JP2009038163A - Structure for preventing pattern peeling of leg portion in connection electric component - Google Patents
Structure for preventing pattern peeling of leg portion in connection electric component Download PDFInfo
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- JP2009038163A JP2009038163A JP2007200275A JP2007200275A JP2009038163A JP 2009038163 A JP2009038163 A JP 2009038163A JP 2007200275 A JP2007200275 A JP 2007200275A JP 2007200275 A JP2007200275 A JP 2007200275A JP 2009038163 A JP2009038163 A JP 2009038163A
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Abstract
Description
本発明は、プリント基板に実装され、外部からの抜き差しにより接続されるジャック等の接続電気部品の足部分のパターンの剥がれを防ぐようにした接続電気部品の足部分のパターン剥がれ防止構造に関するものである。 The present invention relates to a pattern peeling prevention structure for a foot portion of a connecting electrical component that is mounted on a printed circuit board and prevents a pattern peeling of a foot portion of a connecting electrical component such as a jack that is connected by external insertion and removal. is there.
従来、ジャックをプリント基板に実装するには、図３（ａ）（ｂ）に示すように、プリント基板１０１に形成された穴１０２に挿入されるジャック１０３の足１０４の半田１０５が付く部分は、ジャック１０３の足１０４の周りだけであるために、ジャック１０３への抜き差しにより、足１０４の部分のパターンが剥がれ易く、端子実挿抜・端子静荷重・端子抉り力の３種類の外部端子強度試験に対応することができないという問題があった。 Conventionally, in order to mount a jack on a printed circuit board, as shown in FIGS. 3A and 3B, a portion to which the solder 105 of the foot 104 of the jack 103 to be inserted into the hole 102 formed in the printed circuit board 101 is attached. Because it is only around the leg 104 of the jack 103, the pattern of the leg 104 is easily peeled off by inserting / removing it to / from the jack 103, and the three types of external terminal strength tests of terminal insertion / extraction, terminal static load, and terminal twisting force There was a problem that it was not possible to cope with.
第１の従来技術を図４（ａ）（ｂ）（ｃ）に示す。この従来の回路基板実装部品のリード構造は、図４（ａ）（ｂ）（ｃ）に示すように、ＩＳＭ型端子部品２０６のリードのそれぞれを、互いに同一面上にある表面実装用のＳＭリード部２６２とそれに垂直な挿入実装用のＩＭリード部２６１とで構成し、ＩＳＭ用プリント板２０７にはパッド２７２とその領域内のスルーホール２７１とを形成する。スルーホール２７１にＩＭリード部２６１を挿入して実装することによって、表面実装法及び挿入実装法のいずれの工法によっても実装が可能であり、スルーホール２７１及びパッド２７２の両所への半田接合によって接合強度が大幅に増大する。（例えば、特許文献１参照）。 The first prior art is shown in FIGS. 4 (a), (b) and (c). As shown in FIGS. 4A, 4B, and 4C, the conventional lead structure of the circuit board mounting component is such that each of the leads of the ISM type terminal component 206 is a surface mounting SM on the same plane. The lead portion 262 and the IM lead portion 261 for insertion mounting perpendicular to the lead portion 262 are formed, and a pad 272 and a through hole 271 in the region are formed on the ISM printed board 207. By mounting the IM lead part 261 by inserting it into the through hole 271, mounting is possible by either the surface mounting method or the insertion mounting method. Bond strength is greatly increased. (For example, refer to Patent Document 1).
ところが、これにおいては、他の部品のリードのランドを共有するものではなく、また、半田盛りが薄いものであった。
本発明は、上記従来の問題に鑑みてなされたものであって、ジャック等の接続電気部品の信号端子パターンから別部品の足のランドまで半田が付くようにすることにより、端子実挿抜・端子静荷重・端子抉り力に耐えることができ、外部端子強度試験の規格改定に対応することができる接続電気部品の足部分のパターン剥がれ防止構造を提供することを目的としている。 The present invention has been made in view of the above-described conventional problems, and by connecting solder from a signal terminal pattern of a connecting electrical component such as a jack to a land of a foot of another component, an actual terminal insertion / extraction / terminal An object of the present invention is to provide a pattern peeling prevention structure for a foot portion of a connecting electrical component that can withstand a static load and a terminal twisting force and can cope with a revised standard of an external terminal strength test.
本発明は、上記課題を解決するために提案されたものであって、請求項１に記載の発明は、プリント基板に実装され、外部からの抜き差しにより接続されるジャック等の接続電気部品の足部分のパターンの剥がれを防ぐようにした接続電気部品の足部分のパターン剥がれ防止構造であって、前記接続電気部品の足部分の半田が付く部分を前記接続電気部品の信号端子パターンから前記プリント基板に実装された別部品の足ランドまで連設したことを特徴としている。 The present invention has been proposed in order to solve the above-mentioned problems. The invention according to claim 1 is a circuit board mounted on a printed circuit board and connected to a connecting electrical component such as a jack connected by external insertion / extraction. A pattern peeling prevention structure for a foot portion of a connecting electrical component that prevents peeling of a pattern of the portion, wherein a soldered portion of the foot portion of the connecting electrical component is moved from the signal terminal pattern of the connecting electrical component to the printed circuit board. It is characterized by the fact that it is connected to the foot lands of different parts mounted on.
請求項２に記載の発明は、請求項１に記載の発明において、前記別部品が前記接続電気部品と電気的に接続されるものであり、前記接続電気部品の近傍に配置されている電気部品である。 According to a second aspect of the present invention, in the first aspect of the present invention, the separate component is electrically connected to the connection electrical component, and is disposed in the vicinity of the connection electrical component. It is.
請求項３に記載の発明は、請求項１に記載の発明において、前記別部品が前記接続電気部品の近傍に配置されたジャンパー線である。 A third aspect of the present invention is the jumper wire according to the first aspect, wherein the separate component is disposed in the vicinity of the connecting electrical component.
請求項４に記載の発明は、請求項１乃至３のいずれかに記載の発明において、前記接続電気部品の足部分から前記別部品の足ランドまでの前記半田が付く部分の面積が広く形成されている。 According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, an area of the portion to which the solder is attached from the foot portion of the connecting electrical component to the foot land of the separate component is formed wide. ing.
請求項１に記載の発明によれば、ジャック等の接続電気部品の信号端子パターンから別部品の足のランドまで半田が付くようにすることにより、端子実挿抜・端子静荷重・端子抉り力に耐えることができ、外部端子強度試験の規格改定に対応することができる。このことにより、接続電気部品の足部分のパターンの剥がれを確実に防止することができる。尚、半田が付く部分とはランドになっている部分である。 According to the first aspect of the present invention, the solder is attached from the signal terminal pattern of the connecting electrical part such as the jack to the land of the leg of the separate part, so that the terminal actual insertion / extraction, the terminal static load, and the terminal twisting force can be reduced. It can withstand, and can cope with the revision of the standard of external terminal strength test. Thereby, peeling of the pattern of the foot portion of the connecting electrical component can be reliably prevented. The soldered portion is a land portion.
請求項２に記載の発明によれば、別部品が接続電気部品と電気的に接続される電気部品であるから、接続電気部品と電気部品を簡単に電気的に接続することができる。また、電気部品が接続電気部品の近傍に配置されているから、接続電気部品の足部分の半田が付く部分を電気部品の足ランドまで連設し易い利点がある。 According to the second aspect of the present invention, since the separate component is an electrical component that is electrically connected to the connection electrical component, the connection electrical component and the electrical component can be easily electrically connected. Further, since the electrical component is disposed in the vicinity of the connection electrical component, there is an advantage that the soldered portion of the foot portion of the connection electrical component can be easily connected to the foot land of the electrical component.
請求項３に記載の発明によれば、別部品が接続電気部品の近傍に配置されたジャンパー線であるから、接続電気部品の近傍に別の電気部品が存在しなくても、このジャンパー線の足部分まで半田が付く部分を連設して補強することができ、パターンの剥がれを確実に防止することができる。 According to the invention described in claim 3, since the separate part is a jumper wire arranged in the vicinity of the connecting electrical part, even if there is no other electrical part in the vicinity of the connecting electrical part, The part where the solder is attached to the foot part can be connected and reinforced, and the peeling of the pattern can be reliably prevented.
請求項４に記載の発明によれば、接続電気部品の足部分から別部品までの半田が付く部分の面積を広くしたから、この広い範囲の半田によって補強して接続電気部品の足部分のパターンの剥がれを防止することができる。 According to the invention described in claim 4, since the area of the portion where the solder from the foot portion of the connecting electrical component to another component is attached is widened, the pattern of the foot portion of the connecting electrical component is reinforced by this wide range of solder. Can be prevented.
以下、本発明に係る接続電気部品の足部分のパターン剥がれ防止構造の実施の形態について、図を参照しつつ説明する。尚、以下の実施形態では接続電気部品としてジャックについて説明するが、これに限らす、スイッチ等の他の接続電気部品にも適用できるものである。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a pattern peeling prevention structure for a foot portion of a connecting electrical component according to the present invention will be described below with reference to the drawings. In the following embodiments, a jack is described as a connection electrical component. However, the present invention is not limited to this, and can be applied to other connection electrical components such as a switch.
図１は本発明の第１実施形態の接続電気部品（ジャック）の足部分のパターン剥がれ防止構造を示し、（ａ）はそのジャックを実装する前のプリント基板の裏面図、（ｂ）はそのジャックを実装してプリント基板を裏返しした状態の正面図である。 FIG. 1 shows a pattern peeling prevention structure of a foot portion of a connecting electrical component (jack) according to a first embodiment of the present invention, (a) is a back view of a printed circuit board before the jack is mounted, and (b) is that figure. It is a front view of the state which mounted the jack and the printed circuit board was turned over.
この第１実施形態は、図１（ａ）（ｂ）に示すように、プリント基板１にジャック２の足３が挿入される穴４が形成され、この穴４の近傍にアキシャルコイル５の足６が挿入される穴７が形成されている。更に、ジャック２の足３部分の半田Ｈが付く部分即ちランド８がジャック２の信号端子パターンからアキシャルコイル５の足６のランドまで連設されている。この半田Ｈが付く部分（ランド８）は略方形に形成されていて、その面積が広く形成されている。図１（ｂ）に示すように、半田Ｈはジャック２の足３部分からアキシャルコイル５の足６部分までの半田が付く部分の全体に盛られている。また、アキシャルコイル５はジャック２の近傍に配置されている。尚、この第１実施形態では、アキシャルコイル５について説明したが、他の抵抗やコンデンサが配置されているものにも適用できるものである。 In the first embodiment, as shown in FIGS. 1A and 1B, a hole 4 into which the foot 3 of the jack 2 is inserted is formed in the printed circuit board 1, and the foot of the axial coil 5 is formed in the vicinity of the hole 4. A hole 7 into which 6 is inserted is formed. Further, a portion where the solder H is attached to the foot 3 portion of the jack 2, that is, a land 8 is continuously provided from the signal terminal pattern of the jack 2 to the land of the foot 6 of the axial coil 5. The portion to which the solder H is attached (land 8) is formed in a substantially square shape and has a large area. As shown in FIG. 1B, the solder H is deposited on the entire portion where the solder is attached from the foot 3 portion of the jack 2 to the foot 6 portion of the axial coil 5. Further, the axial coil 5 is disposed in the vicinity of the jack 2. In the first embodiment, the axial coil 5 has been described. However, the present invention can also be applied to a structure in which other resistors and capacitors are arranged.
従って、この第１実施形態によれば、ジャック２の信号端子パターンからアキシャルコイル５の足６のランドまで半田Ｈが付くようにすることにより、端子実挿抜・端子静荷重・端子抉り力に耐えることができ、外部端子強度試験の規格改定に対応することができる。このことにより、ジャック２の足３部分のパターンの剥がれを確実に防止することができる。また、アキシャルコイル５がジャック２と電気的に接続される電気部品であるから、ジャック２とアキシャルコイル５を簡単に電気的に接続することができる。また、アキシャルコイル５がジャック２の近傍に配置されているから、ジャック２の足３部分の半田Ｈが付く部分をアキシャルコイル５の足ランドまで連設し易い利点がある。更に、ジャック２の足３部分からアキシャルコイル５の足６部分までの半田Ｈが付く部分の面積を広くしたから、この広い範囲の半田Ｈによって補強してジャック２の足３部分のパターンの剥がれを防止することができる。 Therefore, according to the first embodiment, the solder H is applied from the signal terminal pattern of the jack 2 to the land of the foot 6 of the axial coil 5 to withstand the actual terminal insertion / extraction, terminal static load, and terminal twisting force. It is possible to cope with the revision of the standard of the external terminal strength test. Thereby, peeling of the pattern of the foot 3 portion of the jack 2 can be reliably prevented. Moreover, since the axial coil 5 is an electrical component that is electrically connected to the jack 2, the jack 2 and the axial coil 5 can be easily electrically connected. Further, since the axial coil 5 is disposed in the vicinity of the jack 2, there is an advantage that a portion where the solder H of the foot 3 portion of the jack 2 is attached can be easily provided to the foot land of the axial coil 5. Furthermore, since the area of the portion where the solder H is attached from the foot 3 portion of the jack 2 to the foot 6 portion of the axial coil 5 is widened, the pattern of the foot 3 portion of the jack 2 is peeled off by reinforcement with this wide range of solder H. Can be prevented.
図２は第２実施形態の接続電気部品（ジャック）の足部分のパターン剥がれ防止構造を示し、（ａ）はそのジャックを実装する前のプリント基板の裏面図、（ｂ）はそのジャックを実装してプリント基板を裏返しした状態の正面図である。 2A and 2B show a pattern peeling prevention structure of a foot portion of a connecting electrical component (jack) according to the second embodiment. FIG. 2A is a rear view of a printed circuit board before mounting the jack, and FIG. 2B is mounting the jack. It is the front view of the state where the printed circuit board was turned upside down.
この第２実施形態は、図２（ａ）（ｂ）に示すように、プリント基板１に実装されたジャック２の近傍にジャンパー線９を配置し、ジャック２の足３部分の半田Ｈが付く部分（ランド１０）をジャック２の信号端子パターンからジャンパー線９の足９ａ部分まで連設している。 In the second embodiment, as shown in FIGS. 2A and 2B, a jumper wire 9 is disposed in the vicinity of the jack 2 mounted on the printed circuit board 1 and the solder H of the foot 3 portion of the jack 2 is attached. A portion (land 10) is continuously provided from the signal terminal pattern of the jack 2 to the leg 9a portion of the jumper wire 9.
従って、この第２実施形態によれば、ジャック２の近傍に別の電気部品が存在しなくても、このジャンパー線９の足９ａ部分まで半田Ｈが付く部分（ランド１０）を連設して補強することができ、パターンの剥がれを確実に防止することができる。 Therefore, according to the second embodiment, even if there is no other electrical component in the vicinity of the jack 2, the portion (land 10) where the solder H is attached to the leg 9a portion of the jumper wire 9 is provided continuously. It is possible to reinforce and reliably prevent peeling of the pattern.
Ｈ 半田
１ プリント基板
２ ジャック
３ 足
４ 穴
５ アキシャルコイル
６ 足
７ 穴
８ ランド
９ ジャンパー線
９ａ 足
１０ ランド
H Solder 1 Printed circuit board 2 Jack 3 Foot 4 Hole 5 Axial coil 6 Foot 7 Hole 8 Land 9 Jumper wire 9a Foot 10 Land
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007200275A JP2009038163A (en) | 2007-08-01 | 2007-08-01 | Structure for preventing pattern peeling of leg portion in connection electric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007200275A JP2009038163A (en) | 2007-08-01 | 2007-08-01 | Structure for preventing pattern peeling of leg portion in connection electric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2009038163A true JP2009038163A (en) | 2009-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007200275A Pending JP2009038163A (en) | 2007-08-01 | 2007-08-01 | Structure for preventing pattern peeling of leg portion in connection electric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009038163A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013179404A1 (en) | 2012-05-30 | 2013-12-05 | 三洋電機株式会社 | Electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326443A (en) * | 2000-05-15 | 2001-11-22 | Rb Controls Co | Method of mounting electrical component |
| JP2004006538A (en) * | 2002-05-31 | 2004-01-08 | Toshiba Corp | Securing structure of connector, printed wiring board, and connector securing method |
-
2007
- 2007-08-01 JP JP2007200275A patent/JP2009038163A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326443A (en) * | 2000-05-15 | 2001-11-22 | Rb Controls Co | Method of mounting electrical component |
| JP2004006538A (en) * | 2002-05-31 | 2004-01-08 | Toshiba Corp | Securing structure of connector, printed wiring board, and connector securing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013179404A1 (en) | 2012-05-30 | 2013-12-05 | 三洋電機株式会社 | Electronic device |
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