JP2600902B2 - Socket for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a socket for a semiconductor element for storing and mounting an LSI or an IC for conducting an electrical test. Holder that forms a wiring electrode corresponding to the plane electrode of the semiconductor element and has a sloped side that slopes toward the bottom surface, and a hinge that opens and closes by rotating a hinge on one side edge of the outer shape to project elastic rubber inward. An insulating socket body having a lid, an anisotropic conductive rubber sheet placed so as to be in contact with the wiring electrode, and a frame hole for fitting the inserted semiconductor element outer shape; A semiconductor device is inserted into the recess and placed on the anisotropic conductive rubber sheet, and the wedge portion of the positioning frame is pushed. Nde combined electrodes together to lock presses the semiconductor element with elastic rubber to close the pressing lid.

[Industrial applications]

The present invention relates to a socket for a semiconductor element that accommodates an LSI, an IC, and the like for performing an electrical test.

When testing or experimenting a semiconductor device, there is a demand for a semiconductor device socket that can be easily replaced after the test.

[Conventional technology]

Conventionally, as shown in a perspective view of a main part showing a mounting state of FIG. 3, a semiconductor device without using a semiconductor device socket is used.
Wire the 12 flat electrodes 12a to the wiring electrodes 11a of the test substrate 11.
After mounting by wire bonding in 13
We have 12 tests (or experiments).

Although not shown, a plurality of test microprobes are provided on the substrate, and the test is performed by pressing the contact needles of each probe against the flat electrodes of the semiconductor element mounted on the substrate.

[Problems to be solved by the invention]

However, according to such a mounting structure, when the semiconductor element is mounted by wire bonding, replacement after the test cannot be easily performed, and the test substrate is disposable together with the tested semiconductor element, resulting in a problem of low economical efficiency. Although a stylus using a test microprobe can be replaced after the test, there is a problem that the equipment is large and expensive compared to the wire bonding method.

In view of the above problems, an object of the present invention is to provide a semiconductor device socket that can easily replace a semiconductor device which has been mounted and tested and has been tested.

[Means for solving the problem]

In order to achieve the above object, in a semiconductor device socket according to the present invention, there is provided a recess having an inclined side surface formed on a flat bottom surface and having a wiring electrode corresponding to a plane electrode of the semiconductor device and which is reduced toward the bottom surface; An insulating socket main body having a holding lid that is opened and closed by a hinge provided at one side edge thereof and is provided with an elastic rubber projecting inward, an anisotropic conductive rubber sheet placed on the wiring electrode so as to be in contact therewith, A positioning frame that has a frame hole that fits into the outer shape of the semiconductor device and that projects a wedge portion inserted between the outer shape of the semiconductor device and the inclined side surface of the recess. The semiconductor element is placed on a conductive rubber sheet, the wedges of the positioning frame are pushed in, the electrodes are aligned, the holding lid is closed, and the semiconductor element is pressed with elastic rubber and locked.

[Function] The semiconductor element is automatically centered in the recess by sandwiching the anisotropic conductive rubber sheet between the wiring electrode provided on the bottom of the recess and the plane electrode of the semiconductor element and pressing the wedge of the positioning frame. The electrodes can be matched with each other, and furthermore, by pressing with the holding lid via the elastic rubber, the anisotropic conductive rubber sheet has conductivity only in the thickness direction, so that the electrodes can be electrically connected. Can be.

〔Example〕

Hereinafter, the gist of the present invention will be described in detail based on embodiments shown in the drawings.

As shown in the disassembled perspective view of FIG. 1 and its side sectional view of FIG. 2, the semiconductor element socket 1 is provided with a recess 1a-1 for accommodating the semiconductor element 2 indicated by a two-dot chain line. A conductive socket body 1a, an anisotropic conductive rubber sheet 1b inserted into the recess 1a-1, and a positioning frame 1c for positioning the electrodes.

The insulative socket body 1a is formed by molding an insulative synthetic resin material into a flat cuboid, forming wiring electrodes 1a-2 corresponding to the planar electrodes 2a of the semiconductor element 2 on a flat bottom surface, and facing the bottom surface. Semiconductor device 2 having concave inclined side surface 1a-3
And a truncated inverted quadrangular pyramid-shaped recess 1a-1 having a depth capable of substantially submerging the surface is provided on the surface.

An external connection lead terminal 1a-1a connected to the wiring electrode 1a-2 is projected and formed on the back surface.

A hinge 1a-4 is integrally formed on one side edge of the outer shape of the socket body, and at least the outer size in plan view of the semiconductor element 2 made of a metal spring plate which is opened and closed by the hinge 1a-4 (FIG. (In plan view). A rectangular elastic rubber 1a-6 for directly holding the upper surface of the semiconductor element 2 through the frame hole 1c-2 of the positioning frame 1c is attached and protruded inside the holding lid 1a-5, and is opposite to the hinge 1a-4. There is provided a knob 1a-7 in which a part of the edge is bent at a right angle to form an engagement hole 1a-7a. Further, a locking projection 1a-8a for inserting and engaging the engaging hole 1a-7a of the knob 1a-7 is integrally formed on the main body side wall 1a-8 opposite to the hinge 1a-4.

The anisotropic conductive rubber sheet 1b is made by mixing metal particles in a silicon rubber sheet (also a film), for example, so that it has conductivity only in the thickness direction and has insulation in the sheet surface direction. It is cut into a square shape so that it can be inserted into 1a-1, and inserted into the recess 1a-1 and placed so as to be in contact with the wiring electrode 1a-2.

The positioning frame 1c is formed by molding a synthetic resin material into a square frame shape, and the frame hole 1c-2 is fitted with the outer shape of the semiconductor element 2 and the inclined side surface 1a-3 of the recess 1a-1 of the insulating socket body 1a.
And a wedge portion 1c-1 to be inserted between the outer shape of the semiconductor element 2 inserted into the recess 1a-1 and formed to project downward from four sides.

In order to house the semiconductor element 2 in the insulating socket body 1a, the semiconductor element 2 is inserted into the recess 1a-1, placed on the anisotropic conductive rubber sheet 1b, and the frame hole 1c-2 of the positioning frame 1c is inserted into the semiconductor hole. The inclined side surface of the recess 1a-1 while fitting to the element 2.
Push the wedge 1c-1 between the pin 1a-3 and the cover 1a-5, and finally press the semiconductor element 2 with the elastic rubber 1a-6 to engage the engaging hole 1a-7a of the knob 1a-7. The lock projection 1a
Lock to -8a.

In this manner, the positioning of the electrodes is automatically performed by inserting the positioning frame into the semiconductor element inserted into the recess and pushing the wedge portion between the semiconductor device and the inclined side surface of the recess. Then, by placing an anisotropic conductive rubber sheet between the wiring electrode of the recess and the plane electrode of the semiconductor element, the electrodes can be electrically conductively connected by elastically pressing with a holding lid.

Since the semiconductor element is housed and mounted in the recess by the insertion and pressure contact structure, it can be easily inserted and removed, and the semiconductor element after the test can be easily replaced. Also,
The semiconductor device socket of the present invention can be used repeatedly and is more economical than the conventional disposable wire bonding mounting, and can be manufactured at a lower cost and smaller size than the microprobe stylus connection structure.

〔The invention's effect〕

As described in detail above, according to the present invention, the semiconductor element can be freely replaced, so that the semiconductor element after the test can be easily replaced.Since the structure is simple, the semiconductor element can be manufactured small and inexpensively. Particularly, it is extremely effective as a test socket for a semiconductor device.

[Brief description of the drawings]

FIG. 1 is an assembled perspective view showing an exploded state of an embodiment according to the present invention, FIG. 2 is a side sectional view showing a state where semiconductor elements are housed and mounted in FIG. 1, and FIG. FIG. In the drawing, 1 is a semiconductor element socket, 1a-4 is a hinge, 1a is an insulating socket body, 1a-5 is a holding lid, 1a-1 is a depression,
1a-6 denotes an elastic rubber, 1a-2 denotes a wiring electrode, 2 denotes a semiconductor element, 1a-3 denotes an inclined side surface, and 2a denotes a plane electrode.

Claims (1)

(57) [Claims] 1. A recess having an inclined side surface (1a-3) formed on a flat bottom surface and formed with a wiring electrode (1a-2) corresponding to a plane electrode (2a) of a semiconductor element (2) and tapered toward the bottom surface. (1a-
1) and an insulating socket body comprising a holding lid (1a-5) which is opened and closed by a hinge (1a-4) provided on one side edge of the outer shape and which has an elastic rubber (1a-6) protruding inward. (1a), an anisotropic conductive rubber sheet (1b) placed so as to be in contact with the wiring electrode (1a-2), and a frame hole (1c-
2) having a semiconductor element (2) outer shape and the recess (1a-
1) a positioning frame (1c) protruding a wedge (1c-1) between the inclined side surface (1a-3) and a semiconductor element (2) inserted into the recess (1a-1). And place it on the anisotropic conductive rubber sheet (1b), push in the wedge (1c-1) of the positioning frame (1c) and press the electrodes (2a, 1a).
-2) a semiconductor element socket characterized in that the semiconductor element (2) is locked by pressing the semiconductor element (2) with an elastic rubber (1a-6) by closing the holding lid (1a-5) together.