JP2638589B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device having a mold and a lead frame suitable for improving production efficiency and product quality.

[0002]

2. Description of the Related Art A conventional apparatus has a structure in which a plurality of runners are connected to each pot, and a plurality of product cavities are arranged in series, as described in Japanese Patent Application Laid-Open No. 60-4226. Had become.

[0003]

In the above prior art,
Since the resin was supplied from one cavity to another using only the flow path formed in the mold, the resin was not supplied from the center (thickness direction) of the package, and the flow of the resin in the cavity was uniform. Was not. In particular, if the flow of the resin in the cavity is not uniform in the thinned package, voids are likely to be generated, and it is difficult to ensure the quality of the product.

[0004]

[0005]

An object of the present invention is to solve the above technical problems and to provide a method of manufacturing a semiconductor device which can achieve both improvement of production efficiency and product quality.

[0007]

[0008]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a method of manufacturing a semiconductor device, comprising the steps of: placing a pot for supplying a resin and a plurality of cavities for receiving the resin; A lead frame having a slit formed therein is provided, and resin is supplied from the cavity to another cavity through the slit. Alternatively, a mold for disposing a resin supply pot, a plurality of cavities receiving the supply of the resin, and a gate serving as a resin flow path from the cavity to another cavity is disposed between the cavities. A lead frame having a slit is provided, and resin is supplied from the cavity to another cavity through a flow path formed by the slit and the gate. Preferably, a bridge is provided in the slit.

[0009]

[0010]

[0011]

According to the present invention, since the resin can be supplied from the center of the package, the flow of the resin in the cavity is substantially smaller than the conventional resin supply using only the flow path formed in the mold. It becomes uniform and product quality can be improved. Further, if a bridge is provided in the slit, the deformation due to the flow pressure of the resin can be reduced, so that the product quality can be further improved. On the other hand, even if a plurality of pots for supplying the resin to the cavities are provided and the pots are communicated with each other, the decrease in the resin material yield due to the provision of the pot communication path is counteracted by increasing the number of cavities in series. Significant improvement in resin material yield can be achieved. Further, even if the weight of the resin charged in each pot varies greatly, the molding pressure applied to each pot can be equalized by transferring the resin through the pot communication path. Furthermore, if the semiconductor elements on which the lead frame is to be molded are arranged in two directions in the vertical and horizontal directions, the manufacturing cost per component can be significantly reduced as compared with a conventional lead frame in which the semiconductor elements are arranged in only one direction. In addition, since the pitch between semiconductor elements can be minimized, the flow path of the resin can be shortened, stable molding by reducing the resin flow resistance during molding, and the number of semiconductor elements per unit area of the mold can be increased, thereby further increasing production efficiency. There is an advantage that it can be improved.
On the other hand, since the cylinder rod of the molding machine can be directly connected to each plunger, strict plunger operation control can be performed from the molding machine side, and a significant improvement in product quality can be achieved.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows the configuration of an apparatus according to an embodiment of the present invention. FIG. 1 (a) is a bottom plan view of a mold, wherein 1 is a lower mold of the mold, and 2 is a plurality of pots (FIG. 1) for pressing and supplying resin relating to the mold resin.
(Three in the range of (a)), 3 are runners provided in each of the pots 2. A first gate 4 is provided at the tip of the runner 3, and a first cavity 5 is arranged so as to be connected to the first gate 4. A second gate 6 is provided after the first cavity 5, that is, on the downstream side during resin supply, and a second cavity 7 is connected to the second gate 6. Further, a third cavity is disposed downstream of the second cavity 7 via a third gate 8. The pots 2 are connected to each other by a pot connection flow path 10.

FIG. 1B shows a state in which the lead frame 11 is inserted between the upper mold 12 and the lower mold 1, taken along the line AA in FIG.
It shows a cross section. The lead frame 11 is provided with a chapter 13 at a position corresponding to each of the first cavity 5, the second cavity 7, and the third cavity 9, and is provided with a gold wire.
The chip 13 and the lead frame 11 are connected by 14 to constitute an electric component to be molded.

FIG. 1C shows a state in which the upper mold 12 and the lower mold 1 are closed, and a plunger 17 is attached to a rod 15 of a molding machine (not shown) via a rigid connecting plate 16. BB section of FIG.

1 (a) to 1 (c), a resin (not shown) is put into each pot 2 and the rod 15 of the molding machine is lowered. Fifteen
, And descends in the pot 2. And each plunger
17 transfers the resin to the pot connection flow path 10 and each runner 3;
Further, the resin is provided at each gate provided at the end of each runner 3,
Fill the cavity.

FIG. 2 is a plan view of a lead frame used in the mold shown in FIG. 1, and FIG. 3 is a plan view of a lower mold after the resin is filled using the lead frame.

In FIG. 2, a chip (not shown) is a tab.
Die-bonding is performed on the top of the semiconductor chip 18 and wire-bonded to the tip of the internal lead 19 with a gold wire (not shown) to form a semiconductor component. As described above, semiconductor components are arranged in two vertical and horizontal directions on one lead frame.

FIG. 3 shows a state in which the lead frame 11 shown in FIG. 2 is inserted between the lower mold 1 and the upper mold 12 shown in FIG.
FIG. 4 is a plan view of the lower mold 1 in a state where the zero pressure supply is completed. After a lapse of a predetermined time, the resin 20 is cured, and a molded product 21 is obtained. Then, through a predetermined process, a resin mold semiconductor component is obtained. In the present embodiment, the resin in the cavity continuously flows in the orthogonal direction with respect to the pattern of the external leads 22 serving as the external terminals of the resin-molded semiconductor component.

In the embodiment shown in FIGS. 1 to 3, the case where the plunger 17 is provided above the pot 2 is shown.
Is provided below the pot 2, resin molded semiconductor parts having the same quality and the same productivity can be obtained.

FIG. 4 is a plan view of a lower mold of a mold according to a second embodiment of the present invention, FIG. 5 is a plan view of a lead frame used in the mold of FIG. 4, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

The difference between FIG. 4 and FIG. 1A is that the second gate,
The third gate is not processed, and the second cavity 7,
That is, the third cavities 9 are independently arranged.

On the other hand, as shown in FIG. 5, the lead frame 11 used in the mold shown in FIG. 4 has the downstream second cavity 7 and the third cavity 9 at positions corresponding to the second and third gates. A slit 23 for transferring the resin downstream is formed.

FIG. 6 shows a state in which the lead frame 11 shown in FIG. 5 is inserted between the lower die 1 shown in FIG.
FIG. 3 is a plan view of the lower mold 1 in a state where the resin has been pressed and supplied. After correcting the weight variation in the pot connection flow path 10, the resin 20 fills the first cavity 5 from the pot 2 through the runner 3, the first gate 4, and is supplied into the third cavity 9 through the slit 23, A molded product 21 is obtained. afterwards,
The resin molding semiconductor component is completed through a predetermined process.

In this embodiment, there is an effect that the gate processing cost of the mold can be reduced as compared with the first embodiment.

FIG. 7 is a plan view of a lower mold of a mold according to a third embodiment of the present invention, FIG. 8 is a plan view of a lead frame used for the mold, and FIG. FIG. 4 is a plan view of a lower mold after filling with.

The difference between FIG. 7 and FIG. 1 (a) is that the branching not from the pot 2 of the runner 3 but from the
That is, it is connected to the gate 4 linearly. This has the effect of facilitating die processing and reducing processing costs.

On the other hand, the difference between the lead frame shown in FIGS. 8 and 5 is that a bridge 24 is provided in the slit 23. This prevents the slit 23 from being widened by the flow pressure of the resin being molded, and preventing the lead frame 11 from being deformed. As shown in FIG. 7, a gate is provided between the cavities of the mold, and the resin can flow to the downstream side even with the bridge 24.

FIG. 9 shows a state where the lead frame 11 shown in FIG. 8 is inserted between the lower mold 1 shown in FIG.
FIG. 3 is a plan view of the lower mold 1 in a state where the resin has been pressed and supplied. The resin 20 corrects the weight variation in the pot connection flow path 10, fills the first cavity 5 from the pot connection flow path 10 through the runner 3, the first gate 4,
And a second gate 6 (not shown) under the
The mixture is supplied to the third cavity 9 through the cavity 7, the slit 23 and the third gate 8 (not shown) below the slit 23, and the molded product 21 is obtained. In this method, both the slit 23 and each gate can be used as a flow path, and the flow resistance of the resin can be reduced. Moreover, the bridge 24 can prevent the lead frame 21 from being deformed from the slit 23 portion.

Further, from the relationship between the cavity spacing, the pot spacing, and the pot diameter, the runner and the pot can be arranged in direct contact as shown in FIG.

It is needless to say that lead frames as shown in FIGS. 2, 5 and 8 and FIG. 18 to be described later can also be used for the dies shown in FIGS.

FIG. 11 is a plan view of a lower mold of a mold according to a fourth embodiment of the present invention, and FIG. 12 is a plan view of a lower mold after resin is filled using the lead frame shown in FIG. FIG.

The difference between FIG. 11 and FIGS. 7 and 10 is that an air vent (hatched portion in the drawing) 25 which contacts the pot communication 10, the second gate 6 and the third gate 8 and communicates with the outside of the mold is provided. It is. The air vent 25 has a depth in a range of about 10 μm to 40 μm. On the other hand, the depth of the connection path 10 and the runner 3 is about several mm. The air vent 25 has an effect that air mixed in the resin when the resin collides near the center of the pot communication path 10 and air contained in the resin when passing through the gate are discharged to the outside of the mold. .

By the way, in the lower mold of FIG. 1A or FIG. 4, an air vent connected to a communication passage or a gate can be provided.

FIG. 12 shows the lead frame shown in FIG.
FIG. 12 is a plan view of the lower mold 1 inserted between the lower mold 1 and the upper mold (not shown) shown in FIG. 11 and in which resin filling is completed. According to this method, voids remaining in the molded product 21 can be significantly reduced, and quality can be improved.

If the second gate 6 and the third gate 8 are arranged at positions as shown in FIG. 10 in the mold structure of FIG. 11, the lead frame shown in FIGS. 2, 5, 8, and 11 can be obtained. Needless to say, can be used.

FIG. 14 is a plan view of the lower mold, and FIG. 14 is a plan view of the lower mold after filling the resin using the lead frame shown in FIG.

The difference between FIG. 13 and FIG. 11 is that a dummy cavity 25 that is connected to the third cavity 9 and does not become a semiconductor component is provided together with the air vent 25 described above. The air entrapped in the mold cavity flows out into the dummy cavity 26, thereby further reducing the voids in the molded product and improving the quality.

Incidentally, it is possible to provide a dummy cavity in the lower mold having the shape shown in FIG. 1 (a) or FIG.

It is needless to say that the lead frame shown in FIGS. 2, 5, 8 and 11 can be used if the mold shown in FIG. 13 is also arranged at the gate position as shown in FIG.

FIG. 15 is a plan view of a lower mold of a mold according to a sixth embodiment of the present invention, and FIG. 16 is a plan view of a lower mold after resin is filled using the lead frame shown in FIG. FIG.

The difference between FIG. 15 and FIG. 11 is that the resin discharged from the pot 2 passes through the pot outflow gate 27 having a smaller cross-sectional area than the pot communication path 10 and is guided to the pot communication path 10 and the runner 3. . Thereby, the void inside the resin can be compressed once, and the size of the void flowing into the cavity can be reduced. Further, as described above, the air contained in the resin is discharged to the outside of the mold through the air vent 25. This can reduce the voids in the molded product.

It is needless to say that the lead frame shown in FIGS. 2, 3, 8, and 11 can be used if the mold shown in FIG. 15 is also arranged at the gate position as shown in FIG.

FIG. 17 is a plan view of a lower mold of a mold according to a seventh embodiment of the present invention, FIG. 18 is a plan view of a lead frame used in the mold of FIG. 17, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

The difference between FIG. 17 and FIG.
25, and further provided with a dummy cavity 26 connected to the third cavity 9 so that air contained in the resin flowing in the cavity is finally trapped here. As a result, voids in the molded product can be reduced.

The difference between FIGS. 13 and 14 and FIGS.
In the embodiments of FIGS. 17 and 19, the dummy cavity 26 is provided in the lower mold 1 at a position not protruding from the lead frame 11, and the lead frame 11 is located at a position corresponding to the dummy cavity 26.
A resin outflow slit 28 is also provided inside, and pots 2, runners 3,
There is also an effect that the first gate 4, the second gate 6, the third gate 8, and the dummy cavity 26 can be punched out at the same time and easily, and can be easily removed. I have

FIG. 20 is a plan view of a lower mold of a mold according to an eighth embodiment of the present invention, FIG. 21 is a plan view of a lead frame used in the mold of FIG. 20, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

FIG. 20 is the same as FIG. 7 in the manner of branching the pot communication path 10 and the runner 3, but the cavities are arranged obliquely and the resin flows from the top of the cavity in the plan view to the top of the adjacent cavity. It is different to let.
Also, there are two types of specifications in which the lengths of adjacent runners are different.

The lead frame shown in FIG.
2, 5, 8, 18
The shape is different from the type in which the external lead 22 shown in FIG. Further, the external lead 22 of FIGS. 2, 5, 8, and 18 is arranged in parallel with one of the outer frames of the lead frame, while in FIG. 21, the outer frame of the lead frame and the external lead 22 are at a predetermined angle. Has formed.

FIG. 22 shows the lead frame 11 shown in FIG.
Inserted between the lower mold 1 shown in 20 and the upper mold not shown,
FIG. 3 is a plan view of the lower mold 1 in a state where resin supply has been completed.
According to this method, a semiconductor component having the external leads 22 in four directions can be formed with high production efficiency.

In this embodiment, only an example of a combination of one mold structure and one lead frame structure is shown.
It goes without saying that various combinations similar to those described above up to the embodiment can be made.

In the above-described embodiment, an example in which three cavities are arranged in series with one runner and three molded products are taken out has been described. However, the present invention is not limited to this. Needless to say, regarding the number of molded products, the size of the molded product may be appropriately set in consideration of the ease of resin flow.

FIG. 23 is an overall configuration of an apparatus according to a ninth embodiment of the present invention, FIG. 24 is a molding profile of this apparatus, and FIG.
Is a diagram showing the effect.

FIG. 23 shows the structure of the entire resin mold semiconductor manufacturing apparatus according to the present invention in FIG. 1 (c) in a state where the upper mold 12 and the lower mold 1 are closed and the mold is mounted on the molding machine 29. It is. Each plunger 17 is fixed to the rigid connection plate 16,
Further, a rod 15 of the molding machine is connected to the rigid connecting plate 16 in a direction opposite to that of the plunger 17. In addition, the resin 20 put into each pot 2 is connected to each other through the pot connection flow path 10. Next, an outline of a driving device configuration of the rod 15 will be described. In this apparatus, when a rod lowering switch (not shown) is turned on, the plunger 17 connected to the rod 15 via the rigid connecting plate 16 is lowered to inject the resin 20 in the pot 2 into the mold. And a pulse generator 31 according to a odometer capable of detecting the traveling distance of the servo motor 30 and the servo motor 30 related to the electric motor. , A primary current imax and a secondary current imax as motor maximum currents to be given to the servomotor in advance.
2 (where imax1> imax2) and a predetermined traveling distance are set, and when the plunger lowering switch is turned on, the servo motor 30 is set to speed control and the motor maximum current is set to the primary current. Set,
When the traveling distance has reached the set traveling distance, the motor maximum current is switched to the secondary current and set, and when the motor current reaches this secondary current, the servo motor 30 can be in torque control. An electric circuit having a drive control unit 32, the speed of the servo motor 30 is reduced, and this is converted into a linear motion and transmitted to the rod 15, and a deceleration / linear motion conversion mechanism capable of lowering the rod 15 is provided. This is a molding device provided with such a ball screw jack 33 connected to the servomotor 30.

The details will be described below. Reference numeral 30 denotes a servomotor connected to the tachogenerator 34 and the pulse generator 31. 35 takes the number of rotation signals from the tachogenerator 34 and controls the servomotor 30 in a region where speed control is performed.
A motor driver that can perform closed lube control so that the number of revolutions of the microcomputer becomes the number of revolutions set in the microcomputer unit 36 (details will be described later). The pulse generator 36 receives a displacement signal from the pulse generator 31 and controls the operation of the plunger 17.
The console is capable of setting the maximum motor current, the rotation speed of the servo motor 30, and the plunger displacement.

The operation of the molding apparatus configured as described above will now be described with reference to FIG.
This will be described with reference to FIGS. In this example, a resin having poor fluidity (a high-viscosity resin mixed with a large amount of filler) is used.

The console unit 37 allows the microcomputer unit 36
The first current imax1, the second current imax2, the first plunger displacement d1 (a predetermined position where the lower end of the plunger 17 is slightly above the upper end of the resin tablet (not shown) in the pot 2), the second plunger displacement d2 (plunger
A predetermined position where the lower end of 17 is below the first plunger displacement d1, that is, a position where the plunger 17 is not yet filled with the resin), a first rotational speed N1, and a second rotational speed N2.
(However, N1> N2) is set.

Here, when a resin tablet (not shown) is put into the pot 2 and a plunger lowering switch (not shown) of the apparatus is turned on, the microcomputer unit 36 sends a speed control command and a motor driver 35 to the motor driver 35. 1 rotation speed N1
Is output, the motor maximum current is set to the primary current imax1, and the servo motor 30 rotates at the first rotation speed N1. This rotation is transmitted to the ball screw jack 33, where it is decelerated and converted into a downward movement of the rod 15 and each plunger 17.

The number of revolutions of the servo motor 30 is counted by a tach generator 34, and a rotation signal from the tach generation 34 is taken into a motor driver 35, and the rotation of the servo motor 30 is always kept at the first rotation speed N1. Closed rope control is performed so that A signal from the pulse generator 31 enters the microcomputer unit 36 and is compared with the first plunger displacement d1. Blanja 17
When the plunger displacement detected by the pulse generator 31 becomes the first plunger displacement d1 at a high speed corresponding to the first rotational speed N1 (point a in FIG. 24). In response to a command from the microcomputer unit 36, the rotation speed of the servo motor 30 drops from the first rotation speed N1 to the second rotation speed N2, and the plunger 17 descends at a low speed.

The resin 20 heated and melted by the heaters (not shown) of the lower mold 1 and the upper mold 12 fills the pot connecting flow path 10 by lowering the plunger 17, and also as shown in FIGS. 1 (a) and 1 (b). ), And are sequentially transported downstream through the first gate 4. Then, when the resin has come to just before the filling of the third cavity 9 at the most downstream position is completed, that is, when the displacement of the plunger 17 becomes the second plunger displacement d2 (t1 in FIG. 24), the microcomputer unit 36 issues a command. And the motor maximum current is switched from the primary current imax1 to imax2. The servo motor 30 maintains the second rotation speed N2 as it is. When the resin 20 has been filled into all the cavities and the plunger 17 has stopped (t in FIG. 24).
2), the motor current i holds the value of the set value imax2 on the secondary side, and the process shifts to torque control; the resin pressure P corresponding to imax2 is applied to the resin 20 for a predetermined time;
The molding device is turned off.

Since such control is performed, the plunger 17 descends at the set speed until just before the filling with the resin having poor moldability is completed. In addition, since the load is reduced immediately before the completion of filling, there is no problem of generation of burrs and insert deformation due to application of high pressure in the cavity.

FIG. 25 shows an example of a void generation rate and an unfilling defect generation rate of a resin-encapsulated product molded by the apparatus according to the present invention using a conventional hydraulic open-loop molding machine for a mold shown in FIG. FIG. 4 is a defect generation diagram shown in comparison with a molded product. In FIG. 25, A indicates a defect of a resin-encapsulated product molded with a conventional hydraulic open loop type circuit,
Shows defects of the resin-encapsulated product molded by the apparatus according to the present invention, and it can be seen that the defects of the present invention are significantly reduced.

In this embodiment, an example of closed loop control of electric drive is shown, but closed loop control of hydraulic drive may be used.

[0064]

As described above, according to the present invention, the productivity can be improved by supplying the resin from the cavity to the cavity, and the product quality can be improved by supplying the resin to the cavity through the central portion of the package. And a method of manufacturing a semiconductor device that achieves both.

[Brief description of the drawings]

FIGS. 1A and 1B show a first embodiment of the present invention, wherein FIG. 1A is a plan view of a lower mold, FIG. 1B is a sectional view taken along the line AA of FIG. ) Is a BB cross-sectional view.

FIG. 2 is a front view of a lead frame used in the mold of FIG. 1;

FIG. 3 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the first embodiment.

FIG. 4 is a plan view of a lower die of the second embodiment.

FIG. 5 is a front view of a lead frame used in the mold shown in FIG. 4;

FIG. 6 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the embodiment of FIG. 2;

FIG. 7 is a bottom plan view of the third embodiment.

FIG. 8 is a front view of a lead frame used in the mold shown in FIG. 7;

FIG. 9 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the third embodiment.

FIG. 10 is a plan view of a lower die of the third embodiment.

FIG. 11 is a bottom plan view of a fourth embodiment.

FIG. 12 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the fourth embodiment.

FIG. 13 is a bottom plan view of a fifth embodiment.

FIG. 14 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the fifth embodiment.

FIG. 15 is a bottom plan view of a sixth embodiment.

FIG. 16 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the sixth embodiment.

FIG. 17 is a plan view of a lower die of the seventh embodiment.

FIG. 18 is a front view of a lead frame used in the mold of FIG. 17;

FIG. 19 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the seventh embodiment.

FIG. 20 is a plan view of a lower die of the eighth embodiment.

FIG. 21 is a front view of a lead frame used in the mold of FIG. 20;

FIG. 22 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the eighth embodiment.

FIG. 23 is an overall configuration diagram of a semiconductor resin sealing device according to a ninth embodiment.

FIG. 24 is a molding profile diagram formed by a semiconductor resin sealing device according to a ninth embodiment.

FIG. 25 is a defect generation diagram shown in comparison with that of a conventional molding method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Lower mold 2 ... Pot 3 ... Runner 4 ... 1st gate 5 ... 1st cavity 6 ... 2nd gate 7 ... 2nd cavity 8 ... 3rd gate 9 ... 3rd cavity 10 ... Pot connection flow path 11 ... Lead frame DESCRIPTION OF SYMBOLS 12 ... Upper die 15 ... Cylinder rod 16 ... Rigid connection plate 17 ... Plunger 23 ... Slit 24 ... Bridge 25 ... Air vent 26 ... Dummy cavity 27 ... Pot outflow gate 28 ... Resin outflow slit 30 ... Servo motor 31 ... Pulse generator 32 ... Drive Control unit 34: Tacho generator

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Isamu Yoshida 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi, Ltd. Production Technology Research Laboratory (72) Inventor Kunihiko Nishi, 1450, Josuihoncho, Kodaira-shi, Tokyo (56) References JP-A-58-207660 (JP, A) JP-A-56-94635 (JP, A) JP-A-61-13952 (JP, U)

Claims (3)

(57) [Claims] 1. A metal mold having at least a pot for supplying a resin and a plurality of cavities for receiving the resin.
Forming a slit in the mold between the cavities;
Mounting a lead frame and supplying a resin from the cavity to another cavity through the slit . 2. A pot for supplying a resin, and a supply of the resin.
Receiving multiple cavities and other
With a gate that serves as a resin flow path to the cavity
The mold has a slit disposed between the cavities
A lead frame is installed, and a lead frame is formed through a flow path formed by the slit and the gate.
To supply resin from the cavity to other cavities.
A method of manufacturing a semiconductor device. 3. The method according to claim 1, wherein a bridge is provided in the slit.
3. A method of manufacturing a semiconductor device according to claim 1, wherein
Law.