JP2668737B2 - Cure device - Google Patents

Abstract

PURPOSE:To enable prevention of contamination on a surface of a die to be improved by providing a heat-resistant breathing member on a heat block. CONSTITUTION:A lead frame 7 where a die 5 is die-bonded through a thermosetting adhesive 6 consisting of Ag, etc., is placed at a breathing member. 3 is carried in sequence on the breathing member 3 using tact feed by a drive means for curing. Thus. since the lead frame 7 can be placed on a heat block 1 with a heat-resistant breathing member 3 as a sheet, a contact area between the lead frame 7 and the breathing member 3 is wide and is in multiple contact, thus enabling conduction of heat to the lead frame 7 to be uniform. Namely, supply of heat to the heat block 1 to the lead frame 7 becomes uniform. Also, when eliminating impurity gas near a surface of the lead frame 7 by supplying a high-temperature gas 4 from an upper part of the lead frame 7, the breathing member 3 becomes a flow path for a high-temperature gas and the gas is discharged through a porous gap so that the high-temperature gas 4 flows while it covers a surface of the lead frame 7, thus causing the impurity gas to flow downward efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a curing device for drying a thermosetting bonding agent applied to a plate-shaped member.

[Prior Art] For example, in manufacturing a semiconductor device, a step of dropping a thermosetting bonding agent onto a lead frame made of a plate-shaped member, a die bonding step of attaching a die to the lead frame via the thermosetting bonding agent, a thermosetting The curing process is performed by drying the bonding agent to fix the die to the lead frame, and a wire bonding process of connecting the lead post of the lead frame and the pad of the die with a wire.

By the way, the conventional curing device for performing the curing process has a heat block on which a die-die-bonded lead frame is mounted, and the thermosetting bonding agent is cured by heating the heat block. An example of this type of device is Japanese Patent Laid-Open No. 62233671.

[Problems to be Solved by the Invention] In the above-mentioned conventional technique, even if the die-bonded lead frame is brought into contact with the heat block, the flatness of the surfaces of the lead frame and the heat block is not always constant. The contact surface is uneven. The gap due to this unevenness serves as a heat inlet and causes a temperature gradient.
When the lead frame is heated by this temperature gradient,
The heating conditions vary depending on the product, which causes quality variations.

Further, in the curing device, in order to more effectively remove and cure the impurity gas generated by the curing of the thermosetting bonding agent, a high temperature gas is blown downward from above the die to generate impurities near the die surface. Gas is being exhausted downwards and removed. Also in this case, when the surface of the heat block is wider than the surface of the lead frame, the exhaust passage is disturbed and gas removal becomes difficult.

An object of the present invention is to provide a curing device capable of uniform heating supply.

Another object of the present invention is to provide a curing device which can satisfactorily exhaust the impurity gas and can improve the prevention of contamination of the die surface.

[Means for Solving the Problems] The above object has a heat block on which a plate-shaped member coated with a thermosetting bonding agent is placed, and the curing is performed by curing the thermosetting bonding agent by heating the heat block. In the apparatus, it is achieved by providing a heat resistant breathable member on the heat block.

[Operation] A plate-shaped member such as a lead frame is placed on a heat block using a heat-resistant air-permeable member as a sheet. Therefore, the contact surface between the plate-shaped member and the air-permeable member is wide and multi-point contact is made, and the heat conduction to the plate-shaped member becomes uniform. That is, the heat supply of the heat block becomes uniform.

Further, when the high temperature gas is supplied from above the die to remove the impurity gas near the surface of the plate-shaped member, the breathable member serves as an outflow passage for the high temperature gas and is exhausted through the porous gap of the breathable member. The high temperature gas flows over the surface of the plate member, and the impurity gas effectively flows downward.

Example An example of the present invention will be described below with reference to the drawings. A plurality of heat blocks 1 are arranged in parallel with a certain gap 2, and on the heat block 1, heat resistance of, for example, metal, synthetic resin, ceramics, etc., which is porous and has excellent thermal conductivity. A breathable member 3 such as a net is provided. The hot gas 4 is blown downward from above the breathable member 3, and the hot gas 4 is exhausted below the heat block 1.

Therefore, the lead frame 7 in which the die 5 is die-bonded through the thermosetting bonding agent 6 made of Ag or the like is placed on the breathable member 3 and sequentially driven on the breathable member 3 by tact feeding by a driving means (not shown). It is conveyed and cured.

In this way, since the lead frame 7 is placed on the heat block 1 with the heat-resistant breathable member 3 as a sheet, the contact surface between the lead frame 7 and the breathable member 3 is wide and multipoint contact is achieved. In addition, heat conduction to the lead frame 7 becomes uniform. That is, the heat supply from the heat block 1 to the lead frame 7 becomes uniform.

Further, when the high temperature gas 4 is supplied from above the lead frame 7 to remove the impurity gas near the surface of the lead frame 7, the breathable member 3 serves as an outflow passage of the high temperature gas, and the porous gap of the breathable member 3 is formed. As a result, the high temperature gas 4 flows over the surface of the lead frame 7, and the impurity gas effectively flows downward.

[Effects of the Invention] As is clear from the above description, according to the present invention, uniform heating and supply is possible. Further, even when the high temperature gas is supplied from above the plate-shaped member to remove the impurity gas near the surface of the plate-shaped member, the impurity gas can be satisfactorily exhausted and the prevention of contamination of the plate-shaped member surface is improved. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a sectional view of an essential part showing an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of FIG. 1: Heat block, 3: Breathable material, 6: Thermosetting adhesive, 7: Lead frame.

Claims (1)

(57) [Claims] 1. A curing device having a heat block on which a plate-shaped member coated with a thermosetting bonding agent is mounted, wherein the thermosetting bonding agent is cured by heating of the heat block. A curing device having a heat-resistant breathable member.