JP2684886B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used when conducting an electrical characteristic test of an IC.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a conventional IC socket A of this type, and FIG. 4 is a sectional view thereof. The right half of FIG. 4 shows the set state, and the left half shows the removed state (or the state before setting).

In the figure, 1 is an IC package, 1a is a sealing resin portion of the IC package 1, and 1b is a sealing resin portion 1a.
It is a lead portion that is connected to an IC (not shown) sealed inside and protrudes outside from the sealing resin portion 1a. The IC socket A is a socket body 2 for setting the IC package 1.
And a large number of contactors 3 that individually press and contact the large number of lead portions 1b. Reference numeral 2a denotes a setting recessed portion formed on the upper surface of the socket body 2 for setting the sealing resin portion 1a of the IC package 1. Reference numeral 2b denotes a sealing resin portion 1a formed on the inner side surface around the setting recessed portion 2a.
It is a tapered positioning portion that guides and sets when setting.

The tapered positioning portion 2b positions the sealing resin portion 1a with respect to the setting recessed portion 2a in the X and Y directions by its guiding action. By this positioning, each lead portion 1a is brought into contact with each contactor 3 (contactor end portion 3b) so as to be aligned. The contactor 3 includes a curved spring portion 3a at an intermediate portion and a contactor end portion 3 protruding upward from the upper surface of the socket body 2 and biased upward by the spring portion 3a.
b, a contactor body 3c fixed to the socket body 2,
It comprises a lead portion 3d protruding downward from the socket body 2. Each lead 3d is connected to a characteristic test device (not shown).

Next, the operation will be described.

An IC is provided by an alignment mechanism (not shown).
The package 1 is held by suction. This alignment mechanism is capable of minute displacement in the X direction and the Y direction, and has a function of pressing the suction-held IC package 1 against the IC socket A. The IC package 1 is set in the IC socket A by driving the alignment mechanism. In the setting process, the lower outer peripheral surface of the sealing resin portion 1a is guided by the tapered positioning portion 2b and set in the setting recessed portion 2a in a positioned state, and the lead portion 1b is biased upward by the spring portion 3a. The contactor end portion 3b of the contactor 3 that is being held contacts and is pressed.

Next, by using the characteristic test device connected to the lead portion 3d of the contactor 3, I inside the IC package 1 is
An electrical characteristic test for C (not shown) is performed.
After the test, the alignment mechanism moves upward (Za direction).
The IC package 1 is pulled out upward from the setting recessed portion 2a by the spring force of the spring portion 3a of the contactor 3.

[0008]

By the way, due to variations in manufacturing tolerances of the IC package 1, the recess 2 for setting is set.
When the size of the sealing resin portion 1a is slightly larger than that of a, the sealing resin portion 1a may bite into the tapered positioning portion 2b. Further, when there remains burrs on the sealing resin portion 1a is, the sealing resin portion 1a for that burrs may bite into the tapered positioning portion 2b.

In the conventional IC socket A, the spring portion 3 of the contactor 3 is removed from the setting recessed portion 2a after the test is completed.
Since it depends on the spring force of a, there is a problem that if the above-mentioned bite occurs, a drawing error occurs.

Therefore, in order to avoid the bite, if the tapered positioning portion 2b is formed with a size that allows a margin on the plus side (plus tolerance), the lead portion 1b of the IC package 1 in the X and Y directions. And contactor 3
However, there is a problem that the accuracy of alignment with the contact end 3b deteriorates.

The present invention was devised to solve the above problems, and even when the sealing resin portion bites into the tapered positioning portion due to size tolerance or burrs. An object of the present invention is to provide an IC socket that can be properly extracted after the test is completed and that can accurately align the lead portion of the IC package and the contactor end portion of the contactor.

[0012]

SUMMARY OF THE INVENTION An IC socket according to the present invention is a set recess for setting a sealing resin portion of an IC package, and a tapered positioning formed on an inner side surface around the set recess. And a contact with which the lead portion of the IC package comes into pressure contact, which is vertically slidably inserted in the socket body with the tip exposed at the bottom of the setting recess. The ejector pin is provided with a compression spring for biasing the ejector pin so as to project in the IC package extraction direction.

[0013]

According to the above configuration of the present invention, when the IC package is set in the setting recess, the ejector pin is pushed down on the bottom surface of the IC package while being set against the biasing force of the compression spring. After the end of the electrical characteristic test, when the force pushing down the IC package is released, the ejector pin pushes up the bottom surface of the IC package by the biasing force accumulated in the compression spring. Therefore, even if the sealing resin part bites into the tapered positioning part due to size tolerance or burrs, the biting is released by the forced push-up of the ejector pin by the biasing force of the compression spring. To do.

Since such forced removal is possible, it is not necessary to set the size of the tapered positioning portion to be too large, and the size is set to I.
It becomes possible to just match it with the sealing resin portion of the C package.

[0015]

1 is a plan view showing an IC socket according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof. The right half of FIG. 2 shows the set state, and the left half shows the extracted state (or the state before setting).

In the figure, A1 is an IC socket and 1 is an I socket.
C package, 1a is a sealing resin portion of the IC package 1,
1b is a lead part, 2 is a socket body, 2a is a recess for setting, 2b is a tapered positioning part, 3 is a contact,
3a is a spring portion of the contactor 3, 3b is a contactor end portion, 3c is a contactor main body, 3d is a lead portion, and these configurations are the same as those of the conventional example described in FIGS. 3 and 4. ,
Here, only the code name is described, and the description is omitted.

In this embodiment, the following configuration is provided in addition to the above configuration. In the central portion of the set recess 2a, the socket body 2 is vertically (Z direction).
A through hole 4 is formed so as to penetrate through, and an ejector pin 5 for forcibly discharging the IC package 1 is slidably inserted into the through hole 4. Tip of ejector pin 5 (upper end)
The part is formed in a hemispherical shape, and a stopper ring 6 is fitted midway. An annular groove 2c is formed on the outer circumference of the through hole 4 at the bottom of the socket body 2, and the other end of the compression spring 7 is fitted to the outer circumference of the ejector pin 5 and has one end fitted in the annular groove 2c. Is in contact with the stopper ring 6 of the ejector pin 5. The ejector pin 5 is urged upward (Za direction) by the urging force of the compression spring 7, and in a free state, the hemispherical portion at the tip thereof is exposed upward from the bottom surface of the setting recess 2a (FIG. 2). Left half).

Next, the operation will be described.

The IC package 1 sucked and held by an alignment mechanism (not shown) capable of minute displacement in the X and Y directions is moved downward (Zb direction) to the IC socket A.
Set to 1. In the process of this set, I
The sealing resin portion 1a of the C package 1 is guided by the tapered positioning portion 2b of the socket body 2 and set in the setting recessed portion 2a while being positioned, and the bottom surface of the sealing resin portion 1a compresses the ejector pin 5 into a compression spring. 7, the lead portion 1b is pressed against the contactor end portion 3b of the contactor 3 which is biased upward by the spring portion 3a. A biasing force is accumulated in the compression spring 7.

Then, the I inside the IC package 1 is measured by a characteristic test device connected to the lead portion 3d of the contactor 3.
An electrical characteristic test for C (not shown) is performed.
After the test, the alignment mechanism moves upward (Za direction).
When the IC package 1 is moved backward, the force pushing down the IC package 1 is released, and the ejector pin 5 by the biasing force accumulated in the compression spring 7 pushes up the bottom surface of the IC package 1 to force the IC package 1 from the recess 2a for setting. Will be extracted.

In this case, even if the sealing resin portion 1a bites into the tapered positioning portion 2b due to size tolerance or burrs, the biting is released by the forced push-up of the ejector pin 5, and the IC package is released. 1 can be reliably and satisfactorily discharged from the setting recessed portion 2a.

Therefore, it is not necessary to make the size of the tapered positioning portion 2b much larger than that of the sealing resin portion 1a in advance in order to avoid the bite, and the setting of the sealing resin portion 1a with respect to the setting recessed portion 2a can be made into a gap. A highly accurate alignment state that does not occur can be obtained, and as a result, the lead portion 1b of the IC package 1 is aligned with the contact end portion 3b of the contact 3 in the X direction and the Y direction with high accuracy. It becomes possible.

In the above embodiment, the forced ejection mechanism including the ejector pin 5 and the compression spring 7 is provided only at one place of the setting recessed portion 2a, but the present invention is not limited to this. Similar mechanisms may be provided at more than one place.

[0024]

According to the present invention, since the ejector pin which is slidable up and down and the compression spring for biasing the ejector pin to project are provided, the sealing resin portion is positioned in a tapered shape due to size tolerance and burrs. Even if it is biting into the part, after the electrical characteristic test is completed, the bite is forcibly released by the ejector pin that is energized by the force of storage, and the IC package is reliably pulled out from the recess for setting. Therefore, it is not necessary to form the tapered positioning portion in a large size, and the lead portion of the IC package and the contact end portion of the contact can be aligned with high accuracy.

[Brief description of the drawings]

FIG. 1 is a plan view showing an IC socket according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the operation of the IC socket of the embodiment.

FIG. 3 is a plan view showing a conventional IC socket.

FIG. 4 is a sectional view showing the operation of a conventional IC socket together.

[Explanation of symbols]

 A1 IC socket 1 IC package 1a Sealing resin part 1b Lead part 2 Socket body 2a Set recessed part 2b Tapered positioning part 3 Contact 3b Contact end 4 Through hole 5 Ejector pin 6 Stopper ring 7 Compression spring

Claims (1)

(57) [Claims] 1. A set recess for setting a sealing resin part of an IC package, a tapered positioning part formed on an inner side surface around the set recess, and a lead part of the IC package are in pressure contact with each other. An IC socket provided with a contact, an ejector pin slidably inserted into a socket body in a vertical direction in a state where a tip thereof is exposed on a bottom surface of the setting recessed portion, and the ejector pin is pulled out from an IC package. An IC socket, comprising: a compression spring that biases a projecting direction.