JP2641020B2 - Suction clamping mechanism and temperature test device using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction holding mechanism suitable for a temperature test of a chip component such as an IC, and a temperature test apparatus using the same.

[0002]

2. Description of the Related Art A temperature test apparatus of this type moves a chip component sequentially supplied into a constant temperature chamber and applies a temperature load, for example, -55 to 150 ° C. to the chip component to perform a temperature test of the chip component. It is.

In a conventional temperature test apparatus, a chip component is moved into a constant temperature chamber by sucking the chip component or placing the chip component on a plate or block such as a turntable and transporting the chip component horizontally.

[0004]

However, the conventional temperature test apparatus has a problem that when suction is performed, chip components drop when the vacuum source is cut off.
When mounting chip components on a plate or a block, the plate or block needs to be changed according to the size of the chip component. Further, there is a problem that the chip components are blown off by the wind of a fan circulating in the constant temperature chamber.

Further, since a large number of chip parts are moved horizontally in a temperature-controlled room, there is a problem that a large installation area for the device is required and space efficiency is poor.

In view of the above, the present invention has been made in view of the above circumstances, and provides a suction holding mechanism capable of securely holding a chip component and having a small installation area, and a temperature test apparatus using the same. The purpose is to do.

[0007]

According to a first aspect of the present invention, there is provided a suction / holding mechanism which is provided at a tip end of a slide shaft supported reciprocally.
The chip component is sandwiched between a flat contact surface having a suction port for vacuum suctioning the chip component with the lead terminal protruding from the side surface and the flat component contact surface in conjunction with the reciprocating movement of the slide shaft. possess a chuck, the chuck is the chip
The fulcrum of rotation is located below the flat abutment surface when picking up parts.
It is characterized in that it is provided so that

Further, in the temperature test apparatus according to the second aspect of the invention, in the temperature test apparatus in which the chip parts having the lead terminals protruding from the side surfaces which are sequentially supplied are moved into a temperature-controlled room and a temperature load is applied to the chip parts, reciprocation A slide shaft movably supported, and a flat contact surface provided at the tip of the slide shaft and having a suction port for vacuum suctioning the chip component,
A plurality of suction and holding mechanisms including a chuck for holding the chip component between the flat contact surface in conjunction with the reciprocating operation of the slide shaft, and the plurality of suction and holding mechanisms can be rotated in a vertical plane possess a rotation mechanism for holding the said tea
When the chip part is picked up,
It is characterized in that it is provided below the surface .

[0009]

[0010]

[0011]

According to the suction holding mechanism of the first aspect, the chip component is held in conjunction with the reciprocating operation of the slide shaft.
The mechanism can be reduced in size and simplified. In addition, the chip component is sandwiched between the flat contact surface and the chuck is rotated.
Since the dynamic fulcrum is located below the flat contact surface,
It does not interfere with the chip component Te, adsorption of chip components that are out lead terminal from the side, be performed clamped easily be allowed <br/> ability.

According to the temperature test apparatus of the second aspect, the suction holding mechanism holds the chip part by vacuum suction and holds the chip part, so that the chip part can be held even when the vacuum source is cut off. Even if the parts are different in size, it is possible to perform suction and clamping without changing the setup.

[0013] The rotation mechanism is so rotatably holds a plurality of suction gripping mechanism in a vertical plane, it is possible to downsize the footprint.

Further, since the chip component is held in conjunction with the reciprocating operation of the slide shaft, the suction holding mechanism can be reduced in size and simplified. Furthermore, the chip component is pinched between the flat contact surface and the rotation of the chuck interferes with the chip component.
Does not, it is possible to perform suction of the chip parts are lead terminals from the side protruding, the pinching easily.

[0015]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is an external perspective view showing an embodiment of a temperature test apparatus according to the present invention, and FIG. 2 is a front view showing a schematic configuration thereof.

As shown in FIG. 1, the apparatus of this embodiment has a box-shaped constant temperature chamber 3 arranged on a supply line 2 for chip components 1, and in this constant temperature chamber 3, as shown in FIG. A plurality of suction and holding mechanisms 5 for holding the chip component 1, a rotation mechanism 6 for rotatably holding the plurality of suction and holding mechanisms 5 in a vertical plane, and a driving mechanism 7 to be described later for driving the suction and holding mechanism 5
And is arranged.

FIG. 3 is a side view showing the suction holding mechanism 5, the rotation mechanism 6 and the driving mechanism 7, and FIGS.
FIG. 4 is a side view showing details of FIG.
Indicates after operation.

The suction holding mechanism 5 includes a plate 50 fixed to a rotating plate 61 of a rotating mechanism 6 described later, and a vacuum shaft (a vertical shaft) which is inserted through a hole 50a provided in the plate 50 and is vertically movable. A sliding shaft) 51, a holding member 53 for holding the vacuum shaft 51,
A first spring 52 that urges the vacuum shaft 51 upward, a slide rail 54 that guides the movement of the vacuum shaft 51 together with the holding member 53, and a chip component 1 that is interposed or interlocked with the reciprocating operation of the vacuum shaft 51. A release link mechanism 55 is provided, and the whole is pre-assembled as a single unit, and is configured to be replaceable in units of this unit.

The link mechanism 55 includes a pair of links 550 rotatably connected to the plate 50, a pair of chucks 551 respectively rotatably connected to the distal ends of the pair of links 550, and a pair of chucks 551. A connecting link 552 that connects the rear ends of the chuck 551 to each other, and a second spring 553 that urges the connecting link 552 downward.
And a pair of stoppers 554 that prevent the chuck 551 from opening too much. This chuck 551 is interlocked with the reciprocating motion of the vacuum shaft 51, and
Is held between an abutting surface (flat abutting surface) 51a having a bellows (suction port) described later.
Further, the connecting link 552 is formed in an inverted U-shape.
In the suction operation shown in FIG.
a at a predetermined distance from both ends of a
Arranged so that the end is located below the flat contact surface 51a
And the ends of the chucks 551 and 551 are attached to both lower ends thereof.
The part is rotatably supported.

The tip end of the vacuum shaft 51 is provided with a flat contact surface 51a with which the chip component 1 comes into contact, so that the chip component 1 is securely clamped and heat is easily transmitted to the chip component 1. ing. In addition, at the center of the vacuum shaft 51, the intake hole 51 is formed along the axial direction.
B is formed so that the chip component 1 can be sucked through the suction hole 51b. Further, a bellows (suction port) 56 is provided on the tip end side of the air intake hole 51b to ensure that the chip component 1 can be suctioned.

In the suction holding mechanism 5 before the operation, as shown in FIG. 4, the spring force of the first spring 52 overcomes the spring force of the second spring 553, so that the first spring 52 extends and the first spring 52 extends. The second spring 553 is compressed and the pair of chucks 551 are in a closed state. Further, in the suction holding mechanism 5 after the operation, as shown in FIG. 5, the support member 71 of the drive mechanism 7 described later pushes down the vacuum shaft 51, the first spring 52 is compressed, and the second spring 553 is Extending, the pair of chucks 551 are in an open state.

The rotating mechanism 6 includes a fixed plate 60 fixed to the floor, a rotating plate 61 rotatably supported by a rotating shaft 63 on the fixed plate 60, and a stepping motor for rotating the rotating plate 61. First motor such as (see FIG. 6)
62. When the rotation plate 61 is rotated by the first motor 62, the rotation mechanism 6 rotates the plurality of suction holding mechanisms 5, the rotation plate 61, and the rotation shaft 63 together.

The drive mechanism 7 is a thermostatic chamber 3 in FIG.
As shown in FIG. 3, the fixing plate 60 is disposed at the lower center of the fixing plate 60.
A slide rail 70 fixed to the slide rail 70, a support member 71 supported by the slide rail 70 to be vertically movable,
A second motor (see FIG. 6) 72 such as a stepping motor for holding the chip component 1 by moving the support member 71 in the vertical direction, and converting the rotational driving force of the second motor 72 into a linear direction. And a rack and pinion mechanism (not shown) for transmitting the power to the slide rail 70.
Controls the suction holding mechanism 5 that has been moved to a position opposite to the drive mechanism 7. At the tip end of the support member 71, an intake hole 71a to which a pipe (not shown) is connected from the vacuum pump 9 is provided.
An elastic member 73 such as an O-ring or a bellows is provided on the tip side of the a so that the vacuum shaft 51
The upper end surface 51c of the above can be closely attached.

FIG. 6 is a block diagram showing the control system of this embodiment.

The apparatus comprises a constant temperature section 8 for maintaining the constant temperature chamber 3 at a constant temperature, a vacuum pump 9 for performing a suction operation, a pump drive section 10 for driving the vacuum pump 9, a first and a second motor. A motor drive unit 11 that drives 62 and 72;
And a control unit 12 for controlling each unit of the apparatus.
The suction holding mechanism 5, the driving mechanism 7, the vacuum pump 9, the pump driving unit 10, and the motor driving unit 11 constitute suction holding means 4 for vacuum suctioning the chip component 1 and holding the component 1.

Next, the operation of this embodiment will be described.

The constant temperature chamber 3 is kept at a constant temperature to be tested by the constant temperature section 8.

When the chip component 1 to be subjected to the temperature test is conveyed on the supply line 2 and reaches just below the constant temperature chamber 3, the motor drive unit 11 controls the second drive mechanism 7 under the control of the control unit 12. The motor 72 is driven to lower the support member 71 along the slide rail 70 via a rack and pinion mechanism (not shown).

When the support member 71 is lowered, the support member 71
The elastic member 73 provided on the distal end side of the suction holding mechanism 5
Abuts on the upper end surface 51c of the vacuum shaft 51, and the support member 71 further lowers the holding member 53. The first spring 52 is compressed, the second spring 553 of the link mechanism 55 is extended, the connecting link 552 is pushed downward, and the pair of chucks 551 are opened.

On the other hand, when the vacuum shaft 51 starts descending, the pump drive section 10 drives the vacuum pump 9 under the control of the control section 12 to start the intake operation.

When the vacuum shaft 51 further descends and the contact surface 51a comes into close contact with the upper surface of the chip component 1,
As shown in FIG. 7, the bellows 56 is compressed upward and adheres to the upper surface of the chip component 1, and the chip component 1 is adsorbed to the contact surface 51 a of the vacuum shaft 51.

Next, the motor drive section 11 is controlled by the control section 12 to reversely rotate the second motor 72 of the drive mechanism 7,
The support member 71 is raised along the slide rail 70 via a rack and pinion mechanism (not shown). At this time, FIG.
, The first spring 52 expands, the second spring 553 compresses, the connecting link 552 returns upward, and the pair of chucks 551 close to close the chip component 1.
Is clamped. At this time, a pair of chucks
Reference numeral 551 denotes a connection rib located below the contact surface 51a.
So that the lower end of the link 552 has a center of rotation.
The lead terminals are protruding on both sides.
Moves without interfering with the lead terminals of
Easy to pinch because the tip contacts the bottom of the chip component
To be able to do.

When the chip component 1 is clamped by the pair of chucks 551, the pump driving unit 10 stops the suction operation by the vacuum pump 9 under the control of the control unit 12.

Next, the motor driving unit 11 rotates the rotary plate 61 under the control of the control unit 12 so that the suction holding mechanism 5 adjacent to the suction holding mechanism 5 that clamps the chip component 1 faces the driving mechanism 7. The chip component 1 is moved to the position and the chip component 1 is sucked and pinched in the same manner as described above. In this way, the plurality of chip components 1 that are sequentially supplied are placed in a thermostatic chamber 3
The temperature load can be continuously applied to the plurality of chip parts 1 by sequentially moving the inside. Conversely, when the rotating plate 61 makes one rotation, to return the sandwiched chip component 1 onto the supply line 2, the vacuum shaft 51 is lowered while the chip component 1 is sucked by the suction operation, and the second spring 5
When the link 53 is extended and the link 552 is pushed down, the chuck 5 is extended.
After opening and releasing 51, the intake operation is stopped.

According to this embodiment, since the chip part 1 is vacuum-sucked and the part 1 is clamped, the chip part 1 can be held even when the vacuum source is cut off. Can be reliably held. Therefore, it is possible to carry the chips upside down, and a large number of chip components 1 can be sent three-dimensionally. Also,
Since the plurality of suction holding mechanisms 5 are rotatably held in a vertical plane, the installation area can be reduced. Further, since the suction holding mechanism 5 is configured to hold or release the chip component 1 in conjunction with the moving operation of the vacuum shaft 51,
The downsizing and simplification of the suction holding mechanism 5 can be achieved. Furthermore, unlike mounting on a plate or block such as a turntable, the chip components 1 of different sizes can be clamped, so that setup change can be eliminated.

The present invention is not limited to the above embodiment,
Various modifications can be made without departing from the scope of the invention.

[0038]

According to the present invention, as described in detail above, the following effects can be obtained.

According to the first aspect of the present invention, since the chip component is clamped in conjunction with the reciprocating operation of the slide shaft, the mechanism can be reduced in size and simplified, and the installation area of the device using the mechanism can be reduced. The size can be reduced. In addition, even if the chip components differ in size, suction and holding can be performed, and the setup change conventionally required can be eliminated. Further, the chip component is sandwiched between the flat contact surface and the rotation of the chuck does not interfere with the chip component.
Therefore , a chip component having a lead terminal protruding from the side surface can be easily sucked and held.

According to the second aspect of the present invention, since the chip component is vacuum-sucked and is sandwiched, the chip component can be held even when the vacuum source is cut off, and the chip component can be reliably held. Become like Further, even if the chip parts are different in size, they can be sucked and pinched, and the setup change which has been conventionally required can be eliminated.

Further, since rotatably holds a plurality of suction gripping mechanism in a vertical plane, it can be made compact footprint.

Since the suction holding mechanism is configured to hold the chip component in conjunction with the reciprocating operation of the slide shaft, the size of the suction holding mechanism can be reduced and simplified. further,
Chat while sandwiching the chip component with the flat abutment surface
Since click of rotation does not interfere with the chip component, the chip components are out lead terminal from the side, adsorption, the clamping can be easily row <br/> Ukoto.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing one embodiment of a temperature test apparatus of the present invention.

FIG. 2 is a front view showing a schematic configuration of this embodiment.

FIG. 3 is a side view showing a suction holding mechanism, a rotation mechanism, and a driving mechanism of the embodiment.

FIG. 4 is a detailed side view showing a state before the operation of the suction holding mechanism of the embodiment.

FIG. 5 is a detailed side view showing a state after the operation of the suction holding mechanism of the embodiment.

FIG. 6 is a block diagram showing a control system according to the embodiment.

FIG. 7 is a side view for explaining the operation of the present embodiment.

FIG. 8 is a side view for explaining the operation of the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip component 2 Supply line 3 Constant temperature chamber 4 Suction holding means 5 Suction holding mechanism 51 Vacuum shaft (slide shaft) 55 Link mechanism 551 Chuck 56 Bellows (suction port) 6 Rotating mechanism 61 Rotating plate 63 Rotating shaft

Claims (2)

(57) [Claims] A slide shaft supported reciprocally;
Provided at the tip of this slide shaft, lead terminals from the side
A flat contact surface provided with a suction port for vacuum-sucking the chip component from which the protrusion has come out, and a chuck for holding the chip component between the flat contact surface in conjunction with the reciprocating operation of the slide shaft. And the chuck rotates when the chip component is sucked.
A fulcrum is provided below the flat contact surface.
Characterized in that it is a suction holding mechanism. 2. The lead terminals come out from the side faces that are sequentially supplied.
In a temperature tester that applies a temperature load to the chip component by moving the chip component into a temperature-controlled room, a slide shaft supported so as to be capable of reciprocating and a tip end of this slide shaft are attached to the chip component by vacuum suction. A plurality of suction holding mechanisms having a flat contact surface having a suction port to perform, and a chuck for holding the chip component between the flat contact surface in conjunction with the reciprocating operation of the slide shaft; possess a rotation mechanism for rotatably holding the plurality of suction gripping mechanism in a vertical plane, said chuck Kaido支when the chip component pickup
The point is provided below the flat contact surface.
A suction holding mechanism characterized in that it is a thing.