CN113745133B - Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof - Google Patents
Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof Download PDFInfo
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- CN113745133B CN113745133B CN202111037371.3A CN202111037371A CN113745133B CN 113745133 B CN113745133 B CN 113745133B CN 202111037371 A CN202111037371 A CN 202111037371A CN 113745133 B CN113745133 B CN 113745133B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses plastic packaging equipment for packaging a 5G communication radio frequency chip SIP and a use method thereof, wherein the plastic packaging equipment comprises a base, a quick-change mechanism, a heat sealing mechanism, side plates and a clamping mechanism, the quick-change mechanism which is convenient for disassembling or fixing the chip packages with different sizes is arranged in the center of the base, a fixing plate is arranged on the right side wall of the base, and the heat sealing mechanisms which are convenient for plastic packaging treatment in different directions are arranged on the fixing plate and the upper side wall of the edge of the base. Through quick change mechanism and fixture cooperation operation, be convenient for carry out high-efficient butt joint to not unidimensional encapsulation on an equipment, carry out more efficient heating plastic envelope processing to the encapsulation after the butt joint through heat seal mechanism, improved the result of use of plastic envelope equipment.
Description
Technical Field
The invention relates to the technical field of SIP packaging production, in particular to plastic packaging equipment for packaging a 5G communication radio frequency chip SIP and a use method thereof.
Background
Along with development of technology, the development of the fifth generation mobile communication technology is rapid, the fifth generation mobile communication technology is a new generation broadband mobile communication technology with the characteristics of high speed, low time delay and large connection, and is a network infrastructure for realizing man-machine object interconnection, the 5G communication technology is a chip, the chip is required to be assembled through SIP packaging in the production process, the packaging is divided into an upper plastic plate and a lower plastic plate, and plastic packaging treatment is required to be carried out to carry out subsequent processing.
The existing plastic packaging equipment has some defects: 1. the existing plastic packaging equipment is inconvenient to carry out plastic packaging treatment on chip packages with different sizes on one piece of equipment, and the treatment efficiency is reduced. 2. The operation process of the existing plastic packaging equipment for carrying out butt joint plastic packaging on the upper and lower packages is complex, time and labor are consumed, meanwhile, quick plastic packaging on different directions is inconvenient, and the plastic packaging effect is reduced.
Disclosure of Invention
The invention mainly aims to provide plastic packaging equipment for packaging a 5G communication radio frequency chip SIP and a use method thereof, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a plastic envelope equipment for 5G communication radio frequency chip SIP encapsulation, includes base, quick change mechanism, heat sealing mechanism, curb plate and fixture, base center internally mounted has the quick change mechanism of being convenient for dismantle or fixed to different size chip encapsulation, the fixed plate is installed to the base right side wall, the heat sealing mechanism of being convenient for to different direction plastic envelope processing is installed to the upper lateral wall of fixed plate and base edge, the curb plate is installed to the base left side outer wall, curb plate internally mounted has electric telescopic handle, the connecting plate is installed to electric telescopic handle upper end, connecting plate lower extreme internally mounted has the fixture of being convenient for high-efficient clamp different size encapsulation;
the quick-change mechanism comprises a bottom groove, a plugboard, a clamping block and bolts, wherein the bottom groove is formed in the upper end of the center of the base, the plugboard is inserted into the bottom groove, side grooves are formed in the left side and the right side of the bottom groove, the clamping block is inserted into the side grooves and is connected with the side wall of the plugboard at the inner end, a first spiral groove is formed in the clamping block, a second spiral groove is formed in the lower end of the side groove, and the bolts are meshed and installed in the first spiral groove and the second spiral groove.
Preferably, the heat sealing mechanism comprises a rotating wheel, a rotating ring and a heating gun, wherein the rotating wheel is arranged on the outer wall of the upper end of the fixed plate, the lower end of the rotating wheel penetrates through the fixed plate to be connected with a motor, the rotating ring is arranged at the edge of the outer wall of the upper side of the base, a vertical rod is welded on the outer wall of the upper end of the rotating ring, and the heating gun is arranged at the upper end of the vertical rod; the butt joint parts in different directions are convenient to be heated and sealed according to the needs.
Preferably, the clamping mechanism comprises a half-open groove, a limit sleeve and a spring, wherein the half-open groove is formed in two sides of the lower end of the connecting plate, a slide bar is welded in the half-open groove, the limit sleeve is sleeved on the outer wall of the slide bar, the spring is arranged on the outer end wall of the limit sleeve, and the lower end of the limit sleeve penetrates through the half-open groove to be connected with a clamping plate; and efficient clamping of different packages is facilitated.
Preferably, the right end of the rotating wheel is clung to the rotating ring, and the side surfaces of the rotating wheel are made of frosted materials; the position of the heating gun is more convenient to control.
Preferably, a limit groove with the width dimension matched with the width dimension of the connecting plate is formed in the side wall of the right end of the side plate; the clamped package is more stable to move downwards.
Preferably, the size of the side groove is the same as that of the clamping block; and a more stable fixed plugboard is facilitated.
Preferably, the size of the half slot is matched with that of the limit sleeve; so that the clamping process of the clamping plate is more stable.
Preferably, the outer end of the limit sleeve is connected with one end of a spring, and the other end of the spring is connected with the side wall of the half-open groove; the package is clamped more efficiently by elastic potential energy.
Preferably, the outer wall threads of the bolt are meshed with the inner wall threads of the first screw groove and the second screw groove; and the fixing or the dismounting is more convenient.
The application method of the plastic packaging equipment for the SIP packaging of the 5G communication radio frequency chip comprises the following steps:
step one: selecting a plugboard with a size of a placing groove which is matched with the size of the processed package to be inserted into the bottom groove, inserting clamping blocks at two sides into side grooves at the same time, aligning a first spiral groove with a second spiral groove, twisting down a bolt to be meshed and rotated to be installed in the first spiral groove and the second spiral groove, and upwards and reversely inserting a half package opening of the processed SIP chip into the placing groove at the center of the plugboard;
step two: manually pulling the clamping plates to two sides to drive the limiting sleeve to slide to the outer end of the outer wall of the sliding rod, simultaneously embedding the limiting sleeve in the semi-open groove to slide to the outer end smoothly, simultaneously extruding the spring while the limiting sleeve moves, converting kinetic energy into elastic potential energy to be stored by extrusion shrinkage deformation, downwards placing the other half packaging opening corresponding to the SIP chip to be packaged between the clamping plates at two sides, loosening the tension to the clamping plates, converting the elastic potential energy into kinetic energy, pushing the limiting sleeve to drive the clamping plates to move to the center to package and clamp the chip by the spring;
step three: the electric telescopic rod is controlled by external control equipment to shrink downwards to drive the connecting plate to move downwards vertically in the limiting groove, and the clamped package is driven to move downwards to butt joint with the corresponding package edge of the insert board;
step four: the motor is controlled by the external control equipment to drive the rotating wheel to rotate, the rotating wheel rotates to drive the rotating ring to rotate through friction force generated by the rough surface of the side wall, the rotating ring rotates to drive the heating gun on the upper side to surround the butted packaging to rotate, the butted packaging is heated, and the plastic packaging processing of the SIP chip packaging is completed.
Compared with the prior art, the invention has the following beneficial effects: 1. the inserting plate provided with the packaging placing grooves with different sizes is inserted into the bottom groove in an embedding mode, the inserting plates of the placing grooves with different sizes are fixed in the first spiral groove and the second spiral groove in a meshed rotating mode through bolts at two ends, fixing of the inserting plates of the placing grooves with different sizes is completed, plastic packaging processing is conducted on packages with different sizes on one device, and efficiency of the plastic packaging processing is improved.
2. In the process of plastic packaging, only need make the stop collar steadily slide outside the interior end of half open slot through the gliding mode of gomphosis through manual pulling both sides splint, make the spring store elastic potential energy simultaneously, the encapsulation centre gripping of the encapsulation corresponding size of putting in with the picture peg is put between splint, it is laminating to drive the encapsulation downstream of being held through electric telescopic handle shrink, it is the swivel friction of frosted material equally to drive the runner of side surface frosting material to rotate with the side surface through the operation of control motor, drive swivel rotation, thereby drive the heating rifle around two upper and lower encapsulation of laminating as required, manual operation heating rifle can carry out the heating plastic packaging treatment to the encapsulation laminating position of required direction, the effect and the efficiency of plastic packaging have been increased.
Drawings
Fig. 1 is a schematic perspective view of a plastic packaging device for SIP packaging of a 5G communication radio frequency chip according to the present invention.
Fig. 2 is a schematic diagram of a partial enlarged structure of a plastic packaging device for SIP packaging of a 5G communication radio frequency chip in fig. 1 according to the present invention.
Fig. 3 is a schematic diagram of a partial front sectional structure of a quick-change mechanism of a plastic packaging device for SIP packaging of a 5G communication radio frequency chip.
Fig. 4 is a schematic diagram of a front cross-sectional structure of a clamping mechanism of a plastic packaging device for SIP packaging of a 5G communication radio frequency chip according to the present invention.
In the figure: 1. a base; 201. a bottom groove; 202. inserting plate; 203. a side groove; 204. a clamping block; 205. a first screw groove; 206. a second screw groove; 207. a bolt; 3. a fixing plate; 401. a motor; 402. a rotating wheel; 403. a swivel; 404. a vertical rod; 405. a heating gun; 5. a side plate; 6. an electric telescopic rod; 7. a limit groove; 8. a connecting plate; 901. semi-slotting; 902. a slide bar; 903. a limit sleeve; 904. a spring; 905. and (3) clamping plates.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1-4, a plastic packaging device for packaging a 5G communication radio frequency chip SIP comprises a base 1, a quick-change mechanism, a heat-sealing mechanism, a side plate 5 and a clamping mechanism, wherein the quick-change mechanism which is convenient for disassembling or fixing different-size chip packages is arranged in the center of the base 1, a fixed plate 3 is arranged on the right side wall of the base 1, the heat-sealing mechanism which is convenient for plastic packaging treatment in different directions is arranged on the fixed plate 3 and the upper side wall of the edge of the base 1, the side plate 5 is arranged on the outer wall of the left side of the base 1, an electric telescopic rod 6 is arranged in the side plate 5, a connecting plate 8 is arranged at the upper end of the electric telescopic rod 6, and the clamping mechanism which is convenient for efficiently clamping different-size packages is arranged in the lower end of the connecting plate 8;
the quick-change mechanism comprises a bottom groove 201, a plugboard 202, a clamping block 204 and a bolt 207, wherein the bottom groove 201 is formed in the upper end of the center of the base 1, the plugboard 202 is inserted into the bottom groove 201, side grooves 203 are formed in the left side and the right side of the bottom groove 201, the clamping block 204 is inserted into the side grooves 203 and is connected with the side wall of the plugboard 202 at the inner end, a first screw groove 205 is formed in the clamping block 204, a second screw groove 206 is formed in the lower end of the side groove 203, and the bolt 207 is meshed and mounted in the first screw groove 205 and the second screw groove 206.
Specifically, the heat sealing mechanism comprises a rotating wheel 402, a rotating ring 403 and a heating gun 405, wherein the rotating wheel 402 is arranged on the outer wall of the upper end of the fixed plate 3, the lower end of the rotating wheel 402 penetrates through the fixed plate 3 and is connected with a motor 401, the rotating ring 403 is arranged on the edge of the outer wall of the upper side of the base 1, a vertical rod 404 is welded on the outer wall of the upper end of the rotating ring 403, and the heating gun 405 is arranged on the upper end of the vertical rod 404; the butt joint parts in different directions are convenient to be heated and sealed according to the needs.
Specifically, the clamping mechanism comprises a half-open groove 901, a limit sleeve 903 and a spring 904, wherein the half-open groove 901 is formed in two sides of the lower end of the connecting plate 8, a slide bar 902 is welded in the half-open groove 901, the limit sleeve 903 is sleeved on the outer wall of the slide bar 902, the spring 904 is arranged on the outer end wall of the limit sleeve 903, and the lower end of the limit sleeve 903 penetrates through the half-open groove 901 to be connected with a clamping plate 905; and efficient clamping of different packages is facilitated.
Specifically, the right end of the rotating wheel 402 is tightly attached to the rotating ring 403, and the side surfaces are made of frosted materials; it is more convenient to control the position of the heating gun 405.
Specifically, the side wall of the right end of the side plate 5 is provided with a limit groove 7 with the width dimension mutually matched with the width dimension of the connecting plate 8; the clamped package is more stable to move downwards.
Specifically, the size of the side groove 203 is the same as the size of the latch 204; facilitating a more stable securing of the card 202.
Specifically, the size of the half-open groove 901 is matched with the size of the limit sleeve 903; the clamping process of the clamping plate 905 is more stable.
Specifically, the outer end of the limit sleeve 903 is connected with one end of a spring 904, and the other end of the spring 904 is connected with the side wall of the half-open groove 901; the package is clamped more efficiently by elastic potential energy.
Specifically, the threads of the outer wall of the bolt 207 intermesh with the threads of the inner walls of the first screw channel 205 and the second screw channel 206; and the fixing or the dismounting is more convenient.
The application method of the plastic packaging equipment for the SIP packaging of the 5G communication radio frequency chip comprises the following steps:
step one: inserting a plugboard 202 with a size of a placing groove matched with the size of a processed package into a bottom groove 201, inserting clamping blocks 204 on two sides into side grooves 203 at the same time, aligning a first screw groove 205 with a second screw groove 206, twisting a bolt 207 downwards to be meshed and rotatably installed in the first screw groove 205 and the second screw groove 206, and reversely inserting a half packaging opening of the processed SIP chip into the placing groove in the center of the plugboard 202 upwards;
step two: manually pulling the clamping plates 905 to two sides to drive the limit sleeve 903 to slide outwards on the outer wall of the slide bar 902, simultaneously enabling the limit sleeve 903 to be embedded in the half-open groove 901 to slide outwards steadily, simultaneously extruding the spring 904 while the limit sleeve 903 moves, enabling the spring 904 to be extruded, contracted and deformed to convert kinetic energy into elastic potential energy for storage, enabling the other half packaging opening corresponding to the SIP chip to be packaged downwards between the clamping plates 905 on two sides, loosening the pulling force of the clamping plates 905, and enabling the spring 904 to convert the elastic potential energy into kinetic energy to push the limit sleeve 903 to drive the clamping plates 905 to move towards the center to clamp the chip packaging;
step three: the electric telescopic rod 6 is controlled by external control equipment to shrink downwards to drive the connecting plate 8 to move downwards vertically in the limiting groove 7, so that the clamped package is driven to move downwards to be butted with the corresponding package edge of the insert plate 202;
step four: the motor 401 is controlled by the external control equipment to drive the rotating wheel 402 to rotate, the rotating wheel 402 rotates to drive the rotating ring 403 to rotate through friction force generated by the rough surface of the side wall, the rotating ring 403 rotates to drive the heating gun 405 on the upper side to rotate around the butted package, the butted package is heated and sealed, and the plastic package processing of the SIP chip package is completed.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a plastic envelope equipment for 5G communication radio frequency chip SIP encapsulation, includes base (1), quick change mechanism, heat sealing mechanism, curb plate (5) and fixture, a serial communication port, base (1) central internally mounted has the quick change mechanism of being convenient for dismantle or fix different size chip encapsulation, fixed plate (3) are installed to base (1) right side wall, the heat sealing mechanism of being convenient for to different direction plastic envelope processing is installed to fixed plate (3) and base (1) edge upper side wall, curb plate (5) are installed to base (1) left side outer wall, curb plate (5) internally mounted has electric telescopic handle (6), connecting plate (8) are installed to electric telescopic handle (6) upper end, connecting plate (8) lower extreme internally mounted has the fixture of being convenient for high-efficient clamp different size encapsulation;
the quick-change mechanism comprises a bottom groove (201), an inserting plate (202), a clamping block (204) and a bolt (207), wherein the bottom groove (201) is formed in the upper end of the center of the base (1), the inserting plate (202) is inserted into the bottom groove (201), side grooves (203) are formed in the left side and the right side of the bottom groove (201), the clamping block (204) is inserted into the side grooves (203) and is connected with the side wall of the inserting plate (202) at the inner end, a first spiral groove (205) is formed in the clamping block (204), a second spiral groove (206) is formed in the lower end of the side groove (203), and the bolt (207) is meshed and installed in the first spiral groove (205) and the second spiral groove (206).
The heat sealing mechanism comprises a rotating wheel (402), a rotating ring (403) and a heating gun (405), wherein the rotating wheel (402) is arranged on the outer wall of the upper end of a fixed plate (3), the lower end of the rotating wheel (402) penetrates through the fixed plate (3) and is connected with a motor (401), the rotating ring (403) is arranged on the edge of the outer wall of the upper side of the base (1), a vertical rod (404) is welded on the outer wall of the upper end of the rotating ring (403), and the heating gun (405) is arranged at the upper end of the vertical rod (404).
2. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 1, wherein: the clamping mechanism comprises a half-slotting (901), a limiting sleeve (903) and a spring (904), wherein the half-slotting (901) is formed in two sides of the lower end of the connecting plate (8), a sliding rod (902) is welded in the half-slotting (901), the limiting sleeve (903) is sleeved on the outer wall of the sliding rod (902), the spring (904) is arranged on the outer end wall of the limiting sleeve (903), and the lower end of the limiting sleeve (903) penetrates through the half-slotting (901) to be connected with a clamping plate (905).
3. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 1, wherein: the right end of the rotating wheel (402) is clung to the rotating ring (403), and the side surfaces are made of frosted materials.
4. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 1, wherein: the right side wall of the side plate (5) is provided with a limit groove (7) with the width dimension matched with the width dimension of the connecting plate (8).
5. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 1, wherein: the size of the side groove (203) is the same as that of the clamping block (204).
6. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 2, wherein: the size of the half-open groove (901) is matched with that of the limit sleeve (903).
7. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 2, wherein: the outer end of the limit sleeve (903) is connected with one end of a spring (904), and the other end of the spring (904) is connected with the side wall of the half-open groove (901).
8. The plastic packaging device for packaging a 5G communication radio frequency chip SIP according to claim 1, wherein: the outer wall threads of the bolt (207) are meshed with the inner wall threads of the first screw groove (205) and the second screw groove (206).
9. The application method of the plastic packaging equipment for packaging the SIP of the 5G communication radio frequency chip based on any one of claims 1 to 8 is characterized in that: the method comprises the following steps:
step one: inserting a plugboard (202) with a size of a placing groove matched with the size of a processed package into a bottom groove (201), inserting clamping blocks (204) at two sides into side grooves (203) at the same time, aligning a first screw groove (205) with a second screw groove (206), downwards twisting a bolt (207) to be meshed and rotated to be installed in the first screw groove (205) and the second screw groove (206), and upwards and reversely inserting a half packaging opening of the processed SIP chip into the placing groove at the center of the plugboard (202);
step two: manually pulling the clamping plates (905) to two sides to drive the limit sleeve (903) to slide outwards on the outer wall of the sliding rod (902), simultaneously embedding the limit sleeve (903) in the half-open groove (901) to slide outwards steadily, simultaneously extruding the spring (904) while the limit sleeve (903) moves, converting kinetic energy into elastic potential energy for storage through extrusion and shrinkage deformation, downwards placing the other half packaging opening corresponding to the SIP chip to be packaged between the clamping plates (905) on two sides, loosening the pulling force on the clamping plates (905), and converting the elastic potential energy into kinetic energy to push the limit sleeve (903) to drive the clamping plates (905) to move towards the center to clamp the chip packaging;
step three: the electric telescopic rod (6) is controlled by external control equipment to shrink downwards to drive the connecting plate (8) to move downwards and vertically in the limiting groove (7), so that the clamped package is driven to move downwards to butt joint with the corresponding package edge of the insert plate (202) in-package;
step four: the motor (401) is controlled by the external control equipment to drive the rotating wheel (402) to rotate, the rotating wheel (402) rotates to drive the rotating ring (403) to rotate through friction force generated by the rough surface of the side wall, the rotating ring (403) rotates to drive the heating gun (405) on the upper side to rotate around the butted package, the butted package is subjected to heating plastic packaging treatment, and plastic packaging processing of SIP chip packaging is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111037371.3A CN113745133B (en) | 2021-09-06 | 2021-09-06 | Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof |
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| CN202111037371.3A CN113745133B (en) | 2021-09-06 | 2021-09-06 | Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof |
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