JP2688791B2 - A device to attach sample chips to the mount of sample books - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for attaching a sample chip such as wall covering material to a mount of a sample book.

[0002]

2. Description of the Related Art When sample chips (small pieces) such as different kinds of wallpaper are pasted on a mount of a sample book in a predetermined arrangement, it is inefficient to work by hand, and mistakes and malformations occur. It's easy to do. Therefore, a device for mechanizing the attachment of such a sample chip has been developed and put into practical use.

Japanese Patent Publication No. 54-2834 discloses an example of a mechanized device for putting a sample chip on a mount of such a sample book and put into practical use.
This device consists of a box containing sample chips in each cell,
A device that glues the sample chip, a cradle that mounts the mount to which the sample chip is attached, and the sample chip is adsorbed from the box,
This is transferred to the second soccer, the first soccer having a vacuum suction device that can be transported to a position facing the second soccer, and the sample chips from the first soccer are sucked and glued to the chips while passing through the gluing device. And a second sucker having a vacuum suction device capable of conveying the sample chips so that the chips can be subsequently attached to the mount, and between the box body and the facing position by performing the first sucker, In addition, it is configured by a driving mechanism for playing a second soccer and moving up and down and left and right between the facing position and the pedestal via the gluing device, respectively.

Further, as in the automatic sample sticking apparatus disclosed in Japanese Patent Publication No. 1-33415, a sample supply mechanism and a sample sticking mechanism are integrally provided on a conveying path for conveying a mount, It has also been proposed that a paste-coated mount is fed in the middle of the conveying path by a plate drum or the like and the paste is applied by pressure bonding.

[0005]

[Patent Document 1] Japanese Patent Publication No. Sho 5 used to mechanically attach a sample chip to a mount of a sample book.
In the case of the above-mentioned conventional device as described in Japanese Patent Application Laid-Open No. 4-2834, a first soccer sucking a sample chip from a box and transporting it to an opposing position to transfer it to a second soccer and a first soccer at the opposing position. It is necessary to have a cam mechanism or a link lever mechanism for moving up and down and left and right, respectively, with the second soccer sucking the sample chip from one soccer and transporting it to the cradle on which the mount is placed via the gluing device. As a result, the entire device was quite exaggerated and expensive, and it took a lot of time to maintain it so that reliable gluing could be performed.In addition, it was necessary to manually insert the mount onto the pedestal to replenish it. There was also a problem with sex.

[0006] As described in Japanese Patent Publication No. 1-33415, the paste is applied to the backing paper and the paste is sent to a portion where a sample supply mechanism and a sample sticking mechanism are integrally formed by a conveying path. Then, the structure of the gluing mechanism and the conveying path must be complicated.

The present invention has been made in view of the above problems, has a simple structure, is inexpensive, and can reliably and efficiently attach a sample chip to a mount of a sample book,
Moreover, it aims at obtaining the apparatus which can improve workability.

[0008]

A device for pasting a sample chip on a mount of a sample book according to the present invention includes a chill box in which the sample chip is stored in each cell, and a chill box arranged below the chill box and moved up and down. Then, the three heights of the lowest point height, the chip receiving height, and the intermediate chip passing height can be maintained, and the vacuum suction which can receive the sample chip from the chill box by suction and transfer it to the second soccer. A first soccer provided with a device, and two positions, a tip receiving position directly above the first soccer and a lateral bonding position by moving horizontally between the chill box and the lowest point height of the first soccer. A second sucker equipped with a vacuum suction device that can maintain the suction, transfers the sample chip from the first sucker to the bonding position by suction, and maintains the suction at the bonding position until the bonding is completed; It is located right below the movement path of the second soccer in the middle of the receiving position and the laminating position, and can move up and down to maintain two heights of the glue coated point and the non-glue coated point. A glue roll that can apply glue to the lower surface of the sample chip when it passes in the bonding position direction,
A mount preparation stand on which the mount is placed in an upright position, a mount feeder that draws the frontmost mount on the mount preparation stand one by one by suction and supplies it below the bonding position, and below the bonding position. It can be moved up and down to maintain two heights, the lowest height and the bonding height, and the mount supplied by the mount feeder is attached to the sample chip sucked and held at the bonding position by the second soccer. A laminating table that presses from below to perform laminating, and the first soccer is moved up and down between the lowest point height and the chip receiving height, and the second soccer is horizontal between the chip receiving position and the laminating position. Drive mechanism to move the glue roll up and down between the glue coat point and the non-glue coat point to move the bonding table up and down between the lowest descent height and the bonding height, and the mount feeder. Drive mechanism to drive Characterized in that it comprises.

[0009] Here, at the position of the bonding table, the bonding table is hung parallel to the bonding table along its upper surface and lower surface without contacting the bonding table in the state in which the bonding table is at the lowest height, and the forward and reverse rotation is performed. It is possible to reverse the position, by positioning the mount supplied from the mount feeder against the front cover, stopping at the time of bonding and lifting the upper part by the bonding table, and rotating forward to discharge the bonded mount. It is possible to arrange a belt conveyor that controls the position of the mount supplied by the feeder and discharge the bonded mount, and press the bonded mount sent by this belt conveyor. The sample chip can be completely attached to the mount by providing a press roll that sends the sample to the discharge base.

Further, the mount feeder is capable of expanding and contracting in a horizontal posture to maintain a position separated from the frontmost mount on the mount preparation stand and a position where the mount comes into contact with and is attracted to the mount, and the horizontal posture is maintained. On the other hand, the mount supply position can be maintained by rotating downward by about 90 degrees. At that time, as a drive mechanism for driving the mount feeder, a first actuator for expanding and contracting the mount feeder and a second actuator for rotating the mount feeder are provided.

[0011]

[Function] Sample chips of different types are stored in the chill box for each grid. Then, the first sucker equipped with a vacuum suction device rises from the lowest point height, stops at the chip receiving height, receives one sample chip by suction from each grid of the chill box, and descends to the bottom. Stand by at point height. Next, the second soccer provided with the vacuum suction device horizontally moves and is stopped and maintained at the tip receiving position directly above the first soccer which is maintained at the lowest point height, and then the first soccer delivers the chip. Ascend to the height, stop the adsorption, and hand the sample chip to the second soccer.

After receiving the sample chip from the first soccer by suction, the second soccer is horizontally transferred to the bonding position while maintaining the suction. At this time, the glue roll rises from the non-glue coated point and is maintained at the glue coated point, and the glue is applied to the lower surface of the sample chip that is sucked and transferred by the second sucker.

Further, the mount feeder pulls out the frontmost one of the mount placed on the mount preparation stand in an upright state by suction, and moves the sample chip to the bonding position before the sample chip is transferred by the second soccer. Supply the mount below. Then, in the state where the second soccer reaches the laminating position and is stopped and maintained, the laminating table which was at the lowermost height rises to the laminating height, and the sample chip adsorbed on the second soccer is attached by the mount feeder. The supplied mount is pressed from below and pasted.

First soccer, second soccer, glue roll,
The mount feeder and the laminating table are driven by their respective drive mechanisms.

When the mount is supplied by the mount feeder, the belt conveyor is reversed to bring the mount to the front and position the mount. Further, the belt conveyor stops at the time of bonding and the upper part is lifted up together with the bonding table, and after bonding, it rotates forward to discharge the bonded mount.

The press roll presses the pasted board which has been sent by the belt conveyor so that the sample chip is completely stuck to the board and sent to the discharge table.

In the horizontal posture, the mount feeder extends from a position separated from the frontmost mount on the mount preparation stand to a position in contact with the mount, pulls out the mount by suction, and then 90 ° from the horizontal position. Rotate downward to supply the mount. At that time, the expansion and contraction of the mount feeder is performed by the first actuator, and the rotational drive is performed by the second actuator.

[0018]

Embodiments will be described below with reference to the drawings.

FIG. 1 is a main configuration diagram of a chip attaching machine according to an embodiment of the present invention. In this chip sticking machine, a chill box 2 for storing sample chips 1 in a plurality of cells and a first chill box 2 which is arranged directly below the chill box 2 and moves up and down.
A chip supply unit is configured with the soccer 3. Then, a second soccer 5 is arranged on the guide rail 4 so as to move horizontally between a position facing the first soccer 3 from above and a bonding position described later. A tip holding metal fitting 6 for preventing the sample tip 1 from falling is attached to the lower end portion of each grid of the chill box 2. Further, the first soccer 3 is provided with a vacuum suction type suction cup 7 on the upper surface corresponding to each cell of the chill box 2, and is vertically driven by an air cylinder 8. The second soccer 5 has a suction cup 9 of vacuum suction type on the lower surface facing each suction cup 7 of the first soccer 3, and is driven left and right by a slider.

Directly below the movement path of the second soccer 5, a pair of upper and lower glue rolls 10 are arranged. The glue roll 10 replenishes the glue from the glue pan 11 and is driven up and down by the air cylinder 23 together with the support 12.

Further, a mount preparation stand 14 on which a large number of mounts 13 can be placed in a standing position is provided at an upper position in front of the lateral movement end of the second soccer 5, and a pasting position in front of the mount preparation stand 14 is provided. The uppermost mount 1 on the mount preparation stand 14 above
A mount feeder 15 is arranged to attract 3 and pull out one by one. The mount feeder 15 is a suction pad 16
Between a position in which a suction unit 17 including a movable body is expanded and contracted by a vacuum suction device (not shown) and is rotated by a rotary actuator (not shown) from a horizontal position to a position rotated 90 degrees downward from the horizontal position. It has a structure that is driven to rotate.

The second soccer 5 can move horizontally to the laminating position sideways. And below this bonding position,
A laminating table 19 movable up and down by an air cylinder 18 is arranged at a position for receiving the mount 13 supplied by the mount feeder 15, and a belt that can be rotated forward and backward by a rotary actuator (not shown). A conveyor 20 is laid in parallel along the upper surface and the lower surface of the bonding table 19. Further, a front pad 19a is provided on the upper surface of the rear end of the bonding table 19.
Has been fixed. A press roll 21 composed of a pair of rolls is arranged in front of the belt conveyor 20, and a discharge table 22 is further provided in front of the press roll 21.

FIG. 2 shows the operation of the first soccer 3. The first soccer 3 can maintain the three heights A, B and C shown in FIG. A is the lowest point height, B is the tip delivery height, and C is the tip delivery height. In the state of FIG. 2, the first soccer 3 is at the lowest point height A. Then, the first sucker 3 ascends, stops at the chip receiving height C, and maintains that height, and then the suction cup 7 starts sucking and receives the sample chip 1 from the chill box 2. Then, while maintaining the state of being sucked by the suction cup 7, the first soccer 3 descends like, and stops at the lowest point height A like, and remains in that state until delivery to the second soccer 5 described later. To maintain.

FIG. 3 shows the first soccer 3 and the second soccer 5.
The chip transfer operation between the two is shown. As shown in FIG. 3, the second soccer 5 moves between the chill box 2 and stops just above the first soccer 3, which is maintained at the lowest point height A. And as from this state the first soccer 3
Rises while adsorbing the sample chip 1, stops rising at the delivery height B, and maintains that height. Then, as in that state, the suction cup 7 of the first soccer 3 stops adsorbing,
By the suction cup 9 of the second soccer 5 starting to suck,
Hand over the chips. Then, as in the above, the first soccer 3 descends while the second soccer 5 maintains the adsorption,
As described above, the first soccer 3 stops at the lowest point height A and maintains the height, and the second soccer 5 maintains the same position to prepare for the next glue coat work.

4 to 7 show the operations of the second soccer 5 and the glue roll 10 in the glue coating operation. The second soccer 5 moves left and right between the bonding position J and the chip receiving position K shown in FIG. 4, and can be maintained at these two points (J and K). Further, the glue roll 10 moves vertically between the lower non-glue coat point height D and the upper glue coat point height E shown in FIG. 4, and can be maintained at these two points (D and E). . Then, the first football 3 is at the lowest point height A and the glue roll 10
When the second sucker 5 moves to the tip receiving position K as shown in FIG. 4 in a state where the glue coating point height D is D, the glue roll 10 rises and the glue coating point height E as shown in FIG. Stop at and maintain its height. Also, this glue roll 10
At almost the same time as the ascending operation, the above-mentioned chip delivery is performed between the first soccer 3 and the second soccer 5. Then, as shown in FIG. 6, the second sucker 5 moves from the chip delivery position K toward the bonding position J while maintaining the chip adsorption, and at that time, the glue roll 10 maintains the glue coat point height E. Then, the adhesive is applied to the lower surface of the sample chip 1 which is rotated in the forward direction and is adsorbed and transferred by the lower surface suction cup 9 of the second sucker 5. Then, as shown in FIG. 7, when the second soccer 5 further moves and stops at the bonding position J, the glue roll 10 descends from the glue coat point height E to the non-glue coat point height D,
Maintain its height.

8 to 10 show the operations of the mount feeder 15, the bonding table 19, the belt conveyor 20 and the second sucker 5 for supplying and bonding the mount. As shown in FIG. 8, the mount feeder 15 has a non-sucking position H separated from the foremost mount 13 on the mount preparation base 14 in a horizontal position, and a mount suction position I for contacting and sucking the mount 13. It expands and contracts between the two, and these 2 of H and I
It stops at a point and maintains its position, and also rotationally moves between the horizontal posture and the mount supply position H ′ rotated downward by 90 degrees, and stops at the mount supply position H ′ to maintain that position. It is possible. Also, the laminating table 1
9 can move up and down between the lowest descent height F and the bonding height G shown in FIG. 8 and stop at these two points to maintain the height.

When the second sucker 5 sucking the sample chip 1 moves to just above the bonding table 19 as shown in FIG. 8, the mount feeder 15 is in the non-sucking position, and the bonding table 19 is held. Is at the lowest descending height F, and the belt conveyor 2 with the mount 13 positioned
0 is placed on. Further, the second soccer 5 maintains the adsorption of the sample chip 1. And from this state,
As shown in FIG. 8, the mount feeder 15 extends, the bonding table 19 rises while the second sucker 5 is maintained at the bonding position J in the chip suction state, and the mount feeder 15 moves to the mount suction position I. It stops and maintains its position, and the bonding table 19 stops rising at the bonding height G and maintains its height. At that time, the mount 13 is pressed from below to the sample chip 1 adsorbed to the second soccer 5 by the bonding table 19 which has been raised to the bonding height G, so that the sample chip 1 and the mount 13 are bonded together. Be seen. Next, FIG.
As shown by, the mount feeder 15 starts suction at the mount suction position to suck the frontmost mount 13 on the mount preparation base 14, and the second sucker 5 stops chip suction. Then, as shown in FIG. 9, the mount feeder 15 contracts from the mount suction position I to the non-suction position H while maintaining the mount suction state, and stops at the non-suction position H to maintain that position. At the same time, the bonding table 19 has a bonding height G
The descent is further started, the descent is stopped at the highest descent height F, and the height is maintained, and the pasted board is placed on the belt conveyor 20. Then, as shown in FIG. 9, the mount feeder 1
5 maintains the non-sucking position H while maintaining the board suction state, the second sucker 5 moves from the bonding position J toward the receiving position, and the bonding table 19 maintains the lowest descending height F. The belt conveyor 20 rotates in the normal direction, and the pasted paper on the belt conveyor 20 is discharged to the press roll 21 side. Then, as shown in FIG. 9, the mount feeder 1
5 rotates 90 degrees downward from the non-suction position H in the horizontal posture, and stops at the mount supply position H ′ to maintain that position.
At that time, the bonding table 19 maintains the lowest descent height F, and the belt conveyor 20 stops rotating to maintain the stopped state. Next, as shown in FIG. 10, the mount feeder 15 stops the mount adsorption while maintaining the mount supply position H ′, whereby the mount 13 is naturally dropped on the belt conveyor 20. At that time, the bonding table 19 maintains the lowest descent height F, and the belt conveyor 20 maintains the rotation stop. Next, as shown in FIG. 10, the mount feeder 15 starts the reverse rotation from the mount supply position H ′ and stops the reverse rotation at the horizontal non-suction position H to maintain the stop, and the bonding table 19 reaches the maximum. With the descending height F maintained, the belt conveyor 20 reverses and the mount 1 on the belt conveyor 20
3 is applied to the front pad 19a for positioning. And FIG.
As indicated by 0, the second soccer 5 moves to the bonding position J again while adsorbing the glue-coated sample chip 1. At that time, the bonding table 19 maintains the lowest descent height F, and the belt conveyor 20 reverses to maintain the positioning of the mount 13.

Next, the operation of the entire chip applicator according to this embodiment will be described with reference to FIGS. 11 to 20.

First, in the state of FIG. 11, the first soccer 3
Maintains the lowest point height A, the glue roll 10 maintains normal rotation at the non-glue coat point height D, the bonding table 19 maintains the lowest descending height F, and the second soccer 5 is bonded. The position J is maintained and chip suction is maintained, the mount feeder 15 maintains the non-suction position H, and the press roll 21 maintains normal rotation.

Next, as shown in FIG. 12, the first soccer 3 rises above the lowest point height A and stops at the chip receiving height C, and the glue roll 10 maintains the non-glue coat point height D. While maintaining normal rotation, the bonding table 19 rises above the lowest height F and stops at the bonding height G, and the second soccer 5
Keeps the bonding position J and the chip adsorption,
The mount feeder 15 extends from the non-suction position H and stops at the mount suction position, and the press roll 21 maintains normal rotation.

Next, as shown in FIG. 13, the first sucker 3 starts sucking at the chip receiving height C, receives the sample chip 1, and the glue roll 10 maintains the non-glue coat point height D. At the same time, the bonding table 19 bonds the mount 13 to the sample chip 1 at the bonding height G, and the second soccer 5 maintains the bonding position J and stops the chip adsorption after bonding. The mount feeder 15 starts suction at the mount suction position I, sucks the mount 13, and presses the press roll 21.
Turns forward.

Next, as shown in FIG. 14, the first sucker 3 descends from the chip receiving height C and stops at the lowest point height A in the chip suction state, and the glue roll 10 moves to the non-glue coated point height. While maintaining the height D, the bonding table 19 is lowered from the bonding height G on the bonding table 19 with the chip-bonded mount 13 placed thereon.
The mount 13 is placed on the belt conveyor 20, further lowered to the lowest descent height F and stopped, the second soccer 5 maintains the bonding position J, and the mount feeder 15 is in the mount suction state from the mount suction position I. It retreats and stops at the non-suction position H, and the press roll 21 rotates normally.

Next, as shown in FIG. 15, the first sucker 3 maintains the lowest point height A in the chip suction state, and the glue roll 10 rotates forward while maintaining the non-glue coat point height D. , The bonding table 19 maintains the lowest descent height F, the belt conveyor 20 rotates forward with the chip-bonded mount mounted on the belt conveyor 20, and the mount 13 is sent to the press roll 21 for the second soccer. 5 is chip receiving position K from bonding position J
Back, the mount feeder 15 maintains the non-suction position in the mount suction state, and the press roll 21 rotates forward to press the chip-bonded mount sent from the belt conveyor 20 and send it to the discharge base 22.

Next, as shown in FIG. 16, the first sucker 3 rises above the lowest point height A in the chip suction state and stops at the tip passing height B, and the glue roll 10 moves to the non-glue coated point height D. From the height of the glue coat point E, the belt conveyor 20 is stopped and the bonding table 19 is at the lowest height F.
, The second soccer 5 maintains the chip receiving position,
The mount feeder 15 rotates downward from the horizontal non-suction position in the mount suction state and stops at the mount supply position, and the press roll 21 rotates normally.

Next, as shown in FIG. 17, the first sucker 3 stops the chip suction at the chip delivery height B, the glue roll 10 maintains the glue coat point height E in the normal rotation state, and Soccer 5 starts chip adsorption at the chip receiving position
The sample chip 1 is received from the soccer 3, the belt conveyor 20 is stopped, and the bonding table 19 is at the lowest descent height F.
Then, the mount feeder 15 stops the mount adsorption at the mount supply position H ′ and causes the mount 13 to drop naturally onto the bonding table 19, and the press roll 21 rotates forward.

Next, as shown in FIG. 18, the first soccer 3 descends from the chip passing height B and stops at the lowest point height A, and the glue roll 10 is in the normal rotation state and the glue coat point height E. The second sucker 5 maintains the chip receiving position K in the chip suction state, the bonding table 19 maintains the lowest descent height F, and the belt conveyor 20 is in the stopped state.
0, the mount 13 is placed without positioning, the mount feeder 15 reverses 90 degrees from the mount supply position H ′, stops at the horizontal non-suction position H, and the press roll 21 rotates normally.

Next, as shown in FIG. 19, the first soccer 3 maintains the lowest point height A, and the second soccer 5 advances from the chip receiving position K in the chip suction state and stops at the laminating position. Then, the glue roll 10 maintains the glue coat point height E in the normal rotation state to apply the glue to the lower surface of the sample chip 1 when passing the second soccer 5, and the bonding table 19 maintains the lowest descent height F. With the mount 13 placed on the belt conveyor 20, the mount is applied to the front support 19a for positioning, and the mount feeder 15
Maintains the non-suction position, and the press roll 21 rotates normally.

Next, as shown in FIG. 20, the first soccer 3 maintains the lowest point height A, the second soccer 5 maintains the bonding position J in the chip suction state, and the glue roll 10 moves straight. In the rolled state, it descends from the glue coating point height E and falls to the non-glue coating point height D
Then, the bonding table 19 keeps the lowest height F, and the belt conveyor 20 stops with the mount placed against the front cover 19a. The mount feeder 15 keeps the non-suction position, and the press roll 21 Turns forward.

[0039]

Since the present invention is configured as described above, it is not necessary to use a cam mechanism or a link lever mechanism as an exaggerated and expensive device for attaching the sample chip to the mount of the sample book. In addition, it is easy to maintain reliable gluing, and it does not take time to replenish the mount. In addition, the configuration of the gluing mechanism and the transport path is significantly simpler than that of an apparatus in which gluing is performed on the mount side.

[Brief description of the drawings]

FIG. 1 is a main configuration diagram of a chip sticking machine according to an embodiment of the present invention.

FIG. 2 is an operation explanatory view of the first soccer in the embodiment.

FIG. 3 is an explanatory diagram of a chip passing operation between the first soccer and the second soccer in the embodiment.

FIG. 4 is an operation explanatory view of the second soccer and the glue roll in the glue coating work of the embodiment (1).

[Fig. 5] Operation explanatory diagram in the same glue coating work (2)

[Fig. 6] An explanatory view of the operation in the same glue coating work (3)

[Fig. 7] Operation explanatory diagram of the glue coating work (4)

FIG. 8 is an operation explanatory diagram (1) of a mount feeder, a bonding table, a belt conveyor and a second soccer for supplying and bonding the mount in the embodiment.

[Fig. 9] Operation explanatory diagram (2) for supplying and pasting the same mount

FIG. 10 is an operation explanatory view for supplying and bonding the mount.
(3)

FIG. 11 is an operation explanatory diagram of the entire chip sticking machine according to the embodiment.
(1)

[Fig. 12] An explanatory view of the operation of the chip pasting machine as a whole (2)

[Fig. 13] Operation explanatory diagram of the same chip sticking machine (3)

[Fig. 14] An explanatory view of the operation of the entire chip pasting machine (4)

[Fig. 15] An explanatory diagram of the operation of the entire chip pasting machine (5)

FIG. 16 is an explanatory diagram of the operation of the entire chip pasting machine (6)

FIG. 17 is an explanatory diagram of the operation of the entire chip pasting machine (7).

FIG. 18 is an explanatory diagram of the operation of the entire chip pasting machine (8)

FIG. 19 is an explanatory diagram of the operation of the entire chip pasting machine (9).

[Fig. 20] An explanatory diagram of the operation of the entire chip pasting machine (10)

[Explanation of symbols]

 1 Sample Chip 2 Chill Box 3 First Soccer 5 Second Soccer 7 Sucker 8 Air Cylinder 9 Sucker 10 Adhesive Roll 13 Mount 14 Mount 14 Preparation Board 15 Mount Feeder 16 Adsorption Pad 17 Adsorption 18 Air Cylinder 19 Laminating Table 20 Belt Conveyor 21 Press roll 22 discharge table

Claims (4)

(57) [Claims] 1. A chill box in which a sample chip is housed in each cell, and a chill box which is arranged below the chill box and moves up and down to have three heights: a lowest point height, a chip receiving height, and an intermediate chip passing height. And a bottom sucking point of the chill box and the first soccer, the first soccer having a vacuum suction device capable of maintaining the height of the chill box and sucking the sample chips from the chill box to the second soccer. The sample chip can be moved horizontally from the height to maintain the chip receiving position directly above the first football and the lateral bonding position, and the sample chip can be received from the first football by suction. A second sucker provided with a vacuum suction device that transfers to the bonding position and maintains suction at the bonding position until the bonding is completed, and the second sucker in the middle of the chip receiving position and the bonding position. The sample chip is arranged directly below the movement path of the soccer and can move up and down to maintain two heights of the glue-coated point and the non-glue-coated point, and the sample chip when the second soccer passes in the bonding position direction. The glue roll that can apply glue to the lower surface of the mount, the mount preparation stand on which the mount is placed in an upright position, and the foremost mount on the mount preparation stand are pulled out one by one by suction, and the bonding is performed. A mount feeder for supplying below the position, and a vertically arranged bottom movable position for maintaining two heights of the lowest descent height and the bonding height. A bonding table that presses the mount supplied from the mount feeder from below to the sample chips sucked and held at the mating position to bond the sample chips, and the first soccer to the height of the lowest point and the chip receiving amount. Between Move down,
The second soccer is moved horizontally between the chip receiving position and the bonding position, the glue roll is moved up and down between the glue coating point and the non-glue coating point, and the bonding table is moved to the maximum position. A device for sticking a sample chip on a mount of a sample book, which is composed of respective drive mechanisms for moving up and down between the descending height and the bonding height, and a drive mechanism for driving the mount feeder. 2. The bonding table is hung parallel to the upper and lower surfaces of the bonding table without coming into contact with the bonding table when the bonding table is at the lowermost height, and can be rotated in the forward and reverse directions. Provided with a belt conveyor for positioning the mount supplied by the mount feeder against the front plate, stopping at the time of bonding, the upper part is lifted by the bonding table, and rotating forward to discharge the bonded mount. An apparatus for attaching a sample chip to a mount of a sample book according to claim 1. 3. An apparatus for sticking a sample chip to a mount of a sample book according to claim 2, further comprising a press roll that presses the bonded mount sent by the belt conveyor and sends it to a discharge base. 4. The mount feeder is capable of expanding and contracting in a horizontal position to maintain a position spaced from the frontmost mount on the mount preparation stand and a position where the mount comes into contact with and is attracted to the mount, and the horizontal position is also maintained. It is assumed that the mount supply position can be maintained by rotating the mount feeder downward by about 90 degrees, and as a drive mechanism for driving the mount feeder, a first actuator that expands and contracts the mount feeder and a second drive that rotates the mount feeder. An apparatus for sticking a sample chip to a mount of a sample book according to claim 1, wherein the actuator is provided.