CN107230517A - The processing method and flexible conductive film of flexible conductive film - Google Patents

The processing method and flexible conductive film of flexible conductive film Download PDF

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Publication number
CN107230517A
CN107230517A CN201610168522.1A CN201610168522A CN107230517A CN 107230517 A CN107230517 A CN 107230517A CN 201610168522 A CN201610168522 A CN 201610168522A CN 107230517 A CN107230517 A CN 107230517A
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China
Prior art keywords
flexible
conductive film
flexible conductive
substrate layer
film
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CN201610168522.1A
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Chinese (zh)
Inventor
陈西宝
于甄
李硕
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Zhangjiagang Kangdexin Optronics Material Co Ltd
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Zhangjiagang Kangdexin Optronics Material Co Ltd
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Priority to CN201610168522.1A priority Critical patent/CN107230517A/en
Publication of CN107230517A publication Critical patent/CN107230517A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

The invention discloses a kind of processing method of flexible conductive film and flexible conductive film, flexible substrate layer is molded by using expressing technique, conducting film is set to possess flexible resist bending property, it is blended with the glue of nano-silver thread using coating machine and is spread evenly across in flexible substrate layer to form flexible conductive layer while flexible substrate layer is molded, realize that flexible substrate layer is prepared with the step of flexible conductive film one, realize and simplify in technique, improve production efficiency, reduce cost.Shaping flexible conductive film when can carry out biaxial tension so that film integrally realize it is thinned, compliant conductive film thickness be less than or equal to 50 μm, increase light transmission rate, lower mist degree.

Description

The processing method and flexible conductive film of flexible conductive film
Technical field
The present invention relates to the manufacturing technology field of nesa coating, and in particular to a kind of flexible conductive film Processing method and flexible conductive film.
Background technology
Nesa coating is a kind of film for possessing conducting function, nesa coating because its have it is lightweight, Deformable, non-friable the advantages of, is widely used in liquid crystal display, solar cell, microelectronics ITO and leads Electrolemma glass, photoelectron and various optical fields.
Generally used in optoelectronic devices, but due to it as nesa coating using ITO in conventional art It is flexible poor, it is completely unsuitable for as the material for preparing flexible transparent conducting film, nano-silver thread conducting film is mesh A kind of preceding conventional conductive form membrane, it possesses preferable electric conductivity, light transmittance and excellent bending, It is most potential replacement ITO material, therefore is widely used in the prior art.
Prior art needs to repeat immersion nano-silver thread and hot pressing, work when preparing nano-silver thread conducting film Skill is cumbersome, and operating efficiency is low.And after repeating every time, its faying face can form a light Educational circles face, adds up, so that the light transmission rate of conducting film can be reduced largely.Another side Method is coating nanometer silver wire slurry in the nesa coating shortage table in PET base material, being molded in this way Face is protected, and nano-silver thread layer is easy to fall off, and film surface is easily scraped off, and influences the quality of conducting film.
In addition, the base material for making nano-silver thread conducting film in the prior art is analogous to the hardening of ITO conducting films Film, i.e., by being coated with nano-silver thread on hardening film, by baking operation formation nano-silver thread Conducting film;Such a method is different from ITO sputterings, but selects base material similar, so it is low to there is light transmission rate, Mist degree is high, and adhesive force is low, the problems such as low production efficiency.
Need to select hard well by being coated with nano-silver thread technique of shaped conductive film on hardening film base material Change film base material, add the thickness of conducting film, production technology increase, cost increase, the conducting film of shaping It is flexible poor, it is unfavorable for the conductive film properties of overall flexibility and improves.
Production method (the patent No. of disclosed a kind of nano-silver thread nesa coating in the prior art: 201410229462.0) base needed for nano-silver thread, conducting film, is prepared in this document using conventional coating methods Material is based on existing base material, and prepared by coated different substrate materials and the different coating fluid formulas of regulation, it is thick Spend for 81-500 μm, thickness is larger, be difficult bending, it is flexible poor.
Therefore, in view of problem above, it is necessary to propose a kind of new conducting film and its forming method, make Conducting film possesses flexible resist bending property, realizes and simplifies in technique, and film integrally realizes thinned, increase Light transmission rate, lowers mist degree, improves production efficiency, reduces cost.
The content of the invention
In view of this, the invention provides a kind of processing method of flexible conductive film and flexible conductive film, lead to Cross and flexible substrate layer is molded using expressing technique, conducting film is possessed flexible resist bending property, it is soft being molded Property substrate layer while coating flexible conductive layer, in technique realize simplify, improve production efficiency, drop Low cost.Biaxial tension can be carried out during shaping flexible conductive film so that film integrally realizes thinned, increasing Plus light transmission rate, lower mist degree.
A kind of processing method of the flexible conductive film proposed according to the purpose of the present invention, using expressing technique into Type flexible substrate layer, and flexible conductive layer is synchronously prepared when being molded flexible substrate layer, specific shaping step It is rapid as follows:
S1:Optical thin film particle needed for molded substrate layer is subjected to melt process, Screw Extrusion is used afterwards Machine uniformly extrudes the substrate layer material under molten condition, forms film-form flexible substrate layer;
S2:Flexible substrate layer to shaping first passes through longitudinal stretching or cross directional stretch processing;
S3:Prepare priming coat glue, and the scattered nano-silver thread in glue;
S4:The glue for being blended with nano-silver thread using coating machine is spread evenly across the flexible base of above-mentioned shaping On the side surface up and down of material layer, flexible conductive layer is formed, flexible substrate layer combines to be formed with flexible conductive layer Described flexible conductive film;
S5:Cross directional stretch or longitudinal stretching processing are carried out to the flexible conductive film after the completion of coating, to be formed Film-form flexible conductive film;
S6:The flexible conductive film of shaping is put into drying box processing is dried, ultimately formed flexible Flexible conductive film.
It is preferred that, the material of the flexible substrate layer is PET, COP, COC, PI, PMMA or PC.
It is preferred that, the priming coat glue is acrylic resin, and the nano-silver thread is uniformly scattered in In the priming coat glue.
A kind of flexible conductive film, is molded, the flexibility is led using the processing method of described flexible conductive film Electrolemma includes the compliant conductive that flexible substrate layer is arranged at coating in the flexible substrate layer upper and lower surface Layer.The flexible conductive film can be bent.
It is preferred that, the thickness of the flexible conductive film is less than or equal to 50 μm.
It is preferred that, the thickness of the flexible substrate layer is 5 μm -125 μm.
It is preferred that, the thickness of the flexible conductive layer is 5nm-1000nm.
It is preferred that, the thickness of the flexible conductive layer is 5nm-500nm.
Compared with prior art, the processing method of flexible conductive film disclosed by the invention and flexible conductive film Advantage is:
Flexible substrate layer is molded by using expressing technique, conducting film is possessed flexible resist bending property, The glue for being blended with nano-silver thread using coating machine while shaping flexible substrate layer is spread evenly across upper soft Property substrate layer on form flexible conductive layer, realize prepared by flexible substrate layer and the step of flexible conductive film one, in work Realize and simplify in skill, improve production efficiency, reduce cost.
Biaxial tension can be carried out during shaping flexible conductive film so that film integrally realizes thinned, increase light Transmitance, lowers mist degree.
In addition, being coated on the surface of flexible substrate layer after nano-silver thread is dispersed in glue, improve The adhesive force of flexible substrate layer, it is to avoid the problems such as nano-silver thread comes off and surface is scraped off, improves flexibility and leads The quality of electrolemma.
The compliant conductive film thickness prepared using the method in the present invention is less than or equal to 50 μm, this conducting film Possess flexible resist bending property, can application flexibility show, flexible touch screen, flexible light, flexible photovoltaic.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to reality The accompanying drawing used required for applying in example or description of the prior art is briefly described, it should be apparent that, below Accompanying drawing in description is only some embodiments of the present invention, for those of ordinary skill in the art, On the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is moulding process Fig. 1 of flexible conductive film disclosed by the invention.
Fig. 2 is moulding process Fig. 2 of flexible conductive film disclosed by the invention.
Fig. 3 is the structural representation of flexible conductive film disclosed by the invention.
The title of digital or alphabetical representative corresponding component in figure:
1st, flexible substrate layer 2, flexible conductive layer 3, coating head
Embodiment
Prior art needs to repeat immersion nano-silver thread and hot pressing, work when preparing nano-silver thread conducting film Skill is cumbersome, and operating efficiency is low.And after repeating every time, its faying face can form a light Educational circles face, adds up, so that the light transmission rate of conducting film can be reduced largely.Another side Method is coating nanometer silver wire slurry in the nesa coating shortage table in PET base material, being molded in this way Face is protected, and nano-silver thread layer is easy to fall off, and film surface is easily scraped off, and influences the quality of conducting film.This Outside, prior art kind makes the base material of nano-silver thread conducting film and is analogous to the hardening films of ITO conducting films, I.e. by being coated with nano-silver thread on hardening film, by baking operation formation nano-silver thread conducting film; Such a method is different from ITO sputterings, but selects base material similar, so existing, light transmission rate is low, and mist degree is high, Adhesive force is low, the problems such as low production efficiency.
The present invention is for of the prior art not enough there is provided a kind of processing method of flexible conductive film and soft Property conducting film, by using expressing technique be molded flexible substrate layer, conducting film is possessed flexible resistance to bend(ing) Matter, coating flexible conductive layer while flexible substrate layer is molded is realized in technique and simplified, improves Production efficiency, reduces cost.Biaxial tension can be carried out during shaping flexible conductive film so that film is overall Realize and be thinned, increase light transmission rate, lower mist degree.
A kind of processing method of the flexible conductive film proposed according to the purpose of the present invention, using expressing technique into Type flexible substrate layer, and flexible conductive layer is synchronously prepared when being molded flexible substrate layer, specific shaping step It is rapid as follows:
S1:Optical thin film particle needed for molded substrate layer is subjected to melt process, Screw Extrusion is used afterwards Machine uniformly extrudes the substrate layer material under molten condition, forms film-form flexible substrate layer;
S2:Flexible substrate layer to shaping first passes through longitudinal stretching or cross directional stretch processing;
S3:Prepare priming coat glue, and the scattered nano-silver thread in glue;
S4:The glue for being blended with nano-silver thread using coating machine is spread evenly across the flexible base of above-mentioned shaping On the side surface up and down of material layer, flexible conductive layer is formed, flexible substrate layer combines to be formed with flexible conductive layer Described flexible conductive film;
S5:Cross directional stretch or longitudinal stretching processing are carried out to the flexible conductive film after the completion of coating, to be formed Film-form flexible conductive film;
S6:The flexible conductive film of shaping is put into drying box processing is dried, ultimately formed flexible Flexible conductive film.
It is preferred that, the material of the flexible substrate layer is PET, COP, COC, PI, PMMA or PC.
It is preferred that, the priming coat glue is acrylic resin, and the nano-silver thread is uniformly scattered in In the priming coat glue.
A kind of flexible conductive film, is molded, the flexibility is led using the processing method of described flexible conductive film Electrolemma includes the compliant conductive that flexible substrate layer is arranged at coating in the flexible substrate layer upper and lower surface Layer, the flexible conductive film can be bent.
It is preferred that, the thickness of the flexible conductive film is less than or equal to 50 μm.
It is preferred that, the thickness of the flexible substrate layer is 5 μm -125 μm.
It is preferred that, the thickness of the flexible conductive layer is 5nm-1000nm.
It is preferred that, the thickness of the flexible conductive layer is 5nm-500nm.
Technical scheme will be clearly and completely described by embodiment below. Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of protection of the invention.
Fig. 1 and Fig. 2 are referred to, as illustrated, a kind of processing method of flexible conductive film, using extrusion work Skill is molded flexible substrate layer, and synchronously prepares flexible conductive layer when being molded flexible substrate layer, realizes soft Property substrate layer and the step of flexible conductive film one prepare, realize and simplify in technique, improve production efficiency, drop Low cost.
The specific forming step of flexible conductive film is as follows:
S1:Optical thin film particle needed for molded substrate layer is subjected to melt process, Screw Extrusion is used afterwards Machine uniformly extrudes the substrate layer material under molten condition, forms film-form flexible substrate layer;
S2:Flexible substrate layer to shaping first passes through longitudinal stretching or cross directional stretch processing;
S3:Prepare priming coat glue, and the scattered nano-silver thread in glue;
S4:The glue for being blended with nano-silver thread using coating machine is spread evenly across the flexible base of above-mentioned shaping On the side surface up and down of material layer, flexible conductive layer is formed, flexible substrate layer combines to be formed with flexible conductive layer Described flexible conductive film;
S5:Cross directional stretch or longitudinal stretching processing are carried out to the flexible conductive film after the completion of coating, to be formed Film-form flexible conductive film;Biaxial tension can be carried out during shaping flexible conductive film so that film is overall real Now it is thinned, increases light transmission rate, lowers mist degree;
S6:The flexible conductive film of shaping is put into drying box processing is dried, ultimately formed flexible Flexible conductive film.
The compliant conductive film thickness prepared using this method is less than or equal to 50 μm, and this conducting film possesses flexibility Resist bending property, can application flexibility show, flexible touch screen, flexible light, flexible photovoltaic.
It is preferred that, the material of flexible substrate layer is PET (polyethylene terephthalate), COP light Learn material, COC (cyclic olefine copolymer), PI (polyimides), PMMA (polymethylacrylic acid Formicester) or PC (makrolon).
Wherein, priming coat glue is acrylic resin, and nano-silver thread is uniformly scattered in priming coat glue In.By being coated on the surface of flexible substrate layer after nano-silver thread is dispersed in glue, improve soft Property substrate layer adhesive force, it is to avoid the problems such as nano-silver thread comes off and surface is scraped off, improve compliant conductive The quality of film.
Fig. 3 is referred to, as illustrated, a kind of flexible conductive film, using the processing side of above-mentioned flexible conductive film Method is molded, and flexible conductive film includes flexible substrate layer 1 and is arranged at the upper and lower surface of flexible substrate layer 1 with coating On flexible conductive layer 2, flexible conductive film can bend.
Wherein, the thickness of the flexible conductive film is less than or equal to 50 μm, and thinner thickness is effectively increased light transmission Rate, lowers mist degree.
The thickness of flexible substrate layer is 5 μm -125 μm.The thickness of flexible conductive layer is 5nm-1000nm.It is soft The thickness of property conductive layer is preferably 5nm-500nm.Depending on specific thickness parameter is as needed, it is ensured that flexible The thickness of conducting film is less than or equal to 50 μm, is not limited herein.
The invention discloses a kind of processing method of flexible conductive film and flexible conductive film, by using extrusion Technological forming flexible substrate layer, makes conducting film possess flexible resist bending property, in shaping flexible substrate layer The glue for being blended with nano-silver thread using coating machine simultaneously, which is spread evenly across in flexible substrate layer, forms soft Property conductive layer, realize prepared by flexible substrate layer and the step of flexible conductive film one, realize and simplify in technique, carry High production efficiency, reduces cost.
Biaxial tension can be carried out during shaping flexible conductive film so that film integrally realizes thinned, increase light Transmitance, lowers mist degree.
The compliant conductive film thickness prepared using the method in the present invention is less than or equal to 50 μm, this conducting film Possess flexible resist bending property, can application flexibility show, flexible touch screen, flexible light, flexible photovoltaic.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use The present invention.A variety of modifications to these embodiments will be aobvious and easy for those skilled in the art See, generic principles defined herein can without departing from the spirit or scope of the present invention, Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein, And it is to fit to the most wide scope consistent with features of novelty with principles disclosed herein.

Claims (8)

1. a kind of processing method of flexible conductive film, it is characterised in that flexible base is molded using expressing technique Material layer, and flexible conductive layer is synchronously prepared when being molded flexible substrate layer, specific forming step is as follows:
S1:Optical thin film particle needed for molded substrate layer is subjected to melt process, Screw Extrusion is used afterwards Machine uniformly extrudes the substrate layer material under molten condition, forms film-form flexible substrate layer;
S2:Flexible substrate layer to shaping first passes through longitudinal stretching or cross directional stretch processing;
S3:Prepare priming coat glue, and the scattered nano-silver thread in glue;
S4:The glue for being blended with nano-silver thread using coating machine is spread evenly across the flexible base of above-mentioned shaping On the side surface up and down of material layer, flexible conductive layer is formed, flexible substrate layer combines to be formed with flexible conductive layer Described flexible conductive film;
S5:Cross directional stretch or longitudinal stretching processing are carried out to the flexible conductive film after the completion of coating, to be formed Film-form flexible conductive film;
S6:The flexible conductive film of shaping is put into drying box processing is dried, ultimately formed flexible Flexible conductive film.
2. the processing method of flexible conductive film as claimed in claim 1, it is characterised in that the flexibility The material selection PET (PET) of substrate layer, cyclic olefine copolymer (COC), Cyclic olefin polymer (COP), polyimides (PI), polymethyl methacrylate (PMMA) or poly- One kind or its a variety of mixture in carbonic ester (PC).
3. the processing method of flexible conductive film as claimed in claim 1, it is characterised in that the primary coat Layer glue is acrylic resin, and the nano-silver thread is uniformly scattered in the priming coat glue.
4. a kind of flexible conductive film, it is characterised in that using the flexibility described in claim any one of 1-3 The processing method shaping of conducting film, the flexible conductive film is arranged at described including flexible substrate layer and coating Flexible conductive layer in flexible substrate layer upper and lower surface.
5. flexible conductive film as claimed in claim 4, it is characterised in that the thickness of the flexible conductive film Degree is less than or equal to 50 μm.
6. flexible conductive film as claimed in claim 4, it is characterised in that the thickness of the flexible substrate layer Spend for 5 μm -125 μm.
7. flexible conductive film as claimed in claim 4, it is characterised in that the thickness of the flexible conductive layer Spend for 5nm-1000nm.
8. flexible conductive film as claimed in claim 7, it is characterised in that the thickness of the flexible conductive layer Spend for 5nm-500nm.
CN201610168522.1A 2016-03-23 2016-03-23 The processing method and flexible conductive film of flexible conductive film Pending CN107230517A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108091417A (en) * 2017-12-22 2018-05-29 歌尔股份有限公司 Flexible conductive film, sound-producing device and wearable device
CN110828066A (en) * 2019-11-04 2020-02-21 惠州达祺光电科技有限公司 Method for manufacturing transparent conductive film
WO2020037768A1 (en) * 2018-08-18 2020-02-27 深圳市华科创智技术有限公司 Flexible conductive film and preparation method therefor
CN112735671A (en) * 2020-12-18 2021-04-30 天津宝兴威科技股份有限公司 Preparation method of nano-silver flexible conductive film
CN114927260A (en) * 2022-03-16 2022-08-19 苏州六材新材料科技有限公司 Conductive film and preparation method thereof

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CN1868737A (en) * 2005-05-24 2006-11-29 上海大智三花薄膜有限公司 Low cost high efficiency polyethylene conductive film and its preparation method
CN102421600A (en) * 2009-05-14 2012-04-18 杜邦帝人薄膜美国有限公司 Transparent conductive composite films
CN104008819A (en) * 2014-05-27 2014-08-27 东莞市鑫聚光电科技有限公司 Production method of nanometer silver wire transparent conducting film

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Publication number Priority date Publication date Assignee Title
JPH0266809A (en) * 1988-08-31 1990-03-06 Nitto Denko Corp Transparent conductive lamination body
CN1868737A (en) * 2005-05-24 2006-11-29 上海大智三花薄膜有限公司 Low cost high efficiency polyethylene conductive film and its preparation method
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CN104008819A (en) * 2014-05-27 2014-08-27 东莞市鑫聚光电科技有限公司 Production method of nanometer silver wire transparent conducting film

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108091417A (en) * 2017-12-22 2018-05-29 歌尔股份有限公司 Flexible conductive film, sound-producing device and wearable device
CN108091417B (en) * 2017-12-22 2020-02-21 歌尔股份有限公司 Flexible conductive film, sound generating device and wearable equipment
WO2020037768A1 (en) * 2018-08-18 2020-02-27 深圳市华科创智技术有限公司 Flexible conductive film and preparation method therefor
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CN110828066A (en) * 2019-11-04 2020-02-21 惠州达祺光电科技有限公司 Method for manufacturing transparent conductive film
CN112735671A (en) * 2020-12-18 2021-04-30 天津宝兴威科技股份有限公司 Preparation method of nano-silver flexible conductive film
CN114927260A (en) * 2022-03-16 2022-08-19 苏州六材新材料科技有限公司 Conductive film and preparation method thereof

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