したボンディングワイヤにおいて、前記ポ
リエステルポリオールの主鎖のポリカルボン酸成分が、
全ポリカルボン酸との重量比で少なくとも30％の脂環族
ポリカルボン酸を含むポリウレタンを被覆したことを特
徴とする。(Technical Means for Solving the Problems) The bonding wire according to the present invention is a bonding wire substantially coated with a polyurethane composed of a polyester polyol and a polyisocyanate, wherein a polycarboxylic acid component of a main chain of the polyester polyol is used. ,
It is characterized by being coated with a polyurethane containing at least 30% by weight of alicyclic polycarboxylic acid with respect to the total polycarboxylic acid.
脂環族ポリカルボン酸の例としては、1,4−あるいは
1,3−シクロヘキサンジカルボン酸、4,4′−ジシクロヘ
キサンジカルボン酸、4,4′−ジシクロヘキシルメタン
ジカルボン酸等シクロヘキサン、ジシクロヘキサン、シ
クロペンタン、シクロブタンの様な脂環族のポリカルボ
ン酸があるが、必ずしもこれに限定されるものではな
い。Examples of alicyclic polycarboxylic acids include 1,4- or
There are alicyclic polycarboxylic acids such as cyclohexane, dicyclohexane, cyclopentane and cyclobutane, such as 1,3-cyclohexanedicarboxylic acid, 4,4'-dicyclohexanedicarboxylic acid, and 4,4'-dicyclohexylmethanedicarboxylic acid. However, the present invention is not necessarily limited to this.
脂環族ポリカルボン酸と併用される酸成分は一般に知
られたポリカルボン酸でよく、例えばオルトフタル酸、
イソフタル酸、テレフタル酸、トリメリット酸、アジピ
ン酸、エチレンテトラカルボン酸等がある。耐熱性を特
に要求する場合はテレフタル酸やイミド基の導入された
ポリカルボン酸が使用される。The acid component used in combination with the alicyclic polycarboxylic acid may be a generally known polycarboxylic acid, for example, orthophthalic acid,
Examples include isophthalic acid, terephthalic acid, trimellitic acid, adipic acid, ethylenetetracarboxylic acid, and the like. When heat resistance is particularly required, terephthalic acid or a polycarboxylic acid into which an imide group is introduced is used.
ポリエステルポリオールを構成する一方のアルコール
成分も一般に知られたものでよく、例としてはエチレン
グリコール、プロピレングリコール、グリセリン、トリ
メチロールプロパン、ペンタエリスリトール等がある。One of the alcohol components constituting the polyester polyol may be one generally known, and examples thereof include ethylene glycol, propylene glycol, glycerin, trimethylolpropane, and pentaerythritol.
脂環族ポリカルボン酸と芳香族ポリカルボン酸と併用
しポリエステルを構成する場合、脂環族ポリカルボン酸
の量が少いと耐熱性は高いがボールを形成した時に炭化
物が残りボンディングに支障をきたす。また脂環族ポリ
カルボン酸と直鎖脂肪族ポリカルボン酸と併用しポリエ
ステルを構成する場合に脂環族ポリカルボン酸の量が少
いと耐熱性が劣る結果となる。従って要求される耐熱性
とボンディング性に応じて量比を加減することが必要
で、実験結果に基づいて、脂環族ポリカルボン酸は全ポ
リカルボン酸に対し重量比で少くとも30％を含む必要が
あることが判明した。When polyester is used in combination with an alicyclic polycarboxylic acid and an aromatic polycarboxylic acid, if the amount of the alicyclic polycarboxylic acid is small, the heat resistance is high, but the carbide remains when a ball is formed, which hinders bonding. . Further, when a polyester is constituted by using an alicyclic polycarboxylic acid and a linear aliphatic polycarboxylic acid in combination, a small amount of the alicyclic polycarboxylic acid results in poor heat resistance. Therefore, it is necessary to adjust the amount ratio according to the required heat resistance and bonding property. Based on the experimental results, the alicyclic polycarboxylic acid contains at least 30% by weight based on the total polycarboxylic acid. It turned out to be necessary.
ポリエステルポリオールの合成は一般的ポリエステル
の合成法で容易に得ることが出来る。脂環族、芳香族、
直鎖脂肪族ポリカルボン酸の併用において、共重合化、
ポリマーブレンド何れでも良く、使用されるポリエステ
ルポリオールの中、全ポリカルボン酸に対し脂環族ポリ
カルボン酸が重量比で少くとも30％含むものであればよ
い。ポリエステルポリオールの分子量は溶液の取扱い易
さと被膜強度から1500から10,000が通常用いられる。さ
らに好ましくは2000から5000である。Polyester polyol can be easily obtained by a general polyester synthesis method. Alicyclic, aromatic,
In combination with a linear aliphatic polycarboxylic acid, copolymerization,
Any of polymer blends may be used as long as the polyester polyol used contains at least 30% by weight of alicyclic polycarboxylic acid with respect to all polycarboxylic acids. The molecular weight of the polyester polyol is usually from 1500 to 10,000 from the viewpoint of easy handling of the solution and film strength. More preferably, it is 2,000 to 5,000.
ポリウレタン化のためのポリイソシアネートは一般市
販品を使用出来る。例えば、トルイレンジイソシアネー
ト、キシリレンジイソシアネート、ジフェニルメタンジ
イソシアネート、ヘキサメチレンジイソシアネート等が
あり、フェノールの如きもので安定化したもの、三量体
化したイソシアヌレート、トリメチロールプロパン等で
アダクト化物としたものは更に好ましい。A general commercial product can be used as the polyisocyanate for polyurethane formation. For example, there are toluylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, etc. preferable.
しかしながらポリイソシアネートもポリウレタンの一
成分として耐熱性と炭化による支障の一端の作用を分担
しており、全ポリイソシアネートに対し重量比で少くと
も30％の脂環族ポリイソシアネートを含むことは更に好
ましい結果を与える（請求項第２項）。脂環族ポリイソ
シアネートの例としては、1,4−シクロヘキサンジイソ
シアネート、4,4′−ジシクロヘキシルメタンジイソシ
アネート等がある。However, polyisocyanate also plays a part in the problem of heat resistance and carbonization as a component of polyurethane, and it is more preferable to contain at least 30% by weight of alicyclic polyisocyanate with respect to the total polyisocyanate. (Claim 2). Examples of the alicyclic polyisocyanate include 1,4-cyclohexane diisocyanate and 4,4'-dicyclohexylmethane diisocyanate.
本発明で用いられる脂環族化合物はシス型、トランス
型があり、何れでもよいがトランス型がよく用いられ
る。The alicyclic compound used in the present invention includes a cis type and a trans type, and any of them may be used, but the trans type is often used.
ポリエステルポリオール中のOH残基とイソシアネート
のモル比は0.5ないし4.0好ましくは0.9ないし2.0が被膜
の柔軟性と摩耗強度から選ばれる。The molar ratio between the OH residue and the isocyanate in the polyester polyol is 0.5 to 4.0, preferably 0.9 to 2.0, which is selected from the flexibility and wear strength of the coating.
本発明によるポリエステルポリオールとポリイソシア
ネートは溶剤、例えばクレゾール、フェノール、キシレ
ン、ナフサ、グリコールエーテル等に溶解し、必要によ
り硬化触媒（オクテン酸亜鉛等）や平滑剤（モダフロ
ー：モンサント製等）等添加剤を加え、ロールコータや
ダイス法により導電性ワイヤに塗布し加熱炉（200〜350
℃,10秒〜10分）で硬化させ巻取ることによりポリウレ
タン被覆ボンディングワイヤとすることが出来る。The polyester polyol and the polyisocyanate according to the present invention are dissolved in a solvent such as cresol, phenol, xylene, naphtha, glycol ether and the like, and if necessary, additives such as a curing catalyst (such as zinc octenoate) and a smoothing agent (Modaflow: manufactured by Monsanto) are used. Is applied to the conductive wire by a roll coater or a die method, and then heated in a heating furnace (200 to 350
(10 ° C., 10 seconds to 10 minutes), and cured to form a polyurethane-coated bonding wire.
（実施例） 脂環族ポリカルボン酸含有ポリエステルポリオールと
ポリイソシアネートをクレゾール35部、フェノール15
部、キシレン50部の容量比のシンナーに溶解し、平滑剤
モダフローを0.1％添加し不揮発分として10％の塗工液
をつくった。(Example) An alicyclic polycarboxylic acid-containing polyester polyol and a polyisocyanate were mixed with 35 parts of cresol and 15 parts of phenol.
Of xylene and 50 parts of xylene by volume, and 0.1% of a smoothing agent Modaflow was added to prepare a coating liquid having a nonvolatile content of 10%.
液をロールコータに移し、直径25μの金線を通してコ
ーティングし、275℃の加熱炉を通してポリウレタン被
覆ボンディングワイヤとした。このコーティング操作を
６〜13回繰返すことで被覆厚みを1.0±0.1μに調整し
た。The solution was transferred to a roll coater, coated with a gold wire having a diameter of 25 μm, and passed through a heating furnace at 275 ° C. to obtain a polyurethane-coated bonding wire. This coating operation was repeated 6 to 13 times to adjust the coating thickness to 1.0 ± 0.1 μm.
ボールボンディングしたあとの観察結果と耐熱性の結
果を下表に示す。耐熱性テストは160℃熱風乾燥機にボ
ンディングワイヤを入れ100時間加熱したあと破壊電圧
を測定し300V以上の電圧に耐えたものを良好とした。The results of observation and heat resistance after ball bonding are shown in the table below. In the heat resistance test, the bonding wire was placed in a 160 ° C. hot air drier and heated for 100 hours, and then the breakdown voltage was measured.
上記表において、試料No.1〜４及び８〜10は本発明の
実施品であり、試料No.5〜７は比較品である。 In the above table, samples Nos. 1 to 4 and 8 to 10 are the products of the present invention, and samples Nos. 5 to 7 are comparative products.
試料No.5及び６は、全ジカルボン酸に対する脂環族ジ
カルボン酸の重量比が30％未満（20％）の比較品であ
り、その評価結果においてボンディング特性又は耐熱性
に問題のあることが知られ、前記重量比が30％以上の実
施品（No.1〜４及び８〜10）で評価結果の高いことが知
られた。Sample Nos. 5 and 6 are comparative products in which the weight ratio of alicyclic dicarboxylic acid to all dicarboxylic acids is less than 30% (20%), and it is known from the evaluation results that there is a problem in bonding characteristics or heat resistance. It was found that the evaluation results were high in the working products (Nos. 1 to 4 and 8 to 10) in which the weight ratio was 30% or more.
又、試料No.8及び９は、全ジイソシアネートに対する
脂環族ジイソシアネートの重量比が及ぼす影響を判定す
るものであり、その重量比が30％以上の試料No.8（32
％）は、それ以下の試料No.9（18％）のものより評価結
果がさらに改善されることが知られた（請求項第２
項）。Samples Nos. 8 and 9 were used to determine the effect of the weight ratio of the alicyclic diisocyanate to the total diisocyanate. Samples No. 8 (32
%), It is known that the evaluation result is further improved as compared with that of Sample No. 9 (18%) which is lower than the above (Claim 2).
Section).
但し、前記脂環族ジイソシアネートの重量比が30％以
下（０％であっても）、評価結果が高く本発明の実施品
である（No.1〜３及び９）。However, when the weight ratio of the alicyclic diisocyanate was 30% or less (even 0%), the evaluation results were high and the products of the present invention were implemented (Nos. 1 to 3 and 9).
試料No.7は脂環族成分を全く含まない従来品である。 Sample No. 7 is a conventional product containing no alicyclic component.
（発明の効果） 本発明によれば、ボンディング時の溶融ボール形成時
に樹脂の酸化や炭化物の付着は少なく、また樹脂収縮に
よるキャピラリーを通過する時の詰まりを防止すること
が出来、信頼性の高いボンディングを得ることが出来
る。(Effects of the Invention) According to the present invention, oxidation of a resin and adhesion of a carbide are small at the time of forming a molten ball at the time of bonding, and clogging at the time of passing through a capillary due to resin shrinkage can be prevented, and reliability is high. Bonding can be obtained.
また加熱・超音波押圧ボンディングでも樹脂は除去さ
れ確実にウェッジボンディングすることが出来る。Also, the resin is removed by heating and ultrasonic pressure bonding, and wedge bonding can be performed reliably.
Claims (2)
ソシアネートからなるポリウレタンを被覆したボンディ
ングワイヤにおいて、ポリエステルポリオールの主鎖の
ポリカルボン酸成分が、全ポリカルボン酸との重量比で
少くとも30％の脂環族ポリカルボン酸を含むポリウレタ
ンを被覆した樹脂被覆ボンディングワイヤ。1. A bonding wire coated with a polyurethane substantially consisting of a polyester polyol and a polyisocyanate, wherein the polycarboxylic acid component of the main chain of the polyester polyol is at least 30% by weight of the total polycarboxylic acid. A resin-coated bonding wire coated with a polyurethane containing a cyclic polycarboxylic acid.
ネートとの重量比で少くとも30％の脂環族ポリイソシア
ネートを含む請求項第１項記載の樹脂被覆ボンディング
ワイヤ。2. The resin-coated bonding wire according to claim 1, wherein said polyisocyanate contains at least 30% by weight of alicyclic polyisocyanate relative to the total polyisocyanate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1334486A JP2746442B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1334486A JP2746442B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03192738A JPH03192738A (en) | 1991-08-22 |
| JP2746442B2 true JP2746442B2 (en) | 1998-05-06 |
Family
ID=18277936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1334486A Expired - Lifetime JP2746442B2 (en) | 1989-12-21 | 1989-12-21 | Resin-coated bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2746442B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005025465B4 (en) | 2005-05-31 | 2008-02-21 | Infineon Technologies Ag | Semiconductor component with corrosion protection layer and method for producing the same |
| CN108084391A (en) * | 2016-11-21 | 2018-05-29 | 航天特种材料及工艺技术研究所 | A kind of polyurethane and preparation method thereof |
-
1989
- 1989-12-21 JP JP1334486A patent/JP2746442B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03192738A (en) | 1991-08-22 |
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