JP2715686B2 - Method for manufacturing ceramic-metal joined body - Google Patents

Method for manufacturing ceramic-metal joined body

Info

Publication number
JP2715686B2
JP2715686B2 JP8348791A JP8348791A JP2715686B2 JP 2715686 B2 JP2715686 B2 JP 2715686B2 JP 8348791 A JP8348791 A JP 8348791A JP 8348791 A JP8348791 A JP 8348791A JP 2715686 B2 JP2715686 B2 JP 2715686B2
Authority
JP
Japan
Prior art keywords
metal
metal plate
ceramic
ceramic substrate
joined body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8348791A
Other languages
Japanese (ja)
Other versions
JPH04295066A (en
Inventor
裕 竹島
康信 米田
行雄 坂部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP8348791A priority Critical patent/JP2715686B2/en
Publication of JPH04295066A publication Critical patent/JPH04295066A/en
Application granted granted Critical
Publication of JP2715686B2 publication Critical patent/JP2715686B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、セラミック基板と金属
板を接合させたセラミック−金属接合体の製造方法に関
する。具体的にいえば、本発明は、例えばICパッケー
ジやパワーダイオード等を搭載するための基板として用
いられるセラミック−金属接合体の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic-metal joined body in which a ceramic substrate and a metal plate are joined. More specifically, the present invention relates to a method of manufacturing a ceramic-metal bonded body used as a substrate for mounting, for example, an IC package, a power diode, and the like.

【0002】[0002]

【従来の技術】セラミック−金属接合体は、セラミック
基板の両主面に金属板を接合させたものであり、金属板
はチタン(Ti)などの活性金属を添加したロウ材を用
いてセラミック基板にロウ付けされている(図2参
照)。この接合体は、例えばICパッケージやパワーダ
イオード等の半導体デバイスを搭載するための基板とし
て用いられる。半導体デバイスは、その高密度化、高速
化、高出力化に伴い発熱量が増大しているため、このよ
うな接合体を基板として用いれば、金属板がヒートシン
クとして働き、半導体デバイスで発生した熱を効率よく
空中へ放熱させることができる。
2. Description of the Related Art A ceramic-metal joined body is obtained by joining metal plates to both main surfaces of a ceramic substrate, and the metal plate is formed by using a brazing material to which an active metal such as titanium (Ti) is added. (See FIG. 2). This joined body is used as a substrate for mounting a semiconductor device such as an IC package or a power diode. Since the heat generated by semiconductor devices has been increasing due to their higher density, higher speed, and higher output, if such a joined body is used as a substrate, the metal plate acts as a heat sink, and the heat generated by the semiconductor device is increased. Can be efficiently radiated into the air.

【0003】この接合体を作製するには、まずセラミッ
ク基板または金属板にロウ材ペーストを印刷し、ロウ材
ペーストを挟んで金属板とセラミック基板を積層する。
ついで、真空中において熱処理を施すと、熱処理によっ
てロウ材が溶融する。溶融したロウ材は、冷却によって
固化され、セラミック基板と金属板は固化したロウ材に
よって強固に接合される。
[0003] In order to manufacture this joined body, first, a brazing material paste is printed on a ceramic substrate or a metal plate, and the metal plate and the ceramic substrate are laminated with the brazing material paste interposed therebetween.
Next, when heat treatment is performed in a vacuum, the brazing material is melted by the heat treatment. The molten brazing material is solidified by cooling, and the ceramic substrate and the metal plate are firmly joined by the solidified brazing material.

【0004】[0004]

【発明が解決しようとする課題】しかし、ロウ材ペース
トを挟んで積層されたセラミック基板と金属板の熱処理
は、ロウ材中のチタン等の活性金属を酸化させないよう
真空中で行われるため、ロウ材中の金属が飛散してセラ
ミック基板に付着し易い。そして、ロウ材中の金属がセ
ラミック基板の金属板を接合されない領域(絶縁領域)
に付着すると、金属板相互の絶縁抵抗が低くなったり、
また、金属板の表面にメッキを施す際にセラミック基板
上にもメッキ金属が付着したりし、基板材料としての信
頼性が低下する問題があった。
However, the heat treatment of the ceramic substrate and the metal plate laminated with the brazing material paste interposed therebetween is performed in a vacuum so as not to oxidize active metals such as titanium in the brazing material. The metal in the material is scattered and easily adheres to the ceramic substrate. A region where the metal in the brazing material is not joined to the metal plate of the ceramic substrate (insulating region)
If it adheres, the insulation resistance between the metal plates decreases,
Further, when plating the surface of the metal plate, there is a problem that the plating metal adheres to the ceramic substrate and the reliability as a substrate material is reduced.

【0005】また、熱処理工程においては、溶融したロ
ウ材が潤滑層として働くため、セラミック基板と金属板
がずれ動き易く、そのため従来のような接合方法では、
セラミック基板に対する金属板の位置決め精度が悪かっ
た。
In the heat treatment step, the molten brazing material acts as a lubricating layer, so that the ceramic substrate and the metal plate are liable to shift and move.
The positioning accuracy of the metal plate with respect to the ceramic substrate was poor.

【0006】本発明は叙上の従来例の欠点に鑑みてなさ
れたものであり、その目的とするところは、金属板の位
置決めを容易に行え、しかも基板材料としての信頼性が
高い接合体を得ることができるセラミック−金属接合体
の製造方法を提供することにある。
The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to provide a bonded body which can easily position a metal plate and has high reliability as a substrate material. An object of the present invention is to provide a method for producing a ceramic-metal joined body that can be obtained.

【0007】[0007]

【課題を解決するための手段】本発明のセラミック−金
属接合体の製造方法は、セラミック基板の一部に回路用
金属板をロウ付けしてセラミック−金属接合体を製造す
る方法において、セラミック基板表面の金属板接合部分
以外の領域に窒化硼素ペーストを成膜し、セラミック基
板表面の金属接合部分にロウ材を塗布して金属板を重
ね、この後熱処理を施すことによりセラミック基板と金
属板を接合させることを特徴としている。
SUMMARY OF THE INVENTION A method of manufacturing a ceramic-metal bonded body according to the present invention is a method of manufacturing a ceramic-metal bonded body by brazing a circuit metal plate to a part of a ceramic substrate. A boron nitride paste is deposited on the surface of the ceramic substrate in a region other than the metal plate joining portion, a brazing material is applied to the metal joining portion on the ceramic substrate surface, the metal plates are stacked, and then a heat treatment is applied to the ceramic substrate and the metal plate. It is characterized by joining.

【0008】[0008]

【作用】本発明にあっては、セラミック基板表面の金属
板接合部分以外の領域に成膜された窒化硼素ペーストが
マスクとして働くため、ロウ材中から飛散した金属がセ
ラミック基板の金属板接合部分以外の領域に付着するこ
とを防止できる。
According to the present invention, since the boron nitride paste formed in the region other than the metal plate joining portion on the surface of the ceramic substrate functions as a mask, the metal scattered from the brazing material is removed from the metal plate joining portion of the ceramic substrate. It can be prevented from adhering to other areas.

【0009】また、この窒化硼素ペーストの膜厚をロウ
材層の厚みよりも大きくしておけば、窒化硼素ペースト
の膜が金属板の位置決め治具として働き、ロウ付け時な
いし熱処理時におけるセラミック基板と金属板の位置ず
れを防止することができる。
Further, if the thickness of the boron nitride paste made larger than the thickness of the brazing material layer, it serves as a positioning jig of the membrane metal plate boron nitride paste, ceramic in brazing time to the heat treatment The displacement between the substrate and the metal plate can be prevented.

【0010】[0010]

【実施例】以下、本発明の一実施例によるセラミック−
金属接合体の製造方法を具体的に説明する。図1は本発
明の一実施例によるセラミック−金属接合体の製造工程
における熱処理前の状態を示しており、図2はこの実施
例の方法によって製造されたセラミック−金属接合体の
正面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A ceramic according to one embodiment of the present invention will now be described.
The method for manufacturing the metal joined body will be specifically described. FIG. 1 shows a state before heat treatment in a manufacturing process of a ceramic-metal joined body according to one embodiment of the present invention, and FIG. 2 is a front view of the ceramic-metal joined body manufactured by the method of this embodiment. .

【0011】まず、次のようにしてセラミック基板1を
準備した。セラミック基板材料として窒化アルミニウム
(AlN)を選択し、これに焼結助剤として酸化イット
リウム(Y)粉末を3重量%の割合で添加混合
し、さらに有機バインダを加えてシート状に成形した。
このグリーンシートを焼成後の寸法が縦2インチ、横1
インチとなるように打ち抜いた後、窒素雰囲気中におい
て850℃で5時間熱処理してバインダを飛散させ、さ
らに窒素雰囲気中において1850℃で5時間焼成し、
セラミック基板(窒化アルミニウム基板)1を得た。
First, a ceramic substrate 1 was prepared as follows. Aluminum nitride (AlN) was selected as a ceramic substrate material, and yttrium oxide (Y 2 O 3 ) powder was added and mixed at a ratio of 3% by weight as a sintering aid, and an organic binder was further added to form a sheet. did.
The dimensions after firing this green sheet are 2 inches long and 1 inch wide.
After punching out to be inches, heat treatment is performed at 850 ° C. for 5 hours in a nitrogen atmosphere to disperse the binder, and further baked at 1850 ° C. for 5 hours in a nitrogen atmosphere.
A ceramic substrate (aluminum nitride substrate) 1 was obtained.

【0012】ついで、金属板2として、熱膨張→接合→
冷却収縮の過程における寸法変化を考慮した平面寸法の
銅(Cu)板を準備した。なお、この銅板の厚さは30
0μmとした。
Next, as the metal plate 2, thermal expansion → joining →
A copper (Cu) plate having a plane dimension in consideration of a dimensional change in the process of cooling shrinkage was prepared. The thickness of this copper plate is 30
It was set to 0 μm.

【0013】さらに、チタン(Ti)5重量%、銀(A
g)69重量%、銅(Cu)26重量%からなる混合粉
にエチルセルロース5重量%と有機溶剤を添加してロウ
材ペースト3を作製した。また、窒化硼素(BN)粉末
にエチルセルロース5重量%と有機溶剤を添加して窒化
硼素ペースト4を作製した。
Further, titanium (Ti) 5% by weight, silver (A)
g) Ethyl cellulose (5% by weight) and an organic solvent were added to a mixed powder consisting of 69% by weight and 26% by weight of copper (Cu) to prepare a brazing material paste 3. Also, 5% by weight of ethylcellulose and an organic solvent are added to boron nitride (BN) powder to form a nitride.
A boron paste 4 was produced.

【0014】こうして準備が完了した後、まず、セラミ
ック基板1の上下両面の金属板接合部分以外の領域に
化硼素ペースト4を100μmの厚みとなるように予め
印刷し、ついで片面にロウ材ペースト3を印刷された金
属板2をロウ材ペースト3を挟むようにしてセラミック
基板1の金属板接合部分に押し当てた。ここで、ロウ材
ペースト3の膜厚は、窒化硼素ペースト4の膜厚よりも
かなり薄くなっている。さらに、図1に示すように、金
属板2の上から上下両面に窒化硼素板5を重ね、上から
500gの銅製重り6で荷重をかけ、窒化硼素板5を介
して金属板2に均一な圧力を加えた。この状態で1×1
−5Torr以上の真空中において、950℃で10
分間熱処理を行なった。熱処理後は、銅製重り6及び
化硼素板5を取り除き、有機溶剤中で超音波洗浄するこ
とによって窒化硼素ペースト4を除去し、図2のような
セラミック−金属接合体7を得た。
After the preparation is completed, first, the ceramic
Tsu nitrogen in a region other than the upper and lower surfaces of the metal plate joining portion click substrate 1
Boron fossil paste 4 is printed in advance to have a thickness of 100 μm, and then a metal plate 2 on which a brazing material paste 3 is printed on one side is sandwiched by the brazing material paste 3 so that the metal plate joining portion of the ceramic substrate 1 is Pressed against. Here, the thickness of the brazing material paste 3 is considerably smaller than the thickness of the boron nitride paste 4. Further, as shown in FIG. 1, a boron nitride plate 5 is stacked on the upper and lower surfaces of the metal plate 2 and a load is applied with a copper weight 6 of 500 g from above, and the metal plate 2 is evenly applied to the metal plate 2 via the boron nitride plate 5. Pressure was applied. In this state, 1 × 1
In 0 -5 Torr or more in a vacuum, 10 at 950 ° C.
Heat treatment was performed for minutes. After the heat treatment, the copper weight 6 and the nitrogen
The boron nitride plate 5 was removed, and the boron nitride paste 4 was removed by ultrasonic cleaning in an organic solvent to obtain a ceramic-metal bonded body 7 as shown in FIG.

【0015】このようにして製作したセラミック−金属
接合体7では、セラミック基板1と金属板2との位置ず
れが発生しなかった。また、窒化硼素ペースト4の除去
前に、金属板2の表面にニッケル(Ni)の無電解メッ
キを施したが、セラミック基板1にニッケルメッキは付
着しなかった。
In the ceramic -metal bonded body 7 manufactured as described above, no displacement between the ceramic substrate 1 and the metal plate 2 occurred. Before the removal of the boron nitride paste 4, the surface of the metal plate 2 was electrolessly plated with nickel (Ni), but the nickel plating did not adhere to the ceramic substrate 1.

【0016】つぎに、本発明の実施例による接合体の製
造方法と比較するため、下記のように比較例1及び比較
例2の方法によっても接合体を製造した。 (比較例1) 比較例1では、窒化硼素ペーストをセラミック基板に塗
布することなく、それ以外については実施例と同様にし
セラミック−金属接合体を製作した。この場合、セラ
ミック基板に対して金属板の寸法の数%の大きさの位置
ずれが発生した。また、この接合体にニッケル無電解メ
ッキを施した場合、セラミック基板にニッケルメッキの
付着がみられた。
Next, for comparison with the method for manufacturing a joined body according to the embodiment of the present invention, a joined body was also manufactured by the methods of Comparative Examples 1 and 2 as described below. Comparative Example 1 In Comparative Example 1, a ceramic -metal joined body was manufactured in the same manner as in Example except that the boron nitride paste was not applied to the ceramic substrate. In this case, Serra
A misalignment of several percent of the size of the metal plate with respect to the mic substrate occurred. Also, when nickel electroless plating was applied to this joined body, adhesion of nickel plating was observed on the ceramic substrate.

【0017】(比較例2) 比較例2では、窒化硼素の代わりに窒化アルミニウム粉
末を用いたペーストを調製し、この窒化アルミニウムペ
ーストをセラミック基板の金属板接合部分以外の領域に
塗布し、実施例と同様にしてセラミック−金属接合体を
作製した。この場合、ロウ材のエッジ部に窒化アルミニ
ウム粉末が接着し、良好な接合体を得ることができなか
った。
Comparative Example 2 In Comparative Example 2, a paste using aluminum nitride powder instead of boron nitride was prepared, and this aluminum nitride paste was applied to a region other than the metal plate joining portion of the ceramic substrate. In the same manner as in the above, a ceramic -metal joined body was produced. In this case, the aluminum nitride powder adhered to the edge of the brazing material, and a good joined body could not be obtained.

【0018】なお、上記実施例のセラミック−金属接合
体は、比較例と効果を比較するためのサンプルであっ
て、金属板の寸法等は実際の製品寸法を表したものでは
ない。
The ceramic-metal joined body of the above embodiment is a sample for comparing the effect with the comparative example, and the dimensions of the metal plate and the like do not represent actual product dimensions.

【0019】[0019]

【発明の効果】本発明によれば、窒化硼素ペーストによ
ってロウ材からの飛散金属がセラミック基板の金属板接
合部分以外の領域に付着することを防止できる。したが
って、セラミック基板に接合された金属板相互の絶縁抵
抗の低下を防止でき、また、金属板へのメッキ時にセラ
ミック基板上にもメッキ金属が付着することを防止で
き、基板材料としての信頼性を高めることができる。
According to the present invention, the scattered metal from the brazing material can be prevented from adhering to the area other than the metal plate joining portion of the ceramic substrate by the boron nitride paste. Therefore, it is possible to prevent a decrease in insulation resistance between the metal plates joined to the ceramic substrate, and also to prevent a plating metal from adhering to the ceramic substrate during plating on the metal plate, thereby improving reliability as a substrate material. Can be enhanced.

【0020】また、この窒化硼素ペーストの膜厚をロウ
材層の厚みよりも大きくしておけば、ロウ付け時ないし
熱処理時におけるセラミック基板と金属板の位置ずれを
防止することができ、金属板とセラミック基板の位置決
め精度を向上させることができる。
If the thickness of the boron nitride paste is made larger than the thickness of the brazing material layer, displacement of the ceramic substrate and the metal plate during brazing or heat treatment can be prevented, and And the positioning accuracy of the ceramic substrate can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例によるセラミック−金属接合
体の製造方法を示す正面図である。
FIG. 1 is a front view illustrating a method for manufacturing a ceramic-metal joined body according to an embodiment of the present invention.

【図2】同上の方法によって製作されたセラミック−金
属接合体の正面図である。
FIG. 2 is a front view of the ceramic-metal joined body manufactured by the above method.

【符号の説明】[Explanation of symbols]

1 セラミック基板 2 金属板 3 ロウ材ペースト 4 窒化硼素ペースト DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 Metal plate 3 Brazing material paste 4 Boron nitride paste

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セラミック基板の一部に回路用金属板を
ロウ付けしてセラミック−金属接合体を製造する方法に
おいて、 セラミック基板表面の金属板接合部分以外の領域に窒化
硼素ペーストを成膜し、セラミック基板表面の金属接合
部分にロウ材を塗布して金属板を重ね、この後熱処理を
施すことによりセラミック基板と金属板を接合させるこ
とを特徴とするセラミック−金属接合体の製造方法。
1. A method of manufacturing a ceramic-metal bonded body by brazing a metal plate for a circuit to a part of a ceramic substrate, wherein a surface of the ceramic substrate is nitrided in a region other than a bonded portion of the metal plate.
A ceramic-metal joint characterized in that a boron paste is deposited, a brazing material is applied to a metal joint on the surface of the ceramic substrate, a metal plate is laminated, and then a heat treatment is applied to join the ceramic substrate and the metal plate. How to make the body.
JP8348791A 1991-03-22 1991-03-22 Method for manufacturing ceramic-metal joined body Expired - Fee Related JP2715686B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8348791A JP2715686B2 (en) 1991-03-22 1991-03-22 Method for manufacturing ceramic-metal joined body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8348791A JP2715686B2 (en) 1991-03-22 1991-03-22 Method for manufacturing ceramic-metal joined body

Publications (2)

Publication Number Publication Date
JPH04295066A JPH04295066A (en) 1992-10-20
JP2715686B2 true JP2715686B2 (en) 1998-02-18

Family

ID=13803838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8348791A Expired - Fee Related JP2715686B2 (en) 1991-03-22 1991-03-22 Method for manufacturing ceramic-metal joined body

Country Status (1)

Country Link
JP (1) JP2715686B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008150288A (en) * 2008-02-14 2008-07-03 Dowa Holdings Co Ltd Method for manufacturing metal-ceramic joined body

Also Published As

Publication number Publication date
JPH04295066A (en) 1992-10-20

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