JP2739144B2 - Rotary substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of transferring a substrate such as a semiconductor wafer or a glass plate for a liquid crystal panel to a plurality of processing equipments, supplying a required processing liquid to the transferred substrate, and cleaning the substrate and forming a thin film. The present invention relates to a rotary substrate processing apparatus for performing a rotation process on a substrate.

[0002]

2. Description of the Related Art A rotary type substrate processing apparatus of this type includes a plurality of processing apparatuses which are driven based on a substrate processing procedure to process a substrate, and a substrate transfer apparatus for transferring a substrate to each processing apparatus. As the plurality of processing devices, for example,
Rotation processing equipment that supplies various processing liquids such as photoresist, developing solution or ultrapure water to the rotated substrate and performs various rotation processing on the substrate, and heat treatment that performs heat treatment on the substrate such as a hot plate and a cool plate Equipment and the like. In addition, various control parameters such as substrate transfer order to each processing equipment, substrate processing conditions in each processing equipment and control conditions of each processing equipment (substrate rotation speed, processing temperature, specification of processing liquid to be used, processing liquid discharge amount, etc.) Etc.) are individually created in accordance with the desired substrate quality and are stored in advance in the storage device of the rotary substrate processing apparatus.

When a certain substrate processing procedure is designated, the rotary substrate processing apparatus sequentially transports the substrates to the corresponding processing equipment based on the substrate transport sequence in the designated substrate processing procedure, and transports the substrates. In each processing equipment
The processing equipment is driven based on the control parameters in the substrate processing procedure to rotate the substrate.

[0004]

By the way, when creating a new substrate processing procedure corresponding to a desired new substrate quality, each control parameter included in the substrate processing procedure, such as a heat treatment temperature, a processing liquid discharge amount, a substrate At present, the number of rotations, the deviation from a target value at the time of performing the so-called PID control, the integral amount, the differential amount, and the like are input without fail.

[0005] However, since the substrate processing procedure includes not only the above-mentioned control parameters but also various control parameters, a great deal of labor is required to create a new substrate processing procedure.

The present invention has been made to solve the above problems, and has as its object to reduce the labor required to create a new substrate processing procedure.

[0007]

Means adopted by the present invention to achieve the above object are a plurality of processing devices including a rotary processing device for performing a rotation process on a substrate using a required processing solution, Storage means for storing a plurality of substrate processing procedures including control parameters in the plurality of processing apparatuses, wherein the plurality of processing apparatuses are stored based on a substrate processing procedure designated as needed from among the stored plurality of substrate processing procedures. A rotary substrate processing apparatus that processes a substrate by controlling the processing apparatus, wherein a control parameter of the processing equipment is changed for each of the plurality of substrate processing procedures, a common parameter as a control parameter common to the plurality of substrate processing procedures. Parameter distinguishing means for distinguishing between variable parameters as possible control parameters,
Parameter input means for inputting the distinguished variable parameter, substrate processing procedure generating means for generating a substrate processing procedure including the input variable parameter and the common parameter, and storage means for storing the generated substrate processing procedure And a means for adding a substrate processing procedure to be additionally stored in the storage device.

Here, in discriminating the control parameters into the common parameters and the variable parameters, control parameters (substrate rotation speed, processing temperature, processing liquid to be used, etc.) relating to substrate processing conditions in each processing equipment which directly affects the substrate quality are used. (Designation, processing liquid discharge amount, etc.) are frequently changed parameters for each desired substrate quality, and control parameters relating to control conditions of each processing device (a deviation from a target value when performing PID control and an integral amount thereof) , The differential amount, the control range upper limit value, the lower limit value, and the like when performing the temperature control) are used as common parameters common to a plurality of substrate processing procedures because the frequency of change for each desired substrate quality is extremely low.

[0009] Even if the control parameters relating to the substrate processing conditions in each processing apparatus directly affect the substrate quality, if the frequency of change for each desired substrate quality is low, the control parameters may be common parameters for a plurality of substrate processing procedures. Is also good. In other words, the distinction between the common parameter and the variable parameter may be appropriately made according to the influence of the control parameter on the board quality, the frequency of the change, and the like.

[0010]

According to the rotary substrate processing apparatus of the present invention having the above configuration, when a variable parameter of the common parameter and the variable parameter distinguished by the parameter distinguishing means is inputted from the parameter input means, the inputted variable parameter is A substrate processing procedure including the common parameters is newly created by the substrate processing procedure creating means. Then, the newly created substrate processing procedure is added and stored in the storage means by the substrate processing procedure adding means.

That is, the input of the control parameters necessary for creating a new substrate processing procedure is covered only by the input of the variable parameters.

[0012]

Next, a preferred embodiment of the rotary substrate processing apparatus according to the present invention will be described with reference to the drawings. First, the outline of the rotary substrate processing apparatus of the present embodiment will be briefly described with reference to FIG. 1 which is a schematic perspective view of the apparatus.

The rotary substrate processing apparatus 1 is an apparatus for rotating a substrate such as a semiconductor wafer, applying a photoresist or the like to the surface of the substrate and subjecting the substrate to a heat treatment. As shown in FIG. 2 and a substrate processing unit 3.
In the following description, in order to clearly distinguish the two from each other, the former substrate supply unit 2 is referred to as a substrate transfer unit 2 and the substrate processing unit 3 is referred to as a process processing unit 3.
Shall be referred to as

The substrate transfer unit 2 takes out the substrates W from the cassettes C1 to C4 storing the substrates W in multiple stages and transfers the substrates W to a substrate transfer position P which is a substrate transfer position, or transfers the substrates W from the substrate transfer position P. Then, the substrate W is stored in one of the cassettes capable of storing the substrate.
The process processing unit 3 includes a plurality of various processing devices including a rotary processing device that supplies a required processing liquid to the substrate and performs a rotation process as described later, and drives each of the processing devices to process the substrate. I do.

Next, each of the above units will be described.
As shown in FIG. 1, the substrate transfer unit 2 includes two cassettes C1 and C2 storing the substrates W in multiple stages and two cassettes C3 and C4 not storing the substrates, on the upper surface of the cassette mounting table 4.
Is provided. Further, a substrate transfer device 6 for taking out the substrate W from each cassette or storing the substrate W in each cassette is provided so as to be horizontally movable in the direction of arrow D in the drawing along the rows of the cassettes C1 to C4.

A main operation panel 5 for giving various instructions to the substrate transfer unit 2 and a process processing unit 3 to be described later is incorporated in the front of the cassette mounting table 4. The main operation panel 5 includes a keyboard 5a (see FIG. 2) for performing various settings and numerical values, a display 5b (see FIG. 2) for displaying various screens based on instructions from the keyboard 5a, and a touch panel. A switch.

As shown in FIG. 1, the substrate transfer device 6 includes a substrate suction arm 7 for sucking and sucking the substrate W on its lower surface.
The arrow E in the drawing can move up and down along the stacking direction of the substrates W in the cassette, and extends between a standby position before the illustrated cassette and a take-out position that has entered the cassette.
Prepare to be able to move back and forth in the direction

For this reason, the substrate transfer device 6 is moved horizontally in the direction of arrow D in the figure to the front of the desired cassette,
Thereafter, the substrate suction arm 7 is raised to a height corresponding to the substrate storage groove at the desired stage in the cassette, the substrate suction arm 7 enters the cassette, the substrate suction arm 7 is slightly raised again, and the substrate suction arm 7 is moved up. Retreat, substrate suction arm 7
Are sequentially performed, the removal of the substrate W from the cassette is completed. Also, the substrate suction arm 7 is operated in the reverse order.
Is moved, the storage of the substrate W in the cassette is completed.

The substrate taken out of the cassette in this manner is transferred to the substrate transfer position P by the substrate transfer device 6, and then transferred to a substrate transfer device 37 attached to the process processing unit 3, which will be described later. It is sequentially conveyed and processed by a spin coating device or the like. The processed substrate that has been processed is returned to the substrate transfer position P by the substrate transfer device 37, and then stored in a predetermined cassette by the substrate transfer device 6.

The substrate transfer device 6 includes the substrate suction arm 7
In addition, in order to horizontally support the substrate W taken out of the cassette by the substrate suction arm 7, three support pins (not shown) are provided on the base 9 so as to be vertically movable. In order to align the center of the substrate W supported by each of the support pins, a position having four guide pins projecting from each other in an array having a curvature substantially equal to the outer diameter of the substrate W is provided. A mating plate 10 is provided on both sides of the base 9 so as to freely reciprocate horizontally. Therefore, when each alignment plate 10 is reciprocated horizontally while the substrate W is supported by the support pins raised from the base 9, each guide pin comes into contact with and separates from the outer periphery of the substrate W. The center alignment of W is completed.

Further, on the upper surface of the cassette mounting table 4, a cassette number containing substrates to be processed, a procedure number numerical code required for specifying a substrate processing procedure, a processing order in cassette units, and the like are input. A cassette control panel 18 (see FIG. 2) is provided. Further, an optical sensor 24 (see FIG. 2) for detecting a substrate for detecting the presence or absence of the substrate W stored in each cassette is provided. The optical sensor 24 includes the optical sensor elevating mechanism 2
5 (see FIG. 2), during the ascent along the cassette, the presence or absence of the substrate in the cassette is collectively detected in association with the number of substrate storage grooves in the cassette. The correspondence with the number of steps of the substrate storage groove is performed using a pulse generated by the timing detection sensor 42 (see FIG. 2) based on the movement state of the slit having the same pitch as the substrate storage groove of the cassette.

A process processing unit 3 for receiving a substrate from the substrate transfer unit 2 and processing the substrate is shown in FIG.
As shown in Fig. 5, spin coating devices 31 and 32 for forming a processing liquid thin film by dropping a processing solution on the surface of a rotating substrate, and a heat treatment device for heat-treating (heating and cooling) the substrate before and after performing the processing by the spin coating device. 33, 34 and 35 are provided. Furthermore,
Each spin coating device 31, 32 and heat treatment device 33, 34,
A substrate transfer device 37 is provided which is horizontally movable in the direction of arrow A in FIG. As shown in the figure, each heat treatment device includes a heating heat treatment device in an upper stage and a cooling heat treatment device in a lower stage.

Each of these spin coating equipment and heat treatment equipment are:
It includes a controller (described later) that receives loads of various control parameters in the substrate processing procedure from a main controller 50 (see FIG. 2) described later, a rotation speed sensor, a temperature sensor, and the like (not shown). Then, based on the detection signals of these sensors and the control parameters (control command values) related to the processing conditions in the substrate processing procedure, which will be described later, each spin coating device and the heat treatment device are fed back by a controller attached to each processing device. Is controlled.

The substrate transporting device 37 has a head 39 which can be turned in the direction of arrow B in the figure on the upper surface of a stage 38 which can be moved horizontally in the direction of arrow A by a drive system (not shown). -Shaped substrate support arms 37a, 3
7b is provided in two upper and lower stages. Each of the substrate support arms 37a and 37b is configured to be able to move in and out of the head 39.

The process processing unit 3 having the above configuration drives and controls the substrate transfer device 37 based on the transfer process in a predetermined substrate processing procedure, and moves the substrate transfer device 37 from the substrate transfer position P in the substrate transfer unit 2 to the above-mentioned rotary coating device. The substrates are sequentially transferred to necessary processing equipment among the plurality of processing equipment. Then, the substrate is processed based on the processing conditions in the substrate processing procedure by a rotary coating device or the like to which the substrate has been transported, and the processed substrate that has been processed by each transported processing device is returned to the substrate transfer position P I do.

Next, a control system in the rotary substrate processing apparatus 1 will be described with reference to a block diagram shown in FIG. The control system according to the present embodiment includes a main controller 50 that integrally controls the entire rotary substrate processing apparatus 1.
In addition, as its sub-controllers, a board transfer unit controller 60 for controlling the board transfer unit 2;
A substrate transport device controller 37A, which is a controller for each processing device constituting the process processing unit 3,
A spin coating device controller 31A for each spin coating device,
32A and heat treatment equipment controller 3 for each heat treatment equipment
3A, 34A and 35A.

The main controller 50 comprises a well-known CPU 51 for executing a logical operation, a ROM 52 for storing various programs for controlling the CPU in advance, and a RAM 53 for temporarily storing various data as a logical operation circuit. In addition, a storage disk 54 that can write and hold data at any time and stores a large amount of data described later in advance is built in.

Then, the main controller 50
The input / output port 56 connected to the CPU or the like via a common bus 55 allows input / output with the outside, for example,
Data is transferred between the main operation panel 5, the substrate transfer unit controller 60, the substrate transfer device controller 37A, and the controllers 31A to 35A for each processing device.

The board transfer unit controller 60 is connected to the board transfer device 6, the cassette control panel 18, the light sensor elevating mechanism 25, and the like, in addition to the optical sensor 24 and the timing detection sensor 42. Then, the arithmetic operation data obtained by the controller and the signals from the sensors and the cassette control panel 18 are output to the main controller 50. The cassette control panel 18, optical sensor 24, timing detection sensor 42, optical sensor elevating mechanism 25, etc.
Are provided in each of the four cassettes C1 to C4 on the upper surface of the substrate, and each is connected to the substrate transfer unit controller 60.

Next, a description will be given of a substrate processing procedure for controlling the driving of each of the above processing equipment. There are a plurality of types of substrate processing procedures. As shown in FIG. 3, each of them corresponds to a procedure number numerical code for specifying each substrate processing procedure and a control parameter related to a processing condition or a control condition in each processing device. In addition, it is written and stored in the storage disk 54 in advance.

More specifically, as shown in FIG. 3, for each procedure number numerical code, a process symbol representing a process in each process step and a processing device for performing the process are provided for each necessary process step. , Data relating to the control parameters in the process.

That is, the symbols in the column of process symbols in each processing step correspond to the respective process names, the process symbol AD indicates a heating process before application of the processing solution, AC indicates a cooling process before application of the processing solution, SC Represents a treatment liquid application step, and SB represents a heating step after treatment liquid application. Further, when a plurality of processing devices (processing devices 1, 2,...) Are written in the same processing step (the heat treatment devices 33a, 34a for the processing step 1 in the procedure number numerical code 01).
Indicates that processing may be performed by any of the processing devices.
However, the smaller the numerical value of the processing device, the higher the priority. For example, in the case of the procedure number numerical code 01, the heating heat treatment equipment 33a in the column of the processing equipment 1 is preferentially used, and if the heating heat treatment equipment 33a cannot be used as it is being processed, the processing equipment 2 Is used.

The processing steps other than the processing step 3 are heat treatment steps before and after the application of the processing liquid as can be seen from the process symbols AD, AC, SB, etc., and as described in the processing condition column, the corresponding processing equipment Is provided with numerical data representing various control parameters (control command values) such as a processing temperature and a processing time in controlling the control.

Processing step 3 of each processing step is as follows:
As can be seen from the process symbol SC, this is a processing liquid application step using a rotary processing device. Since the processing liquid application is repeatedly performed, the processing steps are further divided into a first step portion, a second step portion,. Has partitioned data.

That is, in the processing step 3, which is a processing liquid application step, the processing liquid is applied while rotating the substrate, so that a plurality of types of processing liquids to be used are specified, the processing speed, the rotational acceleration, and the processing liquid discharge time ( In addition to being executed based on a number of control parameters (control command values) such as a discharge amount, a rotation process using a different processing liquid (chemical liquid) is repeatedly performed. For this reason, the processing step 3 is provided with many types of condition data, which is much more than the other processing steps, but it is designed so that all of them can be stored without any trouble.

As described above, a plurality of types of substrate processing procedure condition data are recorded on the storage disk 54, including a huge amount of processing condition data. Then, when a certain procedure number numerical code, for example, a procedure number numerical code of 00 is designated, the substrate processing procedure at this time is first to perform a heat treatment by the heating heat treatment equipment 33a before applying the processing liquid (processing step 1). Next, a cooling process is performed by the cooling heat treatment device 33b (processing step 2), and subsequently, a processing solution coating process is performed by the spin coating device 32 (processing step 3), and a heating process after the processing solution coating is performed. This is performed by the heating heat treatment device 35a (processing step 4). Of course, if the data is created and stored in the processing steps 5 and subsequent steps, the processing is performed according to the data.

The above-described control parameters that directly affect the substrate quality such as the substrate rotation speed and the processing temperature (hereinafter, these control parameters are referred to as process parameters) can be changed as needed for each substrate processing procedure. In the heat treatment steps such as the processing steps 1, 2, 4, etc., the substrate surface temperature is set in consideration of the difference between the temperature of the plate constituting the heat treatment equipment and the actual substrate surface temperature in addition to the set processing temperature. Correction amount for temperature (estimated correction amount of substrate temperature)
Are also stored as control parameters.

Control parameters relating to control conditions and the like for maintaining the control state of each processing apparatus at the control state indicated by the above process parameters (hereinafter, these control parameters are referred to as initial parameters) are changed for each desired substrate quality. Although the need to perform the process is extremely low and is common to a plurality of substrate processing procedures, it can be changed similarly to the above process parameters.

The initial parameters include a deviation from a target value when PID control is performed on the processing equipment, an integral amount and a differential amount thereof, a control range upper limit value when performing substrate processing,
In addition to the control conditions such as the lower limit value, parameters that contribute to the maintenance of the equipment by notifying the occurrence of abnormal situations in each processing equipment, for example, temperature abnormalities, rotation abnormalities, etc. (alarm upper / lower limit temperature, alarm upper / lower limit) Rotation speed, etc.).

The storage disk 54 stores, in addition to the data relating to a plurality of types of substrate processing procedures described above, a step for each processing content in each substrate processing procedure, for example, a heat treatment step, a processing liquid application step, and the like. An initial parameter map as shown in FIG. 4 in which the initial parameters are associated with the parameter values is stored. The initial parameters are stored for each process such as a heat treatment process and a process liquid application process, and are included together with the process parameters for each process step in the substrate processing procedure.

It should be noted that the initial parameters may be stored for each process such as the heat treatment process and the process liquid application process without associating with the respective process steps in the substrate processing procedure.
In this case, data for reading initial parameters is written in the data column of each processing step in the substrate processing procedure of FIG. 3, and the initial data may be read based on the data each time the substrate processing is performed.

As shown in FIG. 4, temperature control parameters P (deviation), temperature control parameter I (integral amount), and temperature control parameter D (differential Amount),
Upper and lower limit parameters of the appropriate processing temperature control range centered on the set processing temperature, and abnormalities for judging and reporting the occurrence of temperature abnormalities (excessive temperature increase state or non-heated state to the set processing temperature) Notification temperature upper and lower limit parameters are included. Initial parameters (a0, b0, etc.) are set in advance for these initial parameters. Further, as initial parameters in the treatment liquid application step,
In addition to the parameters for performing PID control of the spin coating device, upper and lower limit parameters of an appropriate control range centered on the set processing liquid temperature and the set substrate rotation speed, and for notifying processing liquid temperature abnormality and substrate rotation abnormality. Abnormality upper and lower limit parameters and the like.

Writing of data to the storage disk 54 is performed by inputting data from the main operation panel 5 as described later. Further, in an external storage device 70 (see FIG. 2) for writing and storing data in a storage medium such as a magnetic tape or a flexible disk, the above-described data input is performed in advance, and then the input / output port 56 from the external storage device 70 is connected. Data may be written to the storage disk 54 by data transfer via the like.

An instruction to select a desired substrate processing procedure from among the plurality of substrate processing procedures stored in this way is made by operating the key input operation of the numerical value of the procedure number numerical code on the cassette control panel 18 or the main operation panel 5 or the like. Is executed by

When the procedure number numerical code is designated when starting the substrate processing, the parameters (process parameters and initial parameters) in each processing step of the corresponding substrate processing procedure are sent from the main controller 50 to the corresponding processing equipment. Loaded to the attached controller. For example, when a procedure number numerical code of 00 is designated, each parameter in the processing step 1 and the processing step 2 is loaded into the heat treatment equipment controller 33A attached to the heat treatment equipment 33 having the heat treatment equipment 33a for heating and the heat treatment equipment 33b for cooling. . Similarly, each parameter in the processing step 3 is loaded to the spin coating device controller 31A attached to the spin coating device 31, and each parameter in the processing step 4 is set to the heating heat treatment device 35a.
Is loaded into the heat treatment equipment controller 35A attached to the heat treatment equipment 35 having

Each of the controllers 37A, 31A to 35A, which have received the loaded control parameters, performs the substrate processing while performing feedback control of each processing device based on the loaded control parameters and the detection signals from the sensors. The controller attached to each processing device is a well-known CPU, RO, similar to the main controller 50.
Although it is configured as a logical operation circuit mainly with M, RAM, etc., the description thereof is omitted.

Next, the control for creating a substrate processing procedure performed by the rotary substrate processing apparatus 1 of the present embodiment having the above-described configuration will be described with reference to the flowcharts of FIGS.
The flowchart of FIG. 5 is an initial parameter setting routine that is executed every time a predetermined key operation of the keyboard 5a for setting initial parameters or an operation of a touch switch or the like on the main operation panel 5 (initial parameter setting ON operation) is performed. Represents The flowchart in FIG. 6 shows a new substrate processing procedure creation routine that is executed every time the new substrate processing procedure creation ON operation is performed by the touch switch or the like.

In the initial parameter setting routine, as shown in the flowchart of FIG. 5, when the initial parameter setting ON operation is performed, first, a process for each processing content for editing the initial parameters, for example, a heat treatment process, a process liquid application. Whether or not a process such as a process is designated is determined by a predetermined key operation on the keyboard 5a or the main operation panel 5.
Is determined based on the presence or absence of an operation of a touch switch or the like in step (step 100, hereinafter, step is simply referred to as S). Then, it waits until a processing step is designated. In the following description of the initial parameter setting routine, the case where the heat treatment step is specified in S100 will be described.

Thereafter, initial parameters relating to the designated step (heat treatment step) are read from the initial parameter map shown in FIG. 4 (S110), and displayed on the display 5b as shown in FIG. 7 (S120). In the display, the uppermost character string (temperature control parameter P) is highlighted in the initial screen so as to sequentially prompt the user to change the initial parameters.

After the initial screen is displayed, whether or not it is necessary to change the parameter value of each initial parameter in the processing step (heat treatment step) specified in S100 is determined by whether or not a numeric key is input from the numeric keypad on the keyboard 5a. The determination is made based on the presence or absence of the pressing operation of the touch switch (the next screen, the top menu, the end of the editing work) on the operation panel 5 (S130). Here, if there is a numeric key input, it is determined that the parameter value of the initial parameter needs to be changed, and the flow shifts to the next S140. The processing when each of the touch switches is pressed will be described later.

If there is a numeric key input in S130, it is determined that the parameter value in the highlighted character string is to be changed, and the input numeric value is updated as a new parameter value in the highlighted character string, and this is updated. It is stored (S140). That is, the initial parameter map in FIG. 4 is rewritten. Then, the process proceeds to S130.

For example, if the numerical value of a1 is input while the uppermost character string is highlighted (initial screen), it is determined that the parameter value a0 is changed to the input numerical value a1, and the temperature control parameter P The parameter value is updated to a1 and stored (S140). As described above, if the parameter value is changed in the uppermost character string that has been reversely displayed, the reverse display column is displayed so as to prompt the user to change the initial parameter in the next character string (temperature control parameter I). Is the character string of the next stage (temperature control parameter I). If there is a numeric key input again in S130 after the shift, the parameter value in the character string (temperature control parameter I) of the next highlighted line is changed to the input numerical value and stored.

Before inputting the numeric keys, the main operation panel 5
When the down arrow key (not shown) is pressed,
It is determined that it is not necessary to change the parameter value in the inverted character string, and the inverted character string is used as the character string of the next stage, and the change of the initial parameters in the next stage is prompted.

That is, by repeating the processing of S130 and S140, the setting of the parameter values for all the initial parameters in the processing step (heat treatment step) specified in S100 is completed. More specifically, the setting of the parameter values for the displayed six initial parameters is completed. The setting of a parameter value means that either the corresponding parameter value is changed or held.

On the other hand, in step S130, a touch switch (next screen,
When either the top menu or the end of the editing operation is pressed, it is determined that the setting of the parameter values for all the initial parameters in the processing step (heat treatment step) specified in S100 is completed, and the processing is performed based on each switch. Perform

That is, if the touch switch is depressed in place of the numerical input in S130, the process proceeds to S131. In S131, it is determined whether the depressed touch switch is the next screen. For example, in the processing of this routine, a control signal for displaying a screen for setting initial parameters in the next processing step is output. For this reason, when the next screen switch is pressed, it is determined that the parameter values of the initial parameters are to be set in the next processing step, for example, the processing liquid application step, etc. Perform processing.

In S131, if the pressed touch switch is not the next screen, that is, if the touch switch for ending the top menu or the editing operation is pressed, the initial parameter setting routine shown in FIG. 5 is ended. I do. The top menu switch outputs a control signal for ending the current routine and displaying a screen for selecting this routine or another routine (not shown). And outputs a control signal indicating that the editing operation has been completed. Therefore, when these two switches are pressed, it is determined that the setting of the parameter values for all the initial parameters in all the processing steps including the processing step (heat treatment step) specified in S100 is completed. To end.

Next, a routine for creating a new substrate processing procedure will be described with reference to the flowchart of FIG. As shown in the flow chart of FIG. 6, when the new substrate processing procedure creation ON operation is performed, the new substrate processing procedure creation routine first sets processing parameters (variable parameters), specifically, a processing step. It is determined whether or not the processing steps such as the processing steps 1 and 2 in FIG. 3 are designated based on the presence or absence of a predetermined key operation of the keyboard 5a or an operation of a touch switch or the like on the main operation panel 5 (S200). Then, it waits until a processing step is specified. Note that, in the following description of the new substrate processing procedure creation routine, this S200
The case where a heat treatment step (one of the processing steps 1, 2, 4, and the like in FIG. 3) which is one of the heat treatment steps is designated will be described.

Thereafter, a parameter setting screen for prompting the user to set all process parameters related to the designated processing step (heat treatment step) is displayed on the display 5b as shown in FIG. 8 (S210). As shown in the figure, the display screen shows initial parameters set for the heat treatment step which is a step related to this heat treatment step in the initial parameter setting routine described above, and process parameters to be set (heat treatment temperature, heat treatment time, heat treatment-related non-treatment time). , Heat treatment related processing time,
(Estimated correction amount of substrate temperature).

In the initial screen, an initial value 0 is displayed as the parameter value of each process parameter. Here, the heat treatment-related processing time means
When performing other processing in parallel with the heat treatment, for example, when applying the processing liquid to the substrate surface while performing the heat treatment or irradiating with ultraviolet rays or the like, these parallel treatments (application of the treatment liquid, ultraviolet irradiation, etc.) are performed. Time. The heat treatment-related no-processing time defines the start timing of these parallel processes. That is, after the heat treatment is started, after the time specified by the heat treatment-related non-processing time has elapsed, the parallel processing is performed for the time specified by the heat treatment-related processing time. The substrate temperature expected correction amount is, as described above,
This is a correction amount (correction temperature) for setting the substrate surface temperature to the set processing temperature in consideration of the difference between the ambient temperature and the actual substrate surface temperature.

After this screen is displayed, it is determined whether or not a numeric key has been input from the numeric keypad on the keyboard 5a in order to set a desired numerical value for the parameter value of each process parameter in the processing step (heat treatment step) specified in S200. (S220), and waits for a numeric key input.

Here, if there is a numeric key input, the parameter value of the process parameter (heat treatment time) at the top is rewritten to the input numerical value and stored (S23).
0). At this time, the input numerical value is also displayed on the display screen.

Thereafter, it is determined whether or not parameter values have been set for all the process parameters in the processing step (heat treatment step) designated in S200 (S240). If the parameter value setting for is not completed, the process proceeds to S220.

That is, by repeating the processing of S220 and S230, the setting of the parameter values for all the process parameters in the processing step (heat treatment step) specified in S200 is completed. Specifically, the setting of the parameter values for the five displayed process parameters is completed.

When it is determined in S240 that the setting of the parameter values has been completed for all the process parameters, the parameter values of the process parameters are set for all the processing steps including the processing step (heat treatment step) specified in S200. It is determined whether or not has been completed (S250). This determination is made by pressing the next screen switch or the editing work end switch described above. That is, when the next screen switch is pressed, it is determined that the parameter values of the process parameters are set in the next processing step, for example, processing step 3 (processing liquid application step) in FIG. 3, and the process proceeds to S200. The following processes described above are performed.

On the other hand, when the editing work end switch is pressed, the affirmative judgment is made in S250 that the setting work of the parameter values for all the process parameters in all the processing steps shown in FIG. 3 is completed. Note that, even if the editing operation end switch is pressed before the parameter value setting input for all the process parameters (five types) in FIG. 8 is completed, an affirmative determination is not made in S250, and an operation error is processed.

When the setting of the parameter values for all the process parameters in all the processing steps shown in FIG. 3 is completed, it is determined whether or not the procedure number numerical code has been input by inputting numerical keys from the ten keys on the keyboard 5a. (S260), and waits until the numeric key is input. If there is a numerical key input, the input numerical value is stored as a procedure number numerical code, and the initial parameter data for each process is updated and stored in the above-described initial parameter setting routine (FIG. 4). Is read (S270).

Then, based on the read initial parameter values and the process parameters set for each processing step as described above, data is constructed for each processing step to create a new substrate processing procedure. This is added to the storage disk 54 and stored in association with the procedure number numerical code input in S270 (S2
80). That is, the substrate processing procedure data shown in FIG.
Data for the record (all data relating to a new substrate processing procedure) is added. Thereafter, the processing of this routine ends.

As described above, according to the rotary substrate processing apparatus 1 of the present embodiment, the process parameters are set only for each processing step required for new substrate processing.
Since a new substrate processing procedure can be created, the labor is significantly reduced.

Further, in this embodiment, since the initial parameters common to the substrate processing procedure are also set, the processing equipment can be finely controlled for various kinds of substrate processing. As a result, for example, the stability of the substrate quality can be improved by providing the upper and lower limits of the appropriate processing temperature control range centered on the set processing temperature.

Although the embodiment of the present invention has been described above, the present invention is not limited to such an embodiment, and can be implemented in various modes without departing from the gist of the present invention. Of course. For example, in the above embodiment, the correction amount for setting the substrate surface temperature to the set processing temperature was set as the process parameter in consideration of the difference between the ambient temperature and the actual substrate surface temperature, but this parameter was set as the initial parameter. Is also good. In addition, although the initial parameters are set, the initial parameters may be fixed and not changed.

[0072]

As described above, according to the rotary substrate processing apparatus of the present invention, of all the control parameters for each processing step required for substrate processing, common to the substrate processing procedure for determining the substrate processing. A new substrate processing procedure can be created only by inputting parameters other than the parameters to be processed. As a result, there is no need to input the setting of the common parameters for each processing step, and it is possible to reduce the labor for creating a new substrate processing procedure.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a rotary substrate processing apparatus 1 according to an embodiment.

FIG. 2 is a block diagram of a control system centered on a main controller 50 in the rotary substrate processing apparatus 1.

FIG. 3 is an explanatory diagram for explaining a substrate processing procedure when a substrate is rotated by a process processing unit 3;

FIG. 4 is an explanatory diagram for explaining a process in the substrate processing procedure and an initial parameter setting routine.

FIG. 5 is a flowchart showing an initial parameter setting routine.

FIG. 6 is a flowchart illustrating a routine for creating a new substrate processing procedure.

FIG. 7 is an explanatory diagram for describing processing in a new substrate processing procedure creation routine.

FIG. 8 is an explanatory diagram for explaining processing in a new substrate processing procedure creation routine.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 rotary substrate processing apparatus 2 substrate transfer unit 3 process processing unit 4 cassette installation table 5 main operation panel 5b display 50 main controller 60 substrate transfer unit controller C1, C2, C3, C4 cassette W substrate

Claims (1)

(57) [Claims] A storage means for storing a plurality of processing apparatuses including a rotation processing apparatus for performing a rotation processing on a substrate using a required processing liquid, and a plurality of substrate processing procedures including control parameters in the plurality of processing apparatuses. A rotary substrate processing apparatus configured to control the plurality of processing apparatuses and process substrates based on a substrate processing procedure designated as needed from among the stored plurality of substrate processing procedures, wherein the processing apparatus Parameter discriminating means for discriminating the control parameters of the above into a common parameter as a control parameter common to the plurality of substrate processing procedures and a variable parameter as a control parameter changeable for each of the plurality of substrate processing procedures; Parameter input means for inputting the input variable parameter, and creating a substrate processing procedure including the input variable parameter and the common parameter. A rotary substrate processing apparatus, comprising: a substrate processing procedure creating unit that stores the created substrate processing procedure in the storage unit;