JP2619594B2 - Module for mounting board and module mounting board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module for a mounting board, and more particularly, to a module on which relatively heavy and relatively large electric and electronic components such as a coil and an electric field capacitor are mounted. It is.

[0002]

2. Description of the Related Art Conventionally, mounting boards having a large number of electric and electronic components mounted on a predetermined motherboard have been frequently used.
Various kinds of electric and electronic parts have been used. Among such electric and electronic parts, as shown in FIG.
In particular, a component, such as a coil forming a booster circuit or an electric field capacitor, which is relatively heavy compared to other components or a component having a large volume, is placed on a predetermined module board 2.
In many cases, components configured in a module 1 that is mounted on a module and exerts a specific function are used.

When the module 1 is mounted and fixed on a motherboard 8 which is a predetermined circuit board, as shown in FIG. 7, the lead terminals 9 provided on the module 1 are connected to the motherboard 8. 8 and fixed by performing a soldering process 11 as shown in FIG. However, in such a soldering process, due to the influence of heat in the soldering process, the lead terminal portion 9 is formed according to the thermal expansion coefficient of the metal material constituting the lead terminal portion 9, for example, copper. ,
Thermal deformation occurs, and stress is generated in the lead terminal portion 9 and the module substrate 2 based on the thermal deformation.

[0004] Naturally, both the substrates 2 and 8 generate stress due to the deformation due to the heat. Therefore, as shown in FIG. 8, when the soldering process is performed in a state where the module substrate 2 and the motherboard 8 are in direct contact with each other, the holes a, Stress is generated in each of the portions b and c and the holes a ′, b ′ and c ′ of the module substrate 2, and there is a risk that the fixed portion by the solder is peeled off.

[0005] Further, even when the soldering process is performed with an interval between the motherboard 8 and the module substrate 2, if the interval is different between a plurality of modules 1, This causes a problem that the solder is peeled off in some of the modules 1 due to the variation in stress. Therefore, as shown in FIG. 9, the distance between the motherboard 8 and the module substrate 2 is
In this case, it is necessary to perform the soldering process after the positioning is performed so that the same interval H is formed.

[0006] Therefore, the work becomes complicated and the efficiency of the manufacturing process is remarkably reduced. On the other hand, as described above, when the heavy or large component 3 is mounted on the module substrate 2, simply mounting the coil, the capacitor, and the like causes shaking, vibration, and the like during use. In this case, there is a risk that the heavy parts such as the coil and the capacitor may shift or fall off. Therefore, as shown in FIG. 6, fixed to a holder 7 formed in an appropriate shape, and the holder 7 and the module substrate 2 are fitted using an appropriate connection mechanism;
The module 1 bonded and fixed is used.

The module 1 itself is heavy, and even without it, the volume tends to be large. Therefore, when the module 1 is mounted on the motherboard 8, the weight or the volume is large. Therefore, the predetermined interval H required between the motherboard 8 and the module substrate 2 is set accurately and uniformly and accurately between the plurality of modules 1. At present, the positioning operation cannot be performed, and therefore, the interval H is mounted with considerable variation.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks of the prior art and to provide a module board 2 of the module 1 and a mother board 8 which is a circuit board to be mounted under any conditions. The mounting process can be performed by accurately and uniformly setting the interval H between the soldering portions, and thereby, the solder fixing portion is peeled or broken due to thermal stress in the soldering process on the mounting board. It is intended to provide a structure of the module 1 without any problem.

[0009]

The present invention employs the following technical configuration to achieve the above object. That is, the module substrate, the plurality of lead terminal portions connected to the module substrate, the heavy or large electric and electronic components mounted on the module substrate, and the heavy or large electric and electronic components are supported. And a plurality of support legs that are extended in the same direction as the direction in which the lead terminals contact the motherboard. This is a mounting board module.

[0010]

Since the mounting board module according to the present invention has the above-described technical configuration, the front end of the lead terminal section 9 provided on the module 1 is supported by the supporting legs 12 of the holder section. , The length inserted into the opening 10 of the motherboard 8 can be defined.
Can be set accurately, and at the same time, when the solder 11 is applied to the lead terminal 9 of the module 1 and the opening 10 of the motherboard 8 during the soldering process, However, in addition to expanding the motherboard 8, the heat causes the lead terminal portions 9 to expand. However, the heat is further transmitted to the holder portion 7 through the lead terminal portions 9, so that the holder In particular, the support legs 12 expand and extend.

The thermal expansion coefficient of the holder 7 is
Since the thermal expansion coefficient is larger than the thermal expansion coefficient of the lead terminal portion 9, the support leg portion 12 is extended to lift the module substrate 2 of the module 1, and accordingly, the lead terminal portion 9 is also lifted upward as a whole. Will be. At this time, since the solder is still in a molten state, the lead terminal portion 9 slides through the opening 10 of the motherboard 8 and is displaced upward.

Thereafter, when the supply of heat in the soldering process is stopped and the solder is cooled, the lead terminal portion 9 and the holder portion 7 begin to contract, but the support leg portion of the holder portion 7 starts to contract. Since the contraction of the lead terminal portion 9 is larger than the contraction of the lead terminal portion 9, the tip of the support leg portion 12 of the holder portion 7 separates from the mounting surface of the motherboard 8, It will be fixed in that state.

By executing such a series of steps in the soldering process, it is possible to reduce the generation of stress due to thermal deformation applied to the motherboard 8 and the module substrate 2 of the module. Partial destruction and peeling can be prevented.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of a module for a mounting board according to the present invention will be described below in detail with reference to the drawings. FIG.
1 shows a configuration of a specific example of the mounting board module 1 according to the present invention. The module board 2, a plurality of lead terminal portions 9 connected to the module board 2, and mounted on the module board 2. And an electric / electronic component 3 having a large weight or volume, and a holder 7 for supporting the electric / electronic component 3 having a large weight or volume. Terminal 9
1 shows a mounting board module 1 provided with a plurality of support legs 12 extending in the same direction as the direction in which the mother board 8 contacts the motherboard 8.

A characteristic feature of the mounting board module according to the present invention is that the holder portion 7 has a larger thermal expansion coefficient than the thermal expansion coefficient of the material forming the lead terminal portion 9. It is composed of materials. Further, another feature of the present invention is that the support leg 1 provided on the holder 7 as shown in FIG.
2 is larger than the tip R of the lead terminal 9.
That is, it is configured to be disposed at a position retracted to the module substrate side 2.

Since the module 1 according to the present invention has the above-described configuration, when the module 1 for a mounting board is first mounted on a predetermined motherboard 8, an opening provided in the motherboard 8 is provided. 10, the leading end portion R of the lead terminal portion 9 of the mounting board module 1 is inserted. As shown in FIG.
Is in contact with the mounting surface of the motherboard 8, so that the length of the leading end of the lead terminal portion 9 provided in the module 1 to be inserted into the opening 10 of the motherboard 8 is defined. The interval H 'shown in FIG. 3 can be accurately set to a preset value, and at the same time, during the soldering process, the lead terminal portion 9 of the module 1 and the motherboard 8 Solder 1 in opening 10
When 1 is applied, the heat expands the motherboard 8 and the lead terminal 9 expands due to the heat.
Further, the heat is transmitted to the holder portion 7 through the lead terminal portion 9, so that the support leg portion 12 of the holder portion expands and extends.

The thermal expansion coefficient of the holder 7 is
Since the thermal expansion coefficient is larger than the thermal expansion coefficient of the lead terminal portion 9, the support leg portion 12 is extended to lift the module substrate 2 of the module 1, and accordingly, the lead terminal portion 9 is also lifted upward as a whole. Will be. At this time, since the solder is still in a molten state, the lead terminal portion 9 slides through the opening 10 of the motherboard 8 and is displaced upward.

Thereafter, when the supply of heat in the soldering process is stopped and the solder is cooled, the lead terminal portion 9 and the holder portion 7 begin to contract, but the support leg portion of the holder portion 7 starts to contract. Since the contraction of the lead terminal portion 9 is larger than the contraction of the lead terminal portion 9, the length of the support leg portion 12 of the holder portion 7 becomes h, as shown in FIG. P is separated from the mounting surface of the motherboard 8 by a predetermined distance, and is fixed in that state.

Further, in the mounting board module 1 according to the present invention, it is preferable that the tip P of the supporting leg 12 provided on the holder 7 is sharpened. This is because the mounting board module 1 may be mounted on a motherboard 8 which is a predetermined circuit board, and then the surface of the motherboard 8 may be coated with an appropriate resin. Depending on the temperature of the coating resin, there is a possibility that the resin constituting the holder portion 7 may further expand and expand, so that the influence of heat at that time is reduced as much as possible, and In order to reduce the stress between the support leg 12 and the support leg 12, it is preferable to make the tip P of the support leg 12 as sharp as possible.

As described above, in the present invention, the distal end portion P of the support leg provided on the holder portion 7 is configured to be shorter than the distal end portion R of the lead terminal portion 9. Although the difference is not particularly limited, the distance between the distal end portion P of the support leg portion 12 provided on the holder portion 7 and the module substrate 2 corresponds to the module 1. A predetermined, predetermined structure to be formed between a mounting surface of the motherboard 8 and a surface 13 of the module substrate 2 facing the motherboard 8 when mounted on a predetermined motherboard 8 and subjected to a soldering process. It must be set to be equal to the gauge H. The tip R of the lead terminal portion 9 is at least the gauge H
It is preferable that the length is set to be longer than the length of the mother board 8 and protrude to the rear surface thereof through the opening of the mother board 8 so that sufficient solder can be attached at the time of the soldering process. .

The holder 7 and the lead terminal 9 of the module 1 for a mounting board according to the present invention are sufficiently firmly joined to each other via the module substrate 2. It is desirable that a distal end portion S opposite to the distal end portion R on the side that comes into contact with 8 is fitted into a part of the holder portion 7, and more preferably, the distal end portion S of the lead terminal portion 9. Means that it comes into contact with the holder portion 7 so as to be slidable under a specific stress.

The resin constituting the holder 7 in the present invention is not particularly limited, but its function is to form the lead terminal 9 as described above, for example, copper. It is desirable to use a resin made of a synthetic resin material having a larger coefficient of thermal expansion than that of a conductive metal material and having good moldability. For example, it is desirable to use a resin having a coefficient of thermal expansion that is about 10 times larger than the coefficient of thermal expansion of the conductive metal material, which constitutes the lead terminal portion 9, whereby the holder portion 7 is formed. In particular, the portion of the support leg portion 12 expands and expands faster and more rapidly than the expansion of the lead terminal portion 9, and when the solder is cooled, the portion of the support leg portion 12 contracts faster and more greatly than the contraction of the lead terminal portion 9. It is like doing.

As one example of a suitable synthetic resin for this purpose, it is desirable to use a polybutylene terephthalate resin. . It is preferable that the holder 7 according to the present invention is provided with an opening 30 for heat radiation, for example, on an upper surface or a side surface thereof.

The mounting board module 1 according to the present invention is mounted on a motherboard 8 to constitute a module mounting board. The module mounting board obtained by the present invention includes the leads of the module 1. The distal end portion R of the terminal portion 9 or the vicinity thereof is fixedly supported by the motherboard 8 by soldering, and the distal end portion P of the support leg portion 12 of the holder portion 7 is separated from the mounting surface of the motherboard 8. Is implemented in a state

[0025]

The mounting board module 1 according to the present invention.
Adopts the above-described technical configuration, the distance H between the module substrate 2 of the module 1 and the motherboard 8 which is the circuit board to be mounted is accurately and uniformly set under any conditions. To achieve the structure of the module 1 in which the soldering fixed portion of the mounting board is not peeled or broken due to thermal stress during the soldering process. Can be done.

[Brief description of the drawings]

FIG. 1 is an external perspective view illustrating the configuration of a specific example of a module for a mounting board according to the present invention.

FIG. 2 is a side view illustrating the configuration of a specific example of a module for a mounting board according to the present invention.

FIG. 3 is a view for explaining a positioning state in the module for a mounting board according to the present invention.

FIG. 4 is a diagram illustrating a state in which the mounting board module according to the present invention is mounted on a motherboard.

FIG. 5 is a diagram showing a configuration of a conventional module.

FIG. 6 is a diagram showing a configuration of a specific example using a holder part in a conventional module.

FIG. 7 is a diagram illustrating an example of a case where a conventional module is mounted on a motherboard.

FIG. 8 is a diagram for explaining an example in which a conventional module is mounted on a motherboard.

FIG. 9 is a diagram illustrating an example in which a conventional module is mounted on a motherboard.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Module for mounting boards 2 ... Module board 3 ... Heavy electric and electronic components such as coils and capacitors 6 ... Adhesive 7 ... Holder 8 ... Motherboard 9 ... Lead terminal 10 ... Opening 11 ... Solder 12 ... Support Leg part 30: heat radiation closed / open hole

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Satoru Kishimoto 1-2-28 Goshodori, Hyogo-ku, Kobe-shi, Hyogo Inside Fujitsu Ten Co., Ltd. No. 1 Inside Fuji Electric Co., Ltd. (56) References JP-A-4-61199 (JP, A) JP-A-5-67047 (JP, U)

Claims (9)

(57) [Claims] 1. A module board, a plurality of lead terminal portions connected to the module board, heavy or volume electric or electronic components mounted on the module board, and the heavy or volume electric or electronic A plurality of support legs that extend in the same direction as the direction in which the lead terminal contacts the motherboard. A mounting board module characterized by being used. 2. The mounting board according to claim 1, wherein the holder portion is made of a material having a thermal expansion coefficient larger than a thermal expansion coefficient of a material forming the lead terminal portion. module. 3. The support leg provided on the holder has a sharpened distal end.
The mounting board module described in the above. 4. A structure in which a tip of a support leg provided on the holder is disposed at a position retracted toward the module substrate side from a tip of the lead terminal. The module for a mounting board according to claim 3, wherein: 5. The mounting board according to claim 1, wherein a distance between a tip of the supporting leg provided on the holder and the module board is equal to a mounting surface of the mother board when the module is mounted on a predetermined mother board. 2. The mounting board module according to claim 1, wherein the setting is made so as to be equal to a predetermined gauge to be formed between the motherboard and the surface facing the motherboard. 6. An end portion of the lead terminal portion opposite to an end portion of the lead terminal portion which is in contact with the mother board, is in contact with the holder portion so as to be slidable under a specific stress. The mounting board module according to claim 1, wherein: 7. The apparatus according to claim 1, wherein said holder is made of polybutylene terephthalate resin.
The mounting board module described in the above. 8. The mounting board module according to claim 1, wherein the holder has an opening for heat radiation. 9. A motherboard on which the module according to claim 1 is mounted, wherein the leading end of the lead terminal portion of the module or the vicinity thereof is soldered to the motherboard. And the tip of the support leg of the holder is
A module mounting board, which is mounted so as to be separated from a mounting surface of the motherboard.