JP2674667B2 - Oscillator application device - Google Patents
Oscillator application deviceInfo
- Publication number
- JP2674667B2 JP2674667B2 JP1108363A JP10836389A JP2674667B2 JP 2674667 B2 JP2674667 B2 JP 2674667B2 JP 1108363 A JP1108363 A JP 1108363A JP 10836389 A JP10836389 A JP 10836389A JP 2674667 B2 JP2674667 B2 JP 2674667B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric body
- conductor
- pad
- epoxy
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Description
【発明の詳細な説明】 〔概要〕 エポキシ系導電性接着材を使用し、アルミナ基板に振
動素子を搭載した振動子応用デバイスの構成に関し、 アルミナ基板に形成されたパッドと振動素子との接着
強度の改善を目的とし、 圧電体に駆動電極を形成し該駆動電極と連通する導体
端子が該圧電体の下面の端部に形成された振動素子を搭
載するアルミナ基板の上面には、所望の導体パターンと
該導体パターンに連通し該導体端子と電気的に接続され
るパッドとが少なくとも形成され、 ガラス粉末を混入し、かつ、該圧電体の下面端部の全
幅に渡って被着されるエポキシ系導電性接着性を介し
て、該導体端子に接続される該パッドが、該圧電体の接
着材被着領域より狭い領域に形成されてなること特徴と
し構成する。DETAILED DESCRIPTION OF THE INVENTION [Outline] Regarding the structure of a vibrator application device in which an epoxy-based conductive adhesive is used and a vibrating element is mounted on an alumina substrate, the bonding strength between a pad formed on the alumina substrate and the vibrating element is described. For the purpose of improving the above, a desired conductor is formed on the upper surface of an alumina substrate on which a vibrating element is formed, in which a drive electrode is formed on a piezoelectric body and a conductor terminal communicating with the drive electrode is formed at the end of the lower surface of the piezoelectric body. An epoxy having at least a pattern and a pad communicating with the conductor pattern and electrically connected to the conductor terminal, mixed with glass powder, and applied over the entire width of the lower end of the piezoelectric body. The pad connected to the conductor terminal via the system conductive adhesive is formed in an area narrower than the area where the adhesive is adhered to the piezoelectric body.
本発明はアルミナ基板に振動素子を搭載した振動子応
用デバイスの構成に関する。The present invention relates to the configuration of a vibrator application device in which a vibration element is mounted on an alumina substrate.
振動子応用デバイス、例えば圧電振動子を利用したフ
ィルタは、LCフィルタに比べ小型，高精度である無調整
で使用できるため、無線機器のアンテナ段やIF部におけ
る不要信号の除去等に多用されている。また、デジタル
伝送機器においても、入力するデジタルデータの中から
データを読み取るためのクロック信号成分を抽出する回
路等に使用されている。A filter using a vibrator application device, such as a piezoelectric vibrator, is smaller and more accurate than an LC filter and can be used without adjustment. Therefore, it is often used for removing unwanted signals in the antenna stage and IF section of wireless devices. There is. Further, in digital transmission equipment, it is also used in a circuit for extracting a clock signal component for reading data from input digital data.
第２図は振動素子を使用したフィルタの構成例を示す
回路図、第３図は該振動素子の構成例を示す斜視図、第
４図は該フィルタの構成例を示す側面図（イ）とその平
面図（ロ）である。2 is a circuit diagram showing a configuration example of a filter using a vibrating element, FIG. 3 is a perspective view showing a configuration example of the vibrating element, and FIG. 4 is a side view (a) showing a configuration example of the filter. It is the top view (b).
第２図において、ディスクリート形フィルタ１は、一
対の振動素子２とコンデンサ３を図示のようにラダー接
続して構成される。In FIG. 2, a discrete filter 1 is constructed by connecting a pair of vibrating elements 2 and a capacitor 3 in a ladder connection as shown.
第３図において、ストリップ形圧電振動素子２は、圧
電体４の対向主面（上面と下面）に駆動電極５を形成
し、駆動電極５に適当な高周波電力を印加すると圧電体
４は、図中の矢印で示す方向に厚み滑り振動が発生す
る。In FIG. 3, the strip-type piezoelectric vibrating element 2 has drive electrodes 5 formed on the opposing main surfaces (upper surface and lower surface) of the piezoelectric body 4, and when a suitable high-frequency power is applied to the drive electrode 5, the piezoelectric body 4 becomes Thickness shear vibration occurs in the direction indicated by the arrow inside.
かかる振動素子２において、駆動電極５から圧電体４
の長さ方向の端部に向けてリード5aが駆動電極５と一体
に形成され、圧電体４の上面および下面に形成されたリ
ード5aは、圧電体４の長さ方向の対向端面に向けて延在
する。In the vibrating element 2, the drive electrode 5 to the piezoelectric body 4
Lead 5a is integrally formed with the drive electrode 5 toward the end portion in the longitudinal direction of the piezoelectric body 4, and the lead 5a formed on the upper surface and the lower surface of the piezoelectric body 4 faces the opposite end surface of the piezoelectric body 4 in the longitudinal direction. Extend.
第２図に示すフィルタ１の構成例を示す第４図におい
て、セラミック基板６の上面には、導体パターン7,8,9,
10と、導体パターンの一端に連通する外部接続用電極7
a,電極８の一端に連通する外部接続用電極8a,導体パタ
ーン９の一端に連通する外部接続用電極9aおよび、導体
パターン７の他端に連通するパッド7b,導体パターン８
の他端に連通するパッド8b,導体パターン10の一端に連
通するパッド10a,導体パターン11を介してパッド10aに
連通するパッド10bとが形成される。In FIG. 4 showing a configuration example of the filter 1 shown in FIG. 2, conductor patterns 7, 8, 9,
10 and an electrode 7 for external connection communicating with one end of the conductor pattern
a, an external connection electrode 8a communicating with one end of the electrode 8, an external connection electrode 9a communicating with one end of the conductor pattern 9, and a pad 7b communicating with the other end of the conductor pattern 7, a conductor pattern 8
A pad 8b communicating with the other end, a pad 10a communicating with one end of the conductor pattern 10, and a pad 10b communicating with the pad 10a via the conductor pattern 11.
圧電体４の下面に形成されたリード5aの先端部（導体
端子）5bは、振動素子２をその搭載基板の上面に形成さ
れたパッドと電気的に接続されるようになるが、圧電体
４の上面に形成されたリード5aは、振動素子２のその搭
載基板の上面に形成されたパッドと電気的に接続するた
め、圧電体４の上面から端面を通り下面に及ぶ導体端子
12が形成される。The tip portion (conductor terminal) 5b of the lead 5a formed on the lower surface of the piezoelectric body 4 electrically connects the vibration element 2 to the pad formed on the upper surface of the mounting substrate. The lead 5a formed on the upper surface of the piezoelectric element 4 is electrically connected to the pad formed on the upper surface of the mounting substrate of the vibration element 2, so that the lead 5a extends from the upper surface of the piezoelectric body 4 through the end surface to the lower surface.
12 is formed.
導体パターン９と10との間にはコンデンサ素子３が搭
載され、パッド7bと10aとの間には第１の振動素子２が
搭載され、パッド8bと10bとの間には第２の振動素子２
が搭載されるが、パッド7b,8a,10a,10bの幅w2は圧電体
４の幅w1より大きく、従って振動素子２をセラミック基
板６の上面に搭載したときエポキシ系導電性接着材13
は、パッド7b,8a,10a,10bからはみ出すことなしに被着
されるようになる。The capacitor element 3 is mounted between the conductor patterns 9 and 10, the first vibrating element 2 is mounted between the pads 7b and 10a, and the second vibrating element is positioned between the pads 8b and 10b. Two
However, the width w 2 of the pads 7b, 8a, 10a, 10b is larger than the width w 1 of the piezoelectric body 4, so that when the vibration element 2 is mounted on the upper surface of the ceramic substrate 6, the epoxy-based conductive adhesive 13
Will be applied without protruding from the pads 7b, 8a, 10a, 10b.
前述したように、振動素子２の圧電体４は滑り振動す
るようになるが、従来の振動子応用デバイス１は、エポ
キシ系導電接着材14とパッド7b,8a,10a,10bとの接着強
度が不十分であり、該滑り振動等によってその接着部分
で剥離されることがあるという問題点があった。As described above, the piezoelectric body 4 of the vibrating element 2 comes to vibrate by sliding, but in the conventional vibrator application device 1, the adhesive strength between the epoxy-based conductive adhesive 14 and the pads 7b, 8a, 10a, 10b is high. There is a problem in that it is insufficient, and the bonded portion may be peeled off due to the sliding vibration or the like.
本発明は、一般にAg−PdペーストまたはCuペーストが
使用される従来のパッド7b,8a,10a,10bと、エポキシ系
導電性接着材と接着強度および、エポキシ系導電性接着
材とアルミナ板との接着強度を調べ、後者が前者より優
れることを確認し、そのことを利用して前記問題点を除
去することを目的とする。The present invention is a conventional pad 7b, 8a, 10a, 10b generally used Ag-Pd paste or Cu paste, an epoxy-based conductive adhesive and adhesive strength, and an epoxy-based conductive adhesive and an alumina plate The purpose is to examine the adhesive strength, confirm that the latter is superior to the former, and utilize this to eliminate the above problems.
上記目的は、本発明の実施例を示す第１図によれば、
圧電体４に駆動電極５を形成し駆動電極５と連通する導
体端子5b,12が圧電体４の下面の端部に形成された振動
素子２を搭載するアルミナ基板６の上面には、所望の導
体パターン7,8,9,10,11と導体パターン7,8,9,10,11に連
通し導体端子5b,12と電気的に接続されるパッド7c,8c,1
0c,10dとが少なくとも形成され、 ガラス粉末を混入し、かつ、圧電体４の下面端部の全
幅に渡って被着されるエポキシ系導電性接着材13を介し
て、該導体端子5b,12に接続される該パッド7c,8c,10c,1
0dが、圧電体４の接着材13被着領域より狭い領域に形成
されてなることを特徴とする振動子応用デバイスによっ
て達成される。According to FIG. 1 showing the embodiment of the present invention,
A desired driving electrode 5 is formed on the piezoelectric body 4, and conductor terminals 5b, 12 communicating with the driving electrode 5 are formed on the lower surface of the piezoelectric body 4 on the upper surface of the alumina substrate 6 on which the vibration element 2 is mounted. Pads 7c, 8c, 1 connected to the conductor patterns 7, 8, 9, 10, 11 and the conductor patterns 7, 8, 9, 10, 11 and electrically connected to the conductor terminals 5b, 12
0c and 10d are formed at least, the glass powder is mixed, and the conductor terminals 5b and 12 are provided through the epoxy-based conductive adhesive 13 that is applied over the entire width of the lower end of the piezoelectric body 4. Connected to the pads 7c, 8c, 10c, 1
0d is achieved by a vibrator application device characterized in that it is formed in a region narrower than a region where the adhesive 13 of the piezoelectric body 4 is adhered.
本発明者の調査によれば、エポキシ系導電性接着材は
導体性ペーストを焼成してなるパッドよりアルミナ基板
との接着力が強く、さらにそのエポキシ系導電性接着材
にガラス粉末を混入することで残留応力や熱応力に対す
る耐性が改善されることが確認された。上記手段はかか
る接着力の差および耐応力性の改善を利用し、エポキシ
系導電性接着材の一部がアルミナ基板と直接に接着され
るようにし、かつ、その接着材にはガラス粉末を混入し
振動子応用デバイスを構成したものであり、そのことに
よって振動素子の機械的接着力が向上された。According to the investigation by the present inventor, the epoxy-based conductive adhesive has a stronger adhesive force with the alumina substrate than the pad formed by firing the conductive paste, and further, the epoxy-based conductive adhesive is mixed with glass powder. It was confirmed that the resistance to residual stress and thermal stress was improved. The above means utilizes the difference in adhesive strength and the improvement of stress resistance so that a part of the epoxy-based conductive adhesive is directly bonded to the alumina substrate, and the adhesive is mixed with glass powder. This is a device for applying a vibrator, which improves the mechanical adhesive force of the vibration element.
以下に、図面を用いて本発明の実施例による振動子応
用デバイスを説明する。A vibrator application device according to an embodiment of the present invention will be described below with reference to the drawings.
第１図は第２図に示す回路のフィルタに本発明を適用
した実施例を示す側面図（イ）とその平面図（ロ）であ
る。FIG. 1 is a side view (a) and a plan view (b) showing an embodiment in which the present invention is applied to the filter of the circuit shown in FIG.
前出図と共通部分に同一符号を使用した第１図におい
て、フィルタ21に使用するセラミック基板６の上面に
は、導体パターン7,8,9,10,11と、導体パターンの一端
に連通される外部接続用電極7a,電極８の一端に連通さ
れる外部接続用電極8a,導体パターン９の一端に連通さ
れる外部接続用電極9aおよび、導体パターン７の他端に
連通されるパッド7c,導体パターン８の他端に連通され
るパッド8c,導体パターン10の一端に連通されるパッド1
0c,導体パターン11を介してパッド10aに連通されるパッ
ド10dとを形成する。In FIG. 1 in which the same reference numerals are used for the same parts as in the above-mentioned drawing, the upper surface of the ceramic substrate 6 used for the filter 21 is connected to the conductor patterns 7, 8, 9, 10, 11 and one end of the conductor pattern. An external connection electrode 7a, an external connection electrode 8a communicated with one end of the electrode 8, an external connection electrode 9a communicated with one end of the conductor pattern 9, and a pad 7c communicated with the other end of the conductor pattern 7, A pad 8c communicating with the other end of the conductor pattern 8 and a pad 1 communicating with one end of the conductor pattern 10
0c, a pad 10d communicating with the pad 10a via the conductor pattern 11 is formed.
導体パターン９と10との間にはコンデンサ素子３が搭
載され、導体パターン７または11と同一幅に形成された
パッド7cと10cとの間には第１の振動素子２が搭載さ
れ、導体パターン８または11の同一幅に形成されたパッ
ド8cと10dとの間には第２の振動素子２が搭載される
が、パッド7c,8c,10c,10dの幅w3（例えば400μｍ〜600
μｍ）は、圧電体４の幅w1（例えば1mm〜1.2mm）より狭
く、従って振動素子２をセラミック基板６の上面に搭載
したとき、圧電体４の下面端部の全幅に渡り例えば長さ
ｌ＝1mm程度に被着されるエポキシ系導電性接着材13
は、パッド7c,8c,10c,10dよりその幅w3方向にはみ出し
た部分が、セラミック基板６と直接に接着するようにな
る。The capacitor element 3 is mounted between the conductor patterns 9 and 10, and the first vibrating element 2 is mounted between the pads 7c and 10c formed in the same width as the conductor pattern 7 or 11, The second vibrating element 2 is mounted between the pads 8c and 10d having the same width of 8 or 11 and the width w 3 of the pads 7c, 8c, 10c and 10d (for example, 400 μm to 600 μm).
μm) is narrower than the width w 1 (for example, 1 mm to 1.2 mm) of the piezoelectric body 4, and therefore, when the vibrating element 2 is mounted on the upper surface of the ceramic substrate 6, the entire length of the lower end portion of the piezoelectric body 4 is, for example, the length. Epoxy-based conductive adhesive applied to l = 1mm 13
The portions of the pad 7c, 8c, 10c, 10d protruding in the width w 3 direction are directly bonded to the ceramic substrate 6.
下記の表は、本発明の実施に先立って調査した エポキシ系導電性接着材の接着強度の実測値であり、ペ
ースト材を印刷焼成し形成したAg−Pd膜およびCu膜に対
するエポキシ系導電性接着材の接着強度は、アルミナ基
板とエポキシ系導電性接着材との接着強度より劣るよう
になる。The table below was investigated prior to the practice of the invention. This is the measured value of the adhesive strength of the epoxy-based conductive adhesive, and the adhesive strength of the epoxy-based conductive adhesive to the Ag-Pd film and Cu film formed by printing and baking the paste material is the adhesive strength of the alumina substrate and the epoxy-based conductive adhesive. It becomes inferior to the adhesive strength with the material.
なお、エポキシ系導電性接着材を用いて振動素子２を
搭載するに際し、従来エポキシ系導電性接着層の厚さは
一般に90μｍ程度であったが、該接着材の硬化時の加熱
処理による残留応力および、使用雰囲気の高温化による
熱応力が、接着材の強度を低減せしめる。When mounting the vibrating element 2 using an epoxy-based conductive adhesive material, the thickness of the conventional epoxy-based conductive adhesive layer was generally about 90 μm, but residual stress due to heat treatment during curing of the adhesive material is generally used. In addition, the thermal stress due to the high temperature of the use atmosphere reduces the strength of the adhesive material.
そのため、接着材にガラス粉末を混入し、厚さ200μ
ｍ程度以上に形成せしめた接着材13は、それ自体が応力
を吸収し易くなる。そのため、例えば０℃〜70℃の温度
範囲で周波数変化率350ppmであった従来の温度特性が10
0ppm程度に向上すると共に、残留応力および使用雰囲気
によって印加された熱応力に伴う寿命を改善することが
可能であり、このことを本発明による振動子応用デバイ
21に適用すれば、本発明の効果は一層顕著になる。Therefore, the glass powder is mixed in the adhesive, and the thickness is 200μ.
The adhesive material 13 formed to have a thickness of about m or more easily absorbs stress by itself. Therefore, for example, in the temperature range of 0 ° C to 70 ° C, the conventional temperature characteristic that the frequency change rate is 350 ppm is 10
It is possible to improve to about 0 ppm and to improve the life due to residual stress and thermal stress applied by the use atmosphere.
When applied to 21, the effect of the present invention becomes more remarkable.
以上説明したように本発明によれば、アルミナ基板に
搭載された振動素子の静的接着強度および熱応力に対す
る接着強度が向上し、かつ、残留内部応力の分散によっ
て振動の温度特性か改善され、例えば第２図に示す回路
構成のフィルタに本発明を適用したとき、例えば故障率
を５％にするまでに印加する温度サイクル数は、従来の
３倍以上になることが実験によって確認された。As described above, according to the present invention, the static adhesive strength and the adhesive strength against thermal stress of the vibration element mounted on the alumina substrate are improved, and the temperature characteristic of vibration is improved by the dispersion of the residual internal stress, For example, when the present invention is applied to the filter having the circuit configuration shown in FIG. 2, it has been confirmed by experiments that the number of temperature cycles applied until the failure rate becomes 5% is three times or more that of the conventional one.
第１図は本発明の一実施例によるフィルタ、 第２図は振動素子を使用したフィルタの構成例を示す回
路図、 第３図は振動素子の構成例を示す斜視図、 第４図は第１図に示すフィルタの従来の構成例、 である。 図中において、 ２は振動素子、 ４は圧電体、 ５は駆動電極、 5b,12は導体端子、 ６はアルミナ基板、 7,8,9,10,11は導体パターン、 7c,8c,10c,10dはパッド、 13はエポキシ系導電性接着材、 21はフィルタ（振動子応用デバイス）、 を示す。FIG. 1 is a filter according to an embodiment of the present invention, FIG. 2 is a circuit diagram showing a structural example of a filter using a vibrating element, FIG. 3 is a perspective view showing a structural example of a vibrating element, and FIG. It is the conventional structural example of the filter shown in FIG. In the figure, 2 is a vibrating element, 4 is a piezoelectric body, 5 is a drive electrode, 5b and 12 are conductor terminals, 6 is an alumina substrate, 7,8,9,10,11 are conductor patterns, 7c, 8c, 10c, 10d is a pad, 13 is an epoxy-based conductive adhesive, and 21 is a filter (vibrator application device).
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中島 敏夫 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭63−19907（ＪＰ，Ａ) 実開 昭56−65683（ＪＰ，Ｕ) 実開 昭57−39127（ＪＰ，Ｕ) 実開 昭63−40023（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Nakajima 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (56) References JP 63-19907 (JP, A) (JP, U) Actually opened 57-39127 (JP, U) Actually opened 63-40023 (JP, U)
Claims (1)
駆動電極（５）と連通する導体端子（5b,12）が該圧電
体（４）の下面の端部に形成された振動素子（２）を搭
載するアルミナ基板（６）の上面には、所応の導体パタ
ーン（7,8,9,10,11）と該導体パターン（7,8,9,10,11）
に連通し該導体端子（5b,12）と電気的に接続されるパ
ッド（7c,8c,10c,10d）とが形成され、 ガラス粉末を混入し、かつ、該圧電体（４）の下面端部
の全幅に渡って被着されるエポキシ系導電性接着材（1
3）を介して、該導体端子（5b,12）に接続される該パッ
ド（7c,8c,10c,10d）が、該圧電体（４）の接着材（1
3）被着領域より狭い領域に形成されてなること特徴と
する振動子応用デバイス。1. A drive electrode (5) is formed on a piezoelectric body (4), and a conductor terminal (5b, 12) communicating with the drive electrode (5) is formed at an end portion of a lower surface of the piezoelectric body (4). The conductor pattern (7,8,9,10,11) and the conductor pattern (7,8,9,10,11) are formed on the upper surface of the alumina substrate (6) on which the vibrating element (2) is mounted.
A pad (7c, 8c, 10c, 10d) which is connected to the conductor terminal (5b, 12) and is electrically connected to the conductor terminal (5b, 12), glass powder is mixed, and the lower end of the piezoelectric body (4) is formed. Epoxy conductive adhesive that is applied over the entire width of the part (1
The pads (7c, 8c, 10c, 10d) connected to the conductor terminals (5b, 12) via the adhesive material (1) of the piezoelectric body (4)
3) A vibrator application device characterized in that it is formed in an area narrower than the deposition area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108363A JP2674667B2 (en) | 1989-04-26 | 1989-04-26 | Oscillator application device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108363A JP2674667B2 (en) | 1989-04-26 | 1989-04-26 | Oscillator application device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02285706A JPH02285706A (en) | 1990-11-26 |
| JP2674667B2 true JP2674667B2 (en) | 1997-11-12 |
Family
ID=14482850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1108363A Expired - Lifetime JP2674667B2 (en) | 1989-04-26 | 1989-04-26 | Oscillator application device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2674667B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5406682A (en) * | 1993-12-23 | 1995-04-18 | Motorola, Inc. | Method of compliantly mounting a piezoelectric device |
| KR100538654B1 (en) * | 2001-10-18 | 2005-12-26 | 쌍신전자통신주식회사 | Thin Film Piezoelectric Element and Manufacture Method of The Same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665683U (en) * | 1979-10-23 | 1981-06-01 | ||
| JPS6319907A (en) * | 1986-07-14 | 1988-01-27 | Fujitsu Ltd | Piezoelectric vibrator |
| JPS6340023U (en) * | 1986-08-29 | 1988-03-15 |
-
1989
- 1989-04-26 JP JP1108363A patent/JP2674667B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02285706A (en) | 1990-11-26 |
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