JP2669728B2 - Wiring board exposure processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of exposing a wiring board of a liquid crystal display element by dividing it into a plurality of exposure areas and exposing the wiring board.

[0002]

2. Description of the Related Art In the case of a liquid crystal display element which drives each display pixel by an active matrix driving method, a thin film transistor (hereinafter referred to as a TFT) is used as a switching element of each display pixel.
) Or MIM (Metel-Insulator-Metal). In order to form these switching elements in the display section of the liquid crystal display element, the substrate of the liquid crystal display element must be exposed multiple times and a plurality of circuit wirings must be formed on the etched circuit wirings. I have to. When performing these exposures, the sequential exposure apparatus 1 shown in FIG. 1 described in the embodiment, which is used for exposure of a large scale integrated circuit, is used.

[0003] A substrate 6 to be exposed is mounted on a stage 5 composed of an X stage 5x, a Y stage 5y, and a Θ stage 5θ of the sequential exposure apparatus 1, and the X stage 5x and the Y stage 5y movable in orthogonal directions. Can be moved and exposed, so that a plurality of liquid crystal display element regions 21
(The liquid crystal display element regions 21a and 21b to be described later are collectively referred to as reference numeral 21).

FIG. 12 is a diagram showing a first conventional example.
A liquid crystal display element region 21 formed by a first exposure process indicated by four dotted lines, four in each of the vertical and horizontal directions, is formed on a substrate (not shown), and a set of the liquid crystal display element regions 21 is rectangular. .

For these exposures, the central coordinate m0 of each liquid crystal display element region 21 is controlled from the setting input section 10 of the diagram showing the electrical configuration of the sequential exposure apparatus 1 shown in FIG. It is stored in the calculation unit 11, and the control calculation unit 11 stores
Is performed by aligning the center coordinate m0 with the center of the exposure position of the sequential exposure apparatus 1.

The substrate 6 which has been subjected to etching, cleaning and the like after the first exposure processing is placed on the table 5. At this time, using the positioning marker (not shown) formed by the first exposure process, the exposure position of the sequential exposure apparatus 1 and
Positioning is performed using the stages 5θ, 5y, and 5x of the table 5 so that the positional relationship with the substrate matches that in the first exposure process. However, when fixing the Θ stage 5θ that is not used for exposure to the Y stage 5y,
θ moves in the rotation direction. For this reason, as shown in FIG. 12, x indicating the moving direction of the X stage 5x of the table 5
The axis and the y-axis indicating the moving direction of the y stage orthogonal to the axis are an angle α between the first exposure processing and the second exposure processing.
Deviation occurs.

In FIG. 12, a positioning marker (not shown) formed on the center coordinate m of the set of the liquid crystal display element regions 21 is moved to the same position as that during the first exposure using the X stage 5x and the Y stage 5y. And the moving distance is shown in FIG.
And the XYθ laser interferometer 8 shown in FIG. 12 is used for measurement by the control calculation unit 11, and correction is performed based on the moving distance so that each center coordinate m0 matches each center coordinate m0 in the first exposure processing. Be seen. Therefore, as shown in FIG. 12, although the center coordinates m0 of the liquid crystal display element region 21 at the time of the first exposure process and the liquid crystal display device region 21 at the time of the second exposure process indicated by the solid line are the same, At other positions, there is a deviation of an angle α in the rotation direction about each center coordinate m0.

Due to this displacement, the positional relationship between the circuit wiring formed by the first exposure processing and the circuit wiring formed by the second exposure processing may be displaced, causing electrical disconnection. The display quality is maintained by designing the circuit wiring so that the circuit wiring is formed so that the generation thereof does not affect the display.

[0009]

FIG. 13 is a diagram showing a second conventional example. In the second conventional example, the first exposure process and the second exposure process are performed by the same method as the first conventional example. The second conventional example differs from the first conventional example in that the liquid crystal display element region 21 is large and four types of photomasks A, B,
That is, one display element region 21 is exposed using C and D.

In this case, the circuit wiring formed by the second exposure processing has a wiring-free gap 22 at the center,
Further, the circuit wiring is such that each exposure area 23 exposed by the photomasks A, B, C and D is displaced from the adjacent exposure area 23 in the x-axis or y-axis direction.

Therefore, when the display is performed, each exposure area 2
The display quality is deteriorated, for example, a cross section is generated at the connection portion of No. 3, and when the liquid crystal display element is driven, a difference in contrast occurs between the exposure regions 23.

An object of the present invention is to provide an exposure processing method for a wiring board that improves the display quality.

[0013]

According to the present invention, there is provided an exposure method for a wiring board, wherein a wiring board is divided into display areas each consisting of one or a plurality of exposure areas by one mask to perform exposure processing. Coordinate data indicating the first coordinate set in advance and the second coordinate set in advance for each exposure area.
Various data including second coordinate data based on the first coordinate indicating the coordinate and third coordinate data indicating the third coordinate which is the coordinate of the positioning means formed at the time of exposure are stored in the storage means, and the first means is stored. A first exposure process is performed using the coordinate data and the second coordinate data to form the first circuit wiring and the positioning means on the wiring board, and the third coordinate stored in the storage means and the positioning means. The coordinates of the positioning means formed on the third coordinates during the first exposure processing detected by the coordinate detection means for detecting the coordinates are compared, and the comparison result and the first coordinate data and the third coordinate data are used. First
A coordinate is corrected, and a second exposure process is performed using the corrected first coordinate and second coordinate data to form one or a plurality of second circuit wirings on the first circuit wiring. It is a characteristic method of exposing a wiring board.

[0014]

According to the present invention, in a method of exposing a wiring board for performing an exposure process by dividing the wiring board into display areas each composed of one or a plurality of exposure areas using one photomask, first, the storage means is firstly stored in a storage means. Various data including the second and third coordinate data is stored. The first coordinate data indicates the first coordinate preset for each area, and the second coordinate data indicates the second coordinate preset for each exposure area. The second coordinate data indicates a second coordinate based on the first coordinate. Further, the third coordinate data indicates the third coordinate which is the coordinate of the positioning means formed at the time of exposure. Various data other than the first, second, and third coordinate data include the number of display areas formed on the wiring board, the number of exposure areas forming one display area, the size of the exposure area, and the like.

Next, a first exposure process is performed. The first exposure process is performed by determining the second coordinate from the second coordinate data by using the first coordinate based on the first coordinate data, and setting each exposure region on the wiring board by using the second coordinate. . As a result, the first circuit wiring is formed on the wiring board.

Next, a second exposure process is performed. The position of the wiring board when performing the second exposure process is deviated from the position where the first exposure process is performed. Therefore, the coordinate detection unit detects the coordinate of the positioning unit formed on the third coordinate during the first exposure processing, and compares it with the third coordinate stored in the storage unit. The first coordinate is corrected using the comparison result and the first and third coordinate data. Using the corrected first coordinates, a second coordinate is determined from the second coordinate data,
The second exposure process is performed by setting each exposure area on the wiring board using the second coordinates. As a result, the second circuit wiring is formed on the wiring board. By repeating the second exposure process, a plurality of second circuit wirings can be formed on the first circuit wirings.

[0017]

1 is a side view showing an optical configuration of a sequential exposure apparatus 1. The light reflected by the mirror 2 passes through the photomask 3 having an exposure pattern, and is irradiated onto the substrate 6 on the table 5 via the lens 4. On the substrate 6, a photoresist is applied on a layer which will be the circuit wiring.

The stage 5 has a Θ stage 5θ which is angularly displaced in the rotational direction and an X stage 5x which is movable in directions orthogonal to each other.
And Y stage 5y. The exposure position of the substrate 6 on the table 5 can be arbitrarily selected by driving each stage 5x, 5y, 5θ of the table 5. The error between the position of the table 5 and the measurement position of the XYΘ laser interferometer 8 can be confirmed by using the XYΘ positioning sensor 7 which is the coordinate detecting means.

The position of each stage 5x, 5y, 5θ of the table 5 is constantly measured by the XYΘ laser interferometer 8, and the driving of each stage 5x, 5y, 5θ is performed by XYΘ.
It is performed by the stage drive unit 9.

FIG. 2 is a diagram showing the electrical configuration of the sequential exposure apparatus 1. XYΘ is stored in the control calculation unit 11 which is a storage means.
The positioning sensor 7, the XYΘ laser interferometer 8, the XYΘ stage drive unit 9 and the setting input unit 10 are connected.
The positioning sensor 7 and the XY stage driving unit 9 are also connected. An X stage 5x, a Y stage 5y, and a Θ stage 5θ are connected to the XYΘ stage drive unit 9.

When positioning the table 5, the XY-position sensor 7 informs the XY-stage drive 9 that positioning is to be performed, and the XY-stage drive 9 drives the table 5 based on the detection result of the positioning sensor 7. To do. When the positioning is completed, the XYΘpositioning sensor 7 controls the control
Is notified that the positioning is completed, and the position of the XYΘ laser interferometer 8 is read. When performing the exposure, the control operation unit 11 reads the data of the XY laser interferometer 8 based on the data input from the setting input unit 10 to the control operation unit 11 and transmits the data to the XY stage drive unit 9. The drive signals of the stages 5x, 5y, 5θ are output, and the XYΘ stage drive unit 9 outputs each of the stages 5x, 5y,
Drive 5θ.

The positioning sensor 7 is, for example, a sensor that detects light. The positioning sensor 7 irradiates a positioning marker (not shown) on the table 5 or the substrate with light, detects the luminous intensity of the reflected light from the positioning marker, and reflects the reflected light. The position at which is the maximum is the positioning position of the table 5.

FIG. 3 is a diagram showing an example of division of the liquid crystal display element region 12 which is an embodiment of the present invention. The liquid crystal display element is large, and when the exposure of the liquid crystal display element cannot be performed by the exposure of one photomask, the liquid crystal display element region 12
(Liquid crystal display element regions 12a, 12b, 12c, which will be described later,
12d is referred to as 12) and is divided into a plurality of exposure areas. In FIG. 3, the liquid crystal display element is divided into four exposure areas A, B, C and D. The number of divisions of the liquid crystal display element region 12 is selected from the sizes of the liquid crystal display element region 12 and the photomask, the moving distance of the base 5, and the like.

FIG. 4 is a view showing photomasks a, b, c, d for exposing the liquid crystal display element region 12 shown in FIG. The photomask a is used for exposing the exposure area A, the photomask b is used for exposing the exposure area B, the photomask c is used for exposing the exposure area C, and the photomask d is used for exposing the exposure area D.

FIG. 5 is a diagram showing coordinates input to the control calculation unit 11 which is an embodiment of the present invention. Four liquid crystal display elements 12a, 12b, 12 are provided on one substrate 6 (not shown).
c, 12d are formed. Two liquid crystal display element regions 12 are arranged vertically and horizontally to form a total liquid crystal display element region 13. Liquid crystal display element regions 12a, 12b, 12c, 12d
Are four exposure areas A, indicated by dotted lines as shown in FIG.
It is divided into B, C and D.

The control calculation unit 11 has a third center coordinate M, which is the third coordinate that is the center coordinate of the entire liquid crystal display element region 13,
First center coordinates m1, m2, m3, m4, which are the first coordinates that are the center coordinates of each liquid crystal display element region 12, are input. Further, the second center coordinates ma, mb, mc, md, which are the second coordinates that are the center coordinates of the exposure areas A, B, C, D, are
Liquid crystal display element region 12 including each exposure region A, B, C, D
By storing the distance on the coordinates from the first center coordinates m1, m2, m3, and m4 in the control calculation unit 11, the second center coordinates ma, mb, mc, and md can be calculated. Has become.

FIG. 6 is a process chart for explaining the first exposure process of one embodiment of the present invention. The first exposure process is a process of forming the first circuit wiring by performing the first exposure on the substrate 6. In step a1, each stage 5x, 5y, 5z of the table 5
Is set to the initial position stored in the control calculation unit 11 in advance. In step a2, the positioning sensor 7 positions the positioning marker (not shown) formed on the table 5 and resets it to the initial position. When the initial position set in the step a1 is different from the initial position reset in the step a2, the control calculation unit 11 stores the data based on the measurement result of the XYΘ laser interferometer 8 for each initial position. Correct each coordinate.

In step a3, the photomask 3 is placed on a photomask stage not shown in FIG. In step a3, a photomask positioning sensor installed on the photomask 3 (not shown) is used to perform positioning by a positioning marker (not shown) on the table 5. In step a4, similarly to step a2, each stage 5 of step a2 and step a4
The control calculation unit 11 corrects the stored coordinates based on the positions of a, 5y, and 5θ.

In step a5, the substrate 6 is placed on the table 5. At this time, the substrate 6 is roughly aligned by a plurality of positioning pins (not shown) on the table 5. In step a6, the Θ stage 5θ that is not used for moving the table 5 is fixed on the Y stage 5y during the exposure in step a7.

In step a7, the substrate 6 is exposed. When the photomask a is placed on the photomask stage, the second center coordinates ma of the exposure area A of the liquid crystal display element area 12a is calculated from the first center coordinates m1.
The X stage 5x and the Y stage 5y are moved and aligned so that the calculated second center coordinate ma becomes the center of the exposure region of the sequential exposure apparatus 1, and the position is adjusted with respect to the exposure region A of the liquid crystal display element region 12a. Exposure is performed. Next, to perform exposure of the exposure area A of the liquid crystal display element area 12b, the second center coordinates ma of the exposure area A of the liquid crystal display element area 12b is calculated from the first center coordinates m2, and the calculated second center coordinates m2 are calculated. Exposure is performed after ma is aligned. Exposure area A of liquid crystal display element area 12c and liquid crystal display element area 1
The exposure of the 2d exposure area A is performed in the same procedure. The photomasks b, c, and d are also used for the other exposure areas B, C, and D.
Is mounted on a photomask stage and exposure is performed in the same procedure.

By performing the exposure in such a procedure, the first circuit wiring is formed for each liquid crystal display element region 12 on the substrate 6. The first circuit wiring formed by the first exposure process is simultaneously exposed with the positioning marker for performing the second exposure process.

FIG. 7 is a process chart for explaining the second exposure process of one embodiment of the present invention, FIG. 8 is a diagram showing process b7 of FIG. 7, and FIGS. 9 and 10 are process b8 of FIG. FIG. 11 is a view showing a step b9 of FIG. Process b
The steps 1 to b5 are performed in the same manner as the steps a1 to a5 of FIG. 7 described above. In step b1, the table 5 is set to the initial position, and in step b2, the table 5 is reset to the initial position by the positioning sensor 7 and the positioning marker on the table 5,
When the initial positions of the process b1 and the process b2 are different, the control calculation unit 11 corrects the stored coordinates.

In step b3, a photomask is placed on a photomask stage (not shown), and in step b4 the table 5 is further positioned by the photomask positioning sensor and the positioning marker on the table 5, and the table 5 of steps b2 and b3 is placed. Are different, the control calculation unit 11 corrects the stored coordinates. In step b5, the substrate 6 is aligned on the table 5 by using positioning pins (not shown) on the table 5.

In step b6, the substrate 6 is positioned using the positioning sensor 7 and the plurality of positioning markers formed during the first exposure process. The coordinates of the plurality of positioning markers formed at the time of the first exposure processing are determined in advance by the control
1 is stored. By moving the platform 5,
The substrate 6 is placed at the same position as during the first exposure process using the positioning marker. The position of the table 5 in the step b5 and the step b
The control calculation unit 11 corrects the stored coordinates based on the position of the table 5 of 6. In step b7, the Θ stage 5θ that is not used for driving the table 5 during exposure is fixed on the Y stage 5y. At this time, the Θ stage 5θ is displaced in the rotation direction.

As shown in FIG. 8, the deviation in the rotational direction is the angle α, and the substrate 6 in step b6 shown by the solid line is Θ.
By fixing the stage 5θ, it moves to the position shown by the dotted line, and the third center coordinate M also moves.

In step b8, the alignment sensor 7 and the third sensor
Using the positioning marker (not shown) formed on the center coordinates, the X stage is moved so that the third center coordinates M of the substrate 6 in step b7 where the angular displacement has occurred coincide with the third center coordinates M in step b6. 5x and Y stage 5y are driven.
As a result, as shown in FIG. 9, the third center coordinates M of the substrate 6 in step b6 and the third center coordinates M of the substrate 6 in which the angular displacement indicated by the dotted line has occurred coincide. However, since the Θ stage 5θ is fixed in step b7,
Since the driving in the rotation direction cannot be performed, there is a deviation of the angle α about the third center coordinate M.

Therefore, as shown in FIG.
The third center coordinates of the whole liquid crystal display element region 13 shown by the dotted line formed on the substrate 6 by the exposure process and the whole liquid crystal display element region 13 shown by the solid line formed by the second exposure process coincide with each other. The liquid crystal display element area 12 of the first
The center coordinates m1, m2, m3, and m4 do not match.

The control calculation unit 11 compares the positions of the X stage 5x and the Y stage 5y in the process b7 and the process b8 to determine the third central coordinates M and the respective first central coordinates m1.
Using the positional relationship with m2, m3, and m4, the second center coordinates m1, m2, m3, and m4 in step b8 are the center of the liquid crystal display element region 12 formed by the first exposure process indicated by the dotted line. 2 The coordinates are corrected so as to match the center coordinates m1, m2, m3, m4.

In step b9, each first center coordinate m1, m2, m3 corrected in step b8 is the same as step a7 in FIG.
Based on m4, the second center coordinates ma, mb, mc, md which are the centers of the exposure areas A, B, C, D are determined, and the exposure areas A, B, C, D are exposed, The second circuit wiring is formed.

As shown in FIG. 11, the liquid crystal display element region 12 formed by the first exposure process shown by the dotted line.
And the liquid crystal display element region 12 formed by the second exposure process indicated by the solid line have the first central coordinates m1, m2, m
3 and m4 coincide with each other, and the first center coordinates m1 and m
It is offset by an angle α about 2, m3 and m4.

By repeating the process shown in FIG. 7, a plurality of second circuit wirings can be formed.

As described above, according to this embodiment, the first center coordinates m1, m2, m which are the centers of the liquid crystal display element region 12 are provided.
3, m4 and the second center which is the center of each of the exposure areas A, B, C, D.
The positional relationship between the central coordinates and ma, mb, mc, and md is stored, and the second central coordinates during the first exposure processing and the second central coordinates during the second exposure processing are made to coincide with each other to expose each exposure area A. , B,
Since C and D are exposed, the positional relationship between the exposure regions A, B, C, and D during the first exposure process can be maintained even during the second exposure process. Therefore, unlike the conventional example, the connecting portions of the exposure areas A, B, C, and D are not displaced and a tomographic image is not generated, and display unevenness does not occur in the display center portion.
Display with improved display quality can be performed.

In this embodiment, when the positioning sensor 7 is used, although the XY stage drive unit 9 is caused to determine the signal from the positioning sensor 7, the control calculation unit 11 determines the signal from the positioning sensor 7, XY judgment result
Output to the Θ stage drive unit 9 to output the XYθ stage drive unit 9
May be driven.

In this embodiment, the liquid crystal display element region 12 is divided into four exposure regions A, B, C, and D. However, the division is not limited to this. It is also possible to divide only the number, or to divide into different numbers in the vertical and horizontal directions. Similarly, although the number of liquid crystal display element regions 12 formed on the substrate 6 is four, the number is not limited to this.

In this embodiment, the second coordinates are the center coordinates of the exposure processing areas A, B, C, and D, and the third coordinates are the center coordinates of the liquid crystal display element area 13. However, these are limited to the center coordinates. Instead, it suffices to store each positional relationship according to the selected second and third coordinates, and in which part of the exposure area of the sequential exposure processing apparatus 1 the positioning is performed in the control calculation unit 11.

[0046]

When performing the first exposure processing and the second exposure processing, the positioning of each exposure area is performed using the second coordinates, but the second coordinates are determined based on the first coordinates. When there is a deviation between the three coordinates and the third coordinate detected by the coordinate detecting means, the first coordinate is corrected using the comparison result and the first and third coordinate data. Therefore, the first coordinates are always the same in each exposure process.

In addition, the second coordinate set for each exposure processing area is the second coordinate for the first coordinate set for each display area.
Since the position is determined by the coordinate data, each exposure area is always formed in the same state, and thus the display area is always formed in the same state. Therefore, a set of exposure regions can be set so as to form a display region with high display quality, and the display quality can be improved.

[Brief description of the drawings]

FIG. 1 is a side view showing an optical configuration of a sequential exposure apparatus 1.

FIG. 2 is a diagram showing an electrical configuration of a sequential exposure apparatus 1.

FIG. 3 is a liquid crystal display element region 12 according to an embodiment of the present invention.
It is a figure which shows an example of the division of.

4 is a diagram showing photomasks a, b, c, d for exposing the liquid crystal display element region 12 shown in FIG.

FIG. 5 is a diagram showing coordinates input to a control calculation unit 11 which is an embodiment of the present invention.

FIG. 6 is a process diagram illustrating a first exposure process according to one embodiment of the present invention.

FIG. 7 is a process diagram illustrating a second exposure process according to one embodiment of the present invention.

FIG. 8 is a diagram showing a step b7 in FIG. 7.

9 is a diagram showing a step b8 in FIG. 7. FIG.

10 is a diagram showing a step b8 in FIG. 7. FIG.

11 is a diagram illustrating a step b9 in FIG. 7. FIG.

FIG. 12 is a diagram showing a first conventional example.

FIG. 13 is a diagram showing a second conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sequential exposure apparatus 3, a, b, c, d Photomask 6 Substrate 7 Positioning sensor 12 Liquid crystal display element area M 3rd center coordinate m1, m2, m3, m4 1st center coordinate ma, mb, mc, md 2nd Center coordinates

Claims (1)

(57) [Claims] 1. A method of exposing a wiring board, wherein a wiring board is divided into display areas each including one or a plurality of exposure areas by one mask to perform an exposure process, and a first coordinate set in advance for each display area. Showing the first coordinate data, the second coordinate data based on the first coordinate indicating the second coordinate preset for each exposure area, and the third coordinate which is the coordinate of the positioning means formed during the exposure. Various data including the third coordinate data is stored in the storage means, the first exposure processing is performed using the first coordinate data and the second coordinate data, and the first circuit wiring and the positioning means are provided on the wiring board. And the first coordinate detected by the coordinate detection unit that detects the coordinate of the positioning unit and the third coordinate stored in the storage unit.
During the exposure process, the coordinates of the positioning means formed on the third coordinate are compared, the first coordinate is corrected using the comparison result and the first coordinate data and the third coordinate data, and the corrected first A second exposure process is performed using the coordinates and the second coordinate data so that one or a plurality of second exposure lines are formed on the first circuit wiring.
An exposure processing method for a wiring board, which comprises forming a circuit wiring.