JP2667680B2 - Transparent conductive laminate - Google Patents
Transparent conductive laminateInfo
- Publication number
- JP2667680B2 JP2667680B2 JP21814988A JP21814988A JP2667680B2 JP 2667680 B2 JP2667680 B2 JP 2667680B2 JP 21814988 A JP21814988 A JP 21814988A JP 21814988 A JP21814988 A JP 21814988A JP 2667680 B2 JP2667680 B2 JP 2667680B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- transparent
- thickness
- transparent conductive
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Non-Insulated Conductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明はフイルム基材上に透明な電動性薄膜を設け
た透明導電性積層体に関する。Description: TECHNICAL FIELD The present invention relates to a transparent conductive laminate in which a transparent electric thin film is provided on a film substrate.
一般に、可視光線領域で透明であり、かつ導電性を有
する薄膜は、液晶デイスプレイ、エレクトロルミネツセ
ンスデイスプレイなどの新しいデイスプレイ方式やタツ
チパネルなどにおける透明電極のほか、透明物品の帯電
防止や電磁波遮断などのために用いられている。In general, thin films that are transparent in the visible light region and have electrical conductivity are used in new displays such as liquid crystal displays and electroluminescence displays, as well as in transparent electrodes in touch panels, etc. Used for
従来、このような透明導電性薄膜として、ガラス上に
酸化インジウム薄膜を形成した、いわゆる導電性ガラス
がよく知られているが、基材がガラスであるために、可
撓性，加工性に劣り、用途によつては好ましくない場合
がある。Conventionally, as such a transparent conductive thin film, a so-called conductive glass in which an indium oxide thin film is formed on glass is well known. However, since the base material is glass, flexibility and workability are poor. However, it may not be preferable depending on the use.
このため、近年では、可撓性，加工性に加えて、耐衝
撃性にすぐれ、軽量であるなどの利点から、ポリエチレ
ンテレフタレートフイルムをはじめとする各種のプラス
チツクフイルムを基材とした透明導電性薄膜が賞用され
ている。For this reason, in recent years, in addition to flexibility and workability, it has excellent impact resistance and is lightweight, so that it has advantages such as polyethylene terephthalate film and various kinds of plastic films as base materials. Has been awarded.
しかるに、このようなフイルム基材を用いた従来の透
明導電性薄膜は、耐摩擦性に劣り、使用中に傷がついて
電気抵抗が増大したり、断線を生じるといつた問題があ
つた。また、特にタツチパネル用の導電性薄膜では、ス
ペーサを介して対向させた一対の薄膜同志がその一方の
基材側からの押圧打点で強く接触するものであるため、
これに抗しうる良好な耐久特性つまり打点特性を有して
いることが望まれるが、上記従来の透明導電性薄膜では
かかる特性に劣り、そのぶんタツチパネルとしての寿命
が短くなるという問題があつた。However, the conventional transparent conductive thin film using such a film base material has poor friction resistance, and has a problem that when it is scratched during use, the electric resistance increases, or the wire breaks. Particularly, in the case of a conductive thin film for a touch panel, a pair of thin films opposed to each other via a spacer come into strong contact at a pressing point from one base material side.
It is desired to have a good durability characteristic, that is, a hitting point characteristic that can withstand this, but the conventional transparent conductive thin film described above is inferior to such characteristic, and there is a problem that the life as a touch panel is shortened accordingly. .
この発明は、上記従来の問題点に鑑み、ポリエチレン
テレフタレートフイルムなどのフイルム基材を用いた透
明導電性薄膜の耐擦傷性および打点特性を改良すること
を目的としている。In view of the above-mentioned conventional problems, an object of the present invention is to improve the scratch resistance and the spotting property of a transparent conductive thin film using a film base material such as polyethylene terephthalate film.
この発明者らは、上記の目的を達成するために鋭意検
討した結果、フイルム基材として特定膜厚のものを用い
てその一方の面に透明な導電性薄膜を形成する一方、他
方の面に透明な粘着剤層を介して別の透明基体を貼り合
わせることにより、耐擦傷性および打点特性を大きく改
良できるものであることを知り、この発明を完成するに
至つた。As a result of intensive studies to achieve the above object, the present inventors have used a film substrate having a specific film thickness to form a transparent conductive thin film on one surface thereof, while forming a transparent conductive thin film on the other surface thereof. It has been found that the scratch resistance and the spotting property can be greatly improved by laminating another transparent substrate through a transparent pressure-sensitive adhesive layer, and the present invention has been completed.
すなわち、この発明は、厚さが２〜120μｍの透明な
フイルム基材の一方の面に膜厚が50Å以上の透明な導電
性薄膜を形成し、他方の面に弾性係数が１×105〜１×1
07dyn/cm2、厚さが１μｍ上である透明な粘着剤層を介
して透明基体を貼り合わせてなる透明導電性積層体に係
るものである。That is, according to the present invention, a transparent conductive thin film having a thickness of 50 ° or more is formed on one surface of a transparent film substrate having a thickness of 2 to 120 μm, and an elastic coefficient of 1 × 10 5 to 1 × 1
The present invention relates to a transparent conductive laminate obtained by bonding a transparent substrate through a transparent pressure-sensitive adhesive layer having a thickness of 7 dyn / cm 2 and a thickness of 1 μm.
この発明において使用するフイルム基材としては、透
明性を有する各種のプラスチツクフイルムを使用でき、
具体的にはポリエチレンテレフタレート（PET）、ポリ
イミド（PI）、ポリエーテルサルフオン（PES）、ポリ
エーテルエーテルケトン（PEEK）、ポリカーボネート
（PC）、ポリプロピレン（PP）、ポリアミド（PA）、ポ
リアクリル（PAC）、セルロースプロピオネート（CP）
などが挙げられる。Various plastic films having transparency can be used as the film substrate used in the present invention,
Specifically, polyethylene terephthalate (PET), polyimide (PI), polyethersulfone (PES), polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP), polyamide (PA), polyacryl (PAC) ), Cellulose propionate (CP)
And the like.
これらフイルム基材の厚みは、２〜120μｍの範囲に
あることが必要で、特に好適には６〜100μｍの範囲に
あるのがよい。２μｍ未満では基材としての機械的強度
が不足し、この基材をロール状にして導電性薄膜や粘着
剤層を連続的に形成する操作が難しくなる。一方、120
μｍを超えると、後述する粘着剤層のクツシヨン効果に
基づく導電性薄膜の耐擦傷性や打点特性の向上を図れな
くなる。The thickness of these film base materials needs to be in the range of 2 to 120 μm, and particularly preferably in the range of 6 to 100 μm. If the thickness is less than 2 μm, the mechanical strength of the base material is insufficient, and it is difficult to continuously form the conductive thin film and the pressure-sensitive adhesive layer by forming the base material into a roll. On the other hand, 120
If it exceeds μm, it will not be possible to improve the scratch resistance and hitting point characteristics of the conductive thin film based on the cushioning effect of the pressure-sensitive adhesive layer described later.
このフイルム基材はその表面に予めスパツタリング、
コロナ放電、火炎、紫外線照射、電子線照射、化成、酸
化などのエツチング処理や下塗り処理を施して、この上
に設けられる導電性薄膜の上記基材に対する密着性を向
上させるようにしてもよい。また、導電性薄膜を設ける
前に、必要に応じて溶剤洗浄や超音波洗浄などによ除
塵，洗浄化してもよい。This film substrate is pre-sputtered on its surface,
An etching treatment such as corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation or the like or an undercoating treatment may be performed to improve the adhesion of the conductive thin film provided thereon to the base material. Before providing the conductive thin film, dust removal and cleaning may be performed by solvent cleaning, ultrasonic cleaning, or the like, as necessary.
この発明においては、このようなフイルム基材の一方
の面に透明な導電性薄膜を形成する。導電性薄膜の形成
方法としては、真空蒸着法、スパツタリング法、イオン
プレーテイング法などの従来公知の技術をいずれも採用
できる。また、用いる薄膜材料も特に制限されるもので
はなく、たとえば酸化スズを含有する酸化インジウム、
アンチモンを含有する酸化スズなどが好ましく用いられ
る。この導電性薄膜の厚さとしては、50Å以上とするこ
とが必要で、これより薄いと表面抵抗が１×103Ω／□
以下となる良好な導電性を有する連続被膜となりにく
い。一方、あまり厚くしすぎると透明性の低下などをき
たすため、特に好適な厚さとしては、100〜2,000Å程度
とするのがよい。In the present invention, a transparent conductive thin film is formed on one surface of such a film substrate. As a method for forming the conductive thin film, any of conventionally known techniques such as a vacuum deposition method, a sputtering method, and an ion plating method can be adopted. Further, the thin film material to be used is not particularly limited, for example, indium oxide containing tin oxide,
Antimony-containing tin oxide and the like are preferably used. The thickness of this conductive thin film needs to be 50 mm or more, and if it is thinner, the surface resistance becomes 1 × 10 3 Ω / □.
It is difficult to form a continuous film having the following good conductivity. On the other hand, if the thickness is too large, the transparency is lowered. Therefore, a particularly preferable thickness is preferably about 100 to 2,000 mm.
このような透明な導電性薄膜が形成されたフイルム基
材の他方の面には、透明な粘着剤層を介して透明基体が
張り合わされる。この貼り合わせは、透明基体の方に上
記の粘着剤層を設けておき、これに上記のフイルム基材
を貼り合わせるようにしてもよいし、逆にフイルム基材
の方に上記の粘着剤層を設けておき、これに透明基体を
貼り合わせるようにしてもよい。後者の方法では、粘着
剤層の形成をフイルム基剤をロール状にして連続的に行
うことができるから、生産性の面でより有利である。A transparent substrate is adhered to the other surface of the film substrate on which such a transparent conductive thin film is formed via a transparent pressure-sensitive adhesive layer. In this bonding, the above-mentioned pressure-sensitive adhesive layer may be provided on the transparent substrate, and the above-mentioned film base material may be bonded thereto, or conversely, the above-mentioned pressure-sensitive adhesive layer may be formed on the film base material. May be provided, and a transparent substrate may be attached to this. The latter method is more advantageous in terms of productivity because the pressure-sensitive adhesive layer can be formed continuously by making the film base into a roll.
粘着剤層としては、透明性を有するものであれば特に
制限なく使用でき、たとえばアクリル系粘着剤、シリコ
ーン系粘着剤、ゴム系粘着剤などが用いられる。この粘
着剤層は、透明基体の接着後そのクツシヨン効果により
フイルム基材の一方の面に設けられた導電性薄膜の耐擦
傷性および打点特性を向上させる機能を有するものであ
り、主としてこの機能をより良く発揮させる観点から、
その弾性係数を１×105〜１×107dyn/cm2の範囲、厚さ
を１μｍ以上、通常５〜100μｍの範囲に設定するのが
望ましい。The pressure-sensitive adhesive layer can be used without any particular limitation as long as it has transparency. For example, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or the like is used. The pressure-sensitive adhesive layer has a function of improving the abrasion resistance and hitting characteristics of the conductive thin film provided on one surface of the film substrate by the cushioning effect after the adhesion of the transparent substrate. From the point of view of better performance,
It is desirable to set the elastic modulus in the range of 1 × 10 5 to 1 × 10 7 dyn / cm 2 and the thickness in the range of 1 μm or more, usually 5 to 100 μm.
上記の弾性係数が１×105dyn/cm2未満となると、粘着
剤層は非弾性となるため、加圧により容易に変形してフ
イルム基材ひいては導電性薄膜に凹凸を生じさせ、また
加工切断面からの粘着剤のはみ出しなどが生じやすくな
り、そのうえ耐擦傷性および打点特性の向上効果が低減
する。一方、弾性系数が１×107dyn/cm2を超えると、粘
着剤層が硬くなり、そのクツシヨン効果を期待できなく
なるため、耐擦傷性および打点特性を向上できない。When the above elastic coefficient is less than 1 × 10 5 dyn / cm 2 , the pressure-sensitive adhesive layer becomes inelastic, so that it is easily deformed by pressurization to cause irregularities in the film base material and, consequently, the conductive thin film. The adhesive tends to protrude from the cut surface, and the effect of improving the scratch resistance and the hitting point characteristics is reduced. On the other hand, when the elastic modulus is more than 1 × 10 7 dyn / cm 2 , the pressure-sensitive adhesive layer becomes hard and the cushioning effect cannot be expected, so that the scratch resistance and the dot property cannot be improved.
また、粘着剤層の厚さが１μｍ未満となると、そのク
ツシヨン効果をやはり期待できないため、耐擦傷性およ
び打点特性の構造を望めなくなる。なお、厚くしすぎる
と、透明性を損なつたり、粘着剤層の形成や透明基体の
貼り合わせ作業性さらにコストの面で好結果を得にく
い。When the thickness of the pressure-sensitive adhesive layer is less than 1 μm, the cushioning effect cannot be expected, so that the structure of scratch resistance and hitting point characteristics cannot be expected. If the thickness is too large, transparency is impaired, and it is difficult to obtain good results in terms of workability of forming an adhesive layer, bonding a transparent substrate, and cost.
このような粘着剤層を介して貼り合わされる透明基体
は、フイルム基材に対して良好な機械的強度を付与し、
特にカールなどの発生防止に寄与するものであり、これ
を貼り合わせたのちにおいても可撓性であることが要求
される場合は、通常６〜300μｍ程度のプラスチツクフ
イルムが、可撓性が特に要求されない場合は、通常0.05
〜10mm程度のガラス板やフイルム状ないし板状のプラス
チツクが、それぞれ用いられる。プラスチツクの材質と
しては、前記したフイルム基材と同様のものが挙げられ
る。The transparent substrate bonded via such an adhesive layer imparts good mechanical strength to the film substrate,
In particular, it contributes to the prevention of the occurrence of curling and the like, and when it is required to be flexible even after bonding, a plastic film of about 6 to 300 μm is usually required. If not, usually 0.05
A glass plate having a thickness of about 10 mm or a plastic film or plate is used. Examples of the material of the plastic include those similar to the above-mentioned film substrate.
以上のように、この発明においては、フイルム基材と
して特定厚みのものを用いて、その一方の面に導電性薄
膜を形成する一方、他方の面に透明な粘着剤層を介して
透明基体を貼り合わせる構成としたことにより、上記粘
着剤層のクツシヨン効果に基づいて耐擦傷性と打点特性
の改良された透明導電性積層体を提供できるという格別
の効果が奏し得られるものである。As described above, in the present invention, a film base material having a specific thickness is used to form a conductive thin film on one surface thereof, while a transparent substrate is formed on the other surface via a transparent adhesive layer. By virtue of the constitution in which the layers are laminated, a special effect of being able to provide a transparent conductive laminate having improved scratch resistance and spotting characteristics based on the cushioning effect of the pressure-sensitive adhesive layer can be obtained.
以下に、この発明の実施例を記載してより具体的に説
明する。Hereinafter, embodiments of the present invention will be described in more detail.
実施例１ 厚さが12μｍの透明なPET（ポリエチレンテレフタレ
ート）フイルムからなるフイルム基材の一方の面に、ア
ルゴンガス80％と酸素ガス20％とからなる４×10-3Torr
の雰囲気中で、インジウム−スズ合金を用いた反応性ス
パツタリング法により、厚さ400Åの酸化インジウムと
酸化スズとの複合酸化物からなる透明な導電性薄膜（以
下、ITO薄膜という）を形成した。Example 1 One side of a film substrate made of a transparent PET (polyethylene terephthalate) film having a thickness of 12 μm was coated with 4 × 10 −3 Torr of 80% argon gas and 20% oxygen gas.
A transparent conductive thin film (hereinafter, referred to as an ITO thin film) made of a composite oxide of indium oxide and tin oxide having a thickness of 400 mm was formed by a reactive sputtering method using an indium-tin alloy in the atmosphere described above.
つぎに、上記PETフイルムの他方の面に、弾性係数が
１×106dyn/cm2に調整されたアクリル系の透明な粘着剤
層（アクリル酸ブチルとアクリル酸と酢酸ビニルとの重
合比100:2:5のアクリル系共重合体100重量部にイソシア
ネート系架橋剤を１重量部配合させてなるもの）を約20
μｍの厚さに形成し、この上に厚さが75μｍのPETフイ
ルムからなる透明基体を貼り合わせて、図に示す構造の
この発明の透明導電性積層フイルムを作製した。Next, on the other side of the PET film, an acrylic transparent pressure-sensitive adhesive layer whose elastic modulus was adjusted to 1 × 10 6 dyn / cm 2 (polymerization ratio of butyl acrylate, acrylic acid, and vinyl acetate was 100). : 2: 5 100 parts by weight of an acrylic copolymer mixed with 1 part by weight of an isocyanate-based crosslinking agent)
A transparent substrate made of a PET film having a thickness of 75 μm was adhered on this to form a transparent conductive laminated film of the present invention having the structure shown in the figure.
なお、図中、１は厚さが12μｍのPETフイルムからな
る透明なフイルム基材、２はITO薄膜からなる透明な導
電性薄膜、３はアクリル系の透明な粘着剤層、４は厚さ
が75μｍのPETフイルムからなる透明基体である。In the figure, 1 is a transparent film substrate made of PET film having a thickness of 12 μm, 2 is a transparent conductive thin film made of ITO thin film, 3 is an acrylic transparent adhesive layer, and 4 is a thickness. A transparent substrate made of a 75 μm PET film.
実施例２〜４ フイルム基材として、厚さが25μｍの透明なPES（ポ
リエーテルサルフオン）フイルム（実施例２）、厚さが
12.5μｍの透明なPI（ポリイミド）フイルム（実施例
３）、厚さが80μｍの透明なPC（ポリカーボネート）フ
イルム（実施例４）を、それぞれ使用した以外は、実施
例１と同様にして図に示す構造のこの発明の３種の透明
導電性積層フイルムを作製した。Examples 2 to 4 As a film substrate, a transparent PES (polyethersulfon) film having a thickness of 25 μm (Example 2) was used.
A transparent PI (polyimide) film having a thickness of 12.5 μm (Example 3) and a transparent PC (polycarbonate) film having a thickness of 80 μm (Example 4) were respectively used in the same manner as in Example 1 except for using them. Three types of transparent conductive laminated films of the present invention having the structures shown were produced.
比較例１ 粘着剤層の形成と透明基体の貼り合わせを行わなかつ
た以外は、実施例１と同様にして透明導電性フイルムを
作製した。Comparative Example 1 A transparent conductive film was produced in the same manner as in Example 1, except that the formation of the pressure-sensitive adhesive layer and the bonding of the transparent substrate were not performed.
比較例２ フイルム基材として、厚さが125μｍの透明なPETフイ
ルムを使用した以外は、実施例１と同様にして透明導電
性積層フイルムを作製した。Comparative Example 2 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a transparent PET film having a thickness of 125 μm was used as a film substrate.
比較例３ フイルム基材として、厚さが140μｍの透明なPCフイ
ルムを使用した以外は、実施例１と同様にして透明導電
性積層フイルムを作製した。Comparative Example 3 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a transparent PC film having a thickness of 140 μm was used as a film substrate.
つぎに、上記の実施例１〜４および比較例2,3の各透
明導電性積層フイルムと比較例１の透明導電性フイルム
とにつき、フイルム抵抗、透過率、耐擦傷性および打点
特性を下記の要領で測定評価した。その結果は、後記の
表に示されるとおりであつた。Next, for each of the transparent conductive laminated films of Examples 1 to 4 and Comparative Examples 2 and 3 and the transparent conductive film of Comparative Example 1, the film resistance, the transmittance, the scratch resistance and the dot characteristics are as follows. The measurement and evaluation were performed in the same manner. The results were as shown in the table below.
＜フイルム抵抗＞ 四端子法を用いて、フイルムの表面電気抵抗（Ω／
□）を測定した。<Film resistance> Using the four-terminal method, the surface electric resistance (Ω /
□) was measured.
＜透過率＞ 島津製作所製の分光分析装置UV−240を用いて、光波
長550nmにおける可視光線透過率を測定した。<Transmittance> The visible light transmittance at a light wavelength of 550 nm was measured using a spectrophotometer UV-240 manufactured by Shimadzu Corporation.
＜耐擦傷性＞ 新東科学社製のヘイドン表面性測定機TYPE−HEIDON14
を用いて、擦傷子：ガーゼ（日本薬局方タイプＩ）、
荷重:100g/cm2、擦傷速度:30cm/分、擦傷回数:10
0回（往復50回）の条件で、薄膜表面を擦つたのちにフ
イルム抵抗（Rs）を測定し、初期のフイルム抵抗（Ro）
に対する変化率（Rs/Ro）を求めて、耐擦傷性を評価し
た。<Scratch resistance> Haydon surface property measuring instrument TYPE-HEIDON14 manufactured by Shinto Kagaku
Scratches: gauze (Japanese Pharmacopoeia Type I)
Load: 100 g / cm 2 , Scratch speed: 30 cm / min, Scratch frequency: 10
Under the condition of 0 times (50 round trips), the film resistance (Rs) is measured after rubbing the thin film surface, and the initial film resistance (Ro)
The rate of change (Rs / Ro) with respect to was determined, and the scratch resistance was evaluated.
＜打点特性＞ ２枚の透明導電性積層フイルム（または透明導電性フ
イルム）を厚さ100μｍのスペーサを介して導電性薄膜
同志が向かい合うように対向配置し、一方のフイルム
（の透明基板またはフイルム基材）側より、硬度40度の
ウレタンゴムからなるロツド（鍵先7R）を用いて荷重10
0gで100万回のセンター打点を行つたのち、フイルム抵
抗（Rd）を測定し、初期のフイルム抵抗（Ro）に対する
変化率（Rd/Ro）を求めて、打点特性を評価した。<Rotation point characteristics> Two transparent conductive laminated films (or transparent conductive films) are arranged so that conductive thin films face each other via a spacer having a thickness of 100 μm, and one of the films (the transparent substrate or the film base) is disposed. From the material) side, using a rod (key tip 7R) made of urethane rubber with a hardness of 40 degrees, load 10
After performing center hitting 1 million times at 0 g, the film resistance (Rd) was measured, the rate of change (Rd / Ro) with respect to the initial film resistance (Ro) was determined, and the hitting characteristics were evaluated.
なお、上記のフイルム抵抗の測定は、対向配置した２
枚の透明導電性積層フイルム（または透明導電性フイル
ム）の打点時の接触抵抗を調べたものである。The measurement of the film resistance described above was carried out by using the two oppositely arranged films.
The contact resistance at the time of hitting a transparent conductive laminated film (or transparent conductive film) is examined.
上記表の結果から明らかなように、この発明の透明導
電性積層フイルムは、透明性および導電性が良好である
うえに、耐擦傷性および打点特性に非常にすぐれたもの
であることが判る。 As is clear from the results in the above table, the transparent electroconductive laminated film of the present invention has excellent transparency and electroconductivity, as well as very excellent scratch resistance and dot striking properties.
図面はこの発明の透明導電性積層体の一例を示す断面図
である。 １……フイルム基材、２……導電性薄膜、 ３……粘着剤層、４……透明基体The drawing is a sectional view showing an example of the transparent conductive laminate of the present invention. DESCRIPTION OF SYMBOLS 1 ... Film base material, 2 ... Conductive thin film, 3 ... Adhesive layer, 4 ... Transparent base
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭59−104764（ＪＰ，Ａ) 特開 昭61−185813（ＪＰ，Ａ) 特開 昭62−7112（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-104764 (JP, A) JP-A-61-185813 (JP, A) JP-A-62-7112 (JP, A)
Claims (1)
の一方の面に膜厚が50Å以上の透明な導電性薄膜を形成
し、他方の面に弾性係数が１×105〜１×107dyn/cm2、
厚さが１μｍ以上である透明な粘着剤層を介して透明基
体を貼り合わせてなる透明導電性積層体。A transparent conductive thin film having a thickness of 50 ° or more is formed on one surface of a transparent film substrate having a thickness of 2 to 120 μm, and an elastic coefficient of 1 × 10 5 to 1 is formed on the other surface. × 10 7 dyn / cm 2 ,
A transparent conductive laminate obtained by laminating a transparent substrate via a transparent pressure-sensitive adhesive layer having a thickness of 1 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21814988A JP2667680B2 (en) | 1988-08-31 | 1988-08-31 | Transparent conductive laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21814988A JP2667680B2 (en) | 1988-08-31 | 1988-08-31 | Transparent conductive laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266809A JPH0266809A (en) | 1990-03-06 |
| JP2667680B2 true JP2667680B2 (en) | 1997-10-27 |
Family
ID=16715412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21814988A Expired - Lifetime JP2667680B2 (en) | 1988-08-31 | 1988-08-31 | Transparent conductive laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2667680B2 (en) |
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| JPS59104764A (en) * | 1982-12-03 | 1984-06-16 | Canon Inc | Liquid crystal display keyboard |
| JPS61185813A (en) * | 1985-02-14 | 1986-08-19 | 日東電工株式会社 | Composite sheet |
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|---|---|
| JPH0266809A (en) | 1990-03-06 |
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