CN113745133A - Plastic packaging equipment for SIP packaging of 5G communication radio frequency chip and use method thereof - Google Patents
Plastic packaging equipment for SIP packaging of 5G communication radio frequency chip and use method thereof Download PDFInfo
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- CN113745133A CN113745133A CN202111037371.3A CN202111037371A CN113745133A CN 113745133 A CN113745133 A CN 113745133A CN 202111037371 A CN202111037371 A CN 202111037371A CN 113745133 A CN113745133 A CN 113745133A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
The invention discloses plastic package equipment for SIP (session initiation protocol) packaging of a 5G communication radio frequency chip and a using method thereof. Through the cooperation of the quick-change mechanism and the clamping mechanism, the packaging of different sizes can be conveniently and efficiently butted on one device, the butted packaging is subjected to more efficient heating plastic packaging treatment through the heat-sealing mechanism, and the using effect of the plastic packaging device is improved.
Description
Technical Field
The invention relates to the technical field of SIP packaging production, in particular to plastic packaging equipment for SIP packaging of a 5G communication radio frequency chip and a using method thereof.
Background
With the development of science and technology, the development of the fifth generation mobile communication technology is rapid, the fifth generation mobile communication technology is a new generation broadband mobile communication technology with the characteristics of high speed, low time delay and large connection, and is a network infrastructure for realizing man-machine-object interconnection, the 5G communication technology is an indispensable chip, the chip needs to be assembled through SIP packaging in the production process, the packaging is divided into an upper plastic plate and a lower plastic plate, and subsequent processing can be carried out only by plastic packaging treatment.
Some defects of the existing plastic packaging equipment are as follows: 1. the existing plastic packaging equipment is inconvenient for carrying out plastic packaging treatment on chips with different sizes on one equipment, and the treatment efficiency is reduced. 2. The existing plastic packaging equipment is complex in operation process of carrying out butt joint plastic packaging on an upper package and a lower package, consumes time and labor, is inconvenient for carrying out quick plastic packaging on different directions, and reduces the effect of plastic packaging.
Disclosure of Invention
The invention mainly aims to provide plastic packaging equipment for SIP packaging of a 5G communication radio frequency chip and a using method thereof, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
the plastic package equipment for SIP packaging of the 5G communication radio frequency chip comprises a base, a quick-change mechanism, a heat-seal mechanism, side plates and a clamping mechanism, and is characterized in that the quick-change mechanism convenient for dismounting or fixing chips with different sizes is installed in the center of the base, a fixing plate is installed on the right side wall of the base, the heat-seal mechanisms convenient for plastic package treatment in different directions are installed on the side walls on the edge of the fixing plate and the edge of the base, the side plates are installed on the outer wall of the left side of the base, an electric telescopic rod is installed in each side plate, a connecting plate is installed at the upper end of the electric telescopic rod, and the clamping mechanism convenient for efficiently clamping the chips with different sizes is installed in the lower end of the connecting plate;
the quick change mechanism comprises a bottom groove, a plugboard, a fixture block and a bolt, wherein the bottom groove is formed in the upper end of the center of the base, the plugboard is inserted into the bottom groove, side grooves are formed in the left side and the right side of the bottom groove, the fixture block is inserted into the side grooves and connected with the plugboard side wall at the inner end, a first spiral groove is formed in the fixture block, a second spiral groove is formed in the lower end of the side groove, and the bolt is meshed and installed in the first spiral groove and the second spiral groove.
Preferably, the heat sealing mechanism comprises a rotating wheel, a rotating ring and a heating gun, the rotating wheel is installed on the outer wall of the upper end of the fixed plate, the lower end of the rotating wheel penetrates through the fixed plate and is connected with a motor, the rotating ring is installed on the edge of the outer wall of the upper side of the base, a vertical rod is welded on the outer wall of the upper end of the rotating ring, and the heating gun is installed at the upper end of the vertical rod; the butt joint parts in different directions can be conveniently heated and plastically packaged according to requirements.
Preferably, the clamping mechanism comprises a half-open groove, a limiting sleeve and a spring, the half-open groove is formed in two sides of the lower end of the connecting plate, a sliding rod is welded in the half-open groove, the limiting sleeve is sleeved on the outer wall of the sliding rod, the spring is installed on the outer end wall of the limiting sleeve, and the lower end of the limiting sleeve penetrates through the half-open groove and is connected with a clamping plate; facilitating efficient clamping of different packages.
Preferably, the right end of the rotating wheel is tightly attached to the rotating ring, and the side surfaces of the rotating wheel and the rotating ring are all made of frosted materials; the position of the heating gun is more convenient to control.
Preferably, the side wall of the right end of the side plate is provided with a limit groove with the width size matched with that of the connecting plate; the downward movement of the clamped package is more stable.
Preferably, the size of the side groove is the same as that of the fixture block; the fixing inserting plate is convenient to be more stable.
Preferably, the size of the semi-open groove is matched with that of the limiting sleeve; the clamping process of the clamping plate is more stable.
Preferably, the outer end of the limiting sleeve is connected with one end of a spring, and the other end of the spring is connected with the side wall of the semi-open groove; the package is clamped more efficiently by elastic potential energy.
Preferably, the screw thread on the outer wall of the bolt is meshed with the screw threads on the inner walls of the first screw groove and the second screw groove; more convenient to fix or dismantle.
A use method of plastic packaging equipment for SIP packaging of a 5G communication radio frequency chip comprises the following steps:
the method comprises the following steps: selecting an inserting plate with the size of a placing groove matched with the size of a processed package to be inserted into the bottom groove, simultaneously inserting clamping blocks on two sides into the side grooves to align the first screw groove and the second screw groove, downwards twisting a bolt to be meshed and rotatably installed in the first screw groove and the second screw groove, and inserting a processed SIP chip half-block package opening into the placing groove in the center of the inserting plate in an inverted manner;
step two: the clamping plates are manually pulled to two sides to drive the limiting sleeve to slide towards the outer end of the outer wall of the sliding rod, meanwhile, the limiting sleeve is embedded in the half-open groove to stably slide towards the outer end, the limiting sleeve moves and simultaneously extrudes the spring, the spring is extruded and contracted to deform to convert kinetic energy into elastic potential energy for storage, the other half of packaging openings corresponding to the SIP chips needing plastic packaging are downwards placed between the clamping plates at the two sides, the tension on the clamping plates is released, and the spring converts the elastic potential energy into the kinetic energy to push the limiting sleeve to drive the clamping plates to move towards the center to package and clamp the chips;
step three: the electric telescopic rod is controlled by external control equipment to shrink downwards to drive the connecting plate to move downwards and vertically in the limiting groove, and the clamped packages are driven to move downwards to be in butt joint with the corresponding package edges inserted in the inserting plates;
step four: the motor is controlled to drive the rotating wheel to rotate through the external control equipment, the rotating wheel rotates to drive the rotating ring to rotate through friction force generated by the rough surface of the side wall, the rotating ring rotates to drive the heating gun on the upper side to rotate around the butted package, the package butt joint is heated and subjected to plastic package treatment, and the plastic package processing of SIP chip package is completed.
Compared with the prior art, the invention has the following beneficial effects: 1. the inserting plate provided with the packaging placing grooves of different sizes is inserted into the bottom groove in an embedding mode, the inserting plate is fixed in a rotating mode through the bolts at two ends in the first screw groove and the second screw groove, the inserting plate of the placing grooves of different sizes is fixed, plastic packaging processing is performed on the packaging of the models of different sizes on one device conveniently, and the efficiency of plastic packaging processing is improved.
2. In the process of plastic package, only need make stop collar steadily slide to the outer end and extrude the spring simultaneously through the gliding mode of gomphosis through manual pulling both sides splint, make the spring store elastic potential energy, the encapsulation centre gripping of the corresponding size of encapsulation of putting with the picture peg interpolation is between splint, it moves down with the encapsulation laminating of downside to drive by the encapsulation of centre gripping through electric telescopic handle shrink down, the runner that drives side surface dull polish material through control motor operation rotates and the runner friction that the side surface is dull polish material equally, the drive swivel rotates, thereby drive the upper and lower two blocks of encapsulation that the heating gun centers on the laminating as required, manual operation heating gun can heat the plastic package and handle the encapsulation laminating position of needs orientation, the effect and the efficiency of plastic package have been increased.
Drawings
Fig. 1 is a schematic three-dimensional structure diagram of a plastic package device for SIP packaging of a 5G communication radio frequency chip according to the present invention.
Fig. 2 is a schematic diagram of a partially enlarged structure a in fig. 1 of a plastic package device for SIP packaging of a 5G communication radio frequency chip according to the present invention.
Fig. 3 is a schematic diagram of a partial front-view cross-sectional structure of a quick-change mechanism of a plastic package device for SIP packaging of a 5G communication radio frequency chip according to the present invention.
Fig. 4 is a schematic view of a front cross-sectional structure of a clamping mechanism of the plastic packaging device for SIP packaging of the 5G communication radio frequency chip.
In the figure: 1. a base; 201. a bottom groove; 202. inserting plates; 203. a side groove; 204. a clamping block; 205. a first screw groove; 206. a second screw groove; 207. a bolt; 3. a fixing plate; 401. a motor; 402. a rotating wheel; 403. rotating the ring; 404. a vertical rod; 405. a heating gun; 5. a side plate; 6. an electric telescopic rod; 7. a limiting groove; 8. a connecting plate; 901. semi-slotting; 902. a slide bar; 903. a limiting sleeve; 904. a spring; 905. and (4) clamping the plate.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-4, a plastic package device for SIP packaging of a 5G communication radio frequency chip comprises a base 1, a quick-change mechanism, a heat-seal mechanism, a side plate 5 and a clamping mechanism, and is characterized in that the quick-change mechanism convenient for dismounting or fixing different-size chip packages is installed inside the center of the base 1, a fixing plate 3 is installed on the right side wall of the base 1, the heat-seal mechanisms convenient for plastic package processing in different directions are installed on the fixing plate 3 and the upper side wall of the edge of the base 1, the side plate 5 is installed on the outer wall of the left side of the base 1, an electric telescopic rod 6 is installed inside the side plate 5, a connecting plate 8 is installed at the upper end of the electric telescopic rod 6, and the clamping mechanism convenient for efficiently clamping different-size packages is installed inside the lower end of the connecting plate 8;
the quick-change mechanism comprises a bottom groove 201, an inserting plate 202, a fixture block 204 and a bolt 207, wherein the bottom groove 201 is arranged inside the upper end of the center of the base 1, the inserting plate 202 is inserted into the bottom groove 201, side grooves 203 are formed in the left side and the right side of the bottom groove 201, the fixture block 204 is inserted into the side grooves 203, the inner ends of the fixture block 204 are connected with the side walls of the inserting plate 202, a first screw groove 205 is formed in the fixture block 204, a second screw groove 206 is formed in the lower end of the side groove 203, and the bolt 207 is meshed and arranged inside the first screw groove 205 and the second screw groove 206.
Specifically, the heat sealing mechanism comprises a rotating wheel 402, a rotating ring 403 and a heating gun 405, wherein the rotating wheel 402 is installed on the outer wall of the upper end of the fixing plate 3, the lower end of the rotating wheel 402 penetrates through the fixing plate 3 and is connected with a motor 401, the rotating ring 403 is installed on the edge of the outer wall of the upper side of the base 1, a vertical rod 404 is welded on the outer wall of the upper end of the rotating ring 403, and the heating gun 405 is installed on the upper end of the vertical rod 404; the butt joint parts in different directions can be conveniently heated and plastically packaged according to requirements.
Specifically, the clamping mechanism comprises a half-open groove 901, a limiting sleeve 903 and a spring 904, wherein the half-open groove 901 is formed in two sides of the lower end of the connecting plate 8, a sliding rod 902 is welded in the half-open groove 901, the limiting sleeve 903 is sleeved on the outer wall of the sliding rod 902, the spring 904 is installed on the outer end wall of the limiting sleeve 903, and a clamping plate 905 penetrates through the half-open groove 901 at the lower end of the limiting sleeve 903; facilitating efficient clamping of different packages.
Specifically, the right end of the rotating wheel 402 is tightly attached to the rotating ring 403, and the side surfaces thereof are all made of frosted material; it is more convenient to control the position of the heat gun 405.
Specifically, the side wall of the right end of the side plate 5 is provided with a limit groove 7 the width dimension of which is matched with that of the connecting plate 8; the downward movement of the clamped package is more stable.
Specifically, the size of the side groove 203 is the same as that of the latch 204; facilitating a more stable securing of the board 202.
Specifically, the size of the half-open groove 901 is matched with the size of the stop collar 903; the clamping process of the clamping plate 905 is more stable.
Specifically, the outer end of the limiting sleeve 903 is connected with one end of a spring 904, and the other end of the spring 904 is connected with the side wall of the half-slot 901; the package is clamped more efficiently by elastic potential energy.
Specifically, the threads on the outer wall of the bolt 207 are engaged with the threads on the inner walls of the first groove 205 and the second groove 206; more convenient to fix or dismantle.
A use method of plastic packaging equipment for SIP packaging of a 5G communication radio frequency chip comprises the following steps:
the method comprises the following steps: an inserting plate 202 with the size of a placing groove matched with the size of a processed packaged chip is selected to be inserted into a bottom groove 201, meanwhile, clamping blocks 204 on two sides are inserted into side grooves 203, a first screw groove 205 is aligned with a second screw groove 206, a bolt 207 is turned downwards to be meshed with and rotatably installed in the first screw groove 205 and the second screw groove 206, and a processed SIP chip half-block packaging opening is inserted into the placing groove in the center of the inserting plate 202 in an upward inverted mode;
step two: the clamp plates 905 are manually pulled to two sides to drive the limiting sleeve 903 to slide towards the outer end of the outer wall of the sliding rod 902, meanwhile, the limiting sleeve 903 is embedded in the half-open groove 901 to slide towards the outer end smoothly, the limiting sleeve 903 moves while extruding the spring 904, the spring 904 is extruded and contracted to deform to convert kinetic energy into elastic potential energy to be stored, the other half of the packaging opening corresponding to the SIP chip needing plastic packaging is placed downwards between the clamp plates 905 on two sides, the tension on the clamp plates 905 is released, and the spring 904 converts the elastic potential energy into the kinetic energy to push the limiting sleeve 903 to drive the clamp plates 905 to move towards the center to clamp the chip packaging;
step three: the electric telescopic rod 6 is controlled by external control equipment to shrink downwards to drive the connecting plate 8 to move downwards and vertically in the limiting groove 7, and the clamped packages are driven to move downwards to be in butt joint with the corresponding package edges inserted in the inserting plates 202;
step four: the motor 401 is controlled by external control equipment to drive the rotating wheel 402 to rotate, the rotating wheel 402 rotates to drive the rotating ring 403 to rotate through friction force generated by the rough surface of the side wall, the rotating ring 403 rotates to drive the heating gun 405 on the upper side to rotate around the butted package, the package butt joint is heated and plastically packaged, and the SIP chip package is packaged.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The plastic package equipment for SIP (session initiation protocol) packaging of the 5G communication radio frequency chip comprises a base (1), a quick-change mechanism, a heat-seal mechanism, side plates (5) and a clamping mechanism, and is characterized in that the quick-change mechanism convenient for dismounting or fixing chips of different sizes is installed in the center of the base (1), a fixing plate (3) is installed on the right side wall of the base (1), the heat-seal mechanisms convenient for plastic package processing of different directions are installed on the side walls on the edges of the fixing plate (3) and the base (1), the side plates (5) are installed on the outer wall of the left side of the base (1), an electric telescopic rod (6) is installed in each side plate (5), a connecting plate (8) is installed at the upper end of the electric telescopic rod (6) in the attribute, and the clamping mechanism convenient for efficiently clamping the chips of different sizes is installed in the lower end of the connecting plate (8);
quick change mechanism includes kerve (201), picture peg (202), fixture block (204) and bolt (207), inside base (1) center upper end was seted up in kerve (201), picture peg (202) cartridge is inside in kerve (201), side channel (203) have been seted up to kerve (201) left and right sides, fixture block (204) are inserted and are inlayed in side channel (203) inside and inner connection picture peg (202) lateral wall, first thread groove (205) have been seted up to fixture block (204) inside, second thread groove (206) have been seted up to side channel (203) lower extreme, bolt (207) meshing is installed inside first thread groove (205) and second thread groove (206).
2. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 1, characterized in that: heat-seal mechanism includes runner (402), change (403) and heating gun (405), install at fixed plate (3) upper end outer wall runner (402), runner (402) lower extreme runs through fixed plate (3) and is connected with motor (401), change (403) are installed at base (1) upside outer wall edge, change (403) upper end outer wall welds and is equipped with montant (404), heating gun (405) are installed in montant (404) upper end.
3. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 1, characterized in that: the clamping mechanism comprises a semi-open groove (901), a limiting sleeve (903) and a spring (904), the semi-open groove (901) is formed in two sides of the lower end of the connecting plate (8), a sliding rod (902) is welded inside the semi-open groove (901), the limiting sleeve (903) is sleeved on the outer wall of the sliding rod (902), the spring (904) is installed on the outer end wall of the limiting sleeve (903), and the lower end of the limiting sleeve (903) penetrates through the semi-open groove (901) and is connected with a clamping plate (905).
4. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 2, characterized in that: the right end of the rotating wheel (402) is tightly attached to the rotating ring (403), and the side surfaces of the rotating wheel and the rotating ring are all made of frosted materials.
5. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 1, characterized in that: and the side wall of the right end of the side plate (5) is provided with a limit groove (7) with the width size matched with that of the connecting plate (8).
6. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 1, characterized in that: the size of the side groove (203) is the same as that of the fixture block (204).
7. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 3, characterized in that: the size of the semi-open groove (901) is matched with that of the limiting sleeve (903) mutually.
8. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 3, characterized in that: the outer end of the limiting sleeve (903) is connected with one end of a spring (904), and the other end of the spring (904) is connected to the side wall of the semi-open groove (901).
9. The plastic packaging equipment for SIP packaging of the 5G communication radio frequency chip according to claim 1, characterized in that: the screw thread of the outer wall of the bolt (207) is meshed with the screw thread of the inner wall of the first screw groove (205) and the second screw groove (206).
10. The use method of the plastic package equipment for SIP packaging of the 5G communication radio frequency chip based on any one of claims 1 to 9 is characterized in that: the method comprises the following steps:
the method comprises the following steps: an inserting plate (202) with the size of a placing groove matched with the size of a processed package is selected to be inserted into a bottom groove (201), clamping blocks (204) on two sides are inserted into side grooves (203), a first screw groove (205) is aligned with a second screw groove (206), a bolt (207) is turned downwards to be meshed with and rotatably installed in the first screw groove (205) and the second screw groove (206), and a processed SIP chip half-block package opening is inserted into the central placing groove of the inserting plate (202) in an inverted mode;
step two: the clamp plates (905) are manually pulled to two sides to drive the limiting sleeve (903) to slide towards the outer end of the outer wall of the sliding rod (902), meanwhile, the limiting sleeve (903) is embedded in the semi-open groove (901) to slide towards the outer end in a smooth mode, the limiting sleeve (903) moves while extruding the spring (904), the spring (904) is extruded and contracted to deform to convert kinetic energy into elastic potential energy to be stored, the other half of the packaging opening corresponding to the SIP chip needing plastic packaging is placed downwards between the clamp plates (905) on the two sides, the tension of the clamp plates (905) is released, and the spring (904) converts the elastic potential energy into kinetic energy to push the limiting sleeve (903) to drive the clamp plates (905) to move towards the center to clamp the chip packaging;
step three: the electric telescopic rod (6) is controlled by external control equipment to shrink downwards to drive the connecting plate (8) to move downwards and vertically in the limiting groove (7), and the clamped packages are driven to move downwards to be in butt joint with the corresponding package edges inserted in the inserting plate (202);
step four: the rotating wheel (402) is driven to rotate by the control motor (401) of the external control equipment, the rotating wheel (402) rotates to drive the rotating ring (403) to rotate through friction force generated on the rough surface of the side wall, the rotating ring (403) rotates to drive the heating gun (405) on the upper side to rotate around the butted package, the package butt joint is heated and subjected to plastic packaging, and the plastic packaging processing of SIP chip packaging is completed.
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| CN202111037371.3A CN113745133B (en) | 2021-09-06 | 2021-09-06 | Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof |
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| CN202111037371.3A CN113745133B (en) | 2021-09-06 | 2021-09-06 | Plastic packaging equipment for packaging 5G communication radio frequency chip SIP and use method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115179489A (en) * | 2022-07-14 | 2022-10-14 | 铜陵中锐电子科技有限公司 | Semiconductor packaging mold and packaging method |
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