JP2646935B2 - Glass woven fabric for laminates and laminates - Google Patents
Glass woven fabric for laminates and laminatesInfo
- Publication number
- JP2646935B2 JP2646935B2 JP4126533A JP12653392A JP2646935B2 JP 2646935 B2 JP2646935 B2 JP 2646935B2 JP 4126533 A JP4126533 A JP 4126533A JP 12653392 A JP12653392 A JP 12653392A JP 2646935 B2 JP2646935 B2 JP 2646935B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- woven fabric
- laminates
- coefficient
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Woven Fabrics (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板用の絶
縁基板として適した熱硬化性樹脂積層板ならびにこの積
層板用のガラス織布に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting resin laminated board suitable as an insulating substrate for a printed wiring board and a woven glass fabric for the laminated board.
【０００２】[0002]
【従来の技術】従来、プリント配線板の絶縁基板は、Ｅ
ガラスよりなるガラスフィラメントのガラス織布基材に
熱硬化性樹脂を含浸乾燥し、これを加熱加圧成形した積
層板を用いるのが一般的である。しかし、この積層板は
平面方向の熱膨張率が大きい。従って、熱膨張率の小さ
いリードレスチップキャリアやフリップチップなどのＬ
ＳＩ、チップ抵抗、チップコンデンサ等の部品を、プリ
ント配線板の表面に直接半田付け（表面実装）して使用
すると、熱ストレスによって半田接続部分にクラックが
入りやすい。積層板の平面方向の熱膨張率は、樹脂を含
浸した基材の熱膨張率に大きく影響される。通常基材と
して用いられるガラス織布は、ガラスの成分がＳｉ
Ｏ2、Ａｌ2Ｏ3、ＣａＯ、ＭｇＯなどからなる。このＳ
ｉＯ2、Ａｌ2Ｏ3の成分を増加させることによりガラス
基材の熱膨張率を小さくすることができる。そこで、熱
膨張率が小さい石英ガラス繊維の織布を基材とした熱硬
化性樹脂積層板が提案されているが、繊維自身が硬くま
た脆くなるため織布にすることが難しくなる。また、そ
れを用いた積層板のドリル加工時のドリル摩耗が著しく
悪くなる。ガラス成分のうちアルカリ金属酸化物を調整
することにより、線膨張率を小さく、ドリル加工性も向
上させることができるが、やはり工業的には織布化が困
難である。熱膨張率が負の値を示すアラミド繊維、グラ
ファイト繊維、カーボン繊維等の織布を基材とした熱硬
化性樹脂積層板も提案されている。しかし、アラミド繊
維の織布を基材とした積層板は、穴明けを行うとその壁
面に繊維が残り、スルホールメッキの障害になるし、耐
湿性にも問題がある。また、カーボン繊維の織布を基材
とした積層板は、基材自体に導電性があるので、到底プ
リント配線板の絶縁基板としては使えない。2. Description of the Related Art Conventionally, an insulating substrate of a printed wiring board is made of E.
In general, a glass woven glass substrate of glass filaments made of glass is impregnated with a thermosetting resin and dried, and then heated and pressed to form a laminate. However, this laminate has a large thermal expansion coefficient in the plane direction. Therefore, the low thermal expansion coefficient of leadless chip carriers, flip chips, etc.
When components such as SI, chip resistors, and chip capacitors are directly soldered (surface mounted) to the surface of the printed wiring board, cracks are likely to occur in the solder connection portions due to thermal stress. The coefficient of thermal expansion in the planar direction of the laminate is greatly affected by the coefficient of thermal expansion of the substrate impregnated with the resin. Glass woven fabric usually used as a substrate has a glass component of Si
It is made of O 2 , Al 2 O 3 , CaO, MgO or the like. This S
By increasing the components of iO 2 and Al 2 O 3, the coefficient of thermal expansion of the glass substrate can be reduced. In view of this, a thermosetting resin laminate using a quartz glass fiber woven fabric having a low coefficient of thermal expansion as a base material has been proposed. However, it is difficult to use a woven fabric because the fiber itself is hard and brittle. In addition, drill wear during drilling of a laminated board using the same significantly deteriorates. By adjusting the alkali metal oxide among the glass components, the coefficient of linear expansion can be reduced and the drilling property can be improved, but it is still industrially difficult to form a woven fabric. Thermosetting resin laminates based on woven fabrics such as aramid fibers, graphite fibers, and carbon fibers having a negative coefficient of thermal expansion have also been proposed. However, when a laminated plate made of a woven aramid fiber base material is perforated, fibers remain on the wall surface of the laminated plate, which hinders through-hole plating and has a problem in moisture resistance. Further, a laminate using a carbon fiber woven fabric as a base material cannot be used as an insulating substrate of a printed wiring board because the base material itself has conductivity.
【０００３】[0003]
【発明が解決しようとする課題】このように、プリント
配線板の絶縁基板として平面方向の熱膨張率が小さく機
械加工性もよい、バランスのとれた積層板は見いだされ
ていない。本発明が解決しようとする課題は、ガラス織
布を基材とする積層板において、平面方向の熱膨張率を
小さくし、機械加工性もよくすることである。また、こ
のような積層板のためのガラス織布を提供することであ
る。As described above, no well-balanced laminated board having a small coefficient of thermal expansion in the plane direction and good machinability has not been found as an insulating substrate of a printed wiring board. The problem to be solved by the present invention is to reduce the coefficient of thermal expansion in the planar direction and improve the machinability in a laminated plate made of a glass woven fabric as a base material. It is also an object to provide a glass woven fabric for such a laminate.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る積層板用ガラス織布は、Ｅガラスより
なるガラスフィラメント（ａ）とガラス成分のうちＳｉ
Ｏ2とＡｌ2Ｏ3の合計が８５〜９０重量％であるガラス
よりなるガラスフィラメント（ｂ）とで構成される。そ
して、前記（ａ）と（ｂ）の使用比率が５：５〜２：８
であることを特徴とする。また、本発明に係る積層板
は、前記のようなガラス織布を基材とするものであり、
ガラス織布に熱硬化性樹脂を含浸してなる。In order to solve the above-mentioned problems, a glass woven fabric for a laminated plate according to the present invention comprises a glass filament (a) made of E glass and Si among glass components.
The sum of O 2 and Al 2 O 3 is formed out of glass filaments (b) made of glass is 85 to 90 wt%. And the use ratio of (a) and (b) is 5: 5 to 2: 8.
It is characterized by being. Further, the laminated plate according to the present invention is based on a glass woven fabric as described above,
A glass woven fabric is impregnated with a thermosetting resin.
【０００５】[0005]
【作用】本発明に係るガラス織布は、ＳｉＯ2とＡｌ2Ｏ
3の成分を増加させて熱膨張率を小さくしたガラスフィ
ラメント（ｂ）を、通常ガラス織布に使用されているＥ
ガラスよりなるガラスフィラメント（ａ）と組み合わせ
ることにより、容易に織布化できる。ガラスフィラメン
ト（ａ）と（ｂ）の割合によりガラス織布の熱膨張率は
決まるが、熱膨張率の小さなガラスフィラメント（ｂ）
が多いと織布化が困難となり、同時にドリル加工時のド
リルの摩耗が大きくなる。一方、ガラスフィラメント
（ｂ）が少ないと熱膨張率が小さくならない。つまり、
ガラスフィラメント（ａ）と（ｂ）の使用比率を、５：
５〜２：８とすることにより上記課題を解決することが
できる。ここで、ガラスフィラメント（ｂ）のガラスの
成分は、ＳｉＯ2、Ａｌ2Ｏ3の合計が８５重量％に達し
ないと熱膨張率が小さくならないし、９０％を越えると
単糸化が困難となる。尚、積層板を構成する所定枚数の
ガラス織布基材として、ガラスフィラメント（ａ）より
なるガラス織布とガラスフィラメント（ｂ）よりなるガ
ラス織布を組み合わせるようなことも考えられるが、２
種類の基材が必要になり生産効率上好ましくない。The glass woven fabric according to the present invention comprises SiO 2 and Al 2 O.
The glass filament (b) whose coefficient of thermal expansion has been reduced by increasing the component (3) is used for the glass filament (E) usually used for glass woven fabric.
By combining with the glass filament (a) made of glass, it can be easily woven. Although the coefficient of thermal expansion of the glass woven fabric is determined by the ratio of the glass filaments (a) and (b), the glass filament (b) having a small coefficient of thermal expansion
When the amount is large, it is difficult to form a woven fabric, and at the same time, the wear of the drill during drilling increases. On the other hand, when the glass filament (b) is small, the coefficient of thermal expansion does not decrease. That is,
The use ratio of the glass filaments (a) and (b) is 5:
By setting the ratio to 5-2: 8, the above problem can be solved. Here, as for the glass component of the glass filament (b), if the total of SiO 2 and Al 2 O 3 does not reach 85% by weight, the coefficient of thermal expansion does not become small. Become. As a predetermined number of glass woven fabric base materials constituting the laminate, a glass woven fabric made of glass filament (a) and a glass woven fabric made of glass filament (b) may be combined.
This requires several kinds of substrates, which is not preferable in terms of production efficiency.
【０００６】[0006]
【実施例】一般に、ガラス織布は、５〜１０μ径のガラ
スフィラメントを２００本程度撚り合わせて構成した糸
を所定の打ち込み本数で織ったものである。本発明に係
るガラス織布においても、ガラスフィラメント（ａ）と
（ｂ）を所定本数ずつ合計２００本程度撚り合わせて構
成した糸を所定の打ち込み本数で織る。例えば、Ｅガラ
スフィラメントとＴガラスフィラメントを撚り合わせた
糸を使用する。積層板は、上記ガラス織布に熱硬化性樹
脂を含浸して加熱加圧成形したものである。熱硬化性樹
脂の種類は特に限定するものではない。積層板は、表面
に銅、ニッケル、アルミニウムなどの金属箔を一体に貼
付けたものであってもよい。以下、本発明に係る実施例
を詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS In general, a glass woven fabric is formed by weaving a predetermined number of yarns formed by twisting about 200 glass filaments having a diameter of 5 to 10 μm. Also in the glass woven fabric according to the present invention, a yarn formed by twisting a predetermined number of glass filaments (a) and (b) into a total of about 200 in total is woven by a predetermined number of driving. For example, a yarn obtained by twisting an E glass filament and a T glass filament is used. The laminated board is obtained by impregnating the above-mentioned glass woven fabric with a thermosetting resin and molding by heating and pressing. The type of the thermosetting resin is not particularly limited. The laminate may be one in which a metal foil such as copper, nickel, or aluminum is integrally attached to the surface. Hereinafter, embodiments according to the present invention will be described in detail.
【０００７】主成分が表１に示すとおりである径９μの
ＥガラスフィラメントとNo.１〜４の各種ガラスフィラ
メントを用意した。これらガラスフィラメントを組み合
わせて撚り合わせた糸でガラス織布を織ることとした。[0007] E glass filaments having a diameter of 9 µm whose main components are as shown in Table 1 and various glass filaments of Nos. 1 to 4 were prepared. The glass woven fabric was woven with a yarn twisted by combining these glass filaments.
【０００８】[0008]
【表１】 [Table 1]
【０００９】実施例１〜５、比較例１〜３、従来例 表２に示す本数割合で、ＥガラスフィラメントとNo.１
〜４のガラスフィラメントとを合計２００本撚り合わせ
て糸を作り、この糸を縦４３本、横３２本の打込み本数
で厚さ０．１８mmの織布にした。これをヒートクリーニ
ング後アミノシランで処理した。エポキシ樹脂（エポキ
シ当量：５００、油化シエル製Ｅｐ−１００１）１００
重量部に、ジシアンジアミド３重量部、触媒として２−
エチル４メチルイミダゾール０．２重量部を溶かし、ワ
ニスを調製した。このワニスを上記各ガラス織布に含
浸、乾燥して樹脂量４０重量％のプリプレグを作製し
た。このプリプレグ８枚の両側に１８μ厚の銅箔を載置
し、温度１７０℃、圧力４０Kg／cm2で９０分間加熱加
圧成形して、銅張り積層板を得た。これら積層板の特性
を表３に示す。Examples 1 to 5, Comparative Examples 1 to 3, and Conventional Examples
A total of 200 glass filaments were twisted to produce a yarn, and the yarn was formed into a woven fabric having a length of 43 and a length of 32 and a thickness of 0.18 mm. This was treated with aminosilane after heat cleaning. Epoxy resin (epoxy equivalent: 500, Yuka Ciel Ep-1001) 100
3 parts by weight of dicyandiamide, 2 parts by weight as a catalyst
A varnish was prepared by dissolving 0.2 parts by weight of ethyl 4-methylimidazole. This varnish was impregnated into each of the glass woven fabrics and dried to prepare a prepreg having a resin amount of 40% by weight. A copper foil of 18 μm thickness was placed on both sides of the eight prepregs, and heated and pressed at a temperature of 170 ° C. and a pressure of 40 kg / cm 2 for 90 minutes to obtain a copper-clad laminate. Table 3 shows the properties of these laminates.
【００１０】[0010]
【表２】 [Table 2]
【００１１】表３において、ドリル摩耗率の測定は、ド
リル径１．０φのＵＣ−３５（ユニオンツ−ル製）を使
用して、３枚重ねた積層板に５０００ショット穴明けを
行ない、そのときのドリル摩耗率を測定した。熱膨張率
は、３０℃から８０℃におけるものである。半田接続不
良率の測定は、表面実装用セラミックコンデンサ（５７
５０タイプ）を半田接続した試料を−４０℃×３０分間
〜＋１２５℃×３０分間のサイクルで１０００サイクル
処理後に接続不良率を測定した。[0011] In Table 3, the drill wear rate was measured using a UC-35 (manufactured by Union Tool) with a drill diameter of 1.0φ, and 5,000 shots were drilled in three laminated plates. Was measured for drill wear rate. The coefficient of thermal expansion is from 30 ° C. to 80 ° C. The measurement of the solder connection failure rate is performed using a surface mount ceramic capacitor (57
50 types) were subjected to 1000 cycles of a cycle of −40 ° C. × 30 minutes to + 125 ° C. × 30 minutes, and the connection failure rate was measured.
【００１２】[0012]
【表３】 [Table 3]
【００１３】[0013]
【発明の効果】表３から明らかなように、本発明に係る
積層板は、樹脂を含浸させる基材に本発明に係るガラス
織布を用いて、良いドリル加工性を保持しながら、平面
方向の熱膨張率が小さい。この積層板をプリント配線板
に用いれば、表面実装した部品の半田接続信頼性も良好
である。As is clear from Table 3, the laminated board according to the present invention uses the glass woven fabric according to the present invention as a base material impregnated with a resin, and maintains a good drilling property while maintaining a good drilling property. Has a small coefficient of thermal expansion. If this laminate is used for a printed wiring board, the solder connection reliability of the surface-mounted components is also good.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｄ０６Ｍ 15/55 Ｄ０６Ｍ 15/55 Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｔ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location D06M 15/55 D06M 15/55 H05K 1/03 610 H05K 1/03 610T
Claims (2)
（ａ）とガラス成分のうちＳｉＯ2とＡｌ2Ｏ3の合計が
８５〜９０重量％であるガラスよりなるガラスフィラメ
ント（ｂ）とで構成され、前記（ａ）と（ｂ）の使用比
率が５：５〜２：８であることを特徴とする積層板用ガ
ラス織布。1. A glass filament (a) composed of E glass and a glass filament (b) composed of glass having a total of SiO 2 and Al 2 O 3 of 85 to 90% by weight in a glass component. A glass woven fabric for a laminate, wherein the use ratio of (a) and (b) is 5: 5 to 2: 8.
樹脂を含浸した積層板において、そのガラス織布が請求
項１に記載の積層板用ガラス織布であることを特徴とす
る積層板。2. A laminated sheet comprising a glass woven cloth as a base material and a thermosetting resin impregnated therein, wherein the glass woven cloth is the glass woven cloth for a laminated sheet according to claim 1. Laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4126533A JP2646935B2 (en) | 1992-05-20 | 1992-05-20 | Glass woven fabric for laminates and laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4126533A JP2646935B2 (en) | 1992-05-20 | 1992-05-20 | Glass woven fabric for laminates and laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05321076A JPH05321076A (en) | 1993-12-07 |
| JP2646935B2 true JP2646935B2 (en) | 1997-08-27 |
Family
ID=14937559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4126533A Expired - Fee Related JP2646935B2 (en) | 1992-05-20 | 1992-05-20 | Glass woven fabric for laminates and laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2646935B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3835550C1 (en) * | 1988-10-19 | 1990-02-22 | Bergwerksverband Gmbh, 4300 Essen, De |
-
1992
- 1992-05-20 JP JP4126533A patent/JP2646935B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05321076A (en) | 1993-12-07 |
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