JP2661453B2 - Electrode connection tool and semiconductor device electrode connection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode connecting tool for connecting an electrode of a semiconductor device to an external lead and a semiconductor device electrode connecting device.

[0002]

2. Description of the Related Art In recent years, as a semiconductor element mounting method, a film carrier (hereinafter referred to as TAB tape (TAB)) in which a lead is formed on a resin film with a copper foil instead of a wire bond method.
B: TAB using Tape Automated Bonding)
The mounting method is becoming mainstream. In order to electrically connect the electrodes on the semiconductor device and the leads of the TAB tape in the TAB mounting method, a single point bonding method in which the electrodes are connected one by one and a gang bonding in which all the electrodes of the semiconductor device are connected collectively Although there is a method, a single-point bonding method, which is easy to cope with high density, high pin count, and high reliability of a semiconductor element, has been attracting attention.

An electrode connection tool and a semiconductor device electrode connection device used in a conventional single point bonding method will be described below. FIG. 4A is a top view of a conventional electrode connection tool, and FIG. 4B is a side view thereof. As shown in these figures, the electrode connection tool 1 is manufactured by processing a round bar such as titanium carbide, and one end thereof is held by the holding portion 1.
a, the other end is machined in a conical shape to reduce the tip area
The crimping portion 1b is configured to apply a large pressure to the electrode lead of the AB tape. A central portion of the axis of the electrode connection tool 1 is left as a round bar, and a coil-shaped heater 2 made of a nichrome wire or the like is wound therearound.

Next, a conventional semiconductor device electrode connection device will be described. FIG. 5 is a perspective view of a main part of the semiconductor device electrode connection device. As shown in FIG. 5, the electrode connection unit 3
Has a configuration in which a horn 5 for transmitting ultrasonic waves is attached to the holding block 4, and an electrode connection tool 1 to which a heater 2 is attached is attached to a tip of the horn 5. Electrode connection tool 1
A tape guide 7 for guiding a TAB tape 6 and a chip stage 9 on which a semiconductor element 8 is mounted are arranged in front of the device.

[0005] The operation of the semiconductor device electrode connection device constructed as described above will be described with reference to the electrode connection unit 3 shown in FIG.
This will be described with reference to the perspective view of the main part of FIG. When the semiconductor connection device main body (not shown) is operated, the electrodes 10 of the semiconductor element 8 mounted on the chip stage 9 are aligned with the leads 11 of the TAB tape 6 so as to face each other. Next, the electrode connection tool 1 heated by the heater 2 is lowered onto one lead 11 of the TAB tape 6 aligned with the electrode 10 of the semiconductor element 8, and the lead 11 is pressed against the electrode 10 of the semiconductor element 8. . This operation is sequentially repeated for each lead 11 so that the semiconductor element 8 and the TAB tape 6 are electrically connected to each other.
Connected mechanically. At this time, a predetermined fixed amount of power is supplied from the power supply 12 to the heater 2 attached to the electrode connection tool 1 irrespective of the operation of the electrode connection tool 1 or a change in the ambient temperature, and the heater 2 generates heat. The electrode connection tool 1 is heated.

[0006]

However, in the above-mentioned conventional electrode connection tool, the coil-shaped heater attached to the electrode connection tool moves up and down due to the up and down movement of the electrode connection tool. There has been a problem that the temperature of the connection tool becomes unstable, and the heater wears and deteriorates due to sliding between the heater and the electrode connection tool, thereby shortening the life. Also, in a conventional semiconductor device electrode connection device using an electrode connection tool, a predetermined constant power is supplied to heat the heater, so that the temperature of the electrode connection tool may be caused by disturbances such as external temperature and air flow. There was a problem that it was not possible to cope with a state change due to the operation of the electrode connection tool, and the state always fluctuated.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and uses an electrode connecting tool capable of efficiently and stably transmitting heat of a heater and suppressing deterioration due to sliding wear of the heater and a method of using the electrode connecting tool. It is an object of the present invention to provide a semiconductor device electrode connection device.

[0008]

In order to achieve this object, an electrode connecting tool according to the present invention is designed to crimp a lead in which one end of a cylindrical body is held by a holding portion and the other end is overlapped with an electrode of a semiconductor element. A crimped portion processed into a conical shape, having a non-through hole in the axial direction from the end face on the holding portion side, and having a portion smaller in diameter than the holding portion between the holding portion and the crimping portion. is there.

Further, in the semiconductor device electrode connection device of the present invention, the above electrode connection tool is attached to the electrode connection unit, and a heater wire is wound around a narrow portion of the electrode connection tool and supplied from outside. It has a configuration in which the temperature of the electrode connection tool is controlled by receiving information from a temperature measuring element that is heated by electric power and inserted into a hole formed in the axial direction from the end face on the holding section side.

[0010]

With the configuration of the electrode connection tool, sliding wear of the heater due to vertical movement is prevented, and a non-through hole provided in the axial direction facilitates fixing of the temperature measuring element and at the tip of the most necessary electrode connection tool. Temperature can be measured at a closer position to obtain highly accurate information.

The semiconductor device electrode connecting device using the above electrode connecting tool can immediately respond to the temperature change of the electrode connecting tool due to the occurrence of disturbances such as an external temperature and air flow and the state change due to the operation of the electrode connecting tool. Therefore, stable electrode connection can always be achieved.

[0012]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is a top view of an electrode connection tool according to an embodiment of the present invention, and FIG. 1B is a side view thereof. As shown in these figures, the electrode connection tool 21
Is manufactured by processing a round bar material such as titanium carbide, one end of which is formed into a holding portion 21a and the other end thereof is formed into a conical shape so that the tip area is reduced so that a large pressure is applied to the electrode lead of the TAB tape. The intermediate portion is a portion 21c having a smaller diameter than the holding portion 21a (hereinafter, referred to as a heater mounting portion). A non-through hole 22 is formed in the axial direction from the end face on the holding portion 21a side, and a heater 23 is mounted on the heater mounting portion 21c. The processing depth of the heater mounting portion 21c needs to be appropriately changed according to the diameter of the heater 23. FIG. 1B shows an example in which the hole 22 into which the temperature measuring element is inserted is formed up to the middle of the heater mounting portion 21c. However, the tip of the hole 22 is preferably as close as possible to the crimping portion 21b.

Next, a semiconductor device electrode connecting device according to an embodiment of the present invention will be described. FIG. 2 is a perspective view of a main part of the semiconductor device electrode connection device. As shown in FIG.
The electrode connection unit 24 has a configuration in which a horn 26 for transmitting ultrasonic waves is attached to a holding block 25, and an electrode connection tool 21 to which a heater 23 and a thermocouple 27 are attached is attached to a tip of the horn 26. A tape guide 29 for guiding a TAB tape 28 and a chip stage 31 on which a semiconductor element 30 is mounted are arranged in front of the electrode connection tool 21. The thermocouple 27 is inserted into a hole 22 formed in the axial direction from the end face of the electrode connection tool 21 shown in FIG.

The operation of the semiconductor device electrode connection device constructed as described above will be described with reference to the electrode connection unit 2 shown in FIG.
4 will be described with reference to a perspective view of a main part. When the semiconductor connection device main body (not shown) is operated, the electrodes 34 of the semiconductor element 30 mounted on the chip stage 31 are aligned with the leads 32 of the TAB tape 28 so as to face each other.
Next, the electrode connection tool 21 heated by the heater 23 descends onto one lead 32 of the TAB tape 28 aligned with the electrode 34 of the semiconductor element 30, and presses the lead 32 to the electrode 34 of the semiconductor element 30. . This operation is sequentially repeated for each lead 32, and the semiconductor device 30 and the TAB
The tape 28 is electrically and mechanically connected. The electrode connecting tool 21 is heated by the heater 23, and the thermocouple 27 measures the temperature of the electrode connecting tool 21 and sends a thermoelectromotive force to the temperature controller 32, which is lower or higher than a temperature preset by the temperature controller 32. Then, the output of the power supply 33 that supplies a current to the heater 23 is controlled to adjust the amount of heat generated by the heater 23.
In this way, the temperature of the electrode connection tool 21 can be controlled to stably maintain the optimum temperature for electrode connection.

[0015]

As described above, according to the present invention, the electrode connection tool used for the single point method of TAB mounting is provided with a portion for attaching a heater and a non-through hole for inserting a temperature measuring element, thereby providing excellent temperature stability. It can realize an electrode connection tool that can withstand long-term use. By using this electrode connection tool to feed back the measurement result of the temperature measuring element to the heater heating current, the operation of the electrode connection tool, the ambient environment temperature and It is possible to stably maintain the temperature of the electrode connection tool at an optimum bonding temperature even with a change in air flow or the like, and to realize an excellent semiconductor device electrode connection device capable of performing high quality electrode bonding.

[Brief description of the drawings]

FIG. 1A is a top view of an electrode connection tool according to an embodiment of the present invention. FIG. 1B is a side view of the electrode connection tool.

FIG. 2 is a perspective view of a main part of a semiconductor device electrode connection device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a main part of an electrode connection unit of the semiconductor device electrode connection device.

FIG. 4A is a top view of a conventional electrode connection tool. FIG. 4B is a side view of the electrode connection tool.

FIG. 5 is a perspective view of a main part of a conventional semiconductor device electrode connection device.

FIG. 6 is a perspective view of a main part of an electrode connection unit of the semiconductor device electrode connection device.

[Explanation of symbols]

 21 electrode connection tool 21a holding part 21b crimping part 21c heater mounting part (part with small diameter) 22 hole

Claims (2)

(57) [Claims] 1. One end of a cylindrical body is a holding portion, and the other end is a crimping portion processed into a conical shape for crimping a lead superposed on an electrode of a semiconductor element, and an end surface on the holding portion side. An electrode connection tool having a hole that is not penetrated in the axial direction from the first direction, and having a portion smaller in diameter than the holding portion between the holding portion and the crimping portion. 2. A stage for mounting at least a semiconductor element, a film carrier supply section for supplying a film carrier, an alignment section for aligning a lead of the film carrier with an electrode on the semiconductor element, and the lead and the semiconductor. An electrode connection unit for joining an electrode on the element, wherein the electrode connection tool according to claim 1 is attached to the electrode connection unit, and a heater is wound around a thin portion of the electrode connection tool. A semiconductor element electrode connection device for controlling the temperature of the electrode connection tool by receiving information from a temperature measuring element inserted into the hole and heated by externally supplied electric power.