JP2740788B2 - Circuit board dividing method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board dividing method and apparatus for mounting various electronic elements on a large board, and thereafter dividing the large board to form individual circuit boards.

[0002]

2. Description of the Related Art Conventionally, as a method of dividing a large substrate into individual circuit boards, a V-shaped dividing groove is generally formed on a large substrate, and an electronic element is mounted on the large substrate. Are divided into individual circuit boards. As shown in FIG. 7, a method of dividing the circuit board into individual circuit boards is as follows. A large-sized board 1 is arranged horizontally, and a rolling cutter 3 having a saw blade on the periphery of a disc is formed in V-shaped dividing grooves 2 on the front and back sides. 4 abuts from both sides,
The division groove 2 is further cut to divide the large substrate 1. At this time, the large substrate 1 is moved by a transport mechanism (not shown).
The cutting is performed by passing between the rolling cutters 3 and 4 which are positioned, move in the horizontal direction, and rotate.

Further, as disclosed in Japanese Patent Application Laid-Open No. 6-209149, there has been proposed a method of forming a dividing groove in a ceramic substrate using a rolling cutter made of sintered diamond. This rolling cutter has a cutting edge formed in a mountain shape having a predetermined angle.

[0004]

In the former case of the above prior art, as shown in FIG. 7, the positions of the cutting edges of the rotary cutters 3 and 4 do not exactly match, and the shape of the divided end face is accurately linear. It did not change, and there was variation. further,
Due to the misalignment of the cutting edge and the large stress generated in the large-sized substrate 1 during the division, burrs are likely to occur due to the division, and the burrs also cause errors in the outer dimensions of the circuit board, thereby forming a circuit board with accurate dimensions. There was a problem that it was not possible. In particular, for small-sized electronic devices, there has been a problem of variation in dimensions of the circuit board. Furthermore, since the stress generated on the circuit board at the time of division is large, there is a problem that the mounted electronic elements are adversely affected and their characteristics are changed. Further, in the case of a circuit board having glass fibers, a situation occurs in which the circuit board is not divided due to a shift in the facing position of the cutter, and positioning and feeding of the cutter are extremely troublesome.

[0005] In the latter case of the above-mentioned prior art, a dividing groove is simply formed. However, if this is used to further divide, a problem similar to that of the above-mentioned prior art arises. .

Further, in the above-mentioned conventional technology, cutting powder generated at the time of cutting the substrate may adhere to the electronic elements on the circuit board, causing an error in the electric whistle characteristic or causing other quality deterioration. Therefore, Japanese Patent Application Laid-Open No. Hei 6-190620
As disclosed in Japanese Patent Laid-Open Publication No. H10-209, there is a suction device provided with a suction device in the vicinity of the rotary blade to suction the cutting powder, but it is difficult to completely suck the cutting powder that flies due to the rotation. There was nothing.

[0007] The present invention has been made in view of the above-mentioned problems of the conventional technology, and can accurately divide a substrate with a simple configuration without generating a large stress on the substrate.
It is an object of the present invention to provide a method and an apparatus for dividing a circuit board having high dimensional accuracy of the divided circuit boards.

[0008]

SUMMARY OF THE INVENTION According to the present invention, a large insulating substrate having a V-shaped dividing groove is vertically held in a cantilevered state, and a peripheral portion is formed along the dividing groove of the large substrate. This is a circuit board dividing method in which a large-sized substrate is divided by cutting a portion corresponding to the dividing groove vertically and horizontally by a diamond cutter having a cylindrical edge to the bottom of the opposing dividing groove.

Further, an insulating large substrate having vertical and horizontal dividing grooves formed therein is vertically held in a cantilever state, and a cut is made by a cutter along the vertical dividing grooves of the large substrate. Then, rotate the cutter 90 degrees in the horizontal direction,
Cutting the large substrate along the horizontal dividing groove,
This is a circuit board dividing method for dividing into individual circuit boards.

The present invention also provides a substrate holding member for vertically holding a large substrate having divided grooves facing each other on the front and back surfaces in a cantilever state, and moving the substrate holding member together with the large substrate into a predetermined position. A transport device for transporting, a diamond cutter having a cylindrical peripheral edge that cuts the surface of the large substrate along the dividing groove of the large substrate, a driving device for rotating and driving the diamond cutter, This is a circuit board dividing apparatus that divides the large substrate while cutting the dividing groove. Further, the cutter device having the cutter can switch the cutting direction of the cutter between a vertical direction and a horizontal direction.

[0011] Further, a plurality of injection holes for injecting air around the diamond cutter so as to surround a portion where the diamond cutter is in contact with the substrate, and an air hole positioned inside the plurality of injection holes for injecting air. A suction port for suction is formed. The suction port is opposite to the diamond cutter and is opened on both sides of a substrate holder provided on the back side of the circuit board to be cut. The injection hole is formed around the suction port.

According to the circuit board dividing method and apparatus, the large board divided vertically while cutting the surface of the large board held in the vertical direction by a diamond cutter having a thin cylindrical surface is formed. The large-sized substrate and the electronic elements on the substrate are not subjected to excessive stress. In addition, the air flow injected from the injection hole is drawn into the suction port therebetween, forming an air curtain, and the powder by the diamond cutter does not fly to the periphery.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a first embodiment of the present invention. As shown in FIGS. 1 to 4, a circuit board dividing apparatus according to this embodiment has a V-shaped dividing groove 2 and various electronic elements 6. , 7 mounted on the side edge 1 of the large substrate 1
There are provided four substrate holding members 12 for holding the substrate 1 vertically in a cantilevered state. The substrate holding device 12 is provided so as to be movable by a driving device (not shown) along a vertical transport guide 14 and a horizontal transport guide 16. Below the transport guide 14, there is provided a cassette 18 for holding a large number of large substrates 1 in a vertical direction and for the substrate holding member 12 to take out the large substrates 1 one by one. The large substrate 1 is placed horizontally on the side of the cassette 18.
A cutter device 20 for vertically dividing is provided.
The cutter device 20 is driven by a motor around a rotation shaft 22.
It is provided to be able to rotate 0 degrees. Further, an operation box 24 for operating the circuit board dividing device is mounted above the front center.

A disk-shaped diamond cutter 26 is attached to the cutter device 20. The diamond cutter 26 is rotationally driven by a driving device (not shown), and as shown in FIG. 2, a diamond abrasive layer 28 formed in a cylindrical shape on the peripheral edge is formed. The cutting is performed by the grain layer 28 to form a groove 30 having a U-shaped cross section as shown in FIG. As shown in FIG. 2, the cutter device 20 is provided with a substrate holder 29 for holding the large substrate 1 from the back side, and is opposite to the cutter device 20 of the large substrate 1 when the large substrate 1 is divided. This is fitted and held in the side divided groove 2.

A known conveyor section 34 for carrying out the divided circuit boards 32 is provided on the side of the cutter device 20. Further, a known driving device (not shown) for operating each part of the circuit board dividing device and its control device are provided.

Next, a circuit board dividing method according to an embodiment of the present invention will be described. First, the vertical transport guide 14
The substrate holding member 12 is moved by a driving device (not shown) along the line, and the side edge 11 of the large substrate 1 is moved to the substrate holding member 1.
2 to vertically clamp the cantilever. At this time, the large substrate 1 is accurately positioned and held at a predetermined position of the substrate holding member 12 by a positioning mechanism (not shown). Thereafter, the substrate holding device 12 is moved along the horizontal transport guide 16 so that the large-sized substrate 1 faces the cutter device 20, and the diamond cutter 26 is rotated in the vertical direction while rotating in the vertical direction. The cutter device 20 is moved. Then, a cut is made by the diamond cutter 26 up to the upper end of the circuit board 32 in the lower first row in the order of FIG. At this time, as shown in FIG. 3, a U-shaped groove 30 is formed by the diamond abrasive layer 28 of the diamond cutter 26, and the bottom of the groove 30 reaches the divided groove 2 on the back side, and the separation is performed. Is made.

At this time, the diamond cutter 26 can cut the surface of the large-sized substrate 1 without substantially pressing the large-sized substrate 1 to form the groove 30, and almost no stress is generated in the large-sized substrate 1. Therefore, no force acts on the electronic elements 6 and 7 on the surface, and there is no adverse effect due to the stress generated at the time of division.

Next, the motor for rotating the cutter device 20 is operated to rotate the cutter device 90 by 90 degrees, the diamond cutter 26 is placed in a horizontal state, and the large substrate 1 is faced. To move. And
First, the end of the large substrate 1 is cut off along the division groove 2 at the position shown in FIG. 4, and then the diamond cutter 26 is moved along the division groove 2 at the position on the surface of the large substrate 1. Then, the individual circuit boards 32 are sequentially divided.
At this time, almost no stress is generated in the large-sized substrate 1 as described above.

Each of the divided circuit boards 32 is carried out to a predetermined position by a conveyor unit 34. Further, at the time of the next division, the cutter device 20 rotates 90 degrees in reverse,
In the vertical state, the division grooves 2 for one row are separated in the vertical direction on the circuit board 32 of the next row. In the same manner as described above, the diamond cutter 26 is turned horizontally by 90 degrees, and the large substrate 1
Split. Similarly, when dividing the circuit board 32 in the next row, the circuit board 32 is once divided along the dividing groove 2 in the vertical direction.
Thereafter, horizontal division is performed. Here, the reason why the vertical division is not performed at once is that if a large number of columns are divided at a time, the large circuit board 1 is in a cantilever state, so that the lower circuit board 32 becomes unstable, This is because accurate division cannot be performed. Therefore, depending on the rigidity of the large-sized substrate 1, it may be divided at a time in the vertical direction.

According to the circuit board dividing method and apparatus, the surface of the large substrate 1 held in the vertical direction is divided while being cut by the diamond cutter 26 having a cylindrical surface with a thin peripheral surface, and the dividing groove is accurately formed. Division is performed in two ways, so that unreasonable stress does not occur in the large substrate 1 and the electronic elements 6 and 7 thereon. Therefore, there is no burr, the dividing line is accurate, and the dimension is accurate. Further, accurate positioning and movement can be performed by the substrate holding member 12 and the transport guides 14 and 16, and in this respect, dimensional accuracy can be improved. Furthermore, the division in the horizontal and vertical directions can be performed by one cutter device 20, and the entire device can be downsized.

Next, a second embodiment of the present invention will be described with reference to FIGS. In this embodiment, a suction device 40 is provided on a substrate holder 29 facing the diamond cutter 26. The suction device 40 has a suction port 42 opened on both sides of the substrate holder 29, and a plurality of injection holes 44 formed around the suction port 42 so as to surround the suction port 42 and eject air. . The injection hole 44 is
Air is injected so that the diamond cutter 26 surrounds the place where the diamond cutter 26 is in contact with the circuit board 32. A suction port 48 connected to a suction conduit 46 is formed at the back of the suction port 42,
The injection hole 44 communicates with a mounting portion 50 to which pressurized air is supplied.

In the circuit board dividing apparatus of this embodiment, the air flow injected from the injection hole 44 is drawn into the suction port 42 therebetween, and the air flow from the injection hole 44 serves as an air curtain, and is formed by the diamond cutter 26. The powder is reliably drawn into the suction port 42. Therefore, the diamond cutter 26
The fine powder due to the suction port 4
The cutting powder is not attached to the electronic elements on the circuit board 32.

The cutter according to the present invention can be selected to have an appropriate width, and the substrate holding member, the transfer device, and the drive device can also be set as appropriate. In addition, a plurality of cutter devices may be provided as appropriate, each of which may be provided for each of the horizontal and vertical directions, or a plurality of diamond cutters may be arranged in parallel. Further, as the cutter, a cutter having another cutting portion other than the diamond cutter may be used, and can be appropriately selected.

[0024]

The circuit board dividing method and apparatus according to the present invention are:
The large board can be accurately divided without applying a large force to the large board without causing burrs or dimensional accuracy degradation at the time of division. Each can be divided. In addition, regardless of the type of substrate to be divided, a substrate containing glass fibers can be easily and accurately divided.

Further, according to the circuit board dividing method and apparatus of the present invention, a high-quality circuit board can be efficiently assembled without cutting powder adhering to a circuit board-shaped electronic element.

[Brief description of the drawings]

FIG. 1 is a front view of an embodiment of a circuit board dividing device according to the present invention.

FIG. 2 is a schematic view showing a use state of the first embodiment of the diamond cutter used in the circuit board dividing device of the present invention.

FIG. 3 is a partial cross-sectional view of a large board divided by the circuit board dividing apparatus according to the first embodiment of the present invention.

FIG. 4 is a front view of the large substrate according to the first embodiment of the present invention.

FIG. 5 is a front view of a suction device used in a circuit board dividing device according to a second embodiment of the present invention.

FIG. 6 is a perspective view of a suction device used for a circuit board dividing device according to a second embodiment of the present invention.

FIG. 7 is a schematic diagram showing a state of use of a conventional circuit board dividing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Large board 2 Dividing groove 12 Substrate holding device 14, 16 Transport guide 20 Cutter device 26 Diamond cutter 29 Substrate retainer 42 Suction port 44 Injection hole

Claims (8)

(57) [Claims] 1. A circuit board dividing method for holding an insulating large substrate in a cantilever state in a vertical direction, and dividing the divided portion of the large substrate while cutting it with a cutter. 2. A large-sized insulating substrate having opposed dividing grooves formed on the front and back surfaces is vertically held in a cantilever state, and a peripheral edge is cylindrical along the dividing grooves of the large-sized substrate. A circuit board dividing method for cutting a large substrate by cutting a portion corresponding to the above-mentioned dividing groove by a diamond cutter on a surface and cutting the bottom of the opposing dividing groove to the groove bottom. 3. A large insulating material having divided grooves formed vertically and horizontally.
Hold the board vertically in a cantilevered state, and
Make a cut with a cutter along the vertical dividing groove.
Cut the large substrate along the horizontal dividing groove
3. The circuit according to claim 1, wherein the circuit is divided into individual circuit boards.
Road board division method. 4. A substrate holding member for holding an insulating large substrate in a cantilever state in a vertical direction, a transfer device for transferring the substrate holding member to a predetermined position together with the large substrate, A circuit board dividing device comprising: a cutter for cutting a divided portion in a predetermined dividing direction; and a driving device for rotating and driving the cutter. 5. A substrate holding member for vertically holding an insulating large substrate having a dividing groove in a cantilever state, a transfer device for transferring the substrate holding member together with the large substrate to a predetermined position, A circuit board division comprising: a diamond cutter having a cylindrical peripheral edge for cutting the surface of the large substrate along the division groove of the large substrate; and a driving device for rotating and driving the diamond cutter. apparatus. 6. A cutter device having said cutter, wherein said cutter device comprises:
It is possible to switch the cutter direction between vertical and horizontal.
The circuit board dividing device according to claim 4 or 5, wherein 7. A plurality of injection holes for injecting air in the vicinity of the diamond cutter so as to surround a portion where the diamond cutter is in contact with the substrate, and for injecting air inside the plurality of injection holes. 7. The circuit board dividing device according to claim 4, wherein a suction port for sucking is formed. 8. The suction port, wherein the suction port is opposite to the diamond cutter and is opened on both sides of a substrate holder provided on the back side of the circuit board to be cut, and the injection hole is formed around the suction port. Item 8. The circuit board dividing device according to Item 7.