JPS5818223A - Molding method - Google Patents
Molding methodInfo
- Publication number
- JPS5818223A JPS5818223A JP11821481A JP11821481A JPS5818223A JP S5818223 A JPS5818223 A JP S5818223A JP 11821481 A JP11821481 A JP 11821481A JP 11821481 A JP11821481 A JP 11821481A JP S5818223 A JPS5818223 A JP S5818223A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- pins
- molding
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 16
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
- B29C2045/14081—Positioning or centering articles in the mould using means being retractable during injection centering means retracted by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
- B29C2045/1409—Positioning or centering articles in the mould using means being retractable during injection using control means for retraction of the centering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はインサート部品のある成型品の成型方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for molding a molded product with an insert part.
従来、インサート部品のある成型凸金成型する方法とし
ては、第1図に示すように、成型金型1内に形成される
成型中キビテイ2内に予めインナート部品3を装填し、
さらにこのインサート部品3をト記キャビティ2外から
挿入されたピン4で押えつけた後、そのキャビティ2内
に未硬化樹脂5を充填してそのまま硬化させ、しかる後
に上記ピン4をキャビティ2内から抜くという方法があ
った。Conventionally, as shown in FIG. 1, as a method for molding a molding convex mold with an insert part, an inner part 3 is loaded in advance into a molding hole 2 formed in a molding mold 1,
Furthermore, after this insert part 3 is pressed down with a pin 4 inserted from outside the cavity 2, uncured resin 5 is filled into the cavity 2 and cured as it is, and then the pin 4 is inserted from inside the cavity 2. There was a way to remove it.
しかしながら、第2図に示すように、上述の従来方法で
得られた成型品6け、上記ピン4の跡が孔7となって残
り、このビン孔7が製品としての外観を損ね、またイン
サート部品3に金属を使用する例えばキースイッチ用の
電気部品等の場合には、そのビン孔7によってインサー
ト部品3が腐蝕しやすくなる他、電気的絶縁性も低下す
るという問題を有していた。また、ビン孔7のない成型
品を得ることけ、もちろんできなかった。However, as shown in Fig. 2, in the 6 molded products obtained by the above-mentioned conventional method, the marks of the pins 4 remain as holes 7, and these bottle holes 7 spoil the appearance of the product. In the case where the component 3 is made of metal, such as an electrical component for a key switch, there is a problem that the insert component 3 is easily corroded due to the bottle hole 7, and the electrical insulation properties are also deteriorated. Moreover, it was of course impossible to obtain a molded product without the bottle hole 7.
このようなビン孔7を残さぬためには、上記ピン4を使
用せぬか、あるいは成型完了後にビン孔7を他の方法で
塞ぐしかなかった。前者の方法では、成型時における樹
1旨の成型圧力、充填ショック等によってインサート部
品の浮上り1位置ずれ。In order to avoid leaving such a bottle hole 7, the pin 4 described above must not be used, or the bottle hole 7 must be closed by another method after the molding is completed. In the former method, the insert part floats and becomes misaligned due to molding pressure, filling shock, etc. during molding.
変形等が生じて不良品を出すので、採用できない。This method cannot be used because deformation occurs and defective products are produced.
また後者の方法では、後工程が著しく面倒になるので、
コスト尋の現実面から、やはり採用できない。Also, in the latter method, the post-process becomes extremely troublesome, so
Due to the practical cost, it cannot be adopted.
この発明は以上のよう表背景を鑑みてなされたもので、
その目的とするところは、インサート部品のある成型品
を成型するに際して、そのインサート部品の浮上り9位
置ずれ、変型轡による不良品を出すことなく、また後工
程を面倒にすることなく、上記ピン跡部分にも樹脂を充
填してビン孔を残さないようにすることができる成型方
法#=t−:を提供することにある。This invention was made in view of the above background.
The purpose of this is that when molding a molded product with an insert part, the above-mentioned pin can be fixed without producing defective products due to the insert part floating out of position or being deformed, and without complicating the post-process. An object of the present invention is to provide a molding method #=t-: in which the remaining portion is also filled with resin so that no bottle holes are left.
以下、この発明の実施例を図面に基づいて詳述する。な
お、各図中共通あるい呟相当する部分は同符号で示す。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Note that common or corresponding parts in each figure are indicated by the same reference numerals.
第3WJおよび第4図は、この発明による方法F係う′
装置の一実施例を示す。先ず、同図に示す装置は、その
成型金型IK、成型キャビティ2外から進退可能に挿入
されて、#キャビティ2内に予め装填されたインサート
部品3を押えるピン4と、このピン4を上記キャビティ
2内から後退駆動させるピン駆動機構8を有する。さら
(、上記キャビティ2内への樹脂5の充填が完了する直
前のタイミングを検出するタイミング検出手段を有して
いて、このタイミング検出手段の検出に基づいて上記ピ
ン駆動機構を動作させるようKしである。3WJ and FIG. 4 relate to the method F according to the invention.
An example of the device is shown. First, the device shown in the figure includes a mold IK, a pin 4 that is inserted movably from outside the molding cavity 2 and presses the insert part 3 loaded in advance into the cavity 2, and a pin 4 that is inserted into the mold cavity 2 from above. It has a pin drive mechanism 8 that is driven backward from inside the cavity 2. Furthermore, it has a timing detecting means for detecting the timing immediately before the filling of the resin 5 into the cavity 2 is completed, and the pin driving mechanism is operated based on the detection by the timing detecting means. It is.
ここで、上記ピン駆動装置8は、上記ピン4を上記キャ
ビティ2から後退させる方向に常時付勢するコイルバネ
9と、上記ピ/4と直交方向に移動駆動されるスライド
コア10と、このスライドコア10に摺接して上記ピン
4の進退方向に移動するバッキングプレート11とを有
する。スライドコア10は連結棒12を介して油圧等の
駆動源に接続される。また、コア10とプレート11と
の摺接面は互いに傾斜面となっていて、コア10が右方
向に駆動されると、第3図に示すように1ピン4が押し
下げられてキャピテイ2内に装着されたインサート部品
3を押えつける。また、コア10が左方向へ駆動される
と、第4図に示すように、ピン4が上記バネ9の弾性復
元力によって上方へ後退し、インサート部品3から離脱
する。Here, the pin driving device 8 includes a coil spring 9 that constantly urges the pin 4 in a direction to retreat from the cavity 2, a slide core 10 that is driven to move in a direction perpendicular to the pin 4, and this slide core. It has a backing plate 11 that slides on the pin 10 and moves in the direction in which the pin 4 advances and retreats. The slide core 10 is connected to a drive source such as hydraulic pressure via a connecting rod 12. Furthermore, the sliding surfaces of the core 10 and the plate 11 are inclined surfaces, and when the core 10 is driven rightward, the 1st pin 4 is pushed down and pushed into the cavity 2 as shown in FIG. Press down the inserted insert part 3. Further, when the core 10 is driven to the left, the pin 4 retreats upward due to the elastic restoring force of the spring 9 and separates from the insert part 3, as shown in FIG.
上記タイミング検出手段は、図示の実施例では、上記キ
ャビティ2内に充填され九樹脂5の圧力を検出する圧力
センサ13によって構成される。この圧力センサ13は
、キャビティ2内の充填圧力を貫通ロッド14を媒介し
て受圧する。そして。In the illustrated embodiment, the timing detecting means is constituted by a pressure sensor 13 that is filled into the cavity 2 and detects the pressure of the resin 5. This pressure sensor 13 receives the filling pressure in the cavity 2 via the penetrating rod 14 . and.
この圧力センサ13が上記w脂の充填完了直前における
圧力を検出したときに、この検出に基づいて上記ビン駆
動機構8を動作させて、キャビティ2内への未硬化樹脂
5の充填完了直前に上記ピン4を後退させる。駆動機構
8を動作させるときの検出圧力の大きさは予め設定して
おく。When this pressure sensor 13 detects the pressure immediately before the filling of the wrinkly fat is completed, the bin drive mechanism 8 is operated based on this detection, and the above-mentioned bottle drive mechanism 8 is operated immediately before the filling of the uncured resin 5 into the cavity 2 is completed. Retract pin 4. The magnitude of the detected pressure when operating the drive mechanism 8 is set in advance.
また、上記タイミング検出手段は、図示を省略するが、
タイマによって構成することもできる。In addition, although illustration of the timing detection means is omitted,
It can also be configured by a timer.
この場合、そのタイマは、上記キャビティ2内への樹脂
5の充填操作開始時からの時間を検出するように構成さ
れ、該タイマが予め設定された時間の経過を検出したと
きに、この検出に基づいて上記ピン駆動装置8を駆動す
る。これによっても、上記ビン4をキャビティ2内への
樹脂5の充填が完了する直前に後退させることができる
。In this case, the timer is configured to detect the time from the start of the filling operation of the resin 5 into the cavity 2, and when the timer detects the elapse of a preset time, Based on this, the pin driving device 8 is driven. This also allows the bottle 4 to be moved back just before the filling of the resin 5 into the cavity 2 is completed.
以上のような成型装置を使用することにより。By using a molding device as described above.
先ず第3図に示すように、成型キャビティ2内に予めイ
ンサート部品3を装填し、さらに該インサート部品3を
上記キャビティ2外から挿入されたピン4で押えつけた
後、上記キャピテイ2内にランチおよびゲートを通して
未硬化樹脂5を充填する。そして、第4図に示すように
、その樹脂5の充填が完了する直前罠上記ビン4を後退
させて少なくとも1記インサ一ト部品5から離脱させ、
これによりそのピン4が後退した後にも上記樹脂5を充
填させるのである。これにより、ピン4の跡に少々くと
もインサート部品3が覗かれるようなビン孔を残してい
ない成型製品を得あことができる。ここでもちろん、要
すれば、ピ/4の跡の孔を完全に埋めるようにすること
もできる。ここで注目すべきことは、インサート部品3
の浮上り。First, as shown in FIG. 3, the insert part 3 is loaded into the molding cavity 2 in advance, and after the insert part 3 is pressed down with a pin 4 inserted from outside the cavity 2, the insert part 3 is launched into the cavity 2. Then, uncured resin 5 is filled through the gate. Then, as shown in FIG. 4, just before the filling of the resin 5 is completed, the bottle 4 is moved backward and separated from at least one insert part 5,
This allows the resin 5 to be filled even after the pin 4 has retreated. As a result, it is possible to obtain a molded product that does not leave at least a hole through which the insert part 3 can be seen in the trace of the pin 4. Of course, if necessary, the hole left by the pi/4 can be completely filled. What should be noted here is insert part 3
surfacing.
位置ずれ、変形等が生じやすいのは、樹脂5の充填初期
であって、少なくともその充填完了直前には、浮上り2
位置ずれ、変形等が生じないということである。従って
、得られた成型品には、ピン孔が残っていないとともに
%インサート部品3の浮上少郷による不良もほとんどな
い。これにより、インサート部品3が腐蝕される虞もな
くなり、電気部品郷の製品の場合には、特に腐蝕や絶縁
不良等を生じない品質の良いものが得られる。また、第
5図に示す他の実施例のように、インサート部品3が薄
物で、かつ成型キャビティ2内の中間部に浮かせて装填
されるような場合にも、該インサート部品3が変形した
りすることなく規定の位置に正しくインサートされた成
型品を得ることができる。Misalignment, deformation, etc. are likely to occur at the beginning of filling the resin 5, and at least immediately before the filling is completed, floating 2
This means that no misalignment, deformation, etc. will occur. Therefore, in the molded product obtained, there are no remaining pin holes and there are almost no defects due to the floating of the insert part 3. This eliminates the possibility that the insert part 3 will be corroded, and in the case of products manufactured by Electrical Parts Group, products of good quality that do not suffer from corrosion or poor insulation can be obtained. Further, as in another embodiment shown in FIG. 5, when the insert part 3 is thin and is loaded floating in the middle part of the molding cavity 2, the insert part 3 may be deformed. It is possible to obtain a molded product that is correctly inserted in the specified position without having to do any additional work.
以上のようにこの発明によれば、インサート部品のある
成型品を、従来のようにビン孔を残すことなく、またイ
ンサート部品の浮上り9位置ずれ。As described above, according to the present invention, a molded product with an insert part can be produced without leaving a bottle hole as in the conventional case, and the insert part can be lifted up and shifted by 9 positions.
変形郷による不良品を出すことなく、さらに面倒な後工
程を行なうことなく、比較的簡単に得ることができる。It can be obtained relatively easily without producing defective products due to deformation and without performing any troublesome post-processes.
第1図は従来の成型方法を示す断面図、第2図は従来の
方法によって得られた成型品を示す平面図、第3図およ
び第4図はそれぞれこの発明による成型方法金利用した
装置の一実施例を示す断面図、第5図は他の実施例を示
す要部断面図である。
1・・・・・・・・・成型金型
2・・・・・・・・・成型キャビティ
3・・・・・・・・・ インサート部品4・−・・・・
・・・ ビン
5・・・・・・・・・未硬化樹脂
8・・・・・・・・・ ピン駆動機構
9・・・・・・・・・ ハネ
10・・・・・・ バッキングプレート13・・−・・
・圧力センサ
14・・・・・・貫通ロッド
特許出願人 立石電機株式会社Fig. 1 is a cross-sectional view showing a conventional molding method, Fig. 2 is a plan view showing a molded product obtained by the conventional method, and Figs. 3 and 4 respectively show an apparatus using the molding method according to the present invention. FIG. 5 is a sectional view showing one embodiment, and FIG. 5 is a sectional view showing a main part of another embodiment. 1......Molding mold 2...Molding cavity 3...Insert parts 4...
... Bin 5 ...... Uncured resin 8 ...... Pin drive mechanism 9 ...... Wings 10 ...... Backing plate 13・・・・・
・Pressure sensor 14... Penetration rod patent applicant Tateishi Electric Co., Ltd.
Claims (1)
いて、成型キャビティ内に予めインサート部品を装填し
、さらに該インサート部品管上記キャビティ外から挿入
されたピンで押えつけた後、訪キャビティ内に未硬化樹
脂を充填し、仁の樹脂の充填が完了する直前に上記ピン
を後退させて上記インサート部品から離脱させ、皺ビン
が後退し友跡にも上記樹脂を充填させることを特許とす
る成型方法。(1) In a method for molding a molded product with an insert component, the insert component is loaded into the molding cavity in advance, the insert component tube is pressed down with a pin inserted from outside the cavity, and then the uncured material is placed inside the cavity. This is a patented molding method in which the resin is filled, and just before the resin filling is completed, the pin is moved back to separate from the insert part, and the crease bottle is moved back and the resin is filled into the remaining area.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11821481A JPS5818223A (en) | 1981-07-28 | 1981-07-28 | Molding method |
US06/392,475 US4470786A (en) | 1981-07-28 | 1982-06-28 | Molding apparatus with retractable preform support pins |
GB08220569A GB2103534B (en) | 1981-07-28 | 1982-07-15 | Locating inserts during mould filling |
DE19823228214 DE3228214A1 (en) | 1981-07-28 | 1982-07-28 | MOLDING PROCESS AND MOLDED PRODUCT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11821481A JPS5818223A (en) | 1981-07-28 | 1981-07-28 | Molding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5818223A true JPS5818223A (en) | 1983-02-02 |
Family
ID=14731031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11821481A Pending JPS5818223A (en) | 1981-07-28 | 1981-07-28 | Molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5818223A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05507890A (en) * | 1990-07-09 | 1993-11-11 | ペイジ マニュファクチュアリング、インコーポレーテッド | Insert molding method for non-rigid encapsulated parts |
CN103286921A (en) * | 2013-06-28 | 2013-09-11 | 慈溪市三佩机械有限公司 | Five-core sensor shell package mould |
AT512819A2 (en) * | 2012-04-19 | 2013-11-15 | Kmt Kunststoff Metalltechnik Gmbh | Apparatus and method for injection molding a jacket of a component |
WO2014149685A1 (en) * | 2013-03-15 | 2014-09-25 | Basf Se | Method of forming a frame of a seat back for a vehicle |
JP2016027533A (en) * | 2013-12-19 | 2016-02-18 | ミツミ電機株式会社 | Method of manufacturing switch, and switch |
FR3061628A1 (en) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD |
FR3061629A1 (en) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD |
US10483408B2 (en) | 2017-01-03 | 2019-11-19 | Stmicroelectronics (Grenoble 2) Sas | Method for making a cover for an electronic package and electronic package comprising a cover |
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JPS5591642A (en) * | 1978-12-29 | 1980-07-11 | Matsushita Electric Works Ltd | Holding device for inserted body at enclosing molder |
JPS5777547A (en) * | 1981-09-08 | 1982-05-14 | Daifuku Co Ltd | Holding device of position of reinforcement to be sealed in formed body |
JPS5753322B2 (en) * | 1975-08-25 | 1982-11-12 |
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JPS5753322B2 (en) * | 1975-08-25 | 1982-11-12 | ||
JPS5591642A (en) * | 1978-12-29 | 1980-07-11 | Matsushita Electric Works Ltd | Holding device for inserted body at enclosing molder |
JPS5777547A (en) * | 1981-09-08 | 1982-05-14 | Daifuku Co Ltd | Holding device of position of reinforcement to be sealed in formed body |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05507890A (en) * | 1990-07-09 | 1993-11-11 | ペイジ マニュファクチュアリング、インコーポレーテッド | Insert molding method for non-rigid encapsulated parts |
AT512819A2 (en) * | 2012-04-19 | 2013-11-15 | Kmt Kunststoff Metalltechnik Gmbh | Apparatus and method for injection molding a jacket of a component |
WO2014149685A1 (en) * | 2013-03-15 | 2014-09-25 | Basf Se | Method of forming a frame of a seat back for a vehicle |
US10307949B2 (en) | 2013-03-15 | 2019-06-04 | Basf Se | Method of forming a frame of a seat back for a vehicle |
CN103286921A (en) * | 2013-06-28 | 2013-09-11 | 慈溪市三佩机械有限公司 | Five-core sensor shell package mould |
JP2016027533A (en) * | 2013-12-19 | 2016-02-18 | ミツミ電機株式会社 | Method of manufacturing switch, and switch |
FR3061629A1 (en) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD |
FR3061628A1 (en) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD |
US10325784B2 (en) | 2017-01-03 | 2019-06-18 | Stmicroelectronics (Grenoble 2) Sas | Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover |
US10483408B2 (en) | 2017-01-03 | 2019-11-19 | Stmicroelectronics (Grenoble 2) Sas | Method for making a cover for an electronic package and electronic package comprising a cover |
US10833208B2 (en) | 2017-01-03 | 2020-11-10 | Stmicroelectronics (Grenoble 2) Sas | Method for manufacturing a cover for an electronic package and electronic package comprising a cover |
US11114312B2 (en) | 2017-01-03 | 2021-09-07 | Stmicroelectronics (Grenoble 2) Sas | Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover |
US11688815B2 (en) | 2017-01-03 | 2023-06-27 | Stmicroelectronics (Grenoble 2) Sas | Method for manufacturing a cover for an electronic package and electronic package comprising a cover |
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