JP2577467Y2 - Light emitting diode mounting board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode mounting substrate, and more particularly to an improvement of a light emitting diode mounting substrate on which a surface emitting light emitting diode having a large number of mounting legs on a circuit component mounting surface is mounted.

[0002]

2. Description of the Related Art Conventionally, electronic equipment has a built-in printed circuit board on which components constituting an electronic circuit are mounted.
On the component mounting surface of the printed circuit board, the shape, name, symbol, and the like of the mounted component are printed and displayed, and a large number of component mounting holes are provided. On the other hand, on the circuit pattern surface of the printed circuit board, a circuit pattern made of a conductive metal, generally copper foil, which communicates with the component mounting hole is provided, and the mounting leg and the circuit pattern of the electronic component inserted into the component mounting hole are provided. The circuit pattern surface is covered with a resist, which is an insulating film, except for the solder connection portion of the circuit pattern.

[0003] Circuit components are mounted on a printed circuit board by manual insertion or automatic insertion by a machine. The printed circuit board on which the components are mounted is passed through a solder bath, and the legs of the components and the circuit pattern are soldered. A leg is cut to a predetermined length to complete a printed board on which components are mounted.

FIG. 4 is a perspective view showing a state in which a surface-emitting light emitting diode 1 is mounted on a component mounting surface 41 of a conventional printed circuit board 40. Generally, the light emitting diode 1 for surface light emission is provided with a plurality of pins 2 as mounting legs, and the pins 2 are usually arranged in two rows (dual in-line).

On the other hand, a printed circuit 40 for mounting such a surface-emitting light emitting diode 1 has a mounting hole 4 corresponding to the position of the pin 2 at the mounting position of the light emitting diode 1.
2 are provided. And these mounting holes 4
2 is to facilitate the mounting of the light emitting diode 1,
The inner diameter is considerably larger than the diameter of the pin 2.

FIG. 4A shows a circuit (not shown) in which the pin 2 of the light emitting diode 1 passes through the solder tank after being inserted into the mounting hole 42 of the printed circuit board 40, and the pin 2 is provided on the back surface of the printed circuit board 40. This shows a state where it is soldered to the pattern. Thereafter, the pins 2 of the light emitting diode 1 mounted on the printed circuit board 40 are cut at the positions indicated by the line AA, and the mounting of the light emitting diode 1 on the printed circuit board 40 is completed.

[0007]

However, in the conventional printed circuit board 40, the pin 2 of the light emitting diode 1 is not provided.
Since the diameters of the mounting holes 42 through which the light-emitting diodes 1 are inserted are large and all have the same dimensions, the light-emitting diode 1 rises from the printed circuit board 40 as shown in FIG. 4 or the light emitting diode 1 may be obliquely attached to the printed circuit board 40 as shown in FIG.

Accordingly, the present invention provides a method for manufacturing a printed circuit board on which a light emitting diode is mounted, even if an external force is applied when the printed circuit board is soldered.
An object of the present invention is to provide a printed circuit board for mounting a light emitting diode, in which a light emitting diode mounted on a substrate does not rise from the substrate and the light emitting diode is correctly soldered to the substrate, without increasing the manufacturing cost of the printed circuit board.

[0009]

According to the present invention, there is provided a light emitting diode mounting board according to the present invention, which has a plurality of component mounting holes, a circuit pattern made of a conductive metal provided on a back surface, and the mounting component holes. Some are drilled through this circuit pattern, except for the solder connection portion between the mounting leg of the electronic component inserted into the component mounting hole and the circuit pattern,
A printed circuit board in which the circuit pattern is coated with a resist which is an insulating film, wherein the light emitting diode is mounted on a light emitting diode mounting board on which a surface emitting light emitting diode having a plurality of mounting legs is mounted. Of the plurality of mounting holes, the diameter of at least two mounting holes was formed to be substantially the same as the diameter in a state where the mounting legs of the light emitting diode can be inserted, and smaller than the diameters of the other mounting holes. It is characterized by:

In practice, the diameter of the mounting holes for the at least two light emitting diodes is at least 0.1 mm + the diameter of the light emitting diode legs, and the diameter of the remaining light emitting diode mounting holes is the diameter of the light emitting diode legs. Is preferably equal to or more than the diameter of 0.3 mm.

[0011]

According to the light emitting diode mounting substrate of the present invention,
Since the diameter of at least two of the plurality of mounting holes for mounting the light emitting diode is formed to be substantially the same as the diameter of the mounting leg of the light emitting diode in a state where the mounting leg can be inserted therethrough, The mounting legs of the light emitting diode inserted into the two mounting holes have no play,
With a slight external force, the posture of the light emitting diode on the substrate does not change, and the light emitting diode does not rise from the substrate.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1A is a plan view showing a structure of a light emitting diode mounting printed circuit board 10 (hereinafter referred to as a light emitting diode mounting board 10) according to an embodiment of the present invention.
For example, for mounting a light emitting diode with 14 dual in-line pins. Fig. 1 (a)
In the figure, the two-dot chain line 4 indicates the position where the light emitting diode is attached.

The light emitting diode mounting substrate 1 of this embodiment
0 is provided with 14 mounting holes 11 to 24 corresponding to the pin positions of the light emitting diodes.
Constitute one row, and the mounting holes 18 to 24 constitute the other row. The mounting holes 11 to 16 and the mounting holes 18
The diameters of the mounting holes 17 and 24 located on the diagonal line of the square connecting the mounting holes 11, 17, 18, and 24 are formed to be 0.6 mm. ing. The reason why the diameters of the mounting holes 17 and 24 are 0.6 mm is that the diameter of the pin of the light emitting diode is generally 0.5 mm (max).

FIG. 2 is a perspective view showing a state in which the surface-emitting light emitting diode 1 is mounted on the light emitting diode mounting substrate 10 of the embodiment configured as described above. As described above, the surface-emitting light emitting diode 1 is provided with a plurality of pins 2 serving as a plurality of mounting legs in two rows (dual in-line), and the light emitting diode mounting substrate 1 of this embodiment is provided.
At the time of attachment to the pin 0, the pin 2 is attached to the attachment holes 17 and 24 while being aligned.

FIG. 1B shows a cross section taken along the line XX of FIG. 1A in a state where the light emitting diode 1 is mounted on the light emitting diode mounting substrate 10 as shown in FIG. As can be seen from this figure, there is sufficient play between the mounting holes 11 to 16 and the pin 2 of the light emitting diode 1, but there is no play between the mounting hole 17 and the pin 2 of the light emitting diode 1. The pin 2 is inserted into the mounting hole 17 with almost no gap. Similarly, in the other row, the mounting holes 18 to
Although there is sufficient play between the light emitting diode 23 and the pin 2 of the light emitting diode 1, there is no play between the mounting hole 24 and the pin 2 of the light emitting diode 1, and the pin 2 is inserted into the mounting hole 24 with almost no gap. Have been.

As described above, in the light-emitting diode mounting substrate 10 of this embodiment, the light-emitting diode 1 is defined by the mounting holes 17 and 24 on the diagonal line so that the mounting position does not change.

Therefore, even when an external force such as vibration from the outside is applied during soldering or the like, the light emitting diode 1 may rise from the light emitting diode mounting substrate 10 or may be inclined with respect to the light emitting diode mounting substrate 10. Very low.

FIG. 3A shows the structure of a light emitting diode mounting substrate 10 'according to another embodiment of the present invention. The mounting holes 11 to 13, the mounting holes 15 to 20, and the mounting holes 22 to 22 are shown.
The diameter of the mounting hole 14 and the mounting hole 21 is 0.6 mm, which is the same as the conventional example.
Also in this embodiment, the mounting holes 14 and 21 define that the posture of the light-emitting diode 1 when mounted is not changed.

FIG. 3 (b) shows the structure of a light emitting diode mounting board 10 "according to another embodiment of the present invention.
In this embodiment, three mounting holes 11, 17 and 21 are formed to have a diameter of 0.6 mm, and the remaining mounting holes 12 to 16, 18 to 20 and 22 to 24 are 0.8 mm in diameter.
Is formed. In this embodiment, the mounting position of the light emitting diode 1 is defined to be unchanged at three points of the mounting holes 11, 17 and 21.

As described above, according to the present invention, the mounting position of the light emitting diode on the substrate is hardly changed after the mounting of the light emitting diode on the substrate by providing a plurality of mounting holes on the substrate which are not different from the diameter of the pins of the light emitting diode mounted on the substrate. Further, according to the present invention, the diameter of the mounting hole is only partially changed, which does not increase the cost of the substrate.

[0022]

[Effects of the Invention] As described above, according to the present invention,
Even if an external force is applied during soldering of the printed circuit board on which the light emitting diode is mounted, the light emitting diode mounted on the substrate does not rise from the substrate, and the light emitting diode is correctly soldered to the substrate. Moreover,
The configuration of the light emitting diode mounting substrate of the present invention does not increase the manufacturing cost of the printed circuit board.

[Brief description of the drawings]

1A is a plan view showing a configuration of a light emitting diode mounting substrate according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view showing a state where a light emitting diode is mounted on the substrate of FIG. is there.

FIG. 2 is a perspective view illustrating a state where a light emitting diode is mounted on the light emitting diode mounting substrate of FIG. 1 (a).

3 (a) is a plan view of a light emitting diode mounting board according to another embodiment of the present invention, and FIG. 3 (b) is a plan view of a light emitting diode mounting board according to still another embodiment of the present invention. .

FIG. 4 is a perspective view illustrating how a light emitting diode is mounted on a conventional printed circuit board.

5 (a) is a cross-sectional view of a light emitting diode mounted on a substrate as shown in FIG. 4 after soldering, and FIG. 5 (b) is a cross-sectional view showing a state where a light emitting diode is lifted off the substrate during soldering. (C) is a cross-sectional view showing a state where the light emitting diode is obliquely attached to the substrate during soldering.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 light emitting diode 2 light emitting diode pin 3 solder 10 light emitting diode mounting substrate 10 ′ of one embodiment of the present invention 10 ′ light emitting diode mounting substrate of another embodiment of the present invention 10 ″ light emission of still another embodiment of the present invention Diode mounting board 11-24 Mounting hole

Claims (2)

(57) [Scope of request for utility model registration] 1. A plurality of component mounting holes, a circuit pattern made of a conductive metal is provided on a back surface, and some of the mounting component holes are drilled through the circuit pattern. A printed circuit board in which the circuit pattern is covered with a resist that is an insulating film, except for a solder connection portion between the mounting leg of the electronic component to be inserted and the circuit pattern, and includes a plurality of mounting legs. In a light emitting diode mounting substrate to which a surface emitting light emitting diode is mounted, at least two mounting holes out of a plurality of mounting holes for mounting the light emitting diode can be inserted with the mounting legs of the light emitting diode. A substrate for mounting a light-emitting diode, wherein the substrate is formed to have substantially the same diameter as the diameter of the other mounting holes in the state. 2. The method of claim 2, wherein the diameter of the mounting holes for the at least two light emitting diodes is equal to the diameter of the light emitting diode legs plus 0.1.
2. The light emitting diode mounting board according to claim 1, wherein the diameter is not less than 0.3 mm, and the diameter of the remaining mounting hole for the light emitting diode is not less than the diameter of the leg of the light emitting diode + 0.3 mm.