CN211788959U

CN211788959U - Electronic chip packaging mold convenient to clamp

Info

Publication number: CN211788959U
Application number: CN201922267397.1U
Authority: CN
Inventors: 杨治兵; 夏广清; 钟旭光
Original assignee: Suzhou Yishunhua Intelligent Equipment Co ltd
Current assignee: Suzhou Yishunhua Intelligent Equipment Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-10-27
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses an electron chip packaging mold convenient to centre gripping, including die holder, first push pedal, die cavity and chip main part, first draw-in groove has been seted up to the inside of die holder, and the inside of first draw-in groove is inserted and is equipped with first connecting block, the left side butt of first connecting block has first reed, the right side of first connecting block is connected with first push pedal, and the right side butt of first push pedal has the chip main part, the bottom of chip main part is connected with the thimble, and the bottom of thimble is connected with down the connecting plate, the bottom of connecting plate is connected with the second fixture block down, and the surface butt of second fixture block has first base plate. The utility model discloses a be provided with first push pedal, first spliced block and first reed, the convenience carries out the centre gripping to the chip main part, and the device can conveniently change the thimble through being provided with second spliced pole and second reed.

Description

Electronic chip packaging mold convenient to clamp

Technical Field

The utility model relates to a packaging mold technical field specifically is an electronic chip packaging mold convenient to centre gripping.

Background

The contacts on the chip are wired to pins on the package housing, which in turn are connected to other devices via wires on the printed circuit board, and a package mold is used to facilitate the packaging of the electronic chip.

At present, current partial electronic chip packaging mould, when the chip is placed and is capsulated in chip inslot portion, the size of encapsulation groove and chip is different, the chip is placed probably not so accurate in the encapsulation inslot portion, can influence subsequent encapsulation, and current partial electronic chip packaging mould, the thimble of its bottom is very thin, in relapse a lot of demolding, probably there is partial thimble to produce the fracture, and current partial thimble is fixed through the bolt, but fix through the bolt, when dismantling and changing the thimble, can produce a little inconvenience, consequently, need an electronic chip packaging mould convenient to centre gripping to solve above-mentioned problem urgently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic chip packaging mold convenient to centre gripping to solve the current partial electronic chip packaging mold who proposes in the above-mentioned background art, it does not have clamping function, and current partial electronic chip packaging mold, the problem of the thimble of its below change of not being convenient for.

Realize above-mentioned purpose, the utility model provides a following technical scheme: an electronic chip packaging die convenient for clamping comprises a die holder, a first push plate, a die cavity and a chip main body, wherein a first clamping groove is formed in the die holder, a first connecting block is inserted in the first clamping groove, a first reed is abutted to the left side of the first connecting block, the right side of the first connecting block is connected with the first push plate, the right side of the first push plate is abutted with the chip main body, the bottom end of the chip main body is connected with a thimble, the bottom end of the thimble is connected with a lower connecting plate, the bottom end of the lower connecting plate is connected with a second clamping block, the surface of the second clamping block is abutted with a first base plate, a second clamping groove is formed in the top end surface of the first base plate, a second connecting column is inserted in the second clamping groove, the bottom end of the second connecting column is connected with a second reed, the top end of the second connecting column is connected with a pressing block, and the surface of the second connecting column is abutted, the die comprises a die holder, a first base plate and a first connecting column, and is characterized in that the top end of the first base plate is connected with a first sleeve, the inside of the first sleeve is inserted with the first connecting column, the bottom end of the first connecting column is connected with a first spring, the top end of the first connecting column is connected with a first connecting plate, and the top end of the die holder is provided with a die cavity.

Preferably, the surface of the first connecting block is provided with a convex block, the front surface and the back surface of the first clamping groove are provided with grooves, the first connecting block is inserted into the first clamping groove, and the first connecting block and the first clamping groove form a sliding structure.

Preferably, one end of the first reed is connected to the inner wall of the first clamping groove, the other end of the first reed is connected to the first connecting block in a butting mode, and the first connecting block, the first clamping groove and the first reed form an elastic structure.

Preferably, one end of the first spring is connected to the inner wall of the first sleeve, and the other end of the first spring is connected to the surface of the first connection column, and the first connection column, the first spring and the first sleeve form an elastic structure.

Preferably, the top surface of the first substrate is provided with a connecting groove, the shape and size of the inside of the connecting groove are the same as the shape and size of the surface of the second fixture block, the second fixture block is inserted into the connecting groove, the first substrate is inserted into the second fixture block, and the first substrate and the second fixture block form a sliding structure.

Preferably, one end of the second reed is connected to the bottom end surface of the second connecting column, the other end of the second reed abuts against the inner wall of the second clamping groove, and the second connecting column, the second clamping groove and the second reed form an elastic structure.

Compared with the prior art, the beneficial effects of the utility model are that: this electronic chip packaging mold convenient to centre gripping through being provided with first push pedal, first splice block and first reed, conveniently carries out the centre gripping to the chip main part, and the device can conveniently change the thimble through being provided with second spliced pole and second reed.

1. The device is through being provided with first push pedal, first connecting block and first reed, when the chip main part inserts the inside of establishing to the die cavity completely, first draw-in groove can receive the elastic action of first reed and pop out to the outside to also can make first push pedal carry out the centre gripping to the chip main part, place the possibility that produces the skew in the die cavity inside with the reduction chip main part.

2. The device is through being provided with second spliced pole and second reed, and the rotatable piece of pressing drives the second spliced pole through the rotation of pressing the piece and rotates, makes the bottom of second spliced pole and the inner wall of second draw-in groove no longer carry out the block, can follow afterwards take out the second spliced pole from second draw-in groove inner wall to can take out the second fixture block from the inside of first base plate, change the thimble on connecting plate surface down.

Drawings

FIG. 1 is a schematic sectional view of the front view of the structure of the present invention;

FIG. 2 is a schematic top view of the structure of the present invention;

FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;

fig. 4 is an enlarged schematic view of the structure at B in fig. 1 according to the present invention.

In the figure: 1. a die holder; 2. a first push plate; 3. a die cavity; 4. a chip body; 5. a first connection block; 6. a first card slot; 7. a first reed; 8. a first connecting plate; 9. a first connecting column; 10. a first spring; 11. a first sleeve; 12. a first substrate; 13. a second fixture block; 14. a lower connecting plate; 15. a pressing block; 16. a second connecting column; 17. a second card slot; 18. a second reed; 19. and (4) a thimble.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides an electronic chip packaging mold convenient to centre gripping, including die holder 1, first push pedal 2, chase 3 and chip main part 4, first draw-in groove 6 has been seted up to die holder 1's inside, and the inside of first draw-in groove 6 is inserted and is equipped with first connecting block 5, the surface of first connecting block 5 is provided with the lug, and the front and the back surface connection of first draw-in groove 6 are seted up flutedly, first connecting block 5 is inserted and is established the inside at first draw-in groove 6, first connecting block 5 and first draw-in groove 6 constitute slidingtype structure, can increase the stability that first connecting block 5 removed in first draw-in groove 6 through constituting the slidingtype structure, reduce the possibility that first connecting block 5 removed and produced and rock in first draw-in groove 6.

First reed 7 has been cup jointed on the left side of first connecting block 5, and the inner wall at first draw-in groove 6 is connected to the one end of first reed 7, and the other end of first reed 7 cup jointed has first connecting block 5, and first connecting block 5, first draw-in groove 6 and first reed 7 constitute elastic construction, enable first push pedal 2 inseparabler to the centre gripping of chip main part 4 through constituting elastic construction.

The right side of the first connecting block 5 is connected with a first push plate 2, the right side of the first push plate 2 is abutted with a chip main body 4, the bottom end of the chip main body 4 is connected with a thimble 19, the bottom end of the thimble 19 is connected with a lower connecting plate 14, the bottom end of the lower connecting plate 14 is connected with a second clamping block 13, the surface of the second clamping block 13 is abutted with a first substrate 12, the top end surface of the first substrate 12 is provided with a connecting groove, the inner shape and size of the connecting groove are the same as those of the second clamping block 13, the second clamping block 13 is inserted in the connecting groove, the first substrate 12 is inserted in the second clamping block 13, the first substrate 12 and the second clamping block 13 form a sliding type structure, and the second clamping block 13 can be conveniently taken out from the top end surface of the first substrate 12 by forming the sliding type structure.

Second draw-in groove 17 has been seted up on the top surface of first base plate 12, and the inside of second draw-in groove 17 is inserted and is equipped with second spliced pole 16, the bottom of second spliced pole 16 is connected with second reed 18, the bottom surface at second spliced pole 16 is connected to the one end of second reed 18, the other end butt of second reed 18 is at the inner wall of second draw-in groove 17, second spliced pole 16, elastic construction is constituteed to second draw-in groove 17 and second reed 18, through constituteing elastic construction enable the inseparabler of the interior wall connection of second spliced pole 16 and second draw-in groove 17.

The top of second spliced pole 16 is connected with according to briquetting 15, the surface butt of second spliced pole 16 has lower connecting plate 14, the top of first base plate 12 is connected with first sleeve 11, and the inside of first sleeve 11 is inserted and is equipped with first spliced pole 9, the bottom of first spliced pole 9 is connected with first spring 10, the inner wall at first sleeve 11 is connected to the one end of first spring 10, and the other end of first spring 10 is connected on the surface of first spliced pole 9, elastic construction is constituteed to first spring 10 and first sleeve 11, can conveniently make first spliced pole 9 accomodate in the inside of first sleeve 11, the top of first spliced pole 9 is connected with first connecting plate 8, die cavity 3 has been seted up on the top of die holder 1.

The working principle is as follows: when in use, the chip main body 4 can be firstly placed in the die cavity 3, and then the chip main body 4 is inserted into the die cavity 3, the first push plate 2 can be blocked by the chip main body 4, so that the first push plate 2 approaches to the edge of the die cavity 3, meanwhile, the first spring 7 in the first slot 6 is also in a force accumulation compression state, when the chip body 4 is completely inserted into the die cavity 3, the first slot 6 is ejected outwards under the action of the elastic force of the first spring 7, and also causes the first pushing plate 2 to clamp the chip body 4, so as to reduce the possibility of the chip body 4 being placed inside the die cavity 3 to generate offset, then, the chip main body 4 inside the mold cavity 3 can be conveniently packaged, and after the chip main body 4 is completely packaged, the mold base 1 can be pressed to enable the mold base 1 to move downwards, and the ejector pins 19 are enabled to eject the chip main body 4 inside the mold cavity 3.

And can make thimble 19 produce the damage along with the permanent use of thimble 19, so need change thimble 19, when changing, can dismantle the bolt of connecting first connecting plate 8 and die holder 1 manually, then can manually move die holder 1 upwards, simultaneously, can press pressing block 15, make second reed 18 present the power of holding compression state, then rotatable pressing block 15, drive second spliced pole 16 through the rotation of pressing block 15 and rotate, make the bottom of second spliced pole 16 and the inner wall of second draw-in groove 17 no longer block, can follow afterwards take out second spliced pole 16 from the inner wall of second draw-in groove 17, thereby can take out second fixture block 13 from the inside of first base plate 12, change thimble 19 on lower connecting plate 14 surface.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an electronic chip packaging mold convenient to centre gripping, includes die holder (1), first push pedal (2), die cavity (3) and chip main part (4), its characterized in that: a first clamping groove (6) is formed in the die holder (1), a first connecting block (5) is inserted into the first clamping groove (6), a first reed (7) is abutted to the left side of the first connecting block (5), a first push plate (2) is connected to the right side of the first connecting block (5), a chip main body (4) is abutted to the right side of the first push plate (2), a thimble (19) is connected to the bottom end of the chip main body (4), a lower connecting plate (14) is connected to the bottom end of the thimble (19), a second clamping block (13) is connected to the bottom end of the lower connecting plate (14), a first base plate (12) is abutted to the surface of the second clamping block (13), a second clamping groove (17) is formed in the top end surface of the first base plate (12), a second connecting column (16) is inserted into the second clamping groove (17), a second reed (18) is connected to the bottom end of the second connecting column (16), the die comprises a die holder (1) and is characterized in that the top end of a second connecting column (16) is connected with a pressing block (15), the surface of the second connecting column (16) is abutted to a lower connecting plate (14), the top end of a first base plate (12) is connected with a first sleeve (11), a first connecting column (9) is inserted in the first sleeve (11), the bottom end of the first connecting column (9) is connected with a first spring (10), the top end of the first connecting column (9) is connected with a first connecting plate (8), and a die groove (3) is formed in the top end of the die holder (1).

2. The electronic chip packaging mold facilitating clamping of claim 1, wherein: the surface of the first connecting block (5) is provided with a convex block, the front surface and the back surface of the first clamping groove (6) are provided with grooves, the first connecting block (5) is inserted in the first clamping groove (6), and the first connecting block (5) and the first clamping groove (6) form a sliding structure.

3. The electronic chip packaging mold facilitating clamping of claim 1, wherein: one end of the first reed (7) is connected to the inner wall of the first clamping groove (6), the other end of the first reed (7) is connected with the first connecting block (5) in an abutting mode, and the elastic structure is formed by the first connecting block (5), the first clamping groove (6) and the first reed (7).

4. The electronic chip packaging mold facilitating clamping of claim 1, wherein: the inner wall at first sleeve (11) is connected to the one end of first spring (10), and the surface at first spliced pole (9) is connected to the other end of first spring (10), elastic structure is constituteed to first spliced pole (9), first spring (10) and first sleeve (11).

5. The electronic chip packaging mold facilitating clamping of claim 1, wherein: the top end surface of first base plate (12) has seted up the spread groove, and the internal shape size of spread groove is the same with the surface shape size of second fixture block (13), and second fixture block (13) insert the inside of establishing at the spread groove, first base plate (12) are inserted the inside of establishing at second fixture block (13), slidable formula structure is constituteed to first base plate (12) and second fixture block (13).

6. The electronic chip packaging mold facilitating clamping of claim 1, wherein: one end of the second reed (18) is connected to the bottom end surface of the second connecting column (16), the other end of the second reed (18) abuts against the inner wall of the second clamping groove (17), and the second connecting column (16), the second clamping groove (17) and the second reed (18) form an elastic structure.