JP2682146B2 - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JP2682146B2
JP2682146B2 JP15777089A JP15777089A JP2682146B2 JP 2682146 B2 JP2682146 B2 JP 2682146B2 JP 15777089 A JP15777089 A JP 15777089A JP 15777089 A JP15777089 A JP 15777089A JP 2682146 B2 JP2682146 B2 JP 2682146B2
Authority
JP
Japan
Prior art keywords
wire
electrode
spool
clamp material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP15777089A
Other languages
Japanese (ja)
Other versions
JPH0322545A (en
Inventor
和幸 船津
京市 斎田
政義 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15777089A priority Critical patent/JP2682146B2/en
Publication of JPH0322545A publication Critical patent/JPH0322545A/en
Application granted granted Critical
Publication of JP2682146B2 publication Critical patent/JP2682146B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明はワイヤボンディング方法に関し、詳しくは、
スプールから導出されたワイヤの過度のたるみと、微弱
電流によるワイヤやクランプ材の電蝕を防止しながら、
ベアチップの電極と基板の電極をこのワイヤにより接続
するための手段に関する。Description: TECHNICAL FIELD The present invention relates to a wire bonding method.
While preventing excessive slack of the wire drawn from the spool and electrolytic corrosion of the wire and clamp material due to weak current,
It relates to means for connecting the electrodes of the bare chip and the electrodes of the substrate by this wire.

（従来の技術） 第５図は従来のワイヤボンディング手段を示すもので
あって、101は金線のような微細のワイヤ102が巻装され
たスプール、103はスプール101から導出されたワイヤ10
2にエアを吹き付けてテンションを付与するエア吹出装
置、104はワイヤ102の通過を案内する閉ループ状ガイ
ド、105はベロー、106はテンションクランプ材、107は
カットクランプ材、108はキャピラリ、109はキャピラリ
108を保持するホーンである。(Prior Art) FIG. 5 shows a conventional wire bonding means, in which 101 is a spool around which a fine wire 102 such as a gold wire is wound, and 103 is a wire 10 drawn from the spool 101.
An air blowing device that blows air onto 2 to apply tension, 104 is a closed loop guide that guides the passage of the wire 102, 105 is a bellows, 106 is a tension clamp material, 107 is a cut clamp material, 108 is a capillary, 109 is a capillary.
It is a horn that holds 108.

この手段は、テンションクランプ材106によりワイヤ1
02をクランプして、スプール101からワイヤ102を導出し
ながら、キャピラリ108の下端部から導出するワイヤ102
の下端部に、トーチ電極110を接近させて溶融ボール111
を形成し、この溶融ボール111をリードフレーム等の基
板112に搭載されたベアチップ113の電極に接着した後、
次いでワイヤ102をキャピラリ108の下端部により基板11
2に押し付けて、基板112の電極に接着するようになって
いる。This means uses the tension clamp material 106 to
The wire 102 which is led out from the lower end of the capillary 108 while the 02 is clamped and the wire 102 is led out from the spool 101
Bring the torch electrode 110 close to the lower end of the molten ball 111
And then bonding this molten ball 111 to the electrode of the bare chip 113 mounted on the substrate 112 such as a lead frame,
Then, the wire 102 is attached to the substrate 11 by the lower end of the capillary 108.
It is adapted to be pressed against 2 and adhered to the electrodes of the substrate 112.

（発明が解決しようとする課題） ところが上記従来手段は、ワイヤ102にエアを吹き付
けてテンションを付与しながら、テンションクランプ材
106によりワイヤ102をクランプしてこれを引っ張ること
により、ワイヤ102をスプール101から導出するようにな
っていたため、ワイヤ102はスプール101から均一にほど
けにくく、瞬間的に過度に導出されてワイヤ102が脈動
する場合があり、かくなるとワイヤ102に付与されるテ
ンションに狂いを生じて、その結果、第６図に示すよう
に基板112とベアチップ113を接続するワイヤ102aに曲り
を生じ、隣りのワイヤ102bに接触しやすい問題があっ
た。(Problems to be Solved by the Invention) However, the above-mentioned conventional means is to apply tension to the wire 102 by applying air to the wire 102 while applying a tension clamp material.
Since the wire 102 is pulled out from the spool 101 by clamping the wire 102 with 106 and pulling the wire 102, the wire 102 is difficult to be uniformly unwound from the spool 101, and the wire 102 is momentarily excessively pulled out so that the wire 102 is not pulled out. There is a possibility of pulsation, and when it becomes clogged, the tension applied to the wire 102 is distorted, and as a result, as shown in FIG. 6, the wire 102a connecting the substrate 112 and the bare chip 113 is bent and the adjacent wire 102b is formed. There was a problem that it was easy to come into contact with.

またスプール101から導出されたワイヤ102は、大きく
屈曲させてスプール101の中心孔114を通し、クランプ材
107,108側へ導出していたため、屈曲部ａにおいてワイ
ヤ102がよじれ、ワイヤ102に付与されるテンションに狂
いを生じて、ひいては上記と同様にワイヤ接触を生じや
すいものであった。Further, the wire 102 led out from the spool 101 is largely bent to pass through the center hole 114 of the spool 101, and the clamp material is
Since the wire 102 is led out to the 107, 108 side, the wire 102 is twisted at the bent portion a, the tension applied to the wire 102 is distorted, and the wire contact is likely to occur similarly to the above.

更には、スプール101は、クランプ材106,107やキャピ
ラリ108等が組み付けられたヘッド部Ａとは別体に設け
られており、スプール101は固定されていて、ヘッド部
Ａだけが基板112の上方を移動して所定の作業を行うよ
うになっていたため、スプール101とガイド104の間のワ
イヤ102の導出長Ｌが長くなり、それだけワイヤコント
ロールが困難になりやすいものであった。Further, the spool 101 is provided separately from the head portion A on which the clamp members 106, 107, capillaries 108, etc. are assembled, the spool 101 is fixed, and only the head portion A moves above the substrate 112. Since the predetermined work is performed, the lead-out length L of the wire 102 between the spool 101 and the guide 104 becomes long, which makes the wire control difficult.

したがって本発明は、上記従来手段の問題点を解消す
るワイヤボンディング手段を提供することを目的とす
る。Therefore, an object of the present invention is to provide a wire bonding means that solves the problems of the above-mentioned conventional means.

（課題を解決するための手段） このために本発明は、スプールをモータにより回転さ
せて、ワイヤをスプールから導出するようにし、またス
プールやモータを、テンションクランプ材、カットクラ
ンプ材、キャピラリ等と共に、ヘッド部に一体的に組み
付けている。そしてワイヤの下端部をベアチップの電極
に接着する時間と、ワイヤを基板の電極に接着する時間
を、上記モータの駆動による上記スプールからのワイヤ
の導出時間として予め設定するとともに、上記スプール
とテンションクランプ材の間に、電極と、この電極へ向
ってワイヤにエアを吹き付けるエア吹出部から成るワイ
ヤのたるみ検出手段を設け、上記ヘッド部が上方位置に
あって、テンションクランプ材とカットクランプ材が共
にワイヤをクランプしている時間を、上記たるみ検出手
段によるワイヤのたるみ検出時間として設定し、この検
出時間内において、ワイヤが上記エアの吹付けにより電
極に接触してワイヤのたるみが検出されたときには、上
記導出時間における上記モータの駆動によるワイヤの導
出を中止するようにしたものである。(Means for Solving the Problems) To this end, the present invention rotates a spool by a motor so that a wire is led out from the spool, and the spool and the motor together with a tension clamp material, a cut clamp material, a capillary, and the like. , Integrated with the head part. The time for adhering the lower end of the wire to the electrode of the bare chip and the time for adhering the wire to the electrode of the substrate are set in advance as the time for pulling out the wire from the spool by driving the motor, and the spool and the tension clamp are set. A wire slack detecting means consisting of an electrode and an air blowing portion for blowing air to the wire toward the electrode is provided between the materials, and the head portion is at an upper position, and both the tension clamp material and the cut clamp material are provided. The time during which the wire is clamped is set as the wire slack detection time by the slack detection means, and within this detection time, when the wire comes into contact with the electrode due to the air blowing and slack of the wire is detected, , The derivation of the wire by the drive of the motor at the derivation time is stopped. That.

（作用） 上記構成によれば、モータによるスプールを回転させ
ることにより、ワイヤをスプールから導出してキャピラ
リ側へワイヤを供給する。そしてたるみ検出時間中にワ
イヤのたるみが検出された場合には、ワイヤは十分な余
裕長を有するものと判断され、モータの駆動によるワイ
ヤの導出を中止する。(Operation) According to the above configuration, the wire is led out from the spool and supplied to the capillary side by rotating the spool by the motor. When the slack of the wire is detected during the slack detection time, it is determined that the wire has a sufficient margin length, and the derivation of the wire by driving the motor is stopped.

（実施例） 次に、図面を参照しながら本発明の実施例を説明す
る。Example Next, an example of the present invention will be described with reference to the drawings.

第１図はワイヤボンダーのヘッド部Ａを示すものであ
って、１はヘッド部Ａの主体となるフレームであり、こ
のフレーム１に、以下に述べる種々の部材や部品が一体
的に組み付けられている。２はこのフレーム１に軸着さ
れたスプールであり、金線のような極細のワイヤ３が巻
装されている。４はモータであり、スプール２を回転さ
せてワイヤ３を導出する。その際、ワイヤ３がよじれな
いように、ワイヤ３はスプール２の接線方向Ｎに導出さ
れる。FIG. 1 shows a head portion A of a wire bonder. Reference numeral 1 denotes a frame which is a main body of the head portion A. Various members and parts described below are integrally assembled to the frame 1. There is. Reference numeral 2 is a spool that is axially attached to the frame 1, around which an extremely fine wire 3 such as a gold wire is wound. Reference numeral 4 denotes a motor, which rotates the spool 2 to draw out the wire 3. At this time, the wire 3 is led out in the tangential direction N of the spool 2 so that the wire 3 is not twisted.

５はフレーム１の下方に装着されたテンションクラン
プ材、６はこのテンションクランプ材５の下方に設けら
れたカットクランプ材であって、それぞれ絶縁材７を介
して、フレーム１に取り付けられている。8,9はクラン
プ材5,6に装着されたパッドであり、このパッド8,9によ
りワイヤ３をクランプする。Reference numeral 5 denotes a tension clamp material mounted below the frame 1, and 6 denotes a cut clamp material provided below the tension clamp material 5, which are attached to the frame 1 via an insulating material 7. Reference numerals 8 and 9 denote pads attached to the clamp members 5 and 6, and the wires 3 are clamped by the pads 8 and 9.

11はカットクランプ材６の下方に設けられた長筒状の
キャピラリであって、フレーム１から突出するホーン12
の先端部に保持されている。16はトーチ電極であって、
キャピラリ11から導出するワイヤ３の下端部に接近し、
ワイヤ３の下端部に溶融ボール17を形成する。13はフレ
ーム１の上部に装着されたカメラ、18はその鏡筒であ
り、キャピラリ11の下方のボンディング地点を観察す
る。14は基板、15は基板14に搭載されたベアチップであ
り、後に詳述するように、基板14の電極とベアチップ15
の電極は、ワイヤ３により接続される。Reference numeral 11 denotes a long cylindrical capillary provided below the cut clamp material 6, and a horn 12 protruding from the frame 1
Is held at the tip. 16 is a torch electrode,
Approaching the lower end of the wire 3 derived from the capillary 11,
A molten ball 17 is formed at the lower end of the wire 3. Reference numeral 13 denotes a camera mounted on the upper portion of the frame 1, and reference numeral 18 denotes a lens barrel thereof, which observes a bonding point below the capillary 11. Reference numeral 14 is a substrate, and 15 is a bare chip mounted on the substrate 14.
The electrodes of are connected by wires 3.

21はスプール２とテンションクランプ材５の間に設け
られたエア吹出部、20は図示しない送気装置からこのエ
ア吹出部21にエアを送るチューブ、22,22はエア吹出部2
1に立設されたワイヤ３のガイドである。第２図に示す
ように、このガイド22は電気的に絶縁された線材のタテ
長の閉ループ状に屈曲させて形成されており、その内部
にワイヤ３が通されている。23はエア吹出孔である。こ
のエア吹出部21は、エアをワイヤ３に吹付けることによ
り、ワイヤ３に所望のテンションを加える。Reference numeral 21 is an air blowing portion provided between the spool 2 and the tension clamp member 5, 20 is a tube for sending air from an air feeding device (not shown) to the air blowing portion 21, and 22 and 22 are air blowing portions 2
This is a guide for the wire 3 erected on 1. As shown in FIG. 2, the guide 22 is formed by bending an electrically insulated wire rod into a closed loop having a vertical length, and the wire 3 is passed through the inside thereof. Reference numeral 23 is an air outlet. The air blowing section 21 applies a desired tension to the wire 3 by blowing air to the wire 3.

第２図において、24はガイド22の上方に設けられた電
極であり、電極24には、常時高周波の正電圧が印加され
ている。電極24は制御回路26に接続されており、上記モ
ータ４は、この制御回路26に接続されている。上記エア
吹出部21は、ワイヤ３を電極24に吹き当てる方向にエア
を吹き出すものであり、ワイヤ３が電極24に接触する
と、ワイヤ３は十分なたるみを有するものと判断され
る。すなわちエア吹出部21や電極24は、ワイヤ３のたる
み検出手段を構成している。In FIG. 2, reference numeral 24 is an electrode provided above the guide 22, and a high-frequency positive voltage is constantly applied to the electrode 24. The electrode 24 is connected to a control circuit 26, and the motor 4 is connected to the control circuit 26. The air blowing section 21 blows air in the direction in which the wire 3 is blown against the electrode 24. When the wire 3 comes into contact with the electrode 24, it is determined that the wire 3 has sufficient slack. That is, the air blowing portion 21 and the electrode 24 constitute a slack detecting means for the wire 3.

第３図はワイヤボンディングの作業順を示す展開図で
あって、横軸は時間Ｔ、縦軸はキャピラリ11の高さＺで
ある。また第４図は作業順の部分図であり、次に両図を
参照しながら、全体の動作の説明を行う。FIG. 3 is a development view showing the work order of wire bonding, in which the horizontal axis represents time T and the vertical axis represents the height Z of the capillary 11. Further, FIG. 4 is a partial view in the order of work, and the whole operation will be described below with reference to both drawings.

当初、ヘッド部Ａは基板14の上方位置にあり、この位
置で、テンションクランプ材５とカットクランプ材６
は、共にワイヤ３をクランプしている（第３図t1及び第
４図（ａ）参照）。この状態で、キャピラリ11から導出
するワイヤ３の下端部にトーチ電極16を接近させ、高電
圧を印加して、溶融ボール17を形成する。Initially, the head portion A is located above the substrate 14, and at this position, the tension clamp material 5 and the cut clamp material 6 are provided.
Both clamp the wire 3 (see t1 in FIG. 3 and FIG. 4 (a)). In this state, the torch electrode 16 is brought close to the lower end of the wire 3 led out from the capillary 11 and a high voltage is applied to form the molten ball 17.

次いでカットクランプ材６は開放してクランプ状態を
解除し、テンションクランプ材５によりワイヤ３を軽く
クランプしたままで、ヘッド部Ａを基板14へ向って下降
させる（第３図t2）。Next, the cut clamp material 6 is released to release the clamped state, and the head portion A is lowered toward the substrate 14 while the wire 3 is lightly clamped by the tension clamp material 5 (t2 in FIG. 3).

次いで両クランプ材5,6によるクランプ状態を共に解
除し、キャピラリ11をゆっくり下降させて、ボール17を
ベアチップ15の電極に着地させて接着する（t3,t4及び
第４図（ｂ））。このとき、ホーン12に図示しないUS発
振器から超音波を伝達して、ボール17の接着を促進す
る。Then, the clamped state by both clamp members 5 and 6 is released, and the capillary 11 is slowly lowered to land the ball 17 on the electrode of the bare chip 15 and adhere them (t3, t4 and FIG. 4 (b)). At this time, ultrasonic waves are transmitted to the horn 12 from a US oscillator (not shown) to promote adhesion of the balls 17.

次いでキャピラリ11を上昇させ（t5）、次いで側方へ
移動させ（t6）、次いで下降させて（t7,t8）、ワイヤ
３をキャピラリ11の下端部により基板14の電極に押し付
け、同様にホーン12に超音波を伝達して、ワイヤ３を基
板14に接着する（t9及び第４図（ｃ））。このようにワ
イヤ３をベアチップ15に接着することを1stボンディン
グ、また基板14に接着することを2ndボンディングとい
う。Next, the capillary 11 is raised (t5), then moved laterally (t6), and then lowered (t7, t8), the wire 3 is pressed against the electrode of the substrate 14 by the lower end of the capillary 11, and the horn 12 is also used. Ultrasonic waves are transmitted to the wire 3 to bond it to the substrate 14 (t9 and FIG. 4 (c)). Adhering the wire 3 to the bare chip 15 in this way is called 1st bonding, and adhering it to the substrate 14 is called 2nd bonding.

次いでキャピラリ11を上昇させ、その途中でカットク
ランプ材６でワイヤ３をクランプして上方へ引っ張るこ
とにより、ワイヤ３を基板14との接合部ｂから切断し
（t10,第４図（ｄ），（ｅ））、更にキャピラリ11は上
昇して、当初の高さに復帰する（t1′）。Next, the capillary 11 is raised, and the wire 3 is clamped by the cut clamp material 6 and pulled upward in the middle thereof, so that the wire 3 is cut from the joint b with the substrate 14 (t10, FIG. 4 (d), (E)) Further, the capillary 11 rises and returns to the initial height (t1 ').

上記動作において、モータ４を駆動して、ワイヤ３を
スプール２から導出する時間は、ヘッド部Ａが昇降動作
を停止して、1stボンディングを行っている時間t4と、2
ndボンディングを行っている時間t9に予め設定されてい
る。これは、ヘッド部Ａの昇降動作停止中が、スプール
２からワイヤ３を安定して導出しやすい為である。In the above operation, the time for driving the motor 4 and pulling out the wire 3 from the spool 2 is the time t4 during which the head part A stops the ascending / descending operation and the first bonding is performed.
It is preset to the time t9 during which nd bonding is performed. This is because it is easy to stably pull out the wire 3 from the spool 2 while the lifting operation of the head portion A is stopped.

またヘッド部Ａが上方位置にある時間t1を、上記電極
24によるワイヤ３のたるみ検出時間としている。すなわ
ちこの時間中に、エア吹出部21からのエアの吹出しによ
り、ワイヤ３が電極24に接触すれば、その検出信号は制
御回路26に送られ、上記時間t4,t9におけるモータ４の
駆動を中止して、ワイヤ３の導出は中止される。すなわ
ち、エアの吹き付けにより、ワイヤ３が電極24に接触し
た場合は、ワイヤ３には十分な余裕長があるものと判断
され、ワイヤ３の導出は中止される。したがってワイヤ
３を必要以上に導出することにより、ワイヤ３のテンシ
ョンに狂いを生じて、第６図を参照しながら説明したよ
うに、ワイヤ３に曲りが生じるのを防止する。In addition, the time t1 when the head portion A is in the upper position is
The slack of wire 3 is detected by 24. That is, during this time, if the wire 3 comes into contact with the electrode 24 due to the air blowing from the air blowing portion 21, the detection signal is sent to the control circuit 26, and the driving of the motor 4 at the times t4 and t9 is stopped. Then, the lead-out of the wire 3 is stopped. That is, when the wire 3 comes into contact with the electrode 24 due to the blowing of air, it is determined that the wire 3 has a sufficient margin length, and the lead-out of the wire 3 is stopped. Therefore, by pulling out the wire 3 more than necessary, it is possible to prevent the tension of the wire 3 from being distorted and to prevent the wire 3 from being bent as described with reference to FIG.

この時間t1をたるみ検出時間とするのは、次の理由に
よる。すなわちワイヤ３が電極24に接触すると、電極24
からワイヤ３を通ってクランプ材5,6側へ微弱な電流が
流れるが、この時間t1にあっては、両クランプ5,6は共
に閉じてワイヤ３に接触しており、したがって上部微弱
電流はワイヤ３からパッド8,9へ安定して流れ、ワイヤ
３やパッド8,9は電蝕を殆ど受けないからである。なお
上記時間t1以外の時間をたるみ検出時間とした場合、そ
の時間中にはクランプ材5,6は高速にて開閉して、パッ
ド8,9はワイヤ３に接離するものであるため、ワイヤ３
とパッド8,9の間の接触抵抗に伴う発熱が大きく、その
為ワイヤ３とパッド8,9の表面は電蝕により劣化し、殊
にパッド8,9の表面が荒れてしばしばパッド8,9を交換せ
ねばならなくなる為である。また上記のように両クラン
プ材5,6を特に絶縁材７を介してフレーム１に取り付け
る理由は、ワイヤ３からパッド8,9側へ微弱電流が流れ
るのを極力防止する為である。The time t1 is set as the slack detection time for the following reason. That is, when the wire 3 contacts the electrode 24,
A weak current flows from the wire 3 through the wire 3 to the clamp members 5 and 6, but at this time t1, both clamps 5 and 6 are closed and contact the wire 3, so the upper weak current is This is because the wire 3 stably flows to the pads 8 and 9, and the wire 3 and the pads 8 and 9 are hardly subjected to electrolytic corrosion. When the time other than the time t1 is set as the slack detection time, the clamp members 5 and 6 open and close at high speed during the time, and the pads 8 and 9 contact and separate from the wire 3. Three
A large amount of heat is generated due to the contact resistance between the pads 8 and 9, and the surfaces of the wires 3 and the pads 8 and 9 are deteriorated by electrolytic corrosion. This is because they will have to be exchanged. The reason why both the clamp members 5 and 6 are attached to the frame 1 through the insulating member 7 as described above is to prevent a weak current from flowing from the wire 3 to the pads 8 and 9 as much as possible.

また本手段は、ヘッド部Ａは、ワイヤ３の供給手段で
あるスプール２やモータ４を、クランプ材5,6やキャピ
ラリ11等と同一のフレーム１に一体的に組み付けて構成
されており、したがってクランプ材5,6及びキャピラリ1
1と、スプール２及びモータ４は、一体的に基板14上を
移動するので、スプール２とテンションクランプ材６の
間のワイヤ３の導出長は一定であって、かつこれを極力
短くして、ワイヤコントロールをより正確に行うことが
できる。Further, in this means, the head portion A is constructed by integrally assembling the spool 2 and the motor 4 which are means for supplying the wire 3 to the same frame 1 as the clamp members 5 and 6, the capillary 11 and the like. Clamping material 5, 6 and capillary 1
Since 1, the spool 2 and the motor 4 move integrally on the substrate 14, the lead-out length of the wire 3 between the spool 2 and the tension clamp material 6 is constant, and this is shortened as much as possible. Wire control can be performed more accurately.

（発明の効果） 以上説明したように本発明は、スプールをモータによ
り回転させて、ワイヤを導出するようにし、かつワイヤ
の下端部をベアチップの電極に接着する時間と、ワイヤ
を基板の電極に接着する時間を、上記モータの駆動によ
る上記スプールからのワイヤの導出時間として予め設定
するとともに、上記スプールとテンションクランプ材の
間に、電極と、この電極へ向ってワイヤにエアを吹き付
けるエア吹出部から成るワイヤのたるみ検出手段を設
け、上記ヘッド部が上方位置にあって、テンションクラ
ンプ材とカットクランプ材が共にワイヤをクランプして
いる時間を、上記たるみ検出手段によるワイヤのたるみ
検出時間として設定し、この検出時間内において、ワイ
ヤが電極に接触してワイヤのたるみが検出されたときに
は、上記導出時間における上記モータの駆動によるワイ
ヤの導出を中止するようにしているので、ワイヤを必要
なだけスプールから導出しながら、ボンディング作業を
行うことができ、したがってベアチップと基板を接続す
るワイヤに不要な曲りが生じるのを防止できる。またワ
イヤに流れる微弱電流により、ワイヤとテンションクラ
ンプ材及びカットクランプ材との接触部分に電蝕が発生
するのを防止することができ、更にはスプールからのワ
イヤの導出長を短くして、ワイヤコントロールを正確に
行うことができる。(Effects of the Invention) As described above, according to the present invention, the spool is rotated by the motor so that the wire is led out, and the lower end of the wire is bonded to the electrode of the bare chip, and the wire is connected to the electrode of the substrate. The bonding time is set in advance as the time for pulling out the wire from the spool by driving the motor, and the electrode and the air blowout unit for blowing air toward the electrode between the spool and the tension clamp material are set in advance. The slack detection means for the wire is provided, and the time during which the head portion is in the upper position and the tension clamp material and the cut clamp material both clamp the wire is set as the wire slack detection time by the slack detection means. However, if the wire comes into contact with the electrode and slack in the wire is detected within this detection time, Since the derivation of the wire by driving the motor is stopped during the derivation time, it is possible to carry out the bonding work while deducting the wire from the spool as much as necessary, and thus unnecessary for the wire connecting the bare chip and the substrate. It is possible to prevent a sharp bend. In addition, it is possible to prevent the occurrence of electrolytic corrosion in the contact portion of the wire with the tension clamp material and the cut clamp material due to the weak current flowing in the wire, and also to shorten the length of the wire drawn out from the spool, Control can be done accurately.

【図面の簡単な説明】[Brief description of the drawings]

図は本発明の実施例を示すものであって、第１図はヘッ
ド部の側面図、第２図はたるみ検出手段の斜視図、第３
図はボンディング作業の展開図、第４図は作業順の側面
図、第５図は従来装置の側面図、第６図はベアチップの
平面図である。 Ａ……ヘッド部 ２……スプール ３……ワイヤ ４……モータ ５……テンションクランプ材 ６……カットクランプ材 11……キャピラリ 14……基板 15……ベアチップ 16……トーチ電極 22……エア吹出部 22,24……たるみ検出手段 24……電極 t1……ワイヤのたるみ検出時間 t4,t9……ワイヤの導出時間FIG. 1 shows an embodiment of the present invention. FIG. 1 is a side view of a head portion, FIG. 2 is a perspective view of slack detecting means, and FIG.
FIG. 4 is a development view of the bonding work, FIG. 4 is a side view in the order of work, FIG. 5 is a side view of a conventional device, and FIG. 6 is a plan view of a bare chip. A: Head 2 ... Spool 3 ... Wire 4 ... Motor 5 ... Tension clamp material 6 ... Cut clamp material 11 ... Capillary 14 ... Board 15 ... Bare chip 16 ... Torch electrode 22 ... Air Blow-out section 22,24 …… Slack detection means 24 …… Electrode t1 …… Wire sag detection time t4, t9 …… Wire lead-out time

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ワイヤが巻装されたスプールと、このスプ
ールを回転させてワイヤを導出するモータと、このスプ
ールから導出されたワイヤをクランプしてこのワイヤに
テンションを加えるテンションクランプ材と、このテン
ションクランプ材の下方にあって、ワイヤをクランプす
るカットクランプ材と、このカットクランプ材の下方に
あって、ワイヤが通されるキャピラリとを一体的に組み
付けて成るヘッド部によるワイヤボンディング方法であ
って、上記キャピラリの下端部から導出するワイヤの下
端部にトーチ電極を接近させて溶融ボールを形成すると
ともに、上記テンションクランプ材でワイヤをクランプ
し、かつカットクランプ材によるクランプを解除した状
態で、上記ヘッド部を基板に搭載されたベアチップへ向
って下降させ、この溶融ボールをベアチップの電極に接
着した後、へッド部を基板の電極上へ移動させ、次いで
キャピラリの下端部を基板に押し付けて、このワイヤを
基板の電極に接着し、次いで上記カットクランプ材でこ
のワイヤをクランプし、ワイヤを上方へ引っ張って、基
板との接合部でワイヤを切断することにより、ベアチッ
プの電極と基板の電極をワイヤで接続するにあたり、 上記のようにワイヤの下端部をベアチップの電極に接着
する時間と、ワイヤを基板の電極に接着する時間を、上
記モータの駆動による上記スプールからのワイヤの導出
時間として予め設定するとともに、上記スプールとテン
ションクランプ材の間に、電極と、この電極へ向ってワ
イヤにエアを吹き付けるエア吹出部から成るワイヤのた
るみ検出手段を設け、上記ヘッド部が上方位置にあっ
て、テンションクランプ材とカットクランプ材が共にワ
イヤをクランプしている時間を、上記たるみ検出手段に
よるワイヤのたるみ検出時間として設定し、この検出時
間内において、ワイヤが上記エアの吹付けにより上記電
極に接触してワイヤのたるみが検出されたときには、上
記導出時間における上記モータの駆動によるワイヤの導
出を中止するようにしたことを特徴とするワイヤボンデ
ィング方法。1. A spool around which a wire is wound, a motor for rotating the spool to draw out the wire, a tension clamp member for clamping the wire drawn out from the spool and applying tension to the wire, A wire bonding method using a head portion, which is a combination of a cut clamp material that is below the tension clamp material and that clamps a wire, and a capillary that is below the cut clamp material and through which the wire is passed. In the state where the torch electrode is brought close to the lower end of the wire drawn out from the lower end of the capillary to form a molten ball, the wire is clamped by the tension clamp material, and the clamp by the cut clamp material is released, Lower the head part toward the bare chip mounted on the board, After adhering the molten ball to the electrode of the bare chip, move the head part onto the electrode of the substrate, then press the lower end of the capillary against the substrate, adhere this wire to the electrode of the substrate, and then use the above-mentioned cut clamp material. This wire is clamped with, the wire is pulled upward, and the wire is cut at the joint with the substrate.When connecting the bare chip electrode and the substrate electrode with the wire, the lower end of the wire is The time for adhering to the electrode of the bare chip and the time for adhering the wire to the electrode of the substrate are set in advance as the lead-out time of the wire from the spool by driving the motor, and the electrode is placed between the spool and the tension clamp material. And a wire slack detecting means consisting of an air blowing portion for blowing air toward the electrode toward the electrode, and the head portion is The time during which the tension clamp material and the cut clamp material are both clamping the wire at the same position is set as the wire slack detection time by the slack detection means, and within this detection time, the wire blows the air. A wire bonding method, wherein when the slack of the wire is detected by contacting with the electrode due to attachment, the wire deriving by driving the motor during the deriving time is stopped.
JP15777089A 1989-06-20 1989-06-20 Wire bonding method Expired - Fee Related JP2682146B2 (en)

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JP15777089A JP2682146B2 (en) 1989-06-20 1989-06-20 Wire bonding method

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Application Number Priority Date Filing Date Title
JP15777089A JP2682146B2 (en) 1989-06-20 1989-06-20 Wire bonding method

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JPH0322545A JPH0322545A (en) 1991-01-30
JP2682146B2 true JP2682146B2 (en) 1997-11-26

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JP15777089A Expired - Fee Related JP2682146B2 (en) 1989-06-20 1989-06-20 Wire bonding method

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JPH0322545A (en) 1991-01-30

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