JP2617703C - - Google Patents
Info
- Publication number
- JP2617703C JP2617703C JP2617703C JP 2617703 C JP2617703 C JP 2617703C JP 2617703 C JP2617703 C JP 2617703C
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- copper
- alloys
- present
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 235
- 239000000956 alloy Substances 0.000 claims description 235
- 239000010949 copper Substances 0.000 claims description 57
- 229910052802 copper Inorganic materials 0.000 claims description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 238000000137 annealing Methods 0.000 claims description 42
- 229910052749 magnesium Inorganic materials 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 238000010791 quenching Methods 0.000 claims description 14
- 238000005482 strain hardening Methods 0.000 claims description 13
- 230000000171 quenching effect Effects 0.000 claims description 12
- 238000005266 casting Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 48
- 238000005452 bending Methods 0.000 description 34
- 230000035882 stress Effects 0.000 description 33
- 230000008569 process Effects 0.000 description 30
- 230000032683 aging Effects 0.000 description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 238000005097 cold rolling Methods 0.000 description 18
- 238000011282 treatment Methods 0.000 description 18
- 229910000881 Cu alloy Inorganic materials 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000012545 processing Methods 0.000 description 13
- 238000005336 cracking Methods 0.000 description 12
- 238000005098 hot rolling Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 230000006641 stabilisation Effects 0.000 description 8
- 238000011105 stabilization Methods 0.000 description 8
- 238000007792 addition Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 3
- 229910018098 Ni-Si Inorganic materials 0.000 description 3
- 229910018529 Ni—Si Inorganic materials 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000003483 aging Methods 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 description 2
- 229910001122 Mischmetal Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- 229910008458 Si—Cr Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 241000231739 Rutilus rutilus Species 0.000 description 1
- 229910007981 Si-Mg Inorganic materials 0.000 description 1
- 229910008316 Si—Mg Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 230000003009 desulfurizing effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910001234 light alloy Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2617703B2 (ja) | 改善された組合せの極限引張強さ、電気伝導性および耐応力緩和性を有する銅基合金の製造方法 | |
| JP5847987B2 (ja) | 銀を含む銅合金 | |
| JP4590264B2 (ja) | 時効硬化性銅基合金および製造方法 | |
| KR101667812B1 (ko) | 구리 합금 플레이트 및 그 제조 방법 | |
| US4728372A (en) | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength | |
| EP2784167A1 (en) | Cu-Ti based copper alloy sheet material and method for producing the same, and electric current carrying component | |
| MX2010006990A (es) | Aleaciones de cobre-niquel-silicio. | |
| KR20010080447A (ko) | 응력이완 저항성 황동 | |
| JP3510469B2 (ja) | 導電性ばね用銅合金及びその製造方法 | |
| JPH0841612A (ja) | 銅合金およびその製造方法 | |
| JP2002180165A (ja) | プレス打ち抜き性に優れた銅基合金およびその製造方法 | |
| JPH0625388B2 (ja) | 高強度、高導電性銅基合金 | |
| CN103781925A (zh) | Cu-Ni-Si系合金及其制造方法 | |
| JPWO2007015549A1 (ja) | 電子部品用高強度銅合金及び電子部品 | |
| JP5135914B2 (ja) | 電気・電子部品用高強度銅合金の製造方法 | |
| JP5261691B2 (ja) | プレス打ち抜き性に優れた銅基合金およびその製造方法 | |
| JPS619563A (ja) | 銅合金の製造方法 | |
| JP4350049B2 (ja) | 耐応力緩和特性に優れた銅合金板の製造方法 | |
| JP2617703C (index.php) | ||
| KR20160013241A (ko) | Ｃｕ-Ｔｉ계 구리 합금판재 및 그 제조법 | |
| JP6811199B2 (ja) | 耐金型摩耗性およびプレス打ち抜き性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条 | |
| CN120158643A (zh) | 一种Cu-Fe-Mn-P系合金材料及其制造方法 | |
| JPS6337176B2 (index.php) | ||
| HK1112491A (en) | Silver containing copper alloy |