JPH09278470A - Cutting device for liquid crystal glass plate - Google Patents

Cutting device for liquid crystal glass plate

Info

Publication number
JPH09278470A
JPH09278470A JP11050596A JP11050596A JPH09278470A JP H09278470 A JPH09278470 A JP H09278470A JP 11050596 A JP11050596 A JP 11050596A JP 11050596 A JP11050596 A JP 11050596A JP H09278470 A JPH09278470 A JP H09278470A
Authority
JP
Japan
Prior art keywords
surface plate
slit
break blade
cutting
slits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11050596A
Other languages
Japanese (ja)
Other versions
JP3834099B2 (en
Inventor
Kazuhiko Tanimori
和彦 谷森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
N Tec KK
Original Assignee
N Tec KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by N Tec KK filed Critical N Tec KK
Priority to JP11050596A priority Critical patent/JP3834099B2/en
Publication of JPH09278470A publication Critical patent/JPH09278470A/en
Application granted granted Critical
Publication of JP3834099B2 publication Critical patent/JP3834099B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets

Abstract

PROBLEM TO BE SOLVED: To obtain a cutting device for liquid crystal glass plates which averts the crack during the course of transportation, makes it easy to obtain the accuracy of a surface plate, occupies a less floor area and is, therefore, inexpensively provided as a device for cutting the glass plate provided with plural liquid crystal patterns to a size of one unit. SOLUTION: This cutting device has the surface plate 1 which has plural slits parallel with each other in one direction and is movable back and forth in a direction orthogonal with these slits within the plane, a freely vertically movable scribing cutter 5 which is arranged above the surface plate 1 and travels in a direction parallel with the slits of the surface plate, a supporting surface plate 6 which faces this scribing cutter, stands by below the surface plate 1 and moves vertically into the slits during the stoppage of the surface plate 1, a lower breaking blade 8 which is disposed below the surface plate 1 is parallel with the slit adjustably in the spacing from the supporting surface plate 6 and moves vertically into the slits during the stoppage of the surface plate 1 and an upper breaking blade 7 which faces this lower breaking blade, is disposed above the surface plate 1 and moves downward in synchronization with the upward movement of the lower breaking blade 8 at the time of edge cutting.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、複数単位の液晶
パターンを設けたガラス板を一単位の大きさに切断する
装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cutting a glass plate provided with a plurality of liquid crystal patterns into a unit size.

【0002】[0002]

【従来の技術】携帯用パソコンなどの表示装置として用
いられている液晶パネルは、対角250mm前後の寸法
であるが、このような液晶パネルの製作に際しては、単
位の製品寸法より大きな、たとえば650×550mm
というような大きさのガラス基板に、複数単位(複数台
分)の液晶パターンを印写した後で、当該ガラス基板を
1単位の大きさに切断するという工程で製作されてい
る。大きなガラス基板を用いて複数単位の液晶パターン
を同時に印写しているのは、製作能率を上げ、製造コス
トを低減するためである。
2. Description of the Related Art A liquid crystal panel used as a display device for a portable personal computer or the like has a diagonal size of about 250 mm, but when manufacturing such a liquid crystal panel, it is larger than a unit product size, for example, 650. × 550 mm
It is manufactured by a process of printing a plurality of units (a plurality of units) of liquid crystal patterns on a glass substrate having such a size and then cutting the glass substrate into a unit size. The reason why a plurality of liquid crystal patterns are printed at the same time using a large glass substrate is to increase the manufacturing efficiency and reduce the manufacturing cost.

【0003】近時のこの種の液晶パネルの需要の増大が
著しく、高品質の液晶パネルをより安価にかつ大量に生
産することが要望されている。そのためより大型のガラ
ス基板(マザーガラス)を用いて、より多くの液晶パタ
ーンを同時に印写したいという要求がある。また、使用
されるガラス基板の厚さも、部品の軽量化や高品質化の
要望に伴って、より薄いものが使用されるようになって
きている。
Recently, the demand for this type of liquid crystal panel has been remarkably increased, and it has been desired to mass produce high quality liquid crystal panels at a lower cost. Therefore, there is a demand for printing a larger number of liquid crystal patterns at the same time by using a larger glass substrate (mother glass). Further, with respect to the thickness of the glass substrate used, thinner ones have been used in response to the demand for weight reduction and high quality of parts.

【0004】複数単位の液晶パターンを印写したマザー
ガラスは、切断装置によって1単位の大きさに切断さ
れ、切断縁の研磨が行われるが、ガラス板の切断には、
スクライブとブレークとの2工程が必要である。スクラ
イブは、ダイヤモンド等の硬質のローラやチップでガラ
ス板表面に切目を入れる工程であり、ブレークは、切目
に沿って折曲力を加えてガラス板を分断する工程であ
る。従来装置では、このスクライブとブレークとが別々
の装置で行われていた。
Mother glass on which a plurality of units of liquid crystal patterns are printed is cut into a size of 1 unit by a cutting device and a cutting edge is polished.
Two steps, scribe and break, are required. The scribe is a process of making a cut on the surface of the glass plate with a hard roller such as diamond or a chip, and the break is a process of applying a bending force along the cut to divide the glass plate. In the conventional device, the scribe and the break are performed by different devices.

【0005】すなわちスクライブ装置においては、図1
1に示すように、定盤1上にマザーガラス3を真空吸着
により保持し、視覚センサでマザーガラス上に設けられ
た液晶パターンの基準位置を読み取って、それを基準と
して定盤1を移動させ、所定の位置にスクライブカッタ
5を押し当てて走行させることにより、マザーガラス3
上の図14、15に示すような切断線4、4A(4Aは
耳取り用の切断線)の位置に切目9、9Aを入れる。図
14は耳切りを行わない場合の切断線であるが、液晶パ
ターンとパネル外周との位置関係の精度が要求される場
合には、図15に示すように、単位パネル毎に切り離す
ための切目9の他に、耳切り用の切目9Aを設ける。
That is, in the scribing apparatus, as shown in FIG.
As shown in FIG. 1, the mother glass 3 is held on the surface plate 1 by vacuum suction, the reference position of the liquid crystal pattern provided on the mother glass is read by the visual sensor, and the surface plate 1 is moved with reference to the reference position. , The scribe cutter 5 is pressed against a predetermined position to run the mother glass 3
Cuts 9 and 9A are made at the positions of the cutting lines 4 and 4A (4A is a cutting line for ear removal) as shown in FIGS. FIG. 14 is a cutting line when the edge cutting is not performed. However, when accuracy of the positional relationship between the liquid crystal pattern and the panel outer periphery is required, as shown in FIG. 15, a cut line for separating each unit panel. In addition to No. 9, cuts 9A for cutting the edges are provided.

【0006】このようにして切目9、9Aを入れたマザ
ーガラス3は、スクライブ装置から図12、13に示す
ようなブレーク装置に搬送され、切目9、9Aに沿って
ブレーク刃27、28を押し当てることにより、切目
9、9Aに沿って押し割るようにして分断される。図1
2のブレーク刃27は、耳切り用のブレーク刃で、定盤
1の端縁からオーバーハング状に突出させた耳部分3A
を上から押圧して切除するものであり、図13のブレー
ク刃28は、単位のパネル相互を分断するためのブレー
ク刃で、定盤に設けたスリット内で上動して、鈍角の頂
部稜線10で切目9の背後を押し上げることにより、切
目9に沿ってマザーガラス3を分断する。
The mother glass 3 with the cuts 9 and 9A thus formed is conveyed from the scribing device to the break device as shown in FIGS. 12 and 13, and the break blades 27 and 28 are pushed along the cuts 9 and 9A. By hitting, it is cut along the cut lines 9 and 9A to be divided. FIG.
The break blade 27 of No. 2 is a break blade for edge cutting, and is an ear portion 3A protruding from the edge of the surface plate 1 in an overhang shape.
13 is a break blade 28 for pressing and cutting from above. The break blade 28 in FIG. 13 is a break blade for dividing the unit panels from each other, and moves upward in the slit provided on the surface plate to form an obtuse top ridge line. By pushing up the back of the cut 9 at 10, the mother glass 3 is divided along the cut 9.

【0007】[0007]

【発明が解決しようとする課題】このような従来装置に
おいて、マザーガラスの寸法が大きくなると、スクライ
ブ装置の定盤1の面積も大きくなる。スクライブカッタ
5はバネでガラス板に押し付けられる構造であるが、定
盤の表面とスクライブカッタの先端との間隔は高い寸法
精度が必要で、定盤の表面にうねりがあったり勾配があ
ったりすると、スクライブカッタがマザーガラスの端縁
に切り込まれる箇所で、ガラスの割れや欠けが発生す
る。定盤の寸法が大きくなると、定盤の表面を所定の位
置精度に仕上げるのに技術的困難を伴うようになり、装
置のコストが急激に上昇する。
In such a conventional apparatus, as the size of the mother glass increases, the area of the surface plate 1 of the scribing apparatus also increases. The scribe cutter 5 has a structure in which it is pressed against a glass plate by a spring, but the distance between the surface of the surface plate and the tip of the scribe cutter requires high dimensional accuracy, and if the surface of the surface plate has undulations or slopes. , The glass is broken or chipped at the place where the scribe cutter is cut into the edge of the mother glass. When the size of the surface plate is increased, it becomes technically difficult to finish the surface of the surface plate to a predetermined positional accuracy, and the cost of the apparatus is rapidly increased.

【0008】またマザーガラスが大きくかつ薄くなる
と、スクライブ装置からブレーク装置へマザーガラスを
搬送する作業が非常に困難になる。通常、マザーガラス
はフォーク状のキャリアに載せて搬送されるが、面積が
大きく厚さが薄くかつ切目の入ったマザーガラスは、搬
送中のキャリアの振動等によって割れやすくなり、搬送
途中の割れによる欠損率が増大する。
When the mother glass is large and thin, it becomes very difficult to convey the mother glass from the scribing device to the break device. Normally, mother glass is carried on a fork-shaped carrier, but mother glass with a large area, thin thickness, and cuts is easily broken by the vibration of the carrier during transportation, etc. The loss rate increases.

【0009】さらに面積の大きな定盤を備えたスクライ
ブ装置とブレーク装置を別個に設ける必要から、装置の
設置スペースも大きくなる。
Further, since it is necessary to separately provide a scribing device having a surface plate having a large area and a break device, the installation space of the device becomes large.

【0010】この発明は、搬送途中における割れの発生
を回避することができ、定盤の精度出しが容易で、設置
スペースが小さく、従ってより安価に提供することが可
能な液晶ガラス板の切断装置を得ることを課題としてい
る。
According to the present invention, it is possible to avoid the occurrence of cracks during transportation, it is easy to obtain the precision of the platen, the installation space is small, and therefore the cutting device for the liquid crystal glass plate can be provided at a lower cost. The challenge is to obtain.

【0011】[0011]

【課題を解決するための手段】この発明の液晶ガラス板
の切断装置は、一方向の互いに平行な複数のスリット2
を備えかつ面内で当該スリットと直交する方向に往復移
動可能な定盤1と、定盤1の上方に配置され定盤のスリ
ット2と平行な方向に走行する昇降自在なスクライブカ
ッタ5と、このスクライブカッタと対向して定盤1の下
方に待機し定盤1の停止中にスリット2内に昇降するス
リット2の延在方向に細長いサポート定盤6と、定盤1
の下方にサポート定盤6との間隔を調整可能にスリット
2と平行に配置され定盤1の停止中にスリット2内へ昇
降する下ブレーク刃8と、この下ブレーク刃と対向して
定盤1の上方に配置され耳取り時に下ブレーク刃8の上
動と同期して下動する上ブレーク刃7とを備えている。
A liquid crystal glass plate cutting apparatus according to the present invention comprises a plurality of slits 2 which are parallel to each other in one direction.
A surface plate 1 which is provided with and is capable of reciprocating in a direction orthogonal to the slit in a plane, and a scribing cutter 5 which is arranged above the surface plate 1 and which travels in a direction parallel to the slits 2 of the surface plate. A support platen 6 slender in the extending direction of the slit 2 that stands by below the platen 1 facing the scribe cutter and moves up and down in the slit 2 while the platen 1 is stopped;
A lower break blade 8 which is arranged below the support platen in parallel with the slit 2 so as to be adjustable, and which moves up and down into the slit 2 while the surface plate 1 is stopped, and a surface plate facing the lower break blade 8. 1 and an upper break blade 7 which is arranged above 1 and moves downward in synchronization with the upward movement of the lower break blade 8 at the time of ear removal.

【0012】定盤1は、複数のスリット2のそれぞれが
サポート定盤6と対向する位置と下ブレーク刃8と対向
する位置とのそれぞれの位置で停止しながら移動する。
The surface plate 1 moves while stopping at a position where each of the plurality of slits 2 faces the support surface plate 6 and a position where the slits 2 face the lower break blade 8.

【0013】請求項2の発明は、上記事項を備えた装置
において、定盤1が、枠部材12と、この枠部材に嵌装
される長手方向寸法の等しい複数の矩形板状部材13
と、隣接する矩形板状部材13、13の間に所定幅のス
リット2を形成するスペーサ14とで構成されているこ
とを特徴とするものである。
According to a second aspect of the present invention, in the apparatus provided with the above matters, the surface plate 1 includes a frame member 12 and a plurality of rectangular plate-shaped members 13 fitted in the frame member and having the same longitudinal dimension.
And a spacer 14 forming a slit 2 having a predetermined width between adjacent rectangular plate-shaped members 13, 13.

【0014】また請求項3の発明は、上記事項を備えた
装置において、スクライブカッタ5の走行を案内するガ
イドフレーム15、下ブレーク刃8及び上ブレーク刃7
が定盤1の面直角方向の軸まわりに角度調整可能に設け
られていることを特徴とするものである。
According to a third aspect of the present invention, in the apparatus having the above matters, the guide frame 15, the lower break blade 8 and the upper break blade 7 for guiding the traveling of the scribe cutter 5 are provided.
Is provided so that the angle can be adjusted around the axis of the surface plate 1 in the direction perpendicular to the plane.

【0015】[0015]

【作用】切断しようとするマザーガラス3は、その切断
線4、4Aが定盤のスリット2の位置にくるようにして
定盤1上に載置される。載置されたマザーガラスは、従
来装置と同様真空吸着により定盤1上に吸着保持され
る。定盤1の複数のスリット2は、マザーガラス3の切
断線4、4Aの間隔と等しい間隔で設けられていなけれ
ばならない。切断線4、4Aの間隔が異なるときは、定
盤1を交換するか、定盤のスリット2の間隔を変更す
る。
The mother glass 3 to be cut is placed on the surface plate 1 so that the cutting lines 4 and 4A thereof are located at the slits 2 of the surface plate. The placed mother glass is suction-held on the surface plate 1 by vacuum suction as in the conventional apparatus. The plurality of slits 2 of the surface plate 1 must be provided at intervals equal to the intervals of the cutting lines 4 and 4A of the mother glass 3. When the intervals of the cutting lines 4 and 4A are different, the surface plate 1 is exchanged or the interval of the slits 2 of the surface plate is changed.

【0016】請求項2の装置では、幅寸法の異なる複数
種の矩形板状部材を準備して、必要に応じてこれを交換
することにより、定盤1に設けられるスリットの間隔を
変更することができる。
In the apparatus according to the second aspect, a plurality of types of rectangular plate-shaped members having different width dimensions are prepared, and the plates are exchanged if necessary, whereby the intervals of the slits provided in the surface plate 1 can be changed. You can

【0017】定盤上に保持されたマザーガラスは、従来
装置と同様に視覚センサにより、液晶パターンの基準位
置が検出され、その検出位置を基準とする第1の切断線
がスクライブカッタ5の直下の位置にくるように定盤1
が移動する。この位置ではサポート定盤6がスリット2
に対向するから、サポート定盤6を上動させて、スリッ
ト部分のマザーガラスの下面をサポートした状態でスク
ライブカッタ5を下動して走行させることにより、マザ
ーガラスに切目9、9Aを入れる。
On the mother glass held on the surface plate, the reference position of the liquid crystal pattern is detected by the visual sensor as in the conventional apparatus, and the first cutting line based on the detected position is directly below the scribe cutter 5. Surface plate 1 to come to the position
Moves. In this position, the support surface plate 6 has the slit 2
Since the support surface plate 6 is moved upward, the scribe cutter 5 is moved downward while the lower surface of the mother glass in the slit portion is supported to make the cuts 9 and 9A in the mother glass.

【0018】次にスクライブカッタ5を上動させるとと
もにサポート定盤6を下動し、スリット2が下ブレーク
刃8に対向する位置まで定盤1を移動する。切目9Aが
耳取り用の切目であれば、下ブレーク刃8を上動させる
とともに上ブレーク刃7を下動させて、両者の稜線1
0、11でマザーガラス3を食い違い位置で挟むように
して、マザーガラスの耳部分3Aを折り取る。また切目
9が隣接する液晶パネルを分割するための切目であれ
ば、下ブレーク刃8のみを上動させて、その頂部稜線1
0で切目9の背後を押し上げることにより、マザーガラ
ス3を分断する。
Next, the scribe cutter 5 is moved up and the support surface plate 6 is moved down, and the surface plate 1 is moved to a position where the slit 2 faces the lower break blade 8. If the cut 9A is a cut for ear removal, the lower break blade 8 is moved upward and the upper break blade 7 is moved downward so that both ridge lines 1
The mother glass 3 is sandwiched between 0 and 11 at the crossed positions, and the ear portion 3A of the mother glass is broken off. If the cut 9 is a cut for dividing an adjacent liquid crystal panel, only the lower break blade 8 is moved upward to move the top ridge line 1 thereof.
The mother glass 3 is divided by pushing up the back of the cut 9 at 0.

【0019】請求項3の構成によれば、マザーガラス3
が定盤1上に斜めに置かれたとき、その傾斜角に合わせ
てスクライブカッタのガイドフレーム15並びに下ブレ
ーク刃8及び上ブレーク刃7の角度を調整することによ
り、所定の方向でマザーガラスを切断することができ
る。この調整が必要な角度は通常小さな角度であるか
ら、サポート定盤6の角度を変化させなくても、スクラ
イブカッタ5の軌跡はサポート定盤6の上面から外れる
ことはない。
According to the structure of claim 3, the mother glass 3
When the is placed on the surface plate 1 obliquely, the angle of the guide frame 15 of the scribe cutter and the lower break blade 8 and the upper break blade 7 is adjusted according to the inclination angle of the mother glass in a predetermined direction. Can be cut. Since the angle that needs this adjustment is usually a small angle, the locus of the scribe cutter 5 does not deviate from the upper surface of the support platen 6 even if the angle of the support platen 6 is not changed.

【0020】上記構成の装置においては、マザーガラス
の切断が常にスリット2の位置で行われるから、このス
リットを設けた部分の定盤の精度を所定の精度にしてお
けばよく、定盤が大きくなっても定盤全体の精度を高く
することを要しない。またスクライブとブレークとが同
一の定盤上で行われるから、スクライブ装置からブレー
ク装置にマザーガラスを搬送する工程が不要となり、搬
送中におけるマザーガラスの損傷を完全に回避できる。
また、従来2台の装置で行われていたスクライブとブレ
ークとを同一の装置で行うので、全体としての装置コス
トを低下できるとともに、装置の設置スペースも小さく
できる。
In the apparatus having the above structure, the mother glass is always cut at the position of the slit 2. Therefore, the precision of the surface plate in which the slit is provided may be set to a predetermined accuracy, and the size of the surface plate is large. However, it is not necessary to increase the accuracy of the entire surface plate. Further, since scribing and breaking are performed on the same surface plate, the step of transporting the mother glass from the scribing device to the break device becomes unnecessary, and damage to the mother glass during transportation can be completely avoided.
Further, since the scribing and the break, which are conventionally performed by two devices, are performed by the same device, the overall device cost can be reduced and the installation space of the device can be reduced.

【0021】[0021]

【発明の実施の形態】以下、図1ないし図10に示す実
施例を参照してこの発明の実施の形態を説明する。図7
はこの発明で用いられる定盤の一例を示したものであ
る。定盤1には、矢印X方向の平行なスリット2が多数
設けられており、各スリット2は定盤1を面直角方向に
貫通している。定盤1の上面には、図示してないが、上
面に載置されたマザーガラスを吸着するための空気吸引
孔が多数設けられている。スリット2の間隔は、たとえ
ば図6に示すように、1枚のマザーガラス3からa×b
の大きさの液晶パネルを9単位切り取る場合を例にする
と、間隔aで配置されたスリットが3本、間隔bで配置
されたスリットが3本で、うち1本が共通である7本の
スリットが設けられる。この定盤1は図7の矢印Z方向
に移動かつ位置決め可能に設けられる。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the examples shown in FIGS. Figure 7
Shows an example of a surface plate used in the present invention. The surface plate 1 is provided with a large number of parallel slits 2 in the direction of the arrow X, and each slit 2 penetrates the surface plate 1 in the direction perpendicular to the plane. Although not shown, the upper surface of the surface plate 1 is provided with a large number of air suction holes for adsorbing the mother glass placed on the upper surface. For example, as shown in FIG. 6, the slits 2 are spaced from one mother glass 3 to a × b.
Taking as an example the case of cutting out 9 units of a liquid crystal panel of size, there are 3 slits arranged at intervals a, 3 slits arranged at intervals b, of which 7 slits are common. Is provided. The surface plate 1 is provided so as to be movable and positionable in the direction of arrow Z in FIG.

【0022】図6に示したマザーガラス3は、その切断
線4、4Aがスリット2の中央にくるようにして定盤1
上に載置され、真空吸着して保持される。定盤1の移動
経路の上下には、図1に示すスクライブカッタ5、サポ
ート定盤6及び上ブレーク刃7、下ブレーク刃8が配置
されている。スクライブカッタ5は、外周を鋭いエッジ
にしたローラで、下動してスリット2の長手方向に走行
することにより、マザーガラス3の上面に切目9又は9
Aを入れる。サポート定盤6は、スリット2に挿入可能
なスリット2の長手方向に細長い部材で、上動したとき
にその上面が定盤1の上面と同一面となり、スクライブ
カッタ5が切目9又は9Aをつけるときにマザーガラス
3の背面をサポートする。
The mother glass 3 shown in FIG. 6 has a surface plate 1 such that its cutting lines 4 and 4A are located at the center of the slit 2.
It is placed on top and held by vacuum suction. The scribe cutter 5, the support surface plate 6, the upper break blade 7, and the lower break blade 8 shown in FIG. 1 are arranged above and below the moving path of the surface plate 1. The scribe cutter 5 is a roller whose outer periphery has a sharp edge, and is moved downward and travels in the longitudinal direction of the slit 2 to form a cut 9 or 9 on the upper surface of the mother glass 3.
Insert A. The support surface plate 6 is a member that can be inserted into the slit 2 and is elongated in the longitudinal direction of the slit 2. The upper surface of the support surface 6 is flush with the upper surface of the surface plate 1 when moved upward, and the scribe cutter 5 makes a cut 9 or 9A. Sometimes supports the back of mother glass 3.

【0023】下ブレーク刃8は上端にスリット2の長手
方向の頂部稜線10を備えた細長い部材で、スリット2
に挿入可能である。また上ブレーク刃7は、スリット長
手方向の底部稜線11を備えた細長い部材で、底部稜線
11を下ブレーク刃の頂部稜線10に対して定盤1の移
動方向に若干偏倚させて下ブレーク刃8と対向してい
る。
The lower break blade 8 is an elongated member having a top ridge line 10 in the longitudinal direction of the slit 2 at the upper end thereof.
Can be inserted into The upper break blade 7 is an elongated member provided with a bottom ridgeline 11 in the slit longitudinal direction, and the bottom ridgeline 11 is slightly biased in the moving direction of the surface plate 1 with respect to the top ridgeline 10 of the lower break blade. Is facing.

【0024】定盤1はサポート定盤6及び下ブレーク刃
8が下動し、スクライブカッタ5及び上ブレーク刃7が
上動した状態で、図1の左側から右側へと移動してく
る。そして最初の切断線4A(又は4)がスクライブカ
ッタ5の直下にきた位置で停止する。このときスリット
2は、サポート定盤6の直上に位置する。この位置でサ
ポート定盤6が上動してマザーガラス3の背面をサポー
トし、次いでスクライブカッタ5が下動したあとスリッ
ト長手方向に走行することにより、切目9A(又は9)
が入れられる。
The surface plate 1 moves from the left side to the right side in FIG. 1 with the support surface plate 6 and the lower break blade 8 moving downward and the scribe cutter 5 and the upper break blade 7 moving upward. Then, the first cutting line 4A (or 4) stops at a position directly below the scribe cutter 5. At this time, the slit 2 is located directly above the support surface plate 6. At this position, the support surface plate 6 moves up to support the back surface of the mother glass 3, and then the scribe cutter 5 moves down and then runs in the slit longitudinal direction to form a cut 9A (or 9).
Is inserted.

【0025】次にスクライブカッタ5が上動しサポート
定盤6が下動した後、定盤1が切断線4の間隔aに相当
する分だけ移動する。すると最初のスリットは、下ブレ
ーク刃8の直上に位置し、次のスリットがサポート定盤
6の直上にくるから、その状態で前記と同様にして2番
目の切目9を入れるとともに、下ブレーク刃8を上動さ
せて、その頂部稜線10によりマザーガラス3を切目9
A(又は9)に沿って分断する。
Next, after the scribe cutter 5 moves up and the support surface plate 6 moves down, the surface plate 1 moves by an amount corresponding to the interval a of the cutting line 4. Then, the first slit is located directly above the lower break blade 8 and the next slit is directly above the support surface plate 6. In that state, the second slit 9 is made in the same manner as described above, and the lower break blade is also formed. 8 is moved upward, and the mother glass 3 is cut by the top ridgeline 10
Divide along A (or 9).

【0026】切目が耳取り用の切目9Aであるときは、
図3に示すように下ブレーク刃8の上動と同期して上ブ
レーク刃7が下動し、偏倚した相互位置関係となってい
る頂部稜線10と下部稜線11との間で耳部分3Aに折
曲力を作用させて分断する。
When the cut is the cut 9A for ear removal,
As shown in FIG. 3, the upper break blade 7 moves downward in synchronism with the upward movement of the lower break blade 8, and the top edge line 10 and the lower edge line 11 which are in a deviated mutual positional relationship are attached to the ear portion 3A. Breaks by applying bending force.

【0027】次にスクライブカッタ5及び上ブレーク刃
7を上動し、サポート定盤1及び下ブレーク刃8を下動
させた後、定盤1をさらに切目9の間隔分aだけ移動す
る。そして同様にサポート定盤6の上動、スクライブカ
ッタ5の下動と走行及び下ブレーク刃8の上動により、
次の切目9の形成と先に設けられた切目9に沿うマザー
ガラスの分断とを行う。ブレークされる切目が中間部の
切目9であるときは、マザーガラスの切目9の両側が定
盤1に吸着保持されているので、図4に示すように、下
ブレーク刃8を上動させるのみで、マザーガラスの分断
が行われる。
Next, the scribe cutter 5 and the upper break blade 7 are moved up, the support surface plate 1 and the lower break blade 8 are moved down, and then the surface plate 1 is further moved by the distance a between the cuts 9. Similarly, by the upward movement of the support surface plate 6, the downward movement of the scribe cutter 5 and the running and lower movement of the lower break blade 8,
The next cut 9 is formed and the mother glass along the previously provided cut 9 is divided. When the cut to be broken is the cut 9 in the middle portion, both sides of the cut 9 of the mother glass are sucked and held by the surface plate 1, so that only the lower break blade 8 is moved upward as shown in FIG. Then, the mother glass is divided.

【0028】以上の動作を繰り返すことによって、マザ
ーガラス3がただ1個の定盤1上に載置保持された状態
で、切断線4に沿う切目9の形成と分断とが順次行われ
る。そしてこの間に上ブレーク刃7は定盤1の移動上流
側に若干移動する。この移動により、図5に示すよう
に、最後の耳取り部を分断するときは、最初の耳取りの
ときとは逆の折曲力を利用することができる。
By repeating the above operation, the formation of the cut 9 along the cutting line 4 and the division are sequentially performed in the state where the mother glass 3 is placed and held on only one surface plate 1. During this time, the upper break blade 7 slightly moves upstream of the surface plate 1. As a result of this movement, as shown in FIG. 5, when the last ear removal portion is divided, a bending force opposite to that at the time of the first ear removal can be used.

【0029】このようにして一方の方向の切断線に沿っ
て切断されたマザーガラスは、90度回転して同一の定
盤上に置かれ、定盤を距離b(図6)ずつ間歇的に送り
ながら上記と同様な操作で直交する方向の切断線に沿っ
て切断される。
The mother glass thus cut along the cutting line in one direction is rotated 90 degrees and placed on the same surface plate, and the surface plate is intermittently moved by a distance b (FIG. 6). While feeding, it is cut along the cutting line in the direction orthogonal to the above by the same operation.

【0030】マザーガラス3の切断線の間隔a、bが異
なる切断を行うときは、定盤1のスリット2の間隔を変
えてやらなければならない。液晶パネルの寸法は、何種
類かの大きさに限定されているので、それぞれについて
専用の定盤を準備することもできるが、図8に示すよう
に、枠12と複数枚の矩形板状部材13と複数個のスペ
ーサ14とによって定盤1を形成すれば、各種の幅の矩
形板状部材を準備しておくことにより、切断間隔の異な
る種々のマザーガラスに対応することができる。
When cutting the mother glass 3 at different intervals a and b between the cutting lines, the intervals of the slits 2 of the surface plate 1 must be changed. Since the size of the liquid crystal panel is limited to several sizes, it is possible to prepare a dedicated surface plate for each of them, but as shown in FIG. 8, the frame 12 and a plurality of rectangular plate-shaped members are used. If the surface plate 1 is formed by 13 and the plurality of spacers 14, it is possible to deal with various mother glasses having different cutting intervals by preparing rectangular plate-shaped members having various widths.

【0031】マザーガラス3に液晶パターンが斜めに印
写されていたり、マザーガラス3が定盤1上に斜めに置
かれたときに、マザーガラス3の切断を正確に行うため
には、図9、10に示すように、スクライブカッタ5の
走行を案内するガイドフレーム15や下ブレーク刃8
を、鉛直軸まわりに角度調整可能に装着する。図9にお
いては、スクライブカッタ5を案内するガイドフレーム
15が、その中央の旋回軸16まわりに旋回可能で、ガ
イドフレームの一端に設けたクロスヘッド17に螺合さ
れたネジ18をパルスモータ19で回動させることによ
って、ガイドフレーム15の角度を調整する。
In order to accurately cut the mother glass 3 when the liquid crystal pattern is printed on the mother glass 3 obliquely or when the mother glass 3 is obliquely placed on the surface plate 1, FIG. 10, the guide frame 15 and the lower break blade 8 for guiding the traveling of the scribe cutter 5 are shown.
Is mounted so that the angle can be adjusted around the vertical axis. In FIG. 9, a guide frame 15 that guides the scribe cutter 5 is rotatable about a central rotation shaft 16, and a screw 18 screwed to a crosshead 17 provided at one end of the guide frame is used by a pulse motor 19. The angle of the guide frame 15 is adjusted by rotating the guide frame 15.

【0032】また、図10では、下ブレーク刃8の昇降
を案内するケース20を、定盤1の移動方向に移動位置
決め可能なベース21上に旋回軸受22を介して装着
し、ケース20の一端に設けたクロスヘッド23に螺合
するネジ24をパルスモータ25で回転させることによ
り、下ブレーク刃8の頂部稜線10の角度を調整する。
なお図10において、ベース21を定盤1の移動方向に
移動位置決め可能としているのは、スリット2の間隔に
合わせて、スクライブ位置とブレーク位置の間隔を調整
できるようにするためである。上ブレーク刃7について
も、図9または図10に準じた構造により、角度調整を
行うことができる。
Further, in FIG. 10, a case 20 for guiding the up-and-down movement of the lower break blade 8 is mounted on a base 21 which can be moved and positioned in the moving direction of the surface plate 1 via a swivel bearing 22, and one end of the case 20 is mounted. The angle of the top ridgeline 10 of the lower break blade 8 is adjusted by rotating the screw 24 that is screwed with the crosshead 23 provided on the pulse motor 25.
In FIG. 10, the base 21 can be moved and positioned in the moving direction of the surface plate 1 so that the distance between the scribe position and the break position can be adjusted according to the distance between the slits 2. The angle of the upper break blade 7 can also be adjusted by the structure according to FIG. 9 or 10.

【図面の簡単な説明】[Brief description of drawings]

【図1】切断工程の第1段階の説明図FIG. 1 is an explanatory diagram of a first stage of a cutting process.

【図2】切断工程の第2段階の説明図FIG. 2 is an explanatory diagram of a second stage of the cutting process.

【図3】切断工程の第3段階の説明図FIG. 3 is an explanatory diagram of a third stage of the cutting process.

【図4】切断工程の第4段階の説明図FIG. 4 is an explanatory diagram of a fourth step of the cutting process.

【図5】切断工程の最終段階の説明図FIG. 5 is an explanatory diagram of the final stage of the cutting process.

【図6】マザーガラスの切断線の例を示す平面図FIG. 6 is a plan view showing an example of a cutting line of mother glass.

【図7】定盤の一例を示す斜視図FIG. 7 is a perspective view showing an example of a surface plate.

【図8】定盤の他の構造を示す分解斜視図FIG. 8 is an exploded perspective view showing another structure of the surface plate.

【図9】スクライブカッタの角度調整機構を示す模式的
な斜視図
FIG. 9 is a schematic perspective view showing an angle adjusting mechanism of a scribe cutter.

【図10】下ブレーク刃の角度調整機構を示す模式的な
斜視図
FIG. 10 is a schematic perspective view showing an angle adjusting mechanism of a lower break blade.

【図11】従来のスクライブ装置の模式図FIG. 11 is a schematic diagram of a conventional scribing device.

【図12】従来の耳取り用のブレーク刃の模式図FIG. 12 is a schematic view of a conventional break blade for ear removal.

【図13】従来のパネル分断用のブレーク刃の模式図FIG. 13 is a schematic view of a conventional break blade for dividing a panel.

【図14】マザーガラスの切断線の一例を示す平面図FIG. 14 is a plan view showing an example of a cutting line of mother glass.

【図15】マザーガラスの切断線の他の例を示す平面図FIG. 15 is a plan view showing another example of the cutting line of the mother glass.

【符号の説明】[Explanation of symbols]

1 定盤 2 スリット 5 スクライブカッタ 6 サポート定盤 7 上ブレーク刃 8 下ブレーク刃 12 枠 13 矩形板状部材 14 スペーサ 15 ガイドフレーム 1 surface plate 2 slit 5 scribe cutter 6 support surface plate 7 upper break blade 8 lower break blade 12 frame 13 rectangular plate member 14 spacer 15 guide frame

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 一方向の互いに平行な複数のスリット
(2) を備えかつ面内で当該スリットと直交する方向に往
復移動可能な定盤(1) と、定盤(1) の上方に配置され定
盤のスリット(2) と平行な方向に走行する昇降自在なス
クライブカッタ(5) と、このスクライブカッタと対向し
て定盤(1) の下方に待機し定盤(1) の停止中にスリット
(2) 内に昇降するスリット(2) の延在方向に細長いサポ
ート定盤(6) と、定盤(1) の下方にサポート定盤(6) と
の間隔を調整可能にスリット(2)と平行に配置され定盤
(1) の停止中にスリット(2) 内へ昇降する下ブレーク刃
(8) と、この下ブレーク刃と対向して定盤(1) の上方に
配置され耳取り時に下ブレーク刃(8) の上動と同期して
下動する上ブレーク刃(7) とを備え、定盤(1) は複数の
スリット(2) のそれぞれがサポート定盤(6) と対向する
位置と下ブレーク刃(8) と対向する位置とのそれぞれの
位置で停止しながら移動することを特徴とする、液晶ガ
ラス板の切断装置。
1. A plurality of slits parallel to each other in one direction.
A surface plate (1) which is equipped with (2) and is capable of reciprocating in the plane in a direction orthogonal to the slit, and which is arranged above the surface plate (1) and runs in a direction parallel to the surface plate slit (2). The scribing cutter (5) that can be moved up and down, and a slit facing the scribing cutter while standing below the surface plate (1) while the surface plate (1) is stopped.
(2) A slit (2) that can be adjusted between the support surface plate (6) that is elongated in the direction of the slit (2) that moves up and down inside the support surface (6) and the support surface plate (6) below the surface plate (1) Placed in parallel with
Lower break blade that moves up and down into the slit (2) while (1) is stopped
(8) and the upper break blade (7), which is arranged above the surface plate (1) so as to face the lower break blade and moves downward in synchronism with the upward movement of the lower break blade (8) during ear removal. Provided that the surface plate (1) moves while stopping at each of the positions where the slits (2) face the support surface plate (6) and the lower break blade (8). A device for cutting a liquid crystal glass plate.
【請求項2】 定盤(1) が、枠部材(12)と、この枠部材
に嵌装される長手方向寸法の等しい複数の矩形板状部材
(13)と、隣接する矩形板状部材(13,13) の間に所定幅の
スリット(2) を形成するスペーサ(14)とで構成されてい
る、請求項1記載の液晶ガラス板の切断装置。
2. A platen (1) comprises a frame member (12) and a plurality of rectangular plate-shaped members fitted in the frame member and having the same longitudinal dimension.
The cutting of a liquid crystal glass plate according to claim 1, comprising a (13) and a spacer (14) forming a slit (2) of a predetermined width between adjacent rectangular plate members (13, 13). apparatus.
【請求項3】 スクライブカッタ(5) の走行を案内する
ガイドフレーム(15)、下ブレーク刃(8) 及び上ブレーク
刃(7) が定盤(1) の面直角方向の軸まわりに角度調整可
能に設けられている、請求項1または2記載の液晶ガラ
ス板の切断装置。
3. A guide frame (15) for guiding the traveling of the scribe cutter (5), a lower break blade (8) and an upper break blade (7) are angle-adjusted around an axis in the direction perpendicular to the surface of the surface plate (1). The device for cutting a liquid crystal glass plate according to claim 1 or 2, which is provided so as to be possible.
JP11050596A 1996-04-05 1996-04-05 LCD glass plate cutting device Expired - Fee Related JP3834099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11050596A JP3834099B2 (en) 1996-04-05 1996-04-05 LCD glass plate cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11050596A JP3834099B2 (en) 1996-04-05 1996-04-05 LCD glass plate cutting device

Publications (2)

Publication Number Publication Date
JPH09278470A true JPH09278470A (en) 1997-10-28
JP3834099B2 JP3834099B2 (en) 2006-10-18

Family

ID=14537482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11050596A Expired - Fee Related JP3834099B2 (en) 1996-04-05 1996-04-05 LCD glass plate cutting device

Country Status (1)

Country Link
JP (1) JP3834099B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007164A1 (en) 2002-07-02 2004-01-22 Mitsuboshi Diamond Industrial Co.,Ltd. Pasted base board cutting system and base board cutting method
KR100727202B1 (en) * 2001-07-23 2007-06-13 가와사끼 쥬고교 가부시끼 가이샤 Glass plate cleaving mechanism and a trimming device
JP2007186402A (en) * 2005-12-13 2007-07-26 Honda Lock Mfg Co Ltd Method and apparatus for cutting plate glass
KR100789455B1 (en) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 Cutting method of liquid crystal display panel
KR100789454B1 (en) * 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 Cutter of liquid crystal panel and cutting method thereof
CN100421891C (en) * 2004-12-27 2008-10-01 乐金显示有限公司 Device and method for cutting substrate
JP2010173902A (en) * 2009-01-30 2010-08-12 Mitsuboshi Diamond Industrial Co Ltd Apparatus for conveying and breaking brittle material substrate
KR101160166B1 (en) * 2008-11-05 2012-06-28 세메스 주식회사 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727202B1 (en) * 2001-07-23 2007-06-13 가와사끼 쥬고교 가부시끼 가이샤 Glass plate cleaving mechanism and a trimming device
KR100789454B1 (en) * 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 Cutter of liquid crystal panel and cutting method thereof
KR100789455B1 (en) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 Cutting method of liquid crystal display panel
WO2004007164A1 (en) 2002-07-02 2004-01-22 Mitsuboshi Diamond Industrial Co.,Ltd. Pasted base board cutting system and base board cutting method
JPWO2004007164A1 (en) * 2002-07-02 2005-11-10 三星ダイヤモンド工業株式会社 Substrate cutting system and substrate cutting method for bonded substrates
CN100421891C (en) * 2004-12-27 2008-10-01 乐金显示有限公司 Device and method for cutting substrate
US7992482B2 (en) 2004-12-27 2011-08-09 Lg Display Co., Ltd. Apparatus for cutting substrate and method thereof
JP2007186402A (en) * 2005-12-13 2007-07-26 Honda Lock Mfg Co Ltd Method and apparatus for cutting plate glass
KR101160166B1 (en) * 2008-11-05 2012-06-28 세메스 주식회사 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
JP2010173902A (en) * 2009-01-30 2010-08-12 Mitsuboshi Diamond Industrial Co Ltd Apparatus for conveying and breaking brittle material substrate

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