JP2667680C

JP2667680C -

Info

Publication number: JP2667680C
Authority: JP
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Publication date: 1999-07-12

Description

【発明の詳細な説明】〔産業上の利用分野〕この発明はフイルム基材上に透明な導電性薄膜を設けたタツチパネル用の透明
導電性積層体に関する。〔従来の技術〕一般に、可視光線領域で透明であり、かつ導電性を有する薄膜は、液晶デイス
プレイ、エレクトロルミネツセンスデイスプレイなどの新しいデイスプレイ方式
やタツチパネルなどにおける透明電極のほか、透明物品の帯電防止や電磁波遮断
などのために用いられている。従来、このような透明導電性薄膜として、ガラス上に酸化インジウム薄膜を形
成した、いわゆる導電性ガラスがよく知られているが、基材がガラスであるため
に、可撓性，加工性に劣り、用途によつては好ましくない場合がある。このため、近年では、可撓性，加工性に加えて、耐衝撃性にすぐれ、軽量であ
るなどの利点から、ポリエチレンテレフタレ−トフイルムをはじめとする各種の
プラスチツクフイルムを基材とした透明導電性薄膜が賞用されている。〔発明が解決しようとする課題〕しかるに、このようなフイルム基材を用いた従来の透明導電性薄膜は、耐擦傷
性に劣り、使用中に傷がついて電気抵抗が増大したり、断線を生じるといつた問
題があつた。また、特にタツチパネル用の導電性薄膜では、スペ―サを介して対
向させた一対の薄膜同志がその一方の基材側からの押圧打点で強く接触するもの
であるため、これに抗しうる良好な耐久特性つまり打点特性を有していることが
望まれるが、上記従来の透明導電性薄膜ではかかる特性に劣り、そのぶんタツチパネルとしての寿命が短くなるという問題があつた。この発明は、上記従来の問題点に鑑み、ポリエチレンテレフタレ―トフイルム
などのフイルム基材を用いた透明導電性薄膜のタツチパネル用としての耐擦傷性
および打点特性を改良することを目的としている。〔課題を解決するための手段〕この発明者らは、上記の目的を達成するために鋭意検討した結果、フイルム基
材として特定膜厚のものを用いてその一方の面に透明な導電性薄膜を形成する一
方、他方の面に透明な粘着剤層を介して別の透明基体を貼り合わせることにより
、タツチパネル用としての耐擦傷性および打点特性を大きく改良できるものであ
ることを知り、この発明を完成するに至つた。すなわち、この発明は、厚さが２〜１２０μｍの透明なフイルム基材の一方の
面に膜厚が５０Å以上の透明な導電性薄膜を形成し、他方の面に弾性係数が１×
１０⁵〜１×１０⁷dyn／cm²、厚さが１μｍ以上である透明な粘着剤層を介して透
明基体を貼り合わせてなるタツチパネル用の透明導電性積層体に係るものである
。〔発明の構成・作用〕この発明において使用するフイルム基材としては、透明性を有する各種のプラ
スチツクフイルムを使用でき、具体的にはポリエチレンテレフタレ―ト（ＰＥＴ
）、ポリイミド（ＰＩ）、ポリエ―テルサルフオン（ＰＥＳ）、ポリエ―テルエ
―テルケトン（ＰＥＥＫ）、ポリカ―ボネ―ト（ＰＣ）、ポリプロピレン（ＰＰ
）、ポリアミド（ＰＡ）、ポリアクリル（ＰＡＣ）、セルロ―スプロピオネ―ト
（ＣＰ）などが挙げられる。これらフイルム基材の厚みは、２〜１２０μｍの範囲にあることが必要で、特
に好適には６〜１００μｍの範囲にあるのがよい。２μｍ未満では基材としての
機械的強度が不足し、この基材をロ―ル状にして導電性薄膜や粘着剤層を連続的
に形成する操作が難しくなる。一方、１２０μｍを超えると、後述する粘着剤層
のクツシヨン効果に基づく導電性薄膜の耐擦傷性や打点特性の向上を図れなくな
る。このフイルム基材はその表面に予めスパツタリング、コロナ放電、火炎、紫外線照射、電子線照射、化成、酸化などのエツチング処理や下塗り処理を施して、
この上に設けられる導電性薄膜の上記基材に対する密着性を向上させるようにし
てもよい。また、導電性薄膜を設ける前に、必要に応じて溶剤洗浄や超音波洗浄
などにより除塵，清浄化してもよい。この発明においては、このようなフイルム基材の一方の面に透明な導電性薄膜
を形成する。導電性薄膜の形成方法としては、真空蒸着法、スパツタリング法、
イオンプレ―テイング法などの従来公知の技術をいずれも採用できる。また、用
いる薄膜材料も特に制限されるものではなく、たとえば酸化スズを含有する酸化
インジウム、アンチモンを含有する酸化スズなどが好ましく用いられる。この導
電性薄膜の厚さとしては、５０Å以上とすることが必要で、これより薄いと表面
抵抗が１×１０³Ω／□以下となる良好な導電性を有する連続被膜となりにくい
。一方、あまり厚くしすぎると透明性の低下などをきたすため、特に好適な厚さ
としては、１００〜２，０００Å程度とするのがよい。このような透明な導電性薄膜が形成されたフイルム基材の他方の面には、透明
な粘着剤層を介して透明基体が貼り合わされる。この貼り合わせは、透明基体の
方に上記の粘着剤層を設けておき、これに上記のフイルム基材を貼り合わせるよ
うにしてもよいし、逆にフイルム基材の方に上記の粘着剤層を設けておき、これ
に透明基体を貼り合わせるようにしてもよい。後者の方法では、粘着剤層の形成
をフイルム基材をロ―ル状にして連続的に行うことができるから、生産性の面で
より有利である。粘着剤層としては、透明性を有するものであれば特に制限なく使用でき、たと
えばアクリル系粘着剤、シリコ―ン系粘着剤、ゴム系粘着剤などが用いられる。
この粘着剤層は、透明基体の接着後そのクツシヨン効果によりフイルム基材の一
方の面に設けられた導電性薄膜の耐擦傷性および打点特性を向上させる機能を有
するものであり、主としてこの機能をより良く発揮させる観点から、その弾性係
数を１×１０⁵〜１×１０⁷dyn／cm²の範囲、厚さを１μｍ以上、通常５〜１００
μｍの範囲に設定するのが望ましい。上記の弾性係数が１×１０⁵dyn／cm²未満となると、粘着剤層は非弾性となる
ため、加圧により容易に変形してフイルム基材ひいては導電性薄膜に凹凸を生じさせ、また加工切断面からの粘着剤のはみ出しなどが生じやすくなり、そのう
え耐擦傷性および打点特性の向上効果が低減する。一方、弾性係数が１×１０⁷d
yn／cm²を超えると、粘着剤層が硬くなり、そのクツシヨン効果を期待できなく
なるため、耐擦傷性および打点特性を向上できない。また、粘着剤層の厚さが１μｍ未満となると、そのクツシヨン効果をやはり期
待できないため、耐擦傷性および打点特性の向上を望めなくなる。なお、厚くし
すきると、透明性を損なつたり、粘着剤層の形成や透明基体の貼り合わせ作業性
さらにコストの面で好結果を得にくい。このような粘着剤層を介して貼り合わされる透明基体は、フイルム基材に対し
て良好な機械的強度を付与し、特にカールなどの発生防止に寄与するものであり
、これを貼り合わせたのちにおいても可撓性であることが要求される場合は、通
常６〜３００μｍ程度のプラスチツクフイルムが、可撓性が特に要求されない場
合は、通常０．０５〜１０mm程度のガラス板やフイルム状ないし板状のプラスチ
ツクが、それぞれ用いられる。プラスチツクの材質としては、前記したフイルム
基材と同様のものが挙げられる。〔発明の効果〕以上のように、この発明においては、フイルム基材として特定厚みのものを用
いて、その一方の面に導電性薄膜を形成する一方、他方の面に透明な粘着剤層を
介して透明基体を貼り合わせる構成としたことにより、上記粘着剤層のクツシヨ
ン効果に基づいて耐擦傷性と打点特性の改良されたタツチパネル用の透明導電性
積層体を提供できるという格別の効果が奏し得られるものである。〔実施例〕以下に、この発明の実施例を記載してより具体的に説明する。実施例１厚さが１２μｍの透明なＰＥＴ（ポリエチレンテレフタレ―ト）フイルムから
なるフイルム基材の一方の面に、アルゴンガス８０％と酸素ガス２０％とからな
る４×１０^-3Ｔｏｒｒの雰囲気中で、インジウム−スズ合金を用いた反応性スパ
ツタリング法により、厚さ４００Åの酸化インジウムと酸化スズとの複合酸化物
からなる透明な導電性薄膜（以下、ＩＴＯ薄膜という）を形成した。つぎに、上記ＰＥＴフイルムの他方の面に、弾性係数が１×１０⁶dyn／cm²に
調整されたアクリル系の透明な粘着剤層（アクリル酸ブチルとアクリル酸と酢酸
ビニルとの重量比１００：２：５のアクリル系共重合体１００重量部にイソシア
ネ―ト系架橋剤を１重量部配合させてなるもの）を約２０μｍの厚さに形成し、
この上に厚さが７５μｍのＰＥＴフイルムからなる透明基体を貼り合わせて、図
に示す構造のこの発明の透明導電性積層フイルムを作製した。なお、図中、１は厚さが１２μｍのＰＥＴフイルムからなる透明なフイルム基
材、２はＩＴＯ薄膜からなる透明な導電性薄膜、３はアクリル系の透明な粘着剤
層、４は厚さが７５μｍのＰＥＴフイルムからなる透明基体である。実施例２〜４フイルム基材として、厚さが２５μｍの透明なＰＥＳ（ポリエ―テルサルフオ
ン）フイルム（実施例２）、厚さが１２．５μｍの透明なＰＩ（ポリイミド）フ
イルム（実施例３）、厚さが８０μｍの透明なＰＣ（ポリカ―ボネ―ト）フイル
ム（実施例４）を、それぞれ使用した以外は、実施例１と同様にして図に示す構
造のこの発明の３種の透明導電性積層フイルムを作製した。比較例１粘着剤層の形成と透明基体の貼り合わせを行わなかつた以外は、実施例１と同
様にして透明導電性フイルムを作製した。比較例２フイルム基材として、厚さが１２５μｍの透明なＰＥＴフイルムを使用した以
外は、実施例１と同様にして透明導電性積層フイルムを作製した。比較例３フイルム基材として、厚さが１４０μｍの透明なＰＣフイルムを使用した以外
は、実施例１と同様にして透明導電性積層フイルムを作製した。つぎに、上記の実施例１〜４および比較例２，３の各透明導電性積層フイルム
と比較例１の透明導電性フイルムとにつき、フイルム抵抗、透過率、耐擦傷性お
よび打点特性を下記の要領で測定評価した。その結果は、後記の表に示されると
おりであつた。＜フイルム抵抗＞四端子法を用いて、フイルムの表面電気抵抗（Ω／□）を測定した。＜透過率＞島津製作所製の分光分析装置ＵＶ−２４０を用いて、光波長５５０nmにおける
可視光線透過率を測定した。＜耐擦傷性＞新東科学社製のヘイドン表面性測定機ＴＹＰＥ−ＨＥＩＤＯＮ１４を用いて、
擦傷子：ガーゼ（日本薬局方タイプＩ）、荷重：１００ｇ／cm²、擦傷速
度：３０cm／分、擦傷回数：１００回（往復５０回）の条件で、薄膜表面を擦
つたのちにフイルム抵抗（Ｒｓ）を測定し、初期のフイルム抵抗（Ｒｏ）に対す
る変化率（Ｒｓ／Ｒｏ）を求めて、耐擦傷性を評価した。＜打点特性＞２枚の透明導電性積層フイルム（または透明導電性フイルム）を厚さ１００μ
ｍのスペ―サを介して導電性薄膜同志が向かい合うように対向配置し、一方のフ
イルム（の透明基板またはフイルム基材）側より、硬度４０度のウレタンゴムか
らなるロツド（鍵先７Ｒ）を用いて荷重１００ｇで１００万回のセンタ―打点を
行つたのち、フイルム抵抗（Ｒｄ）を測定し、初期のフイルム抵抗（Ｒｏ）に対
する変化率（Ｒｄ／Ｒｏ）を求めて、打点特性を評価した。なお、上記のフイルム抵抗の測定は、対向配置した２枚の透明導電性積層フイ
ルム（または透明導電性フイルム）の打点時の接触抵抗を調べたものである。上記表の結果から明らかなように、この発明の透明導電性積層フイルムは、透
明性および導電性が良好であるうえに、タツチパネル用としての耐擦傷性および
打点特性に非常にすぐれたものであることが判る。Description: TECHNICAL FIELD The present invention relates to a transparent conductive laminate for a touch panel having a transparent conductive thin film provided on a film substrate. [Prior art] In general, thin films that are transparent in the visible light region and have conductivity include transparent electrodes in new display systems such as liquid crystal displays and electroluminescent displays, touch panels, and the like, as well as antistatic of transparent articles. And is used for shielding electromagnetic waves. Conventionally, as such a transparent conductive thin film, a so-called conductive glass in which an indium oxide thin film is formed on glass is well known. However, since the base material is glass, flexibility and workability are poor. However, it may not be preferable depending on the use. For this reason, in recent years, in addition to flexibility and workability, there are advantages such as excellent impact resistance and light weight. Therefore, transparent conductive films made of various plastic films such as polyethylene terephthalate film as a base material have recently been developed. Functional thin films have been awarded. [Problems to be Solved by the Invention] However, the conventional transparent conductive thin film using such a film base material is inferior in abrasion resistance, is damaged during use, increases electric resistance, and causes disconnection. I had a problem. In particular, in the case of a conductive thin film for a touch panel, a pair of thin films opposed to each other via a spacer come into strong contact at a pressing point from one of the base materials, so that it is possible to resist this. It is desired that the transparent conductive thin film has excellent durability characteristics, that is, hitting characteristics. However, the above-mentioned conventional transparent conductive thin film is inferior in such characteristics, and there is a problem that the life as a touch panel is shortened. SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, an object of the present invention is to improve the abrasion resistance and hitting point characteristics of a transparent conductive thin film using a film substrate such as a polyethylene terephthalate film for use in a touch panel. [Means for Solving the Problems] The present inventors have conducted intensive studies to achieve the above object, and as a result, using a film having a specific thickness as a film substrate, a transparent conductive thin film is formed on one surface thereof. The present invention was found to be able to greatly improve the abrasion resistance and hitting characteristics for touch panels by attaching another transparent substrate to the other surface via a transparent pressure-sensitive adhesive layer. Was completed. That is, according to the present invention, a transparent conductive thin film having a thickness of 50 ° or more is formed on one surface of a transparent film substrate having a thickness of 2 to 120 μm, and an elastic coefficient of 1 × is formed on the other surface.
The present invention relates to a transparent conductive laminate for a touch panel obtained by bonding a transparent substrate through a transparent pressure-sensitive adhesive layer having a thickness of 10 ⁵ to 1 × 10 ⁷ dyn / cm ² and a thickness of 1 μm or more. [Construction and Action of the Invention] As the film substrate used in the present invention, various plastic films having transparency can be used. Specifically, polyethylene terephthalate (PET)
), Polyimide (PI), polyethersulfone (PES), polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP
), Polyamide (PA), polyacryl (PAC), cellulose propionate (CP), and the like. The thickness of these film bases needs to be in the range of 2 to 120 μm, and particularly preferably in the range of 6 to 100 μm. If the thickness is less than 2 μm, the mechanical strength of the base material is insufficient, and it is difficult to roll the base material and continuously form a conductive thin film and a pressure-sensitive adhesive layer. On the other hand, if it exceeds 120 μm, it will not be possible to improve the scratch resistance and hitting characteristics of the conductive thin film based on the cushioning effect of the pressure-sensitive adhesive layer described later. This film base material is subjected to an etching treatment or undercoat treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, etc. on its surface in advance,
You may make it improve the adhesiveness with respect to the said base material of the conductive thin film provided on this. Before providing the conductive thin film, dust removal and cleaning may be performed by solvent cleaning or ultrasonic cleaning as necessary. In the present invention, a transparent conductive thin film is formed on one surface of such a film substrate. As a method for forming the conductive thin film, a vacuum evaporation method, a sputtering method,
Any of conventionally known techniques such as an ion plating method can be adopted. Also, the thin film material to be used is not particularly limited, and for example, indium oxide containing tin oxide, tin oxide containing antimony, and the like are preferably used. The thickness of the conductive thin film needs to be 50 ° or more, and if it is thinner than this, it is difficult to form a continuous film having good conductivity with a surface resistance of 1 × 10 ³ Ω / □ or less. On the other hand, if the thickness is too large, the transparency is lowered. Therefore, a particularly preferable thickness is preferably about 100 to 2,000 °. A transparent substrate is bonded to the other surface of the film substrate on which such a transparent conductive thin film is formed via a transparent pressure-sensitive adhesive layer. In this bonding, the above-mentioned pressure-sensitive adhesive layer may be provided on the transparent substrate, and the above-mentioned film base material may be bonded thereto, or conversely, the above-mentioned pressure-sensitive adhesive layer may be formed on the film base material. May be provided, and a transparent substrate may be attached to this. The latter method is more advantageous in terms of productivity because the pressure-sensitive adhesive layer can be formed continuously by rolling the film substrate. The pressure-sensitive adhesive layer can be used without any particular limitation as long as it has transparency. For example, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or the like is used.
The pressure-sensitive adhesive layer has a function of improving the abrasion resistance and hitting characteristics of the conductive thin film provided on one surface of the film substrate by the cushioning effect after the adhesion of the transparent substrate. From the viewpoint of better performance, the elastic modulus is in the range of 1 × 10 ⁵ to 1 × 10 ⁷ dyn / cm ² , the thickness is 1 μm or more, and usually 5 to 100.
It is desirable to set it in the range of μm. When the above elastic coefficient is less than 1 × 10 ⁵ dyn / cm ² , the pressure-sensitive adhesive layer becomes inelastic, so that it is easily deformed by pressurization to cause irregularities in the film base material and, consequently, the conductive thin film. The adhesive tends to protrude from the cut surface, and the effect of improving the scratch resistance and the hitting point characteristics is reduced. On the other hand, the elastic modulus is 1 × 10 ⁷ d
If it exceeds yn / cm ² , the pressure-sensitive adhesive layer becomes hard and the cushioning effect cannot be expected, so that the scratch resistance and the hitting point characteristics cannot be improved. When the thickness of the pressure-sensitive adhesive layer is less than 1 μm, the cushioning effect cannot be expected, so that it is impossible to improve the scratch resistance and the hitting point characteristics. If the thickness is too large, the transparency is impaired, and it is difficult to obtain good results in terms of workability of forming the pressure-sensitive adhesive layer, bonding the transparent substrate, and cost. The transparent substrate bonded through the pressure-sensitive adhesive layer imparts good mechanical strength to the film substrate and particularly contributes to prevention of curl and the like. In general, plastic films having a thickness of about 6 to 300 μm are required when flexibility is required, and glass sheets or films having a thickness of about 0.05 to 10 mm are generally required when flexibility is not particularly required. Plastics are used respectively. Examples of the material of the plastic include those similar to the above-mentioned film substrate. [Effects of the Invention] As described above, in the present invention, a film having a specific thickness is used as a film substrate, and a conductive adhesive layer is formed on one surface while a conductive thin film is formed on the other surface. With the configuration in which the transparent substrate is bonded through the adhesive layer, a special effect is provided that a transparent conductive laminate for a touch panel having improved scratch resistance and hitting characteristics based on the cushioning effect of the pressure-sensitive adhesive layer can be provided. It is obtained. [Example] Hereinafter, an example of the present invention will be described in more detail. Example 1 An atmosphere of 4 × 10 ⁻³ Torr composed of 80% argon gas and 20% oxygen gas was formed on one surface of a film substrate made of a transparent PET (polyethylene terephthalate) film having a thickness of 12 μm. Among them, a transparent conductive thin film (hereinafter, referred to as ITO thin film) made of a composite oxide of indium oxide and tin oxide having a thickness of 400 ° was formed by a reactive sputtering method using an indium-tin alloy. Next, on the other surface of the PET film, an acrylic transparent pressure-sensitive adhesive layer having an elastic modulus adjusted to 1 × 10 ⁶ dyn / cm ² (weight ratio of butyl acrylate, acrylic acid and vinyl acetate of 100) was used. : 100 parts by weight of an acrylic copolymer of 2: 5 and 1 part by weight of an isocyanate-based cross-linking agent) is formed to a thickness of about 20 μm,
A transparent substrate made of a PET film having a thickness of 75 μm was adhered on this to produce a transparent conductive laminated film of the present invention having a structure shown in the figure. In the drawing, 1 is a transparent film base made of a PET film having a thickness of 12 μm, 2 is a transparent conductive thin film made of an ITO thin film, 3 is a transparent acrylic pressure-sensitive adhesive layer, and 4 is a thin film. It is a transparent substrate made of a 75 μm PET film. Examples 2 to 4 As a film substrate, a transparent PES (polyethersulfon) film having a thickness of 25 μm (Example 2), a transparent PI (polyimide) film having a thickness of 12.5 μm (Example 3), Three kinds of transparent conductive materials of the present invention having the structure shown in the figure in the same manner as in Example 1 except that a transparent PC (polycarbonate) film having a thickness of 80 μm (Example 4) was used. A laminated film was produced. Comparative Example 1 A transparent conductive film was produced in the same manner as in Example 1, except that the formation of the pressure-sensitive adhesive layer and the bonding of the transparent substrate were not performed. Comparative Example 2 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a transparent PET film having a thickness of 125 μm was used as a film substrate. Comparative Example 3 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a transparent PC film having a thickness of 140 μm was used as a film substrate. Next, for each of the transparent conductive laminated films of Examples 1 to 4 and Comparative Examples 2 and 3 and the transparent conductive film of Comparative Example 1, the film resistance, transmittance, scratch resistance and hitting point characteristics were as follows. The measurement and evaluation were performed in the same manner. The results were as shown in the table below. <Film Resistance> The surface electric resistance (Ω / □) of the film was measured using a four-terminal method. <Transmittance> The visible light transmittance at a light wavelength of 550 nm was measured using a spectrophotometer UV-240 manufactured by Shimadzu Corporation. <Scratch Resistance> Using a Haydon surface property measuring device TYPE-HEIDON14 manufactured by Shinto Kagaku Co., Ltd.
Scratches: gauze (Japanese Pharmacopoeia Type I), load: 100 g / cm ² , scratching speed: 30 cm / min, number of scratches: 100 (50 reciprocations), rubbing the thin film surface and then film resistance ( Rs) was measured, and the rate of change (Rs / Ro) with respect to the initial film resistance (Ro) was determined to evaluate the scratch resistance. <Rotation point characteristics> Two transparent conductive laminated films (or transparent conductive films) were 100 μm thick.
The conductive thin films are arranged so as to face each other via a spacer of m, and a rod (key tip 7R) made of urethane rubber having a hardness of 40 degrees is placed on one of the films (the transparent substrate or the film base material) side. After a center hitting point was performed 1 million times with a load of 100 g, the film resistance (Rd) was measured, the rate of change (Rd / Ro) with respect to the initial film resistance (Ro) was determined, and the hitting point characteristics were evaluated. . The measurement of the film resistance described above is obtained by examining the contact resistance at the time of hitting two transparent conductive laminated films (or transparent conductive films) arranged opposite to each other. As is evident from the results in the above table, the transparent conductive laminated film of the present invention has excellent transparency and conductivity, and is also extremely excellent in scratch resistance and hitting point characteristics for touch panels. You can see that.

【図面の簡単な説明】図面はこの発明の透明導電性積層体の一例を示す断面図である。１…フイルム基材、２…導電性薄膜、３…粘着剤層、４…透明基体[Brief description of the drawings] The drawing is a sectional view showing an example of the transparent conductive laminate of the present invention. DESCRIPTION OF SYMBOLS 1 ... Film base material, 2 ... Conductive thin film, 3 ... Adhesive layer, 4 ... Transparent base

Claims

Claims: 1. A transparent conductive thin film having a thickness of 50 ° or more is formed on one surface of a transparent film base material having a thickness of 2 to 120 μm, and an elastic coefficient is formed on the other surface. 1 × 10 ⁵ ~
A transparent conductive laminate for a touch panel, wherein a transparent substrate is attached via a transparent adhesive layer having a thickness of 1 × 10 ⁷ dyn / cm ² and a thickness of 1 μm or more.