JP2665382B2 - Aluminum alloy materials for lithographic printing plates - Google Patents
Aluminum alloy materials for lithographic printing platesInfo
- Publication number
- JP2665382B2 JP2665382B2 JP1260138A JP26013889A JP2665382B2 JP 2665382 B2 JP2665382 B2 JP 2665382B2 JP 1260138 A JP1260138 A JP 1260138A JP 26013889 A JP26013889 A JP 26013889A JP 2665382 B2 JP2665382 B2 JP 2665382B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- lithographic printing
- pits
- aluminum alloy
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007639 printing Methods 0.000 title claims description 41
- 239000000956 alloy Substances 0.000 title claims description 19
- 229910000838 Al alloy Inorganic materials 0.000 title claims description 12
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- 238000007788 roughening Methods 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 16
- 238000000137 annealing Methods 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000005098 hot rolling Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 238000005097 cold rolling Methods 0.000 description 10
- 238000000265 homogenisation Methods 0.000 description 10
- -1 phenol compound Chemical class 0.000 description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910017604 nitric acid Inorganic materials 0.000 description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000010731 rolling oil Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 229910018084 Al-Fe Inorganic materials 0.000 description 2
- 229910018192 Al—Fe Inorganic materials 0.000 description 2
- 229910018191 Al—Fe—Si Inorganic materials 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical group [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 1
- ZMQWRASVUXJXGM-SREVYHEPSA-N (z)-4-cyclohexyloxy-4-oxobut-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OC1CCCCC1 ZMQWRASVUXJXGM-SREVYHEPSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical group C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- RSZXXBTXZJGELH-UHFFFAOYSA-N 2,3,4-tri(propan-2-yl)naphthalene-1-sulfonic acid Chemical compound C1=CC=CC2=C(C(C)C)C(C(C)C)=C(C(C)C)C(S(O)(=O)=O)=C21 RSZXXBTXZJGELH-UHFFFAOYSA-N 0.000 description 1
- IRLYGRLEBKCYPY-UHFFFAOYSA-N 2,5-dimethylbenzenesulfonic acid Chemical compound CC1=CC=C(C)C(S(O)(=O)=O)=C1 IRLYGRLEBKCYPY-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- XUDBVJCTLZTSDC-UHFFFAOYSA-N 2-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C=C XUDBVJCTLZTSDC-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- ABSXMLODUTXQDJ-UHFFFAOYSA-N 4-(4-sulfophenyl)benzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1C1=CC=C(S(O)(=O)=O)C=C1 ABSXMLODUTXQDJ-UHFFFAOYSA-N 0.000 description 1
- KSOWMDCLEHRQPH-UHFFFAOYSA-N 4-diazocyclohexa-1,5-dien-1-amine Chemical compound NC1=CCC(=[N+]=[N-])C=C1 KSOWMDCLEHRQPH-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- LZDOYVMSNJBLIM-UHFFFAOYSA-N 4-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=C(O)C=C1 LZDOYVMSNJBLIM-UHFFFAOYSA-N 0.000 description 1
- YLKCHWCYYNKADS-UHFFFAOYSA-N 5-hydroxynaphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(O)=CC=CC2=C1S(O)(=O)=O YLKCHWCYYNKADS-UHFFFAOYSA-N 0.000 description 1
- YCPXWRQRBFJBPZ-UHFFFAOYSA-N 5-sulfosalicylic acid Chemical compound OC(=O)C1=CC(S(O)(=O)=O)=CC=C1O YCPXWRQRBFJBPZ-UHFFFAOYSA-N 0.000 description 1
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
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- 206010016807 Fluid retention Diseases 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 241001272720 Medialuna californiensis Species 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
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- 229910002651 NO3 Inorganic materials 0.000 description 1
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- BRVWFYLQPDHSPO-UHFFFAOYSA-N benzaldehyde;4-butylphenol Chemical compound O=CC1=CC=CC=C1.CCCCC1=CC=C(O)C=C1 BRVWFYLQPDHSPO-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
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- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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- IEWSOTUOUUKGKQ-UHFFFAOYSA-N n-(4-hydroxynaphthalen-1-yl)-2-methylprop-2-enamide Chemical compound C1=CC=C2C(NC(=O)C(=C)C)=CC=C(O)C2=C1 IEWSOTUOUUKGKQ-UHFFFAOYSA-N 0.000 description 1
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 1
- POVITWJTUUJBNK-UHFFFAOYSA-N n-(4-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=C(NC(=O)C=C)C=C1 POVITWJTUUJBNK-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
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- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical class C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
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- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
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Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は電気化学的粗面化処理及び耐インキ汚れ性に
優れた平版印刷版用アルミニウム合金及びその製造方法
に関する。Description: TECHNICAL FIELD The present invention relates to an aluminum alloy for a lithographic printing plate which is excellent in electrochemical surface roughening treatment and ink stain resistance, and a method for producing the same.
[従来の技術] 一般に平版印刷において、アルミニウム板を支持体と
して用いることは従来から行われているが、感光膜の密
着性及び非画像部の保水性の点からその表面を粗面化し
ておくことが必要である。[Prior Art] Generally, in lithographic printing, the use of an aluminum plate as a support has been conventionally performed, but the surface thereof is roughened from the viewpoint of adhesion of a photosensitive film and water retention of a non-image portion. It is necessary.
この粗面化処理方法としては、従来からボールグレイ
ン法、、ブラシグレイン法、ワイヤーグレイン法等の機
械的粗面化方法があったが、新たに塩酸又はこれを主体
とする電解液(以下塩酸系電解液という)及び硝酸又は
これを主体とする電解液(以下硝酸系電解液という)を
用いて、アルミニウム表面を電気化学的に粗面化する方
法が採用されている。この電気化学的粗面化法は、製版
適性や印刷性能が優れていること、及びコイル材の連続
処理に適していることから近年急速に発展している。As the surface roughening method, there have conventionally been mechanical surface roughening methods such as a ball grain method, a brush grain method, and a wire grain method. However, hydrochloric acid or an electrolytic solution mainly containing the same (hereinafter referred to as hydrochloric acid) has been proposed. A method of electrochemically roughening the surface of aluminum using nitric acid or an electrolytic solution mainly composed of nitric acid (hereinafter referred to as a nitric acid-based electrolytic solution) is employed. The electrochemical surface roughening method has been rapidly developed in recent years because it is excellent in plate making suitability and printing performance and is suitable for continuous treatment of coil materials.
従来、平版印刷版用アルミニウム合金板としては、機
械的粗面化法に対しては、JIS規格のA1100(アルミニウ
ム純度99.9重量%以上)、A3003(アルミニウム純度98.
0〜98.5重量%)に相当するものが用いられ、又電気化
学的粗面化法に対しては比較的均一な電解粗面の得られ
るA1050(アルミニウム純度99.5重量%以上)担当材が
用いられている。そして電気化学的粗面化したA1050相
当材を用いた場合、比較的良好な耐刷性が得られてい
る。耐刷性とは鮮明な印刷物が得られる限度の印刷枚数
を示す。Conventionally, as an aluminum alloy plate for lithographic printing plates, A1100 (aluminum purity 99.9% by weight or more) and A3003 (aluminum purity 98.
0 to 98.5% by weight), and A1050 (aluminum purity: 99.5% by weight or more) is used for electrochemical surface roughening to obtain a relatively uniform electrolytic rough surface. ing. And, when the material equivalent to A1050 which has been electrochemically roughened is used, relatively good printing durability is obtained. Printing durability refers to the maximum number of printed sheets at which a clear printed matter can be obtained.
[発明が解決しようとする課題] 近年、情報化時代が進むに連れて印刷部数が飛躍的に
増え、このためA1050相当材を用いた印刷版の耐刷性で
は不十分となってきた。又、印刷枚数が増えるとともに
印刷物の非画像部が汚れるという現象、即ちインキ汚れ
も目立つようになってきた。[Problems to be Solved by the Invention] In recent years, as the information age has advanced, the number of printing copies has increased dramatically, and therefore, the printing durability of a printing plate using a material equivalent to A1050 has become insufficient. Further, as the number of printed sheets increases, the phenomenon that the non-image portion of the printed matter becomes dirty, that is, the ink stain has also become noticeable.
本発明は上記の欠点を改善し、電気化学的粗面化処理
性が著しく優れ、そのために耐刷性が良好であり、かつ
耐インキ汚れ性が優れた平版印刷版用アルミニウム合金
及びその製造方法を提供することを目的とする。The present invention solves the above-mentioned drawbacks, and has excellent electrochemical surface-roughening treatment properties, and therefore has good printing durability and excellent ink stain resistance, and an aluminum alloy for a lithographic printing plate, and a method for producing the same. The purpose is to provide.
[発明が解決するための手段] 本発明は、Fe:0.1〜1.0%、Si:0.03〜0.2%、Cu:0.00
5〜0.05%、Ti:0.1%以下、Ga:0.04%以下を含み、残り
Al及び不可避不純物であって、TiとGaとの関係が、[Ti
(%)]≧1.2×[Ga(%)]−0.015である平版印刷版
用アルミニウム合金材料である。[Means for Solving the Invention] The present invention provides Fe: 0.1 to 1.0%, Si: 0.03 to 0.2%, Cu: 0.00
5 to 0.05%, including Ti: 0.1% or less, Ga: 0.04% or less, remaining
Al and unavoidable impurities, the relationship between Ti and Ga is [Ti
(%)] ≧ 1.2 × [Ga (%)] − 0.015.
[作 用] 本発明における構成要件について具体的に説明する。[Operation] The components of the present invention will be specifically described.
平版印刷版用として従来から用いられてきたA1050合
金板を電気化学的粗面化処理した場合、ピット(以下、
電気化学的粗面化によるピットを単にピットと称す)が
歪んで半月状になったり、ピットの深さが浅くなったり
しやすく、耐刷性に悪影響を与える。又、A1050合金を
平版印刷版として用いると耐インキ汚れ性が十分でな
い。When the A1050 alloy plate, which has been conventionally used for lithographic printing plates, is subjected to electrochemical surface roughening, pits (hereinafter, referred to as pits)
The pits resulting from electrochemical surface roughening are simply referred to as pits), and are liable to be distorted to have a half-moon shape or to have a shallow pit depth, which adversely affects printing durability. Further, when A1050 alloy is used as a lithographic printing plate, the ink stain resistance is not sufficient.
本発明者等はAl−Fe合金のピット形状に影響する要因
について念入りな解析を行った結果、アルミニウム地金
中に不可避的に含まれるGaがピット形状が歪める原因で
あり、Gaの悪影響を抑制するにはGa含有量に応じてTiを
添加することが有効であること、又Cuを適量添加すると
ピットの深さが深くなること、更に微細な円形のピット
を得るためには合金鋳塊を適切な温度で均質化処理する
ことが有効であることを見出した。又、耐インキ汚れ性
を改良するにはSi量を適正にするとともに、均質化処理
温度と熱間圧延の加熱温度を適切に制御することが有効
であることを見出した。The present inventors have conducted a careful analysis on the factors affecting the pit shape of the Al-Fe alloy, and found that Ga inevitably contained in the aluminum ingot is the cause of the distortion of the pit shape and suppresses the adverse effect of Ga. In order to obtain fine circular pits, it is effective to add Ti according to the Ga content, and it is effective to add an appropriate amount of Cu. It has been found that it is effective to perform a homogenization treatment at an appropriate temperature. In addition, it has been found that, in order to improve the ink stain resistance, it is effective to properly control the homogenizing treatment temperature and the heating temperature of the hot rolling while making the Si amount appropriate.
以下、本発明に基づく合金組成について説明する。 Hereinafter, the alloy composition according to the present invention will be described.
(1)Fe:0.1〜1.0% Feは合金の強度を上げるとともにピットを微細にす
る。0.1%未満では効果が十分でなく、1.0%を越えると
粗大化合物が多くなり逆にピットが不均一となる。(1) Fe: 0.1 to 1.0% Fe increases the strength of the alloy and makes pits finer. If it is less than 0.1%, the effect is not sufficient, and if it exceeds 1.0%, coarse compounds are increased and pits become non-uniform.
(2)Si:0.03〜0.2% Siは合金の強度を上げるとともにAl−Fe−Si化合物を
形成し、ピットの微細化に寄与する。0.03%未満では効
果が十分でなく、0.2%を越えると耐インキ汚れ性が劣
化する。(2) Si: 0.03 to 0.2% Si increases the strength of the alloy and forms an Al-Fe-Si compound, contributing to miniaturization of pits. If it is less than 0.03%, the effect is not sufficient, and if it exceeds 0.2%, the ink stain resistance deteriorates.
(3)Cu:0.005〜0.05% Cuはピットの深さを深くして耐刷性を向上させる。0.
005%未満では効果が十分でなく、0.05%を越えると逆
に電解粗面化のピットを粗大な独立ピットとしてしま
う。(3) Cu: 0.005 to 0.05% Cu increases the depth of the pits to improve printing durability. 0.
If it is less than 005%, the effect is not sufficient, and if it exceeds 0.05%, pits for electrolytic surface roughening are conversely made to be large independent pits.
(4)Ti:0.1%以下 Tiはピットの形状を歪めるというGaの作用を抑制す
る。Tiの有効な添加量は不可避不純物として含まれるGa
量に応じて次式で決められる。(4) Ti: 0.1% or less Ti suppresses the action of Ga, which distorts the shape of the pit. The effective amount of Ti added is
It is determined by the following equation according to the amount.
[Ti(%)]≧1.2×[Ga(%)]−0.015 この関係式は実験により導き出されたものであるが、
次のように解釈される。即ち、アルミニウム中に固溶し
たGaがある限界量を越えるとピッチの形状を歪める作用
が著しくなり、これに対しTiを添加するとTiとGaが化合
物、例えばTi2Gaを形成して固溶Gaが限界量以下に減少
し、その結果Gaの有害作用が抑制されてピットが微細な
円形となるものと考えられる。従って、上式のようにGa
含有量に応じてTi添加量を決めることが必要であり、そ
うすればピットが微細な円形となり、耐刷性が向上する
ものとみられる。[Ti (%)] ≧ 1.2 × [Ga (%)] − 0.015 This relational expression is derived by experiment,
Interpreted as follows. That is, when Ga dissolved in aluminum exceeds a certain limit, the effect of distorting the pitch shape becomes remarkable, whereas when Ti is added, Ti and Ga form a compound, for example, Ti 2 Ga to form solid solution Ga. It is considered that the pit becomes a fine circle because the harmful effect of Ga is suppressed as a result. Therefore, as shown in the above equation, Ga
It is necessary to determine the amount of Ti to be added in accordance with the content, so that the pits become fine circles and the printing durability is expected to be improved.
一方、Ti量が0.1%を越えると粗大化合物を形成し、
粗大なピットが多くなる。On the other hand, if the Ti content exceeds 0.1%, a coarse compound is formed,
There are many coarse pits.
(5)Ga:0.04%以下 Gaはアルミニウム地金中に不可避的に含まれる不純物
である。一般的には0.004〜0.020%程度含まれることが
多いが、スクラップを再溶解する場合にはさらに多く含
まれることもある。Gaはピットの形状を歪めて、印刷版
の耐刷性を劣化させる効果を有する。この効果を抑制す
るために、前記のようにGa含有量に応じてTiが添加され
る。但し、Ga量が0.04%を越えるとTiを添加してもピッ
トの歪みを改良できなくなるので、Ga量は0.04%以下と
規定される。この現象を完全に説明することは難しい
が、次のように解釈され得る。即ち、Ga量が0.04%を越
えた場合、それに応じたTi量(0.033%以上)を添加す
ることが必要であるが、この場合Tiは合金の鋳造時に偏
析を生じたり、他の化合物例えばAl3Tiなどを形成した
りして、均一に分布できなくなり、効果が十分でなくな
るものとみられる。(5) Ga: 0.04% or less Ga is an impurity inevitably contained in aluminum ingot. Generally, it is often contained in an amount of about 0.004 to 0.020%, but may be further contained when redissolving scrap. Ga has the effect of distorting the shape of the pits and deteriorating the printing durability of the printing plate. To suppress this effect, Ti is added according to the Ga content as described above. However, if the Ga content exceeds 0.04%, the pit distortion cannot be improved even if Ti is added, so the Ga content is specified to be 0.04% or less. It is difficult to completely explain this phenomenon, but it can be interpreted as follows. That is, when the amount of Ga exceeds 0.04%, it is necessary to add a corresponding amount of Ti (0.033% or more). In this case, Ti causes segregation at the time of casting of the alloy, or other compounds such as Al The formation of 3Ti or the like makes it impossible to distribute the particles uniformly, and the effect is considered to be insufficient.
次に製造条件について説明する。 Next, the manufacturing conditions will be described.
(1)製造工程 本発明のアルミニウム合金支持体は鋳造−均質化処理
−熱間圧延−冷間圧延−中間焼鈍−仕上げ冷間圧延の工
程により製造される。但し、均質化処理と熱間圧延前の
加熱とは兼ねることもできる。即ち、均質化処理を行っ
た後、そのまま熱間圧延を行ったり、又所定の温度まで
冷却してから熱間圧延を行うこともできる。(1) Manufacturing Step The aluminum alloy support of the present invention is manufactured by the steps of casting, homogenization, hot rolling, cold rolling, intermediate annealing, and finishing cold rolling. However, the homogenization treatment and the heating before hot rolling can also be performed. That is, after the homogenization treatment, hot rolling can be performed as it is, or hot rolling can be performed after cooling to a predetermined temperature.
各製造工程における条件は以下のようにすることが望
ましい。換言すれば、以下の条件で製造することによ
り、平版印刷版用材料としての本発明合金の特性がより
有効に発揮される。It is desirable that the conditions in each manufacturing process are as follows. In other words, by manufacturing under the following conditions, the properties of the alloy of the present invention as a material for a lithographic printing plate are more effectively exhibited.
(2)鋳造:常法によって行う。通常は半連続鋳造によ
ることが多い。(2) Casting: Performed by an ordinary method. Usually, semi-continuous casting is often used.
(3)均質化処理:400〜600℃ 均質化処理においては、過飽和に固溶しているFe、Si
を析出させるとともに、固溶しているGaとTiを結合させ
るものとみられる。これらによりピットが微細な円形と
なり、耐刷力の向上に寄与する。400℃未満においてはF
e、Siを析出が十分でなく、かつGaとTiの結合も十分で
ないため、ピットの形状が歪みやすい。600℃を越える
とSiの固溶量が増え、後工程で単独Siが析出しやすく、
インキ汚れを生じやすくなる。(3) Homogenization treatment: 400-600 ° C In the homogenization treatment, Fe, Si
At the same time as binding Ga and Ti in solid solution. As a result, the pits have a fine circular shape, which contributes to an improvement in printing durability. F below 400 ° C
e, Si is not sufficiently precipitated, and the bonding between Ga and Ti is not sufficient, so that the shape of the pit is easily distorted. When the temperature exceeds 600 ° C, the amount of solid solution of Si increases, so that Si alone is likely to precipitate in a subsequent process,
Ink stains easily occur.
(4)熱間圧延 熱間圧延は350〜600℃に加熱して行う。(4) Hot rolling Hot rolling is performed by heating to 350 to 600 ° C.
350℃未満では変形抵抗が大きいために一回当りの加
工度を大きくできず、圧延のパス回数が多くなって経済
的でない。一方、600℃を越えるとSiの固溶量が増え、 後工程で単独Siが析出しやすく、インキ汚れを生じやす
くなる。又、450℃を越えると熱間圧延中に粗大な再結
晶粒を生じ、筋状の不均一組織によるストリークを生じ
やすくなるので、好ましい温度は350〜450℃である。If the temperature is lower than 350 ° C., the degree of deformation per operation cannot be increased due to high deformation resistance, and the number of rolling passes increases, which is not economical. On the other hand, if the temperature exceeds 600 ° C., the amount of solid solution of Si increases, and it becomes easy for single Si to precipitate in a later step, and ink stains are easily generated. On the other hand, if the temperature exceeds 450 ° C., coarse recrystallized grains are generated during hot rolling, and streaks due to a streaky non-uniform structure are likely to occur.
(5)冷間圧延 熱間圧延板を薄くするために行う。圧延加工度は通常
50〜95%で行われる。(5) Cold rolling This is performed to make a hot-rolled sheet thin. Rolling degree is normal
Done at 50-95%.
(6)中間焼鈍 中間焼鈍は材料を再結晶させるために行い、通常300
〜550℃で行われる。中間焼鈍の方法は規定する必要が
なく、工業的に通常用いられている方法、即ちバッチ炉
を用いる方法や連続焼鈍炉を用いる方法が採用される。
バッチ炉で焼鈍する場合には300〜450℃で数時間加熱す
るが、高温長時間の焼鈍は再結晶粒を粗大化するので34
0〜400℃で焼鈍するのが適当である。連続焼鈍炉では40
0〜550℃で0秒(保持なし)〜数十秒加熱することによ
り微細な再結晶粒を得ることができる。この場合、400
〜550℃で保持すると再結晶粒が粗大化して強度の低下
を招いて印刷版のくわえ切れを生じやすくなり、又保持
中にAl−Fe及びAl−Fe−Si系析出物の粗大化が生じ、電
気化学的粗面化処理で形成されるピットが粗くなるの
で、保持時間が短ければ短いほどよく、0秒(保持な
し)が最も望ましい。(6) Intermediate annealing Intermediate annealing is performed to recrystallize the material, usually 300 times.
Performed at ~ 550 ° C. It is not necessary to define the method of the intermediate annealing, and a method generally used industrially, that is, a method using a batch furnace or a method using a continuous annealing furnace is adopted.
In the case of annealing in a batch furnace, heating is performed at 300 to 450 ° C. for several hours, but annealing at a high temperature for a long time increases the size of recrystallized grains.
It is appropriate to anneal at 0 to 400 ° C. 40 in continuous annealing furnace
By heating at 0 to 550 ° C. for 0 seconds (no holding) to several tens of seconds, fine recrystallized grains can be obtained. In this case, 400
When held at ~ 550 ° C, the recrystallized grains are coarsened and the strength is reduced, and the printing plate is apt to be cut off.Also, during the holding, the Al-Fe and Al-Fe-Si-based precipitates are coarsened. Since the pits formed by the electrochemical surface roughening treatment become rough, the shorter the holding time, the better, and 0 seconds (no holding) is most desirable.
(7)仕上げ冷間圧延 材料の強度を増やし、支持体を版胴に巻きつける時の
くわえ切れを防止する。圧延加工度(板厚減少率)は50
%以上で行う。50%未満では強度不足となり、くわえ切
れの防止効果がなくなる。(7) Finish cold rolling Increases the strength of the material and prevents the grip when the support is wound around the plate cylinder. Rolling degree (thickness reduction rate) is 50
% Or more. If it is less than 50%, the strength will be insufficient, and the effect of preventing rip will be lost.
次に、本発明に係る平版印刷版用アルミニウム合金支
持体の表面処理方法について詳細に説明する。Next, the surface treatment method of the aluminum alloy support for a lithographic printing plate according to the present invention will be described in detail.
砂目立て方法は、塩酸系又は硝酸系電解液中で交流を
流し、砂目立てする電解粗面化法である。アルミニウム
表面を金属ワイヤーでひっかくワイヤーブラシグレイン
法、研摩球と研摩剤でアルミニウム表面を砂目立てする
ボールグレイン法、ナイロンブラシと研摩剤で表面を砂
目立てするブラシグレイン法のような機械的粗面化法を
電解粗面化法として併用してもよい。The graining method is an electrolytic surface roughening method in which an alternating current is flowed in a hydrochloric acid-based or nitric acid-based electrolyte to grain. Mechanical surface roughening such as wire brush graining, which scratches the aluminum surface with a metal wire, ball graining, which sands the aluminum surface with abrasive balls and abrasives, and brush graining, which sands the surface with nylon brushes and abrasives The method may be used in combination as an electrolytic surface roughening method.
電解粗面化処理に先立って、アルミニウム表面に付着
した圧延油あるいは機械的粗面化後のかみ込んだ研摩剤
(機械的粗面化を施した場合)を除去し、表面を清浄化
するための表面処理が行われる。一般的に、圧延油除去
のためにはトリクレン等の溶剤や界面活性剤を用いて表
面を清浄する方法が用いられる。又、1〜30%の水酸化
ナトリウム、水酸化カリウム、炭酸ナトリウム、珪酸ナ
トリウム等の水溶液に、アルミニウム合金板を20〜80℃
の温度で5〜250秒間浸漬してアルカリエッチングを行
い、次いで10〜30%硝酸又は硫酸水溶液に20〜70℃の温
度で5〜250秒間浸漬して、中和及びスマット除去を行
うという方法は、圧延油の除去並びに研摩剤の除去のい
ずれに対しても一般的に用いられる。Prior to electrolytic surface roughening treatment, to remove the rolling oil adhering to the aluminum surface or the abrasive after mechanical surface roughening (if mechanical surface roughening is applied) to clean the surface Is performed. Generally, in order to remove rolling oil, a method of cleaning the surface using a solvent such as trichlene or a surfactant is used. Also, an aluminum alloy plate is placed in an aqueous solution of 1-30% sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, etc. at 20-80 ° C.
Is carried out at a temperature of 5 to 250 seconds for alkali etching, and then immersed in an aqueous solution of 10 to 30% nitric acid or sulfuric acid at a temperature of 20 to 70 ° C. for 5 to 250 seconds to neutralize and remove the smut. It is generally used for removing both rolling oils and abrasives.
このアルミニウム合金板の表面清浄化後、電解粗面化
処理が施される。After surface cleaning of the aluminum alloy plate, electrolytic surface roughening treatment is performed.
電解粗面化処理に使用される電解液は、塩酸溶液を使
用する場合の濃度は0.01〜3重量%の範囲で使用するこ
とが好ましく、0.05〜2.5重量%であれば更に好まし
い。又、硝酸溶液を使用する場合の濃度は、0.2〜5重
量%、好ましくは0.5〜3重量%が好適である。The concentration of the electrolytic solution used for the electrolytic surface roughening treatment when using a hydrochloric acid solution is preferably in the range of 0.01 to 3% by weight, more preferably 0.05 to 2.5% by weight. When a nitric acid solution is used, the concentration is preferably 0.2 to 5% by weight, more preferably 0.5 to 3% by weight.
又、この電解液には必要に応じて硝酸塩、塩化物、モ
ノアミン類、ジアミン類、アルデヒド類、燐酸、クロム
酸、ホウ酸、シュウ酸等の腐蝕抑制剤(又は安定化
剤)、砂目の均一化剤などを加えることができる。The electrolyte may contain a corrosion inhibitor (or stabilizer) such as nitrate, chloride, monoamines, diamines, aldehydes, phosphoric acid, chromic acid, boric acid, oxalic acid, etc. A homogenizing agent or the like can be added.
電解液の温度は通常10〜60℃で処理される。この際に
使用される交流電流は、正負の極性が交互に変換された
ものであれば、矩形波、台形波、正弦波いずれのものも
用いることができ、通常の商用交流の単相及び三相交流
電流を用いることができる。又電流密度は5〜100A/dm2
で、10〜300秒間処理することが望ましい。The temperature of the electrolytic solution is usually treated at 10 to 60 ° C. As the alternating current used at this time, any of a rectangular wave, a trapezoidal wave, and a sine wave can be used as long as the positive and negative polarities are alternately converted. Phase alternating current can be used. The current density is 5-100A / dm 2
It is desirable to process for 10 to 300 seconds.
本発明におけるアルミニウム合金支持体の表面粗さ
は、電気量によって調整し、0.2〜0.8μmとする。0.8
μmをこえると、極端に粗面化面がマクロピットで覆わ
れ、これは耐刷性の低下やインキ汚れの発生原因とな
り、好ましくない。又、0.2μm未満では、印刷版上の
浸し水のコントロールが出来ずシャドー部の網点部がカ
ラミ易くなり、良好な印刷物が得られない。The surface roughness of the aluminum alloy support in the present invention is adjusted by the quantity of electricity and is set to 0.2 to 0.8 μm. 0.8
If the thickness exceeds μm, the extremely roughened surface is covered with macro pits, which causes a reduction in printing durability and causes ink stains, which is not preferable. On the other hand, when the thickness is less than 0.2 μm, the immersion water on the printing plate cannot be controlled, so that the halftone dot portion of the shadow portion becomes liable to be discolored, and a good printed matter cannot be obtained.
このように砂目立ちされたアルミニウム合金は、10〜
50%の熱硫酸(40〜60℃)や稀薄なアルカリ(水酸化ナ
トリウム等)により表面に付着したスマットが除去され
る。アルカリで除去した場合は、引続いて洗浄のため酸
(硝酸又は硫酸)に浸漬して中和する。Aluminum alloy with such a grain is 10 ~
Smut adhering to the surface is removed by 50% hot sulfuric acid (40-60 ° C) or dilute alkali (such as sodium hydroxide). When removed with alkali, it is subsequently neutralized by immersion in an acid (nitric acid or sulfuric acid) for washing.
表面のスマット除去を行った後、陽極酸化皮膜が設け
られる。陽極酸化法は、従来よりよく知られている方法
を用いることができるが、硫酸が最も有用な電解液とし
て用いられる。それについで、リン酸もまた有用な電解
液である。さらに特開昭55−28400号公報に開示されて
いる硫酸とリン酸の混酸法も又有用である。After de-smutting the surface, an anodic oxide coating is provided. As the anodic oxidation method, a conventionally well-known method can be used, but sulfuric acid is used as the most useful electrolytic solution. Subsequently, phosphoric acid is also a useful electrolyte. Further, the mixed acid method of sulfuric acid and phosphoric acid disclosed in JP-A-55-28400 is also useful.
硫酸法は通常直流電流で処理が行われるが、交流を用
いることも可能である。硫酸の濃度は5〜30%で使用さ
れ、20〜60℃の温度範囲で5〜250秒間電解処理され
て、表面に1〜10g/m2の酸化皮膜が設けられる。更にこ
のときの電流密度は1〜20A/dm2が好ましい。リン酸法
の場合には、5〜50%の濃度、30〜60℃の温度で、10〜
300秒間、1〜15A/dm2の電流密度で、処理される。In the sulfuric acid method, the treatment is usually performed with a direct current, but an alternating current can also be used. The sulfuric acid is used at a concentration of 5 to 30%, and is subjected to electrolytic treatment in a temperature range of 20 to 60 ° C. for 5 to 250 seconds to provide an oxide film of 1 to 10 g / m 2 on the surface. Further, the current density at this time is preferably 1 to 20 A / dm 2 . In the case of the phosphoric acid method, at a concentration of 5 to 50% and a temperature of 30 to 60 ° C, 10 to 10%
300 seconds, at a current density of 1 through 15A / dm 2, is treated.
このように、陽極酸化皮膜を設けた後、必要に応じて
後処理を行うことができる。例えば、英国特許第123044
7号公報に開示されたポリビニルホスホン酸の水溶液中
に浸漬処理する方法や、米国特許第3181461号公報に開
示されたアルカリ金属珪酸塩の水溶液に浸漬する方法が
用いられる。又、必要に応じて親水性高分子の下塗り層
を設けることも可能であるが、その後に設ける感光性物
質の性質により、取捨選択される。Thus, after providing the anodic oxide film, post-processing can be performed as needed. For example, British Patent No. 123044
A method of immersion treatment in an aqueous solution of polyvinylphosphonic acid disclosed in Japanese Patent No. 7 and a method of immersion in an aqueous solution of alkali metal silicate disclosed in US Pat. No. 3,118,461 are used. It is also possible to provide an undercoat layer of a hydrophilic polymer if necessary, but it is selected depending on the properties of the photosensitive substance provided thereafter.
本発明によって得られた支持体には、以下に例示する
感光層を設けて平版印刷版とすることができる。The support obtained by the present invention can be provided with a photosensitive layer as exemplified below to form a lithographic printing plate.
[I]ポリヒドロキシ系高分子化合物のo−ナフトキノ
ンジアジドスルホン酸エステル及びフェノール・クレゾ
ール混合のノボラック樹脂を含有する感光層を設ける場
合。[I] A case where a photosensitive layer containing a novolak resin of o-naphthoquinonediazidesulfonic acid ester of a polyhydroxy polymer compound and a mixture of phenol and cresol is provided.
ポリヒドロキシ系高分子化合物としては、平均分子量
で1000〜7000のものが用いられ、例えばベンゼン環上に
ヒドロキシ基を2個以上有する。フェノール化合物(例
えばレゾルシノール、ピロガロール等)とアルデヒド化
合物(例えばホルマリン、ベンズアルデヒド等)との重
縮合物がある。この他、フェノール−ホルムアルデヒド
樹脂、クレゾール−ホルムアルデヒド樹脂、P−tert−
ブチルフェノール−ホルムアルデヒド樹脂、フェノール
変性キシレン樹脂が挙げられる。更に好適なノボラック
樹脂としては、比較的高分子量のフェノールを含むノボ
ラック樹脂で、特開昭55−57841号公報に開示されてい
るフェノール−m−クレゾール−ホルムアルデヒドノボ
ラック樹脂が好ましい。又、露光により可視像を形成す
るためにo−ナフトキノンジアジド−4−スルホニルク
ロライド、p−ジアゾフェニルアミンの無機アニオン
塩、トリハロメチルオキサジアゾール化合物、ベンゾフ
ラン環を有するトリハロメチルオキサジアゾール化合物
等の光によりルイス酸を発生する化合物等が添加され
る。一方色素としては、ビクトリアブルーBOH、クリス
タルバイオレット、オイルブルー等のトリフェニルメタ
ン色素が用いられる。これらの成分からなる感光性組成
物が固形分として、0.5〜3.0g/m2設けられる。As the polyhydroxy polymer compound, those having an average molecular weight of 1,000 to 7000 are used, and have, for example, two or more hydroxy groups on a benzene ring. There is a polycondensate of a phenol compound (eg, resorcinol, pyrogallol, etc.) and an aldehyde compound (eg, formalin, benzaldehyde, etc.). In addition, phenol-formaldehyde resin, cresol-formaldehyde resin, P-tert-
Butylphenol-formaldehyde resin and phenol-modified xylene resin. A more preferred novolak resin is a novolak resin containing phenol having a relatively high molecular weight, and is preferably a phenol-m-cresol-formaldehyde novolak resin disclosed in JP-A-55-57841. Also, in order to form a visible image upon exposure, o-naphthoquinonediazide-4-sulfonyl chloride, an inorganic anion salt of p-diazophenylamine, a trihalomethyloxadiazole compound, a trihalomethyloxadiazole compound having a benzofuran ring, etc. A compound that generates a Lewis acid by the light of the above is added. On the other hand, a triphenylmethane dye such as Victoria Blue BOH, Crystal Violet, or Oil Blue is used as the dye. A photosensitive composition comprising these components is provided in a content of 0.5 to 3.0 g / m 2 as a solid content.
[II]ジアゾ樹脂と水酸基を有する水不溶性且つ親油性
高分子化合物を含有する感光層を設ける場合。[II] A case where a photosensitive layer containing a water-insoluble and lipophilic polymer compound having a diazo resin and a hydroxyl group is provided.
前述の如く、陽極酸化皮膜を設けた後、米国特許第31
81461号に開示されているアルカリ金属シリケート浴中
に浸漬する。このように処理した表面にジアゾ樹脂のPF
6塩又はBF4等とジアゾ樹脂の有機塩と水酸基を有する水
不溶性且つ親油性高分子化合物を含有する感光層を設け
ることが好ましい。かかる感光層を本発明による支持体
表面に塗布すると、保存安定性及び可視画性が優れ、特
に高温・多湿下等の苛酷な条件下で安定な感光性平版印
刷版を得ることができる。As described above, after providing the anodized film, U.S. Pat.
Immersion in the alkali metal silicate bath disclosed in 81461. A diazo resin PF is applied to the surface treated in this way.
It is preferable to provide the 6 photosensitive layer containing a water-insoluble and lipophilic polymeric compound having an organic salt and a hydroxyl group of the salt or BF 4, etc. and diazo resins. When such a photosensitive layer is coated on the surface of the support according to the present invention, a photosensitive lithographic printing plate having excellent storage stability and visibility, and particularly stable under severe conditions such as high temperature and high humidity can be obtained.
このためのジアゾ樹脂は、PF6塩又はBF4塩と有機塩か
ら成り、トリイソプロピルナフタレンスルホン酸、4,
4′−ビフェニルジスルホン酸、5−スルホサリチル
酸、2,5−ジメチルベンゼンスルホン酸、2−ニトロベ
ンゼンスルホン酸、1−ナフトール−5−スルホン酸、
及びp−トルエンスルホン酸等の芳香族スルホン酸、2
−ヒドロキシ−4−メトキシベンゾフェノン−5−スル
ホン酸等の水酸基含有芳香族スルホン酸等が挙げられ
る。The diazo resin for this consists of a PF 6 salt or BF 4 salt and an organic salt, triisopropyl naphthalene sulfonic acid, 4,
4'-biphenyldisulfonic acid, 5-sulfosalicylic acid, 2,5-dimethylbenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 1-naphthol-5-sulfonic acid,
And aromatic sulfonic acids such as p-toluenesulfonic acid;
And hydroxy-containing aromatic sulfonic acids such as -hydroxy-4-methoxybenzophenone-5-sulfonic acid.
又水酸基含有の高分子化合物は、重量平均分子量で50
00〜500,000の化合物で例えば、 (1)N−(4−ヒドロキシフェニル)アクリルアミ
ド、N−(4−ヒドロキシフェニル)メタクリルアミ
ド、N−(4−ヒドロキシナフチル)メタクリルアミド
等と他のモノマーとの共重合体、 (2)o−、m−、又はp−ヒドロキシスチレンと他の
モノマーとの共重合体、 (3)o−、m−、又はp−ヒドロキシフェニルメタク
リレート等と他のモノマーとの共重合体が挙げられる。The hydroxyl-containing polymer compound has a weight average molecular weight of 50.
For example, (1) a copolymer of N- (4-hydroxyphenyl) acrylamide, N- (4-hydroxyphenyl) methacrylamide, N- (4-hydroxynaphthyl) methacrylamide and another monomer. (2) copolymer of o-, m-, or p-hydroxystyrene with other monomer; (3) copolymer of o-, m-, or p-hydroxyphenyl methacrylate with other monomer Polymers.
上記モノマーとしては、例えば、 (イ)アクリル酸、メタクリル酸、無水マレイン酸等の
α,β−不飽和カルボン酸。Examples of the monomer include (a) α, β-unsaturated carboxylic acids such as acrylic acid, methacrylic acid, and maleic anhydride.
(ロ)アクリル酸メチル、アクリル酸エチル等のアルキ
ルアクリレート。(Ii) Alkyl acrylates such as methyl acrylate and ethyl acrylate.
(ハ)メチルメタクリレート、エチルメタクリレート等
のアルキルメタクリレート。(C) Alkyl methacrylates such as methyl methacrylate and ethyl methacrylate.
(ニ)アクリルアミド、メタクリルアミド等のアクリル
アミドもしくはメタクリルアミド類。(D) Acrylamide or methacrylamides such as acrylamide and methacrylamide.
(ホ)エチルビニルエーテル、ヒドロキシエチルビニル
エーテル等のビニルエステル類。(E) Vinyl esters such as ethyl vinyl ether and hydroxyethyl vinyl ether.
(ヘ)スチレン、α−メチルスチレン等のスチレン類。(F) Styrenes such as styrene and α-methylstyrene.
(ト)メチルビニルケトン等のビニルケトン類。(G) Vinyl ketones such as methyl vinyl ketone.
(チ)エチレン、プロピレン、イソプレン等のオレフィ
ン類。(H) Olefins such as ethylene, propylene and isoprene.
(リ)N−ビニルピロリドン、N−ビニルカルバゾー
ル、アクリロニトリル、メタクリロニトリル等が挙げら
れ、その他芳香族性水酸基を含有するモノマーと共重合
し得るモノマーであればよい。(Ii) N-vinylpyrrolidone, N-vinylcarbazole, acrylonitrile, methacrylonitrile, and the like, and any other monomer that can be copolymerized with a monomer containing an aromatic hydroxyl group.
又、感光層中に添加される油溶性染料は、ビクトリア
ピュアーブルーBOH、クリスタルバイオレット、ビクト
リアブルー、メチルバイオレット、オイルブルー#603
等が好ましい。これらの組成の感光層を形成するには、
フッ素系の界面活性剤、ノニオン系界面活性剤、可塑剤
(例えばジブチルフタレート、ポリエチレングリコー
ル、フタル酸ジエチル、リン酸トリオクチル等)及び公
知の安定剤(例えば、リン酸、亜リン酸、有機酸)等を
加えて、乾燥後の塗布重量が0.5〜2.5g/m2となるように
設ける。The oil-soluble dye added to the photosensitive layer is Victoria Pure Blue BOH, Crystal Violet, Victoria Blue, Methyl Violet, Oil Blue # 603.
Are preferred. To form a photosensitive layer having these compositions,
Fluorinated surfactants, nonionic surfactants, plasticizers (eg, dibutyl phthalate, polyethylene glycol, diethyl phthalate, trioctyl phosphate, etc.) and known stabilizers (eg, phosphoric acid, phosphorous acid, organic acids) Etc., so that the coating weight after drying is 0.5 to 2.5 g / m 2 .
[III]カルボン酸残基又は無水カルボン酸残基を有す
る重合体、付加重合性不飽和化合物及び光重合開始剤を
含有する光重合型感光性組成物からなる感光層を設ける
場合。[III] A case where a photosensitive layer comprising a photopolymerizable photosensitive composition containing a polymer having a carboxylic acid residue or a carboxylic anhydride residue, an addition polymerizable unsaturated compound and a photopolymerization initiator is provided.
光重合型感光性材料の場合には、塩酸浴で砂目立てさ
れた支持体表面をリン酸又はリン酸と硫酸の混酸により
陽極酸化することが好ましい。In the case of a photopolymerizable photosensitive material, the surface of the support grained with a hydrochloric acid bath is preferably anodized with phosphoric acid or a mixed acid of phosphoric acid and sulfuric acid.
リン酸浴中で陽極酸化し、シリケート処理した後、カ
ルボン酸残基又は無水カルボン酸残基を有する重合体、
付加重合性不飽和化合物及び光重合開始剤を含有する光
重合型感光性組成物の層を設ける。又、特開昭−107042
号公報に開示されているような電子写真感光体を用いた
平版印刷版に用いることができる。After anodic oxidation in a phosphoric acid bath and silicate treatment, a polymer having a carboxylic acid residue or a carboxylic anhydride residue,
A layer of a photopolymerizable photosensitive composition containing an addition polymerizable unsaturated compound and a photopolymerization initiator is provided. Also, JP-A-1007042
Can be used for a lithographic printing plate using an electrophotographic photoreceptor as disclosed in Japanese Patent Application Laid-Open Publication No. H10-209,878.
このように形成された印刷版は、保存性がよく、しか
も、露出した非画像部のアルミニウム板表面は、印刷イ
ンキで汚れ難く、しかも汚れたインキを迅速に除去する
良好な親水性を有しており、感光層との高い接着力を有
する。The printing plate thus formed has good storability, and the exposed aluminum plate surface in the non-image area is hardly stained with printing ink, and has good hydrophilicity for quickly removing the stained ink. And has high adhesive strength to the photosensitive layer.
この目的に適合するカルボン酸残基又は無水カルボン
酸残基を有する重合体としては、下記の[A]〜[D]
の中から選ばれた構造単位を有する重合体が好ましい。Polymers having a carboxylic acid residue or a carboxylic anhydride residue suitable for this purpose include the following [A] to [D]
A polymer having a structural unit selected from the following is preferable.
(式中R1およびR4は水素原子又はアルキル基を有し、R3
はフェニレン基又はヒドロキシ基を有していてもよいア
ルキレン基、R5は水素原子、置換基を有していてもよい
アルキル基、R6は置換基を有していてもよいアルキル
基、アリル基もしまはアリール基又はシクロアルキル基
を表し、nは0又は1を表す) より具体的な構造単位としては、式(A)としてアク
リル酸、メタクリル酸、クロトン酸、ビニル安息香酸等
が挙げられ、式(B)としてマレイン酸、マレイン酸モ
ノヒドロキシアルキルエステル、マレイン酸モノシクロ
ヘキシルエステル等が挙げられ、式(C)としてマレイ
ン酸モノアルキルアミド、マレイン酸モノヒドロキシア
ルキルアミド等が挙げられ、式(D)として無水マレイ
ン酸、無水イタコン酸等が挙げられる。重合体としては
通常平均分子量1000〜100000のものを使用する。 (Wherein R 1 and R 4 are a hydrogen atom or an alkyl group, R 3
Is an alkylene group which may have a phenylene group or a hydroxy group, R 5 is a hydrogen atom, an alkyl group which may have a substituent, R 6 is an alkyl group which may have a substituent, allyl Group moshi represents an aryl group or a cycloalkyl group, and n represents 0 or 1.) As more specific structural units, acrylic acid, methacrylic acid, crotonic acid, vinylbenzoic acid, etc. may be mentioned as formula (A). Formula (B) includes maleic acid, maleic acid monohydroxyalkyl ester, maleic acid monocyclohexyl ester, and the like, and Formula (C) includes maleic acid monoalkylamide, maleic acid monohydroxyalkylamide, and the like. Examples of (D) include maleic anhydride, itaconic anhydride and the like. As the polymer, those having an average molecular weight of 1,000 to 100,000 are usually used.
付加重合性不飽和化合物は、光重合型感光性樹脂組成
物が活性光線の照射を受けた場合、相互に三次元方向で
付加重合し、不溶化をもたらすようなエチレン性不飽和
二重結合を有する単量体である。例えば、不飽和カルボ
ン酸、不飽和カルボ酸と脂肪族ポリヒドロキシ化合物と
のエステル、不飽和カルボン酸と芳香族ポリヒドロキシ
化合物とのエステル等が挙げられる。The addition-polymerizable unsaturated compound has an ethylenically unsaturated double bond such that when the photopolymerizable photosensitive resin composition is irradiated with actinic rays, it undergoes addition polymerization in three-dimensional directions mutually and causes insolubilization. It is a monomer. Examples thereof include unsaturated carboxylic acids, esters of unsaturated carboxylic acids and aliphatic polyhydroxy compounds, and esters of unsaturated carboxylic acids and aromatic polyhydroxy compounds.
光重合開始剤は、ベンゾイン、ベンゾインアルキルエ
ーテル、ベンゾフェノン、アントラキノン、ミヒラーケ
トン等を単独もしくは組合わせて用いることができ、1
〜3g/m2の乾燥後の塗布量になるように設ける。As the photopolymerization initiator, benzoin, benzoin alkyl ether, benzophenone, anthraquinone, Michler's ketone or the like can be used alone or in combination.
It is provided so that the coating amount after drying is 33 g / m 2 .
以上のようにして平版印刷版を作成する。 A lithographic printing plate is created as described above.
[実施例] 以下実施例によって本発明を詳細に説明する。EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples.
実施例1 第1表に示すNo.1〜No.13の合金を溶解、鋳造し、両
面を面削して厚さ500mm、幅1000mm、長さ3500mmの鋳塊
とし、これに540℃において均質化処理を施し、400℃に
加熱して熱間圧延を行った後、冷間圧延を行い、連続焼
鈍炉により450℃(保持なし)で中間焼鈍を行ってか
ら、板厚減少率80%で仕上げ冷間圧延を施し、0.30mm厚
さの合金板を得た。Example 1 The alloys No. 1 to No. 13 shown in Table 1 were melted and cast, and both surfaces were chamfered to form an ingot having a thickness of 500 mm, a width of 1000 mm and a length of 3500 mm. After performing hot-rolling by heating to 400 ° C, performing cold rolling, performing intermediate annealing at 450 ° C (without holding) in a continuous annealing furnace, and then reducing the sheet thickness by 80%. Finish cold rolling was performed to obtain an alloy plate having a thickness of 0.30 mm.
こうして得た合金板に就いて、機械的性質を調べた。 The mechanical properties of the alloy sheets thus obtained were examined.
次に、前記の0.30mm厚さの合金板の表面を、10%水酸
化ナトリウム水溶液で化学的エッチングを施した後、20
%硝酸中で、温度20℃で中和洗浄し、1%硝酸電解液
で、電流密度30A/m2、50℃、10秒間の交流電解を行っ
た。Next, after the surface of the alloy plate having a thickness of 0.30 mm was chemically etched with a 10% aqueous sodium hydroxide solution,
The solution was neutralized and washed in 20% nitric acid at a temperature of 20 ° C., and subjected to alternating current electrolysis with a 1% nitric acid electrolyte at a current density of 30 A / m 2 at 50 ° C. for 10 seconds.
ひきつづき15%硫酸の50℃水溶液に3分間浸漬して表
面を清浄化したのち20%の硫酸を主成分とする電極液中
で浴温30℃で3g/dm2の酸化皮膜を設けた。Subsequently, the surface was cleaned by immersing it in a 50% aqueous solution of 15% sulfuric acid for 3 minutes, and then an oxide film of 3 g / dm 2 was provided in an electrode solution containing 20% sulfuric acid at a bath temperature of 30 ° C.
このようにして作成したサンプルに下記の感光層を乾
燥時の塗布量が2.5g/m2となるように設けた。The samples prepared in this manner were provided with the following photosensitive layers so that the coating amount upon drying was 2.5 g / m 2 .
ナフトキノン(1,2)−ジアジド−(2)−5−スルホ
ン酸クロライドとレゾルシン−ベンズアルデヒド樹脂と
のエステル化合物 1重量部 フェノールとm−、p−混合クレゾールとホルムアルデ
ヒド共重合縮合樹脂 3.5重量部 2−トリクロロメチル−5−[β−(2′−ベンゾフリ
ル)ビニル]−1,3,4−オキサジアゾール 0.03重量部 ビクトリアピュアーブルーBOH(保土ケ谷化学製) 0.1重量部 p−ブチルフェノールベンズアルデヒドノボラック樹脂
のo−ナフトキノンジアジドスルホン酸エステル 0.05重量部 メチルセロソルブ 27重量部 3kWのメタルハライドランプを用いて、1mの距離で、5
0秒間露光し、4%メタケイ酸ナトリウム水溶液によっ
て25℃、45秒間現像して、水洗乾燥後、ガム引きし、平
版印刷版を得た。Ester compound of naphthoquinone (1,2) -diazide- (2) -5-sulfonic acid chloride and resorcin-benzaldehyde resin 1 part by weight Phenol and m-, p-mixed cresol and formaldehyde copolymerized and condensed resin 3.5 parts by weight 2- Trichloromethyl-5- [β- (2'-benzofuryl) vinyl] -1,3,4-oxadiazole 0.03 parts by weight Victoria Pure Blue BOH (manufactured by Hodogaya Chemical) 0.1 part by weight o- of p-butylphenol benzaldehyde novolak resin Naphthoquinonediazide sulfonic acid ester 0.05 parts by weight Methyl cellosolve 27 parts by weight Using a 3 kW metal halide lamp,
It was exposed for 0 second, developed with a 4% aqueous solution of sodium metasilicate at 25 ° C. for 45 seconds, washed with water and dried, and gummed to obtain a lithographic printing plate.
これらの印刷版をオフセット印刷機KORに取付け、引
画像部の汚れ(インキ汚れ)及び耐刷性を調べた。電気
化学的粗面化によるピットパターンは、電子顕微鏡(SE
M)で表面観察した。These printing plates were mounted on an offset printing machine KOR, and stains (ink stains) in the drawn image area and printing durability were examined. The pit pattern produced by electrochemical surface roughening is measured using an electron microscope (SE
M) The surface was observed.
以上の結果を第2表に示す。 Table 2 shows the above results.
本発明例No.1〜4の場合、引張強さが14kgf/mm2以上
と高く、ピットパターンが微細、円形で良好であり、印
刷枚数が9〜10万枚と多くて耐刷性が良く、インキ汚れ
も少ない。 In the case of the present invention examples Nos. 1 to 4, the tensile strength is as high as 14 kgf / mm 2 or more, the pit pattern is fine and good in a circular shape, the number of printed sheets is as large as 90 to 100,000, and the printing durability is good. , Less ink stain.
比較例No.5はFeが少ないため、強度が低く、ピットパ
ターンもやや不良となり、印刷枚数も少ない。No.6はFe
が多いためにピットパターンが不良であり、印刷枚数が
少ない。No.7はSiが少ないために強度が低く、ピットパ
ターンもやや不良で、印刷枚数も少ない。No.8はSiが多
いためにインキ汚れが多い。No.9はCuが少ないために印
刷枚数が少ない。No.10はCuが多いためにピットパター
ンが不良となり、印刷枚数が少ない。No.11は[Ti
(%)]<1.2×[Ga(%)]−0.015であるためピット
パターンがやや不良であり、印刷枚数が少ない。No.12
はTiが多いためにピットパターンがやや不良であり、印
刷枚数が少ない。No.13はGaが多いためにやはりピット
パターンが不良であり、印刷枚が少ない。Comparative Example No. 5 has a small amount of Fe, so the strength is low, the pit pattern is slightly poor, and the number of printed sheets is small. No. 6 is Fe
The pit pattern is defective due to the large number of prints, and the number of printed sheets is small. No. 7 has low strength due to low Si, the pit pattern is slightly poor, and the number of printed sheets is small. No. 8 has a lot of ink stains because it has a lot of Si. No. 9 has a small number of printed sheets due to a small amount of Cu. No. 10 has a poor pit pattern due to a large amount of Cu, and the number of printed sheets is small. No. 11 is [Ti
(%)] <1.2 × [Ga (%)] − 0.015, the pit pattern is slightly defective, and the number of printed sheets is small. No.12
The pit pattern is slightly defective due to a large amount of Ti, and the number of printed sheets is small. No. 13 also has a poor pit pattern due to a large amount of Ga, and has few printed sheets.
実施例2 次にTi及びGa量の影響を明らかにするために第3表に
示すNo.14〜No.32の合金を溶解、鋳造し、両面を面削し
て厚さ500mm、幅1000mm、長さ3500mmの鋳塊とし、これ
に580℃において均質化処理を施し、410℃に加熱して熱
間圧延を行った後、冷間圧延を行い、連続焼鈍炉により
480℃(保持時間なし)で中間焼鈍を行ってから、板厚
減少率%で仕上げ冷間圧延を施し、0.30mm厚さの合金板
を得た。Example 2 Next, in order to clarify the effects of the amounts of Ti and Ga, the alloys of Nos. 14 to 32 shown in Table 3 were melted and cast, and both surfaces were chamfered to a thickness of 500 mm and a width of 1000 mm. 3500mm length ingot, subjected to homogenization at 580 ℃, heated to 410 ℃ and then hot-rolled, then cold-rolled, by continuous annealing furnace
After intermediate annealing at 480 ° C. (no holding time), finish cold rolling was performed at a sheet thickness reduction rate of% to obtain an alloy sheet having a thickness of 0.30 mm.
こうして得た合金板について、実施例1と全く同様に
機械的性質、ピットパターン、印刷枚数(耐刷性)、イ
ンキ汚れを調べた。結果を第4表に示す。 The alloy plate thus obtained was examined for mechanical properties, pit patterns, number of printed sheets (printing durability), and ink stains in exactly the same manner as in Example 1. The results are shown in Table 4.
本発明例No.14〜25の場合、強度が高く、ピットパタ
ーンが良好で印刷枚数が多く、インク汚れが少ない。比
較例No.26〜32の場合、 [Ti(%)]<1.2×[Ga(%)]−0.015 であるため、ピットパターンがやや不良〜不良となり、
印刷枚数が少ない。 In the case of the present invention examples Nos. 14 to 25, the strength is high, the pit pattern is good, the number of printed sheets is large, and the ink stain is small. In the case of Comparative Examples Nos. 26 to 32, since [Ti (%)] <1.2 × [Ga (%)] − 0.015, the pit pattern was slightly poor to poor,
The number of prints is small.
なお、実施例1のNo.2、No.11と実施例2のNo.29のピ
ットパターンを第1図に示す(倍率1500倍)。No.2の場
合ピットが微細で円形である。No.11の場合ピットが歪
んでやや半月状になっており、No.29の場合ピットが著
しく歪んでいる。The pit patterns of No. 2 and No. 11 of Example 1 and No. 29 of Example 2 are shown in FIG. 1 (1500 times magnification). In the case of No. 2, the pits are fine and circular. In the case of No. 11, the pits are distorted and slightly crescent-shaped, and in the case of No. 29, the pits are significantly distorted.
次に実施例1のNo.1〜4、No.11〜13及び実施例2のN
o.14〜32の結果から、Ti量及びGa量のピットパターンの
関係を示すと第2図のようである。ピットパターンが良
好な領域は次式で示される。Next, Nos. 1 to 4 and Nos. 11 to 13 of Example 1 and N of Example 2
From the results of o.14 to 32, the relationship between the pit patterns of the Ti amount and the Ga amount is shown in FIG. A region having a good pit pattern is represented by the following equation.
[Ti(%)]≦0.10 [Ga(%)]≦0.04 [Ti(%)]≧1.2×[Ga(%)]−0.015 実施例3 次に製造条件の影響をみるために、実施例1のNo.1〜
4の合金について第5表のように均質化処理温度、熱間
圧延の加熱温度、中間焼鈍の方法(連続炉又はバッチ
炉)、仕上げ冷間圧延の板厚減少率を種々変えて0.30mm
厚さの合金板を得た。そして、実施例1と同様に機械的
性質、ピットパターン、印刷枚数(耐刷性)、インキ汚
れを調べた。又、ここでは平版印刷版を作成したときの
表面のストリークも観察した。結果を第6表に示す。[Ti (%)] ≦ 0.10 [Ga (%)] ≦ 0.04 [Ti (%)] ≧ 1.2 × [Ga (%)] − 0.015 Example 3 Next, in order to see the influence of the manufacturing conditions, Example 1 was used. No.1 ~
As shown in Table 5, the alloy No. 4 was prepared by changing the homogenizing treatment temperature, the hot rolling heating temperature, the method of intermediate annealing (continuous furnace or batch furnace), and the thickness reduction rate of the finish cold rolling to 0.30 mm.
An alloy plate having a thickness was obtained. Then, in the same manner as in Example 1, the mechanical properties, the pit pattern, the number of printed sheets (printing durability), and the ink stain were examined. Here, streak on the surface when a lithographic printing plate was prepared was also observed. The results are shown in Table 6.
No.1A、2A、3A、4A、1E、2E、3E、4Eの場合、強度が
高く、ピットパターンが良好であり、印刷枚数が多く、
ストリークも良好で、インキ汚れも少ない。No.1B、2
B、3B、4Bの場合、均質化処理温度が高いためにインキ
汚れがやや多い。No.1C、2C、3C、4Cの場合、均質化処
理温度が低いためにピットがわずかに歪み、印刷枚数が
やや少ない。No.1D、2D、3D、4Dの場合、熱間圧延の加
熱温度が高いために筋状の不均一組織によるストリーク
が発生している。No.1F、2F、3F、4Fの場合、仕上げ冷
間圧延の板厚減少率が低いために強度が低い。 In the case of No. 1A, 2A, 3A, 4A, 1E, 2E, 3E, 4E, the strength is high, the pit pattern is good, the number of printed sheets is large,
Good streak and less ink stain. No.1B, 2
In the case of B, 3B, and 4B, ink stains are slightly more due to the high homogenization treatment temperature. In the case of Nos. 1C, 2C, 3C, and 4C, the pits were slightly distorted due to the low homogenization processing temperature, and the number of printed sheets was slightly small. In the case of Nos. 1D, 2D, 3D, and 4D, streaks due to streak-like non-uniform structures occurred because the heating temperature of hot rolling was high. In the case of Nos. 1F, 2F, 3F and 4F, the strength is low due to the low reduction rate of the thickness of the finish cold rolling.
以上のように、均質化処理温度は450〜600℃、熱間圧
延の加熱温度は350〜600℃、仕上げ冷間圧延の板厚減少
率は50%以上が望ましい。又、中間焼鈍はバッチ炉で行
っても連続炉で行っても良い。各々の最適条件は前記の
通りである。As described above, it is desirable that the homogenization treatment temperature is 450 to 600 ° C., the heating temperature of hot rolling is 350 to 600 ° C., and the reduction rate of the thickness of finish cold rolling is 50% or more. The intermediate annealing may be performed in a batch furnace or a continuous furnace. Each optimum condition is as described above.
[発明の効果] 本発明は、以上説明したとおり構成されていることに
より、平版印刷版用アルミニウム合金支持体は十分な強
度を有するため版割れが生じにくく、電気化学的粗面化
によるピットが微細均一であるから耐刷性にすぐれてお
り、なおかつ耐汚れ性に優れているという顕著な効果を
奏するものである。[Effects of the Invention] The present invention is configured as described above, and therefore, the aluminum alloy support for a lithographic printing plate has sufficient strength to hardly cause plate cracking, and pits due to electrochemical graining are reduced. Since it is finely uniform, it has excellent printing durability and also has a remarkable effect of being excellent in stain resistance.
第1図(イ)(ロ)(ハ)は実施例No.2、11、29の金属
表面組織を示す電子顕微鏡写真、第2図はTi量とGa量と
ピットパターンの関係を示すグラフを示す。FIGS. 1 (a), (b) and (c) are electron micrographs showing the metal surface structures of Examples Nos. 2, 11 and 29, and FIG. 2 is a graph showing the relationship between the pit pattern and the amount of Ti and Ga. Show.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山内 重徳 愛知県名古屋市港区千年3丁目1番12号 住友金属工業株式会社技術研究所内 (72)発明者 鈴木 祐治 愛知県名古屋市港区千年3丁目1番12号 住友金属工業株式会社技術研究所内 (72)発明者 土田 信 愛知県名古屋市港区千年3丁目1番12号 住友金属工業株式会社技術研究所内 (56)参考文献 特開 昭60−215725(JP,A) 特開 昭62−148295(JP,A) 特開 昭58−130242(JP,A) ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shigenori Yamauchi 3-1-112 Minato-ku, Minato-ku, Nagoya-shi, Aichi Prefecture Sumitomo Metal Industries Co., Ltd. Technical Research Institute (72) Inventor Yuji Suzuki 3-year-old Minato-ku, Nagoya-shi, Aichi No. 1-112, Sumitomo Metal Industries, Ltd.Technical Research Laboratory (72) Inventor Shin Nobuchida 3-1-1-12, Minato-ku, Nagoya-shi, Aichi Prefecture Sumitomo Metal Industry Co., Ltd.Technical Research Laboratory (56) References JP-A-60 JP-A-215725 (JP, A) JP-A-62-148295 (JP, A) JP-A-58-130242 (JP, A)
Claims (1)
0.03〜0.2%、Cu:0.005〜0.05%、Ti:0.1%以下、Ga:0.
04%以下含み、残りAl及び不可避不純物であって、Tiと
Gaとの関係が、[Ti(%)]≧1.2×[Ga(%)]−0.0
15であることを特徴とする平版印刷版用アルミニウム合
金材料。1. Fe: 0.1-1.0% (% by weight, the same applies hereinafter), Si:
0.03-0.2%, Cu: 0.005-0.05%, Ti: 0.1% or less, Ga: 0.
Less than 04%, remaining Al and unavoidable impurities, Ti
The relationship with Ga is [Ti (%)] ≧ 1.2 × [Ga (%)] − 0.0
An aluminum alloy material for a lithographic printing plate, which is 15.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1260138A JP2665382B2 (en) | 1989-10-06 | 1989-10-06 | Aluminum alloy materials for lithographic printing plates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1260138A JP2665382B2 (en) | 1989-10-06 | 1989-10-06 | Aluminum alloy materials for lithographic printing plates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03122241A JPH03122241A (en) | 1991-05-24 |
JP2665382B2 true JP2665382B2 (en) | 1997-10-22 |
Family
ID=17343834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1260138A Expired - Lifetime JP2665382B2 (en) | 1989-10-06 | 1989-10-06 | Aluminum alloy materials for lithographic printing plates |
Country Status (1)
Country | Link |
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JP (1) | JP2665382B2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03177528A (en) * | 1989-12-06 | 1991-08-01 | Sky Alum Co Ltd | Aluminum alloy sheet stock for supporting body of printing form plate |
JP2777355B2 (en) * | 1995-09-20 | 1998-07-16 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
US5795541A (en) * | 1996-01-05 | 1998-08-18 | Kabushiki Kaisha Kobe Seiko Sho | Aluminum alloy sheet for lithographic printing plates and method for manufacturing the same |
JP2778664B2 (en) * | 1996-04-08 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2778665B2 (en) * | 1996-04-11 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2778667B2 (en) * | 1996-04-16 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2777350B2 (en) * | 1996-04-17 | 1998-07-16 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2778661B2 (en) * | 1996-01-05 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2778663B2 (en) * | 1996-04-08 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2778662B2 (en) * | 1996-04-05 | 1998-07-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
JP2777349B2 (en) * | 1996-04-17 | 1998-07-16 | 株式会社神戸製鋼所 | Aluminum alloy plate for printing plate and method for producing the same |
EP1964687A4 (en) * | 2005-12-22 | 2009-07-15 | Konica Minolta Med & Graphic | Support for lithographic printing plate material, process for producing the same and lithographic printing plate material therefrom |
Family Cites Families (3)
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JPS58130242A (en) * | 1982-01-28 | 1983-08-03 | Sumitomo Light Metal Ind Ltd | Aluminum or aluminum alloy with superior etchability |
JPS60215725A (en) * | 1984-04-06 | 1985-10-29 | Sukai Alum Kk | Blank aluminum alloy plate for printing |
JPS62148295A (en) * | 1985-12-23 | 1987-07-02 | Furukawa Alum Co Ltd | Aluminum alloy base for planographic plate and production thereof |
-
1989
- 1989-10-06 JP JP1260138A patent/JP2665382B2/en not_active Expired - Lifetime
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