JP2735853B2 - Substrate extrusion equipment - Google Patents

Substrate extrusion equipment

Info

Publication number
JP2735853B2
JP2735853B2 JP1008377A JP837789A JP2735853B2 JP 2735853 B2 JP2735853 B2 JP 2735853B2 JP 1008377 A JP1008377 A JP 1008377A JP 837789 A JP837789 A JP 837789A JP 2735853 B2 JP2735853 B2 JP 2735853B2
Authority
JP
Japan
Prior art keywords
substrate
board
magazine
chute
extruder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1008377A
Other languages
Japanese (ja)
Other versions
JPH02188328A (en
Inventor
隆 須長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Denki Co Ltd
Original Assignee
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Denki Co Ltd filed Critical Sanyo Denki Co Ltd
Priority to JP1008377A priority Critical patent/JP2735853B2/en
Publication of JPH02188328A publication Critical patent/JPH02188328A/en
Application granted granted Critical
Publication of JP2735853B2 publication Critical patent/JP2735853B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Special Conveying (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は、供給マガジンに収納されたプリント基板を
順次下流側装置へ供給する基板押出装置に関する。
The present invention relates to a substrate extruder for sequentially supplying printed boards stored in a supply magazine to a downstream device.

(ロ)従来の技術 従来技術として、本出願人が先に出願した特願昭63−
121063号に添付した明細書等に開示されている通り、基
板収納箱(本発明による供給マガジン)内に収納された
プリント基板を基板押出プッシャ(同じく基板押出装
置)により下流側装置へ供給していた。
(B) Conventional technology As a conventional technology, Japanese Patent Application No.
As disclosed in the specification attached to No. 121063 and the like, a printed circuit board stored in a substrate storage box (supply magazine according to the present invention) is supplied to a downstream device by a substrate extrusion pusher (also a substrate extrusion device). Was.

然し乍ら、前記基板の略中央部をプッシャにより押し
ていたため、基板の押し出し方向に長い基板を押し出す
場合、ストロークの長いプッシャが必要となり、そのた
めプッシャ先端での振れやプッシャ自体の自重によるプ
ッシャの倒れ等が発生して正常の基板の押し出しが出来
なかった(複数枚基板の同時押し出し、下段基板の押し
出し等)。また、プッシャ戻り時の下段基板引っ掛け等
があった。
However, since the substantially central portion of the substrate is pushed by the pusher, a long stroke pusher is required when pushing out a long substrate in the pushing direction of the substrate. Occurred and normal board extrusion was not possible (simultaneous extrusion of multiple boards, extrusion of lower board, etc.). In addition, the lower substrate was hooked when the pusher returned.

(ハ)発明が解決しようとする課題 従って、押し出し方向に長い基板でも確実に押し出す
ことが出来るようにすることである。
(C) Problems to be Solved by the Invention Accordingly, it is an object of the present invention to ensure that even a substrate that is long in the extrusion direction can be extruded.

(ニ)課題を解決するための手段 そこで本発明は、供給マガジンに収納されたプリント
基板を順次下流側へ供給する基板押出装置であって、基
板供給時にガイド体にガイドされた基板の両側端部に当
接して前記ガイド体にガイドされ乍ら該基板を押し出す
と共に基板の幅寸法に合わせるべくその間隔が可変にな
された一対の押出棒を設けたものである。
(D) Means for Solving the Problems Therefore, the present invention is a substrate extruder for sequentially supplying printed boards stored in a supply magazine to a downstream side, wherein both end portions of a substrate guided by a guide body during substrate supply. A pair of push rods are provided in which the substrate is pushed out while being guided by the guide body in contact with the portion, and the distance between the push rods is made variable to match the width of the substrate.

また本発明は、直積マガジンに収納されたプリント基
板を吸着パッドで取り出しシュートに支持させた後、該
基板を下流側装置へ供給する基板押出装置であって、基
板供給時にシュートに支持された基板の両側端部に当接
して前記シュートの支承部に支持され乍ら該基板を押し
出す一対の押出棒を設けたものである。
Further, the present invention is a substrate extruding apparatus which takes out a printed board stored in a direct-stack magazine with an adsorption pad, supports the taken-out board on a chute, and then supplies the board to a downstream device. Are provided with a pair of push rods for pushing out the substrate while being supported by the support portion of the chute in contact with both side ends of the push rod.

(ホ)作用 以上の構成により、供給マガジンに収納されたプリン
ト基板は一対の押出棒により基板の両側端部がガイド体
にガイドされ乍ら押し出される。しかも、基板の種類が
異なり幅寸法が異なることとなってもガイド体の間隔を
基板に合わせて変更でき、両側端部に当接できる。
(E) Operation With the above configuration, the printed circuit board housed in the supply magazine is pushed out by a pair of push rods while both end portions of the board are guided by the guide body. In addition, even if the types of the substrates are different and the widths are different, the interval between the guides can be changed according to the substrate, and the ends can be in contact with both ends.

また、直積マガジンから吸着パッドで取り出され、シ
ュートの支承部に支持されたプリント基板も一対の押出
棒により基板の両側端部が支承部に支持され乍ら押し出
される。
Also, the printed board taken out of the magazine by the suction pad and supported by the support portion of the chute is pushed out by a pair of push rods while both ends of the substrate are supported by the support portion.

(ヘ)実施例 以下、本発明の一実施例について図面に基づき詳述す
る。
(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1)は供給マガジンとしての段積マガジンで、対を
成すガイド体としての固定側基板ガイド溝(2)及び可
動側基板ガイド溝(3)に基板(4)がガイドされて収
納されている。尚、前記マガジン(1)は図示しないリ
フター機構により後述する図示しない基板供給装置の基
板押出装置(5)による基板押し出し位置に次回押し出
される基板(4)が来るように上下動される。
(1) is a stack magazine as a supply magazine, and a substrate (4) is guided and housed in a fixed-side substrate guide groove (2) and a movable-side substrate guide groove (3) as a pair of guide bodies. . The magazine (1) is moved up and down by a lifter mechanism (not shown) so that a substrate (4) to be pushed next time comes to a substrate pushing position by a substrate pushing device (5) of a substrate supply device (not shown).

以下、前記基板押出装置(5)について詳述する。 Hereinafter, the substrate extruder (5) will be described in detail.

(6)はロッドレスシリンダー(7)を利用した前記
基板(4)を図示しない下流側装置へ押し出す基板押出
部で、該ロッドレスシリンダー(7)は基板供給装置本
体に設けられた基板押出部取付板(8)に立設されたロ
ッドレスシリンダー固定ブロック(9)(10)に取り付
けられている。尚、(11)はロッドレスシリンダー
(7)の配管用シャフトである。
(6) is a substrate extruding unit for extruding the substrate (4) using a rodless cylinder (7) to a downstream device (not shown), and the rodless cylinder (7) is a substrate extruding unit provided in a substrate supply device main body. It is attached to a rodless cylinder fixing block (9) (10) erected on the attachment plate (8). Incidentally, (11) is a pipe shaft of the rodless cylinder (7).

(12)(13)は前記ロッドレスシリンダー(7)によ
る基板押出部(6)の移動をガイドするガイドピンで、
前記ロッドレスシリンダー固定ブロック(9)(10)と
同様に基板押出部取付板(8)に立設されたガイドピン
固定ブロック(14)(15)(16)(17)に取り付けられ
ている。
(12) and (13) are guide pins for guiding the movement of the substrate pushing section (6) by the rodless cylinder (7).
Like the rodless cylinder fixing blocks (9) and (10), they are mounted on guide pin fixing blocks (14), (15), (16) and (17) which are erected on the board extruding portion mounting plate (8).

(18A)(18B)は基板押出部取付板(8)に立設され
た前記ロッドレスシリンダー(7)のスライド部(19)
の往復移動端を検出するストロークエンド検出近接スイ
ッチである。
(18A) and (18B) are slide portions (19) of the rodless cylinder (7) erected on the board extruding portion mounting plate (8).
Is a stroke end detection proximity switch for detecting a reciprocating end of the switch.

(20)(21)は前記スライダー部(19)のオーバーラ
ン用ショックアブソーバである。
(20) and (21) are shock absorbers for overrun of the slider portion (19).

以下、前記基板押出部(6)について詳述する。 Hereinafter, the substrate pushing section (6) will be described in detail.

(22)(23)は前記マガジン(1)内の基板(4)の
両側端部に当接して押し出す固定側、可動側の押出棒
で、両先端部に設けられた当接部(22A)(23A)がガイ
ド溝(2)(3)に入り込んで該溝(2)(3)に沿っ
て支承されながら基板(4)を押し出す。
(22) and (23) are fixed-side and movable-side push rods which come into contact with and push both side ends of the substrate (4) in the magazine (1), and contact portions (22A) provided at both ends. (23A) enters the guide grooves (2) and (3) and pushes out the substrate (4) while being supported along the grooves (2) and (3).

(24)は前記押出棒(22)(23)の中間部に平行に設
けられたガイド棒で、該ガイド棒(24)には夫々の間隔
が遠近移動される移動体(25)(26)が遊挿されてお
り、該移動体(25)(26)からは夫々前記押出棒(22)
(23)へ該押出棒(22)(23)の自重による振れや倒れ
等を防止できるように、及び両押出棒(22)(23)の幅
間隔を固定するための補助プレート(27)(28)(29)
(30)が回動可能に掛け渡されている。尚、固定側の押
出棒(22)には、該押出棒(22)に当接して振れや倒れ
等を防止する振れ防止ローラ(55)(56)が設けられて
いる。
(24) is a guide rod provided in parallel with the intermediate portion of the push rods (22) and (23), and the guide rod (24) is a moving body (25) (26) whose distance is moved far and near. The push rods (22) are respectively inserted from the moving bodies (25) and (26).
(23) Auxiliary plates (27) (27) () for preventing the extruded rods (22) and (23) from swaying or falling due to their own weight, and for fixing the width interval between the extruded rods (22) and (23). 28) (29)
(30) is rotatably extended. The fixed-side push rod (22) is provided with run-out preventing rollers (55) and (56) that come into contact with the push-out rod (22) to prevent run-out, fall, and the like.

(31)は前記押出棒(22)(23)の幅間隔を調整する
押出棒幅調整スライド機構(32)のスライド板で、固定
側の押出棒(22)が取り付けられた固定プレート(33)
と、押出棒幅調整移動の終端である終端プレート(34)
とが、該スライド板(31)の両端部に立設されている。
また、該両プレート(33)(34)間には前記ガイド棒
(24)が取り付けられたガイド棒固定プレート(35)
と、可動側の押出棒(23)が取り付けられた可動プレー
ト(36)とが設けられている。
(31) is a slide plate of an extrusion rod width adjusting slide mechanism (32) for adjusting the width interval of the extrusion rods (22) and (23), and is a fixed plate (33) to which the extrusion rod (22) on the fixed side is attached.
And the end plate (34) that is the end of the push rod width adjustment movement
Are erected at both ends of the slide plate (31).
A guide rod fixing plate (35) having the guide rod (24) mounted between the plates (33) and (34).
And a movable plate (36) to which a movable push rod (23) is attached.

そして、前記固定プレート(33)と終端プレート(3
4)とを貫通した状態でガイドピン(37)(38)が固定
プレート(33)と終端プレート(34)とに固定され、ま
た幅調整用螺子軸(39)は固定プレート(33)と終端プ
レート(34)とに夫々図示しないベアリングを介して固
定され、ガイド棒固定プレート(35)は該螺子軸(39)
に遊挿され、可動プレート(36)は螺子軸(39)に螺入
されている。
Then, the fixing plate (33) and the end plate (3
The guide pins (37) and (38) are fixed to the fixed plate (33) and the end plate (34) while the screw pin (39) for width adjustment is fixed to the fixed plate (33) and the end while passing through The guide rod fixing plate (35) is fixed to the plate (34) via a bearing (not shown).
The movable plate (36) is screwed into the screw shaft (39).

以下、動作について詳述する。 Hereinafter, the operation will be described in detail.

段積マガジン(1)のガイド溝(2)(3)にガイド
され収納されている基板(4)を図示しない駆動源によ
りロッドレスシリンダー(7)を駆動させることにより
下流側装置へ供給する。即ち、ロッドレスシリンダー
(7)の駆動によりスライド板(31)が取り付けられた
スライド部(19)がガイドピン(12)(13)にガイドさ
れ乍らマガジン方向に移動されることにより(第2図参
照)、基板押出部(6)の押出棒(22)(23)の当接部
(22A)(23A)が前記ガイド溝(2)(3)に支承され
乍ら溝(2)(3)内に入り込んで(第3図参照)基板
(4)を下流側装置へ押し出す。
The substrate (4) guided and stored in the guide grooves (2) and (3) of the stack magazine (1) is supplied to the downstream device by driving the rodless cylinder (7) by a drive source (not shown). That is, by driving the rodless cylinder (7), the slide portion (19) to which the slide plate (31) is attached is moved in the magazine direction while being guided by the guide pins (12) and (13). (See the figure), the contact portions (22A) and (23A) of the pushing rods (22) and (23) of the substrate pushing portion (6) are supported by the guide grooves (2) and (3) while the grooves (2) and (3). ) (See FIG. 3) and pushes out the substrate (4) to the downstream device.

次に、基板幅の異なる基板を扱う場合の動作について
説明する。
Next, an operation when handling substrates having different substrate widths will be described.

先ず、作業者は基板幅に合わせて押出棒(22)(23)
の間隔を押出棒幅調整スライド機構(32)を使用して調
整する。即ち、一方の押出棒(22)が取り付けられた固
定プレート(33)ともう一方の押出棒(23)が取り付け
られた可動プレート(36)との間隔を例えば狭める場合
には、幅調整用螺子軸(39)を前記間隔が狭まる方向に
回動させて可動プレート(36)をガイドピン(37)(3
8)にガイドさせ乍ら移動させて基板幅サイズに合わせ
る(第4図参照)。また、前記間隔を広げる場合には、
前記螺子軸(39)を逆方向に回動させて所望間隔に調整
する。そして、調整が終了した後、前記同様にして基板
(4)の押し出しを行なう。
First, the worker adjusts the extrusion rod (22) (23) according to the board width.
Is adjusted using the extrusion rod width adjustment slide mechanism (32). That is, when the distance between the fixed plate (33) to which one of the push rods (22) is attached and the movable plate (36) to which the other push rod (23) is attached is reduced, for example, the width adjusting screw is used. By rotating the shaft (39) in the direction in which the distance is reduced, the movable plate (36) is rotated by the guide pins (37) (3).
8) Move while guiding and adjust to the substrate width size (see FIG. 4). In addition, when widening the interval,
The screw shaft (39) is rotated in the opposite direction to adjust to a desired interval. After the adjustment is completed, the substrate (4) is extruded in the same manner as described above.

また、前記螺子軸(39)の回動を駆動モータを用いて
自動で間隔調整しても良く、この時各種の基板のサイズ
等を図示しないRAM(ランダム・アクセス・メモリ)に
入力しておき、マイクロコンピュータ等制御装置を用い
て自動段取するようにしても良い。
Further, the rotation of the screw shaft (39) may be automatically adjusted by using a drive motor, and at this time, the sizes of various substrates and the like are input to a RAM (random access memory) not shown. Alternatively, automatic setup may be performed using a control device such as a microcomputer.

また、本実施例では段積マガジン(1)から基板
(4)を押し出す際の例であったが、ここで、第2の実
施例として直積マガジン(40)からの基板(4)の押し
出しについて第5図乃至第10図を基に詳述する。
Further, in the present embodiment, the example of extruding the substrate (4) from the stacked magazine (1) has been described. Here, as the second embodiment, the extruding of the substrate (4) from the direct magazine (40) is described. This will be described in detail with reference to FIGS. 5 to 10.

直積マガジン(40)は基板(4)を載置する載置板
(40A)を図示しないリフター機構により基板(4)の
厚さ分だけ順次上昇させる構造となっている。
The direct magazine (40) has a structure in which a mounting plate (40A) on which the substrate (4) is mounted is sequentially raised by the lifter mechanism (not shown) by the thickness of the substrate (4).

(41)(42)は直積マガジン(40)に収納され基板取
り出し位置にある基板(4)を吸着して取り出す吸着パ
ッドで、図示しない駆動源により上下動される。
Reference numerals (41) and (42) denote suction pads which are housed in the direct-stack magazine (40) to suck and take out the substrate (4) at the substrate take-out position, and are moved up and down by a drive source (not shown).

(43)は前記マガジン(40)の上方に位置され、後続
の下流側装置へ基板(4)を橋渡しするシュートで、前
記パッド(41)(42)に吸着された基板(4)を保持す
る開閉動可能な一対のクランプ爪(44)(45)を有し、
該クランプ爪(44)(45)の支承部(44A)(45A)で基
板(4)の両側端下部を保持する。
(43) is a chute positioned above the magazine (40) and bridging the substrate (4) to a subsequent downstream device, and holds the substrate (4) adsorbed on the pads (41) and (42). It has a pair of clamp claws (44) (45) that can be opened and closed,
The lower portions of both sides of the substrate (4) are held by the support portions (44A) (45A) of the clamp claws (44) (45).

前記クランプ爪(44)(45)の開閉機構について第9
図及び第10図を基に詳述する。ここで、クランプ爪(4
4)(45)は同じ構造をしているため一方のクランプ爪
(44)を基に説明する。
The opening and closing mechanism of the clamp claws (44) and (45) is ninth.
This will be described in detail with reference to FIG. 10 and FIG. Here, clamp claws (4
4) Since (45) has the same structure, description will be made based on one clamp claw (44).

(46)は図示しない直積式の基板供給装置に取り付け
られた後述のシリンダー取付板(47)の垂下片で、前記
クランプ爪(44)が軸(48)を介して回動可能に軸支さ
れている。
(46) is a hanging piece of a cylinder mounting plate (47), which will be described later, mounted on a direct-loading type substrate supply device (not shown), and the clamp claw (44) is rotatably supported via a shaft (48). ing.

(49)は前記クランプ爪(44)に当接して該クランプ
爪(44)を開く方向に回動させるクランプ爪開閉用シリ
ンダーで、シリンダー取付板(47)に取り付けられてい
る。
Reference numeral (49) denotes a clamp pawl opening / closing cylinder which comes into contact with the clamp pawl (44) and rotates the clamp pawl (44) in an opening direction, and is attached to the cylinder mounting plate (47).

(50)は前記シリンダー取付板(47)に穿設された凹
部(51)とクランプ爪(44)に設けられた突起部(52)
とで係止された圧縮バネである。尚、該直積式の基板供
給装置も第1の実施例で示した基板押出装置(5)を備
えている。
(50) is a concave portion (51) formed in the cylinder mounting plate (47) and a projection (52) provided on the clamp claw (44).
And a compression spring locked by The direct-loading type substrate supply device also includes the substrate extruding device (5) shown in the first embodiment.

以下、動作について詳述する。 Hereinafter, the operation will be described in detail.

先ず、直積マガジン(40)内の最上段の基板(4)を
吸着パッド(41)(42)で吸着し上方で開状態(第5図
及び第10図参照)で待機されたシュート(43)位置まで
運び、シリンダー(49)(他方図示せず)の駆動が解除
されることによりバネ(50)(他方図示せず)の付勢力
によりクランプ爪(44)(45)が閉じる(第7図及び第
9図参照)方向に回動され支承部(44A)(45A)で基板
(4)の両側端下部が保持される。そして、シュート
(43)に保持された基板(4)を前記押出棒(22)(2
3)で下流側装置へ押し出す(第8図参照)。この時、
押出棒(22)(23)は前記クランプ爪(44)(45)の支
承部(44A)(45A)にガイドされ乍ら、基板(4)を押
し出すこととなる。
First, the uppermost substrate (4) in the direct-magazine (40) is sucked by the suction pads (41) and (42), and the chute (43) waited in an open state (see FIGS. 5 and 10) above. The clamp claw (44) (45) is closed by the urging force of the spring (50) (other not shown) by releasing the drive of the cylinder (49) (other not shown) (FIG. 7). (See FIG. 9 and FIG. 9), and the lower ends of both sides of the substrate (4) are held by the support portions (44A) and (45A). Then, the substrate (4) held by the chute (43) is moved to the push rods (22) (2).
In 3), it is pushed out to the downstream device (see FIG. 8). At this time,
The push rods (22) and (23) push the substrate (4) while being guided by the support portions (44A) and (45A) of the clamp claws (44) and (45).

尚、前述した吸着パッド(41)(42)で吸着保持され
た基板(4)をシュート(43)に載せ替える際、基板吸
着時に複数枚(ここでは2枚)の基板(4)が重なって
吸着されてしまうということがある。これに対処するた
めの動作について説明する。
When the substrate (4) sucked and held by the suction pads (41) and (42) is replaced on the chute (43), a plurality of (here, two) substrates (4) are overlapped when the substrate is sucked. It may be adsorbed. An operation for coping with this will be described.

ここで、2枚の基板(4)間の接着力をx〔Kg〕(不
変)として、この接着力を予め実験等の経験から求め
る。
Here, assuming that the adhesive force between the two substrates (4) is x [Kg] (unchanged), this adhesive force is determined in advance from experience of experiments and the like.

そして、この基板供給装置で扱われる基板(4)内で
最小重量の基板(4)の重量をm〔Kg〕とした場合、一
度吸着パッド(41)(42)で持ち上げられた該基板
(4)を前記接着力x〔Kg〕を重量m〔Kg〕で除した加
速度α〔m/s2〕で下降させ停止させれば、慣性力x〔K
g〕で、該基板(4)が分離されることとなる。これに
より、基板(4)を吸着保持した状態の吸着パッド(4
1)(42)を上昇させ(第11図参照)、一度吸着パッド
(41)(42)を前記加速度α〔m/s2〕以上で下降させ下
側の基板(4)をマガジン(40)へ落とす(第12図参
照)。そして、再び上昇させ(第13図参照)、クランプ
爪(44)(45)で基板(4)を保持する(第14図参
照)。尚、前記基板(4)より重量のある基板間の接着
を分離する場合も、一率に加速度α〔m/s2〕で吸着パッ
ド(41)(42)を下降、停止させれば良い。
When the minimum weight of the substrate (4) in the substrate (4) handled by the substrate supply device is m [Kg], the substrate (4) once lifted by the suction pads (41) and (42) is used. ) Is lowered by an acceleration α [m / s 2 ] obtained by dividing the adhesive force x [Kg] by the weight m [Kg], and the inertia force x [K
g], the substrate (4) is separated. Thus, the suction pad (4) holding the substrate (4) by suction is held.
1) Raise (42) (see FIG. 11), and lower the suction pads (41) and (42) once at the acceleration α [m / s 2 ] or more to lower the lower substrate (4) into the magazine (40). (See Fig. 12). Then, it is raised again (see FIG. 13), and the substrate (4) is held by the clamp claws (44, 45) (see FIG. 14). When the adhesion between the substrates heavier than the substrate (4) is separated, the suction pads (41) and (42) may be lowered and stopped at an acceleration α [m / s 2 ].

勿論この加速度α、吸着パッド(41)(42)の下降停
止位置等は前記RAMに予め格納しておき、制御装置がこ
の格納されたデータに基づいて該吸着パッド(41)(4
2)を制御するものである。
Of course, the acceleration α, the descent stop position of the suction pads (41) and (42) and the like are stored in the RAM in advance, and the control device controls the suction pads (41) and (4) based on the stored data.
2) is to control.

また、第1,第2の実施例とも基板(4)の形状(押出
棒(22)(23)により押される両側端部の形状の違い、
即ち、一方に切欠き等がある場合等)に応じるため、第
15図に示す通り押出棒(22)(23)の当接部(22A)(2
3A)を押出棒(22)(23)に設けた長穴(53)(他方図
示せず)にボルト(54)(他方図示せず)止めするよう
にして、基板(4)の形状に合わせて基板方向に伸縮調
整可能としても良い。
Further, in both the first and second embodiments, the shape of the substrate (4) (the difference in the shape of the both ends pressed by the push rods (22) and (23),
In other words, if there is a notch on one side, etc.)
As shown in Fig. 15, the contact part (22A) (2A) of the push rod (22) (23)
3A) is fixed to a slot (53) (other not shown) provided in the push rods (22) and (23) by bolts (54) (other not shown) so as to fit the shape of the substrate (4). It may be possible to adjust the expansion and contraction in the direction of the substrate.

(ト)発明の効果 以上の構成により、押出し方向に長い基板であってそ
の幅寸法が種々のものを供給する場合でも確実に押出し
供給することができる。
(G) Effects of the Invention According to the above configuration, even when a substrate having a long length in the extrusion direction and having various widths is supplied, the substrate can be reliably extruded and supplied.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の一実施例である基板押出装置を示す斜
視図、第2図及び第3図は前記基板押出装置による基板
の押し出し動作を示す図、第4図は基板押出装置の押出
棒の間隔(幅狭)調整後の斜視図、第5図乃至第8図は
直積マガジンからの基板の押し出し動作を示す図、第9
図及び第10図はクランプ爪の開閉機構を示す図、第11図
乃至第14図は吸着パッドに吸着された複数枚の基板から
1枚だけ残すための吸着パッドの動作を示す図、第15図
は押出棒の当接部の他の実施例を示す図を示す。 (1)……段積マガジン、(5)……基板押出装置、
(22)(23)……押出棒、(32)……押出棒幅調整スラ
イド機構、(40)……直積マガジン、(43)……シュー
ト。
FIG. 1 is a perspective view showing a substrate extruding apparatus according to an embodiment of the present invention, FIGS. 2 and 3 are diagrams each showing an operation of pushing out a substrate by the substrate extruding apparatus, and FIG. FIG. 5 to FIG. 8 are perspective views after adjusting the interval (narrowness) of the rods, FIG. 5 to FIG.
FIG. 10 and FIG. 10 are views showing an opening / closing mechanism of a clamp claw, and FIGS. 11 to 14 are views showing the operation of a suction pad for leaving only one of a plurality of substrates sucked by the suction pad. The figure shows another embodiment of the contact portion of the push rod. (1)… stacked magazine, (5)… substrate extruder,
(22) (23): Extrusion rod, (32): Extrusion rod width adjustment slide mechanism, (40): Directly loaded magazine, (43): Shoot.

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】供給マガジンに収納されたプリント基板を
順次下流側へ供給する基板押出装置であって、基板供給
時にガイド体にガイドされた基板の両側端部に当接して
前記ガイド体にガイドされ乍ら該基板を押し出すと共に
基板の幅寸法に合わせるべくその間隔が可変になされた
一対の押出棒を設けたことを特徴とする基板押出装置。
1. A substrate extruder for sequentially supplying a printed circuit board stored in a supply magazine to a downstream side, wherein said substrate extruder abuts on both side ends of a substrate guided by a guide member during substrate supply and guides said guide member. A substrate extruding apparatus comprising a pair of extruding rods whose intervals are variable so as to extrude the substrate and match the width of the substrate.
【請求項2】直積マガジンに収納されたプリント基板を
吸着パッドで取り出しシュートに支持させた後、該基板
を下流側装置へ供給する基板押出装置であって、基板供
給時にシュートに支持された基板の両側端部に当接して
前記シュートの支承部に支持され乍ら該基板を押し出す
一対の押出棒を設けたことを特徴とする基板押出装置。
2. A substrate extruder for picking up a printed board housed in a direct-stack magazine, picking up the board with a suction pad, supporting the board on a chute, and supplying the board to a downstream device, wherein the board is supported by the chute when the board is supplied. A pair of push rods for pushing out the substrate while being supported by the support portion of the chute in contact with both end portions of the substrate.
JP1008377A 1989-01-17 1989-01-17 Substrate extrusion equipment Expired - Fee Related JP2735853B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1008377A JP2735853B2 (en) 1989-01-17 1989-01-17 Substrate extrusion equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1008377A JP2735853B2 (en) 1989-01-17 1989-01-17 Substrate extrusion equipment

Publications (2)

Publication Number Publication Date
JPH02188328A JPH02188328A (en) 1990-07-24
JP2735853B2 true JP2735853B2 (en) 1998-04-02

Family

ID=11691534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1008377A Expired - Fee Related JP2735853B2 (en) 1989-01-17 1989-01-17 Substrate extrusion equipment

Country Status (1)

Country Link
JP (1) JP2735853B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0952603A (en) * 1995-08-16 1997-02-25 Nec Corp Extruding device for thin sheet
CN108820923A (en) * 2018-08-17 2018-11-16 隆钛(深圳)技术有限公司 Adjustable automatic blanking apparatus of stock house
CN113104567B (en) * 2021-04-09 2023-08-01 安徽盛隆木业有限公司 Feeding machine on solid wood board production line

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5486176A (en) * 1977-12-20 1979-07-09 Kondo Kenji Feed mechanism for printed circuit board
JPS5656682U (en) * 1979-10-03 1981-05-16

Also Published As

Publication number Publication date
JPH02188328A (en) 1990-07-24

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