JP2585781Y2 - Film forming equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus, and more particularly to a substrate transfer mechanism for receiving and transferring a substrate in a film forming apparatus such as a sputtering apparatus, a CVD apparatus, and an etching apparatus.

[0002]

2. Description of the Related Art Conventionally, the following technology has been known as a transfer mechanism for transferring and receiving substrates in a film forming apparatus. FIG. 6 is a configuration diagram illustrating a substrate transfer mechanism of a conventional film forming apparatus.

In FIG. 6, a substrate 1 is fixed to a substrate holder 3 by a holding portion 6 and set at a position facing the counter electrode 2. The holding portion 6 is formed so as to be curved such that a holding end portion 61 as a tip portion covers at least a part of the outer peripheral portion of the substrate holder 3. By holding the substrate 1 between the holding end 61 of the holding portion 6 and the substrate holder 3, the substrate 1 is fixed to the substrate holder 3. Here, the holding of the substrate 1 is performed by the holding portion drive shaft 62.
This is performed by moving the holding portion 6 closer to the base 4 by driving in the axial direction.

[0004]

However, the conventional film forming apparatus has the following problems.

In the substrate transfer mechanism of the conventional film forming apparatus, since the substrate holder is fixed to the base, the positional relationship between the substrate and the counter electrode is fixed and cannot be changed. . This is because the holding unit drive shaft is movable with respect to the base, but the movement of the holding unit drive shaft is for fixing the substrate to the substrate holder,
This is because the distance between the substrate and the counter electrode is fixed by the distance between the substrate holder and the counter electrode and cannot be changed.

Therefore, there is a problem that the axial driving and the rotational driving of the substrate with respect to the counter electrode are impossible, and the adjustment in the film forming process cannot be performed by adjusting the positional relationship between the substrate and the counter electrode. I have.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems of the conventional film forming apparatus, and to make it possible to move the substrate in the axial direction and rotationally in a mechanism for transferring the substrate of the film forming apparatus. I do.

[0008]

According to the present invention, there is provided a film forming apparatus having a substrate transfer mechanism for receiving and transferring a substrate, wherein the substrate is movable in a linear direction and a rotational direction. A first urging portion having one end fixed and urging the substrate holder in one direction; and a first urging portion mounted on the substrate holder and having one end with respect to the first urging portion. A second urging portion that abuts and urges the substrate in a direction opposite to the first direction and supports the other end of the substrate by abutting the substrate. The first and second urging portions are provided on the substrate holder. It is driven by linear movement to receive and deliver substrates.

In the present invention, the first urging portion and the first urging portion can be constituted by a pin and an elastic member for urging the pin. For example, a spring or the like is used as the elastic member. Can be adopted.

[0010]

According to the present invention, in a film forming apparatus having a substrate transfer mechanism for receiving and delivering a substrate by the above-described structure, the substrate holder is moved by moving the substrate holder; A gap is formed between the substrate and the end of the urging unit that contacts the substrate, the substrate is inserted into the gap, and then the substrate holder is moved again to contact the substrate of the second urging unit. By moving the end to the substrate side to support the substrate, the substrate is received, and further, by moving the substrate holder, the substrate holder is brought into contact with the substrate, and by the contact between the substrate holder and the substrate, The support is performed by the substrate holder.

Further, according to the present invention, with the above configuration, the substrate holder is moved while the substrate is supported by the substrate holder in the film forming apparatus having the substrate transfer mechanism for receiving and transferring the substrate. By
The substrate is separated from the substrate holder and supported by the second urging unit, and the substrate is transferred while the substrate is supported by the second urging unit.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) (Structure of Embodiment 1) FIG. 1 is a perspective view showing a partial cross section of Embodiment 1 of the film forming apparatus of the present invention shown in FIG. This will be described with reference to the configuration diagram of Embodiment 1 of the film forming apparatus of the present invention shown in FIG. In the drawings, the axial direction of the substrate holder driving shaft is defined as a vertical direction, and the direction orthogonal to the axial direction is defined as a horizontal direction.

In FIG. 1, a substrate transfer apparatus includes a substrate holder 30 for holding a substrate 1 and a base 4
The first urging unit 10 and the second urging unit 20 are attached to the first urging unit.

The substrate holder 30 includes a substrate holder frame 31
And a substrate holder drive shaft 32 and a substrate holder surface 33. The substrate holder surface 33 is a step formed on an inner portion of the substrate holder frame 31, and the substrate 1 is fitted into the step. Note that the substrate holder frame 31 can be formed of a material such as quartz. The substrate holder drive shaft 32 is
The substrate holder 30 is connected to a drive device (not shown) outside the apparatus through the base 4 so that the substrate holder 30 can be moved in the axial direction of the substrate holder drive shaft 32 and the rotational direction of the shaft. By driving the substrate holder drive shaft 32, the substrate 1 on the substrate holder 30 can change the positional relationship between the distance between the counter electrodes with respect to the counter electrode 2 and the horizontal position.

The first urging unit 10 and the second urging unit 20
Is installed between the base 4 and the substrate holder 30, and cooperates with the substrate holder drive shaft 32.
Is to move.

The configuration of the first urging unit 10 and the second urging unit 20 will be described in more detail with reference to the configuration diagram of the first embodiment shown in FIG. The first pin 11 of the first urging portion 10 is provided on the base 4 side, and is arranged in a direction parallel to the axial direction of the substrate holder drive shaft 32 with respect to the first pin support portion 13 fixed to the base 4. The first spring 1 is movably supported between a first pin contact portion 14 provided at the tip of the first pin 11 and an outer end of the first pin support portion 13.
2 are installed. The first spring 12 has a first
The pin contact portion 14 is pressed to urge the first pin 11 in a direction separating from the base 4, that is, in a direction approaching the counter electrode 2.

The second pin 21 of the second biasing portion 20 is provided on the substrate holder 30 side, and can move in a direction parallel to the axial direction of the substrate holder driving shaft 32 with respect to the substrate holder frame 31. And a second pin contact portion 24 provided at the tip of the second pin 21 and the substrate holder frame 31.
A second spring 22 is provided between the first spring 22 and the inner end of the second spring 22. The second spring 22 presses the second pin contact portion 24 to urge the second pin 21 in a direction approaching the base 4, that is, in a direction away from the counter electrode 2.

The first urging unit 10 and the second urging unit 20
Are disposed at opposing positions, and the first pin contact portion 14 and the second pin contact portion 24 are arranged so that their contact surfaces are in contact with each other. Can be abutted depending on the biasing direction of.

The second pin contact portion 24 of the second pin 21
The other end protrudes from the substrate holder frame 31 to the counter electrode 2 side, and the tip end is curved in an L shape to form the second pin pickup section 25. The L-shaped portion of the second pin pickup section 25 is curved toward the substrate holder surface 33, and the substrate 1 is held between the L-shaped portion and the substrate holder surface 33 so that the substrate holder 30
Fixation is performed.

In the above configuration, only the substrate holder 30 is directly driven by the driving device (not shown) via the substrate holder driving shaft 32.
The second urging unit 20 is not directly driven by the driving device, but is driven by the movement of the substrate holder 30 and the cooperative operation of the first spring 12 and the second spring 22.

Further, in order to control the temperature such as heating or cooling of the substrate holder, a heating device or a cooling device (not shown) may be provided on the substrate holder to supply power or a medium through a substrate holder driving shaft or the like. (Operation of First Embodiment) Next, regarding the operation of the first embodiment of the present invention, a flowchart for receiving the substrate of the first embodiment of the present invention in FIG. 3 and a flowchart for transferring the substrate of the first embodiment of the present invention in FIG. , FIG.
The operation of the first embodiment of the present invention will be described with reference to the drawings. (Reception of Substrate) First, an operation when a substrate is received from a transfer device will be described.

In FIG. 3, each step of receiving the substrate 1 from a transfer device (not shown) is represented by a flowchart using step S. The position of the substrate 1 in each step and the substrate holder of the substrate holder 30 are also shown in the flowchart. Position of end of frame 31, first pin contact portion 1 of first pin 11
4 shows the position of the second pin pickup portion 25 of the second pin 21 with the base 4 as a reference position, and shows the length of the first spring 12 and the length of the second spring 22 at that time. I have.

Step S1: First, the substrate 1 is transferred by a transfer device (not shown) along a path line 5 indicated by a dashed line, and is moved to the position of the substrate transfer device. The position of the substrate holder 30 in this step is shown in FIG. In FIG. 5A,
By driving the substrate holder drive shaft 32 to move the substrate holder 30, the end of the substrate holder frame 31 is set at a distance of A2 from the base 4, and the second pin pickup unit 25 is set at a distance of A2 + C1 from the base 4. Then, the pass line 5 is positioned between the end of the substrate holder frame 31 and the second pin pickup unit 25. Due to this positional relationship, the second pin pickup portion 25 protrudes from the end of the substrate holder frame 31 toward the counter electrode 2 by a distance of C1 to form a gap with the end of the substrate holder frame 31. By forming this gap, the conveyed substrate 1 can be inserted between the end of the substrate holder frame 31 of the substrate holder 30 and the second pin pickup section 25 of the second pin 21. At this time, the substrate 1 is located on the pass line by a transport device (not shown). Further, in this state, the first pin contact portion 14 and the second pin contact portion 24 are in contact with each other, and the contact between the first pin contact portion 14 and the second pin contact portion 24 causes the second pin pickup portion 25 from the end of the substrate holder frame 31 to move. The amount of protrusion is C1.

The pass line 5 is at a distance of P1 from the base 4, and the position of the transferred substrate 1 is P
1 distance. To achieve this positional relationship, the substrate holder 30 is moved toward the base 4 and the second spring 2
2 is compressed to SB1. At this time, the first spring 12 is extended and has the length of SA2.

Step S2: Next, the substrate 1 is picked up by raising the substrate holder 30. Here, here, the substrate holder 30 is
The direction away from the substrate holder 30 is defined as the upward direction of the substrate holder 30. The position of the substrate holder 30 in this step is shown in FIG. 5B, the substrate holder driving shaft 32 is driven to move the substrate holder 30, and
The end of the substrate holder frame 31 is set at a distance of A1 from the base 4 and the second pin pickup unit 25 is connected to the base 4 by A1 +
The second pin pickup unit 25 is raised as the distance of C1, and the substrate 1 on the pass line 5 is picked up while being raised. In this step, the substrate 1 to be picked up is supported only by the second pin pick-up unit 25, and is at a position elevated from the pass line 5 to the base 4 by the distance of E1.

In this positional relationship, as in step S1, the second pin pickup section 25 is mounted on the substrate holder frame 3.
The first pin contact portion 14 and the second pin contact portion 24 are in a joined state by protruding toward the counter electrode 2 by a distance of C1 from the end of the first pin. The amount of protrusion of the 2-pin pickup unit 25 from the end of the substrate holder frame 31 is C1.

According to this positional relationship, the substrate 1 and the second pin pickup unit 25 can be moved from the transfer path of the transfer device that has transferred the substrate 1, and the transfer arm (not shown) of the transfer device can be retracted.

In order to achieve this positional relationship, the substrate holder 30 is further moved to the side of the base 4 than in step S1, and the first spring 12 is compressed to SA1. In addition, the second spring 22 is in a state where SB1 is compressed.

Step S3: At the position of the step S2 shown in FIG.
The transfer arm of the transfer device (not shown) is retracted. By retreating the transfer arm, the substrate 1 can be moved to the counter electrode 2 side. The positional relationship in this step is
This is the same as step S2.

Step S4: Next, the substrate holder 30 is lowered, and the substrate 1 is set on the substrate holder surface 33 of the substrate holder 30. Here, the direction in which the substrate holder 30 approaches the counter electrode 2 is defined as the downward direction of the substrate holder 30. The position of the substrate holder 30 in this step is shown in FIG. In FIG. 5C, the substrate holder drive shaft 32 is driven to lower the substrate holder 30, and the end of the substrate holder frame 31 and the second pin pickup unit 25 are set at a distance of A3 from the base 4. The lowering of the substrate holder 30 causes the substrate 1
Is pinched between the substrate holder surface 33 and the second pin pickup section 25. The force holding the substrate 1 is generated by the elastic force of the second spring 22 extending. The substrate 1 sandwiched between the substrate holder surface 33 and the second pin pickup portion 25 is at a position lowered from the pass line 5 toward the counter electrode 2 by a distance of E2 in this step. With this positional relationship, the substrate 1 can be placed on the substrate holder 30.

In order to achieve this positional relationship, the substrate holder 30 is moved to the counter electrode 2 side, and the first spring 12 is extended to SA2, and the second spring 22 is extended to SB2.

Step S5: Next, the substrate holder 30 is lowered from the step S4, and the substrate 1 is set at an arbitrary position on the counter electrode 2 side. The position of the substrate holder 30 in this step is as shown in FIG.
Is shown in In FIG. 5D, the substrate holder driving shaft 32 is driven to lower the substrate holder 30, and the end of the substrate holder frame 31 and the second pin pickup section 25 are set at a distance of A4 from the base 4. Due to the lowering of the substrate holder 30, the substrate 1 is lowered toward the opposing electrode 2 while being sandwiched between the substrate holder surface 33 and the second pin pickup portion 25, and is moved from the pass line 5 to the opposing electrode 2 side, for example, E3.
Can be installed at any position lowered by a distance of. This installation position is set according to the film forming process.

In order to achieve this positional relationship, the substrate holder 30 is opposed to the first spring 12 in the state of SA2 by extending the first spring 12 and SB2 by extending the second spring 22 in the same manner as in step S4. By moving to the electrode 2 side, the contact state between the first pin contact portion 14 and the second pin contact portion 24 is eliminated, and an interval of D4 is generated. The force holding the substrate 1 is the elastic force of the second spring 22 extending.

In this state, the first pin contact portion 14
And the second pin contact portion 24 are not in contact with each other, so that the substrate holder 30 and the base 4 are separated from each other. Thus, the substrate holder 30 can be rotationally driven by rotating the substrate holder drive shaft 32.
Therefore, the position of the substrate 1 placed on the substrate holder 30 with respect to the counter electrode 2 can be changed. (Delivery of Substrate) Next, an operation when the substrate is delivered from the substrate holder to the transfer device will be described. In FIG. 4, each step in the case of transferring the substrate 1 from the substrate holder to a transfer device (not shown) is represented by a flowchart using the tenth code of step S, and the position of the substrate 1 in each step is provided along with the flowchart. The position of the end of the substrate holder frame 31 of the substrate holder 30, the position of the first pin contact portion 14 of the first pin 11, and the position of the second pin pickup portion 25 of the second pin 21 are determined based on the base 4. And the length of the first spring 12 and the length of the second spring 22 at that time.

Step S11: In this step, first, the position of the substrate 1, the position of the end of the substrate holder frame 31 of the substrate holder 30, the first pin 11
Of the first pin contact portion 14 and the second position of the second pin 21
It is assumed that the position of the pin pickup unit 25, the length of the first spring 12, and the length of the second spring 22 are at the positions in step S5.

First, the substrate holder 30 is raised in the above positional relationship to separate the substrate 1 from the substrate holder surface 33 of the substrate holder 30, and the substrate 1 is moved to the base 4 side from the pass line 5. Substrate holder 30 in this step
Is shown in FIG. 5B. In FIG. 5B, the substrate holder drive shaft 32 is driven to drive the substrate holder 3.
0, the end of the substrate holder frame 31 is set at a distance of A1 from the base 4 and the second pin pickup unit 25 is set at a distance of A1 + C1 from the base 4 to raise the second pin pickup unit 25. In this step, the substrate 1 to be picked up is supported only by the second pin pick-up unit 25, and is at a position elevated from the pass line 5 to the base 4 by the distance of E1.

In this positional relationship, as in step S2, the second pin pickup unit 25 is
The first pin contact portion 14 and the second pin contact portion 24 are in a joined state by protruding toward the counter electrode 2 by a distance of C1 from the end of the first pin. The amount of protrusion of the 2-pin pickup unit 25 from the end of the substrate holder frame 31 is C1.

Due to this positional relationship, since the second pin pickup section 25 is located on the side of the base 4 from the pass line 5, a transfer arm of a transfer device (not shown) can be inserted.

To achieve this positional relationship, the substrate holder 30 is moved toward the base 4 to compress the first spring 12 to SA1, and to compress the second spring 22 to SB1. .

Step S12: At the position of step S11 shown in FIG. 5B, a transfer arm of a transfer device (not shown) is inserted. By inserting the transfer arm, the substrate 1 can be moved to the counter electrode 2 side. The positional relationship in this step is the same as that in step S11.

Step S13: Next, the substrate 1 is lowered, and the substrate 1 is transferred onto the transfer arm inserted in step S12. The position of the substrate holder 30 in this step is shown in FIG.
In FIG. 5A, the substrate holder driving shaft 32 is driven to move the substrate holder 30, the end of the substrate holder frame 31 is set at a distance of A2 from the base 4, and the second pin pickup unit 25 is connected to the base 4 The path line 5 is positioned between the end of the substrate holder frame 31 and the second pin pickup section 25 by setting the distance to A2 + C1 from the distance. During positioning at this position, the substrate 1 is transferred onto a transfer arm (not shown) on the pass line 5. Due to this positional relationship, the second pin pickup unit 25 is connected to the substrate holder frame 31.
Projecting toward the counter electrode 2 by the distance of C1 from the end of the substrate holder frame 31 to form a gap between the end and the end of the substrate holder frame 31. By forming this gap, the transfer arm can be inserted below the substrate 1 between the end of the substrate holder frame 31 of the substrate holder 30 and the second pin pickup portion 25 of the second pin 21. In this state, the first pin contact portion 1
4 and the second pin contact portion 24 are in contact with each other, and the amount of protrusion of the second pin pickup portion 25 from the end of the substrate holder frame 31 is C1 by this contact state.

The pass line 5 is at a distance of P1 from the base 4, and the position of the substrate 1 transferred to the transfer arm is at a distance of P1 from the base 4. To achieve this positional relationship, the substrate holder 30 is moved to the base 4 side, and the second spring 22 is compressed to SB1. At this time, the first spring 12 is extended and has the length of SA2.

Step S14: Next, the substrate 1 on the transfer arm is unloaded by retracting the transfer arm (not shown). This step is performed at the position set in the step S13. (Effect of First Embodiment) According to the above configuration, the substrate can be installed and held below the substrate holder by the pin urged by the spring, and the position of the substrate with respect to the lower counter electrode can be changed. Can be. (Embodiment 2) (Configuration of Embodiment 2) The configuration of Embodiment 2 of the present invention will be described with reference to a perspective view showing a partial cross section of Embodiment 2 of the film forming apparatus of the present invention shown in FIG. The second embodiment has a configuration in which the up-down direction of the first embodiment is reversed. In the second embodiment, the substrate is supported upward and the film forming process is performed by the counter electrode provided above.

In FIG. 7, a substrate transfer apparatus includes a substrate holder 30 for holding a substrate 1 and a base 4
The first urging unit 10 and the second urging unit 20 are attached to the first urging unit. In FIG. 7, the opposing electrode 2 side is set to the upper side, and the base 4 side is set to the lower side.

The substrate holder 30 is provided with a substrate holder frame 31.
, A substrate holder surface 33, a heater 34, and a reflector 35. The substrate holder surface 33 is a step formed on an inner portion of the substrate holder frame 31, and the substrate 1 is fitted into the step. The substrate holder 30 is provided with a substrate holder driving unit (not shown), and the substrate holder 30 is rotated by a driving device (not shown) connected to the outside of the apparatus through the base 4. It is possible to move in the direction. By driving the substrate holder driving unit, the substrate 1 on the substrate holder 30 can change the positional relationship between the distance between the counter electrodes with respect to the counter electrode 2 and the horizontal position. A heater 34 and a reflection plate 35 are provided in the substrate holder frame 31 below the substrate holder surface 33.

The first urging unit 10 and the second urging unit 20
Is provided between the base 4 and the substrate holder 30 and moves the substrate holder frame 31 in cooperation with a substrate holder driving unit (not shown). The first pin 11 of the first biasing portion 10 is provided on the base 4 side, is supported movably in the up-down direction with respect to the base 4, and further has a first pin 11 provided at the tip of the first pin 11. Pin contact part 14
The first spring 12 is provided between the first spring 12 and the base 4. The first spring 12 presses the first pin contact portion 14 to urge the first pin 11 in a direction separating from the base 4, that is, in a direction approaching the counter electrode 2.

The second pin 21 of the second urging portion 20 is provided on the substrate holder 30 side, and is supported movably in the vertical direction with respect to the substrate holder frame 31. One end of the second pin 21 projects from the substrate holder 30 toward the substrate 1, and the other end of the second pin 21
The second spring 22 is provided between the substrate holder frame 31 and the inner end thereof. This second spring 22
Presses the second pin contact portion 24 to urge the second pin 21 in a direction approaching the base 4, that is, in a direction away from the counter electrode 2.

Then, the first urging unit 10 and the second urging unit 20
Are disposed at opposing positions, and the first pin contact portion 14 and the second pin contact portion 24 are arranged so that their contact surfaces are in contact with each other. Can be abutted depending on the biasing direction of.

The second pin contact portion 24 of the second pin 21
The end on the opposite side protrudes from the substrate holder frame 31 toward the opposing electrode 2 as described above, and the end forms a second pin support 26. The second pin support 26 supports the substrate 1 from below.

In the above configuration, only the substrate holder 30 is driven by the driving device (not shown) via the substrate holder driving unit, and the first urging unit 10 and the second urging unit
The urging portion 20 is not directly driven by the driving device, but moves the substrate holder 30 and the first spring 12.
In addition, it is driven by the cooperative operation of the second spring 22.

In order to control the temperature such as heating or cooling of the substrate holder, a heating device or a cooling device (not shown) is provided on the substrate holder as in the first embodiment. A supply can also be made. (Operation of Second Embodiment) Next, the operation of the second embodiment of the present invention will be described with reference to FIG. 8 which illustrates the operation of the second embodiment of the present invention. (Reception of Substrate) First, an operation when a substrate is received from a transfer device will be described.

In FIG. 8, first, the substrate 1 is transported along a path line (not shown) by a transport device (not shown) and moved to the position of the substrate transfer device. The position of the substrate holder 30 in this step is shown in FIG. In FIG. 8A, by moving the substrate holder 30 downward, the first spring 12 and the second spring 22 are compressed to lower the second pin 21, and the second pin 21 at the tip of the second pin 21 is moved downward. The positional relationship is such that an interval is provided between the two-pin support 26 and the substrate 1. The substrate 1 is transported by using the interval in this positional relationship. In this state, the first pin contact portion 14 and the second pin contact portion 24
Is in a contact state.

Next, when the substrate holder 30 is moved upward by a driving device (not shown), the second pin supporting portion 26 at the tip of the second pin 21 is kept in a state of protruding from the substrate holder surface 33 of the substrate holder 30. Ascends and comes into contact with the lower surface of the substrate 1. This state is shown in FIG. As a result, the substrate 1 is supported from below by the second pin supporting portion 26, and the transfer arm (not shown) supporting the substrate 1 during the transfer can be retracted.

Next, in FIG. 8C, when the substrate holder 30 is further moved upward by a driving device (not shown), the substrate holder frame 31 of the substrate holder 30 is raised and the substrate holder surface 33 is Contact the lower surface. Thus, the substrate 1 is supported by the substrate holder surface 33 from below. At this time, the position of the substrate 1 with respect to the counter electrode 2 can be arbitrarily set by moving the substrate holder 30 in the vertical direction. In this state, the first
The contact state between the pin contact portion 14 and the second pin contact portion 24 is cancelled, and the substrate holder 30 is separated from the base 4. Thus, the substrate holder 30 can be rotated by driving a driving device (not shown). Therefore, the position of the substrate 1 in the vertical direction and the horizontal position with respect to the counter electrode 2 can be changed by a driving device (not shown). (Delivery of Substrate) Next, an operation when the substrate is delivered from the substrate holder to the transfer device will be described. In this step, first, the position of the substrate 1, the position of the end of the substrate holder frame 31 of the substrate holder 30, the position of the first pin contact portion 14 of the first pin 11,
The position of the second pin support portion 26 of the second pin 21 and the length of the first spring 12 and the length of the second spring 22 are in the state shown in FIG. It is assumed that

First, the substrate holder 30 is lowered in the above positional relationship, and the substrate 1 is separated from the substrate holder surface 33 of the substrate holder 30. This state is shown in FIG. By separating the substrate 1 from the substrate holder surface 33,
The lower surface of the substrate 1 is supported by the second pin support 26, and a gap is formed between the lower surface of the substrate 1 and the substrate holder surface 33. The formation of this gap makes it possible to insert a transfer arm of a transfer device (not shown).

Next, a transfer arm is inserted into the gap between the lower surface of the substrate 1 and the substrate holder surface 33 to support the substrate 1 and transfer the substrate 1 to the transfer arm. After that, the substrate holder 30 is further lowered as shown in FIG. As a result, the second pin supporting portion 26 is completely separated from the lower surface of the substrate 1, so that the transfer arm can be retracted, and the substrate 1 can be taken out. At this time, the first spring 12 and the second spring 22 are both in a compressed state, and the first pin contact portion 14 and the second pin contact portion 24 are in a contact state. (Effect of Second Embodiment) With the above-described configuration, the substrate can be installed and held above the substrate holder by the pin urged by the spring, and the position of the substrate with respect to the upper counter electrode can be changed. Can be. (Modification) The present invention is not limited to the above embodiment,
Various modifications are possible based on the spirit of the present invention, and they are not excluded from the scope of the present invention.

FIG. 9 is a structural view showing a modified example of the present invention, and illustrates an example in which the substrate is set on the substrate holder provided above as shown in the first embodiment. In this modified example, a plurality of sets of the urging portions including the first urging portion and the second urging portion are arranged in a ring shape with respect to the substrate holder, thereby forming a plurality of substrates. The film processing can be performed by batch processing.

This modification can also be applied to a configuration in which a substrate is placed on a substrate holder provided below as shown in the second embodiment.

The present invention can be applied to a mechanism for transferring a substrate in a film forming apparatus such as a sputtering apparatus, a CVD apparatus, and an etching apparatus.

[0061]

[Effects of the Invention] As described above, according to the present invention,
In a mechanism for transferring a substrate of a film forming apparatus, the substrate can be moved in the axial direction and rotated.

Further, continuous rotation can be made possible with the substrate mounted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a partial cross section of a first embodiment of a film forming apparatus of the present invention.

FIG. 2 is a configuration diagram of Embodiment 1 of the film forming apparatus of the present invention.

FIG. 3 is a flowchart of receiving a substrate according to the first embodiment of the present invention;

FIG. 4 is a flowchart for transferring a substrate according to the first embodiment of the present invention;

FIG. 5 is a diagram for explaining the operation of the first embodiment of the present invention;

FIG. 6 is a configuration diagram illustrating a substrate transfer mechanism of a conventional film forming apparatus.

FIG. 7 is a perspective view showing a partial cross section of Embodiment 2 of the film forming apparatus of the present invention.

FIG. 8 is a diagram illustrating the operation of the second embodiment of the present invention.

FIG. 9 is a configuration diagram showing a modification of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2 ... counter electrode, 4 ... base, 5 ... pass line, 10 ... 1st biasing part, 11 ... 1st pin, 12 ... 1st spring, 13 ... 1st pin support part, 14 ... 1st Pin contact portion, 20 ... second biasing portion, 21 ... second pin, 22 ... second spring, 24 ... second pin contact portion, 25 ... second pin pickup portion, 26 ... second pin support portion, Reference numeral 30: substrate holder, 31: substrate holder frame, 32: substrate holder drive shaft, 3
3 ... substrate holder surface, 34 ... heater, 35 ... reflector

Claims (1)

(57) [Scope of request for utility model registration] 1. A film forming apparatus having a substrate transfer mechanism for receiving and transferring a substrate, comprising: (a) a substrate holder that is movable in a linear direction and a rotational direction and supports the substrate; and (b) one end. And a first urging unit for urging the substrate holder in one direction, and (c) being installed on the substrate holder and having one end with respect to the first urging unit. A second side that urges and abuts the substrate in the direction opposite to the other direction and abuts and supports the other end on the substrate.
(D) the first urging unit and the second urging unit are driven by the linear movement of the substrate holder to receive and deliver the substrate. Characteristic film forming apparatus.