JP2007005638A

JP2007005638A - Mounting structure of single-sided board

Info

Publication number: JP2007005638A
Application number: JP2005185291A
Authority: JP
Inventors: Kenichi Kamata; 謙一鎌田
Original assignee: Murata Machinery Ltd
Current assignee: Murata Machinery Ltd
Priority date: 2005-06-24
Filing date: 2005-06-24
Publication date: 2007-01-11

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a single-sided board wherein, even if mounting on the side of the solder surface of the board an electronic component having a plurality of connecting terminals, the efficiency of mounting work is favorable and a soldering defect hardly occurs. <P>SOLUTION: In the mounting structure of the single-sided board 1, one surface is formed as a component mounting surface 1a, and the other surface is formed as a solder surface 1b. A pair of jumper-wire holes 1d is formed corresponding to each of inserting holes 1c of a connecting terminal 2a of an electronic component 2 to be mounted. Further, the connecting terminal 2a of the electronic component 2 mounted on the solder face 1b is so protruded from the inserting hole 1c to the side of the component mounting surface 1a, and the protruded connecting terminal 2a is fixed to a jumper wire J that is wired at the component mounting surface 1a side from the pair of jamper wire holes 1d. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、一方の面を部品実装面、他方の面を導体パターンが形成されたはんだ面とした片面基板の実装構造に関し、詳しくは、ジャンパ線を用いてはんだ面側に電子部品を容易に実装可能とした片面基板の実装構造に関する。 The present invention relates to a single-sided board mounting structure in which one surface is a component mounting surface and the other surface is a solder surface on which a conductor pattern is formed. Specifically, electronic components can be easily placed on the solder surface side using jumper wires. The present invention relates to a single-sided board mounting structure that can be mounted.

従来より、抵抗、コンデンサ、半導体チップ等の電子部品を実装し、電子回路を構成する回路基板の構造としては、両面に導体パターンを備えた両面基板、ウエハース状に絶縁体と導体パターンとを積み重ねた多層基板等種々あるが、その中でも安価で大量生産も可能な構造として、上述のような片面のみに導体パターンを備えた片面基板が知られている。
該片面基板を電子機器等の操作パネルのように、部品実装面側に電子部品を実装させるスペースが少ない所の電子回路として用いる場合、実装する電子部品が大型であったり、高さのあるものであると、操作パネルの厚みが増してしまうため、回路設計上、部品実装面側に電子部品が実装できないという問題がある。
そこで、上記問題を解消すべく図３に示すように部品実装面ではなく、はんだ面側へ電子部品を実装させる場合がある。図中、１００は回路基板、１００ａは部品実装面、１００ｂははんだ面、２００は電子部品、２００ａはリード（接続端子）、３００ははんだ、４００はランドを示している。 Conventionally, electronic circuit components such as resistors, capacitors, and semiconductor chips are mounted, and the structure of a circuit board that constitutes an electronic circuit is a double-sided board with a conductor pattern on both sides, and an insulator and a conductor pattern stacked in a wafer shape. There are various types such as a multi-layer substrate. Among them, a single-sided substrate having a conductor pattern only on one side as described above is known as a structure that is inexpensive and can be mass-produced.
When this single-sided board is used as an electronic circuit where there is little space for mounting electronic components on the component mounting surface side, such as an operation panel of an electronic device, the electronic components to be mounted are large or high If this is the case, the thickness of the operation panel increases, so that there is a problem that electronic components cannot be mounted on the component mounting surface side in terms of circuit design.
Therefore, in order to solve the above problem, there is a case where an electronic component is mounted not on the component mounting surface but on the solder surface side as shown in FIG. In the figure, 100 is a circuit board, 100a is a component mounting surface, 100b is a solder surface, 200 is an electronic component, 200a is a lead (connection terminal), 300 is solder, and 400 is a land.

しかし、図３に示す例のように、はんだ面１００ｂ側に電子部品２００を実装させた場合、電子部品２００が抵抗やコンデンサ等のように、リード（接続端子）のピッチが比較的空いているものであれば作業面に問題は生じないが、リードを多数備えており、そのピッチが狭小なＤＩＰ等の半導体チップをはんだ付けする場合は、はんだごての先がリードの根元に入りにくいため、作業が難しく、はんだ不良を起こしやすいという問題があった。
特開平７−３３６０２９号公報 However, when the electronic component 200 is mounted on the solder surface 100b side as in the example shown in FIG. 3, the electronic component 200 has a relatively free lead (connection terminal) pitch, such as a resistor or a capacitor. If there is no problem on the work surface, it has many leads, and when soldering a DIP or other semiconductor chip with a narrow pitch, the tip of the soldering iron is difficult to enter the root of the lead The problem is that the work is difficult and the soldering is liable to occur.
Japanese Unexamined Patent Publication No. 7-336029

ところで回路基板に電子部品を実装する際に、ジャンパ線を使用して実装する技術として、上記特許文献１に記載のものがある。
しかしながら、このものは、電源トランス等の大型の電子部品を実装する際に、ジャンパ線を利用してはんだ付けを補強する技術であって、ジャンパ線を使用してはんだ面側に電子部品を実装するものではない。 By the way, when mounting an electronic component on a circuit board, there is one described in Patent Document 1 as a technique for mounting using a jumper wire.
However, this is a technology that reinforces soldering using jumper wires when mounting large electronic components such as power transformers. Electronic components are mounted on the solder side using jumper wires. Not what you want.

本発明は、このような問題を解決するために提案されるものであり、複数の接続端子を有する電子部品をはんだ面側に実装する場合でも、作業効率がよくはんだ不良を起こしにくい片面基板の実装構造を提供することを目的としている。 The present invention is proposed in order to solve such a problem, and even when an electronic component having a plurality of connection terminals is mounted on the solder surface side, the single-sided board has high work efficiency and hardly causes solder failure. The purpose is to provide a mounting structure.

上記目的を達成するために、請求項１の発明に係る片面基板の実装構造は、一方の面を部品実装面、他方の面を導体パターンが形成されたはんだ面とし、実装すべき電子部品の接続端子の挿着孔のそれぞれに対応した一組のジャンパ線孔部が形成された片面基板の実装構造であって、上記電子部品は、上記はんだ面側に実装され、その接続端子を上記挿着孔より上記部品実装面側に突出させるとともに、この突出させた接続端子を、上記一組のジャンパ線孔部より上記部品実装面側に配線させたジャンパ線にはんだで固定させたことを特徴とする。
また本発明において、請求項２のように、上記電子部品は、複数の接続端子を有する半導体チップとすることができる。半導体チップとしては、例えばＤＩＰ、ＳＤＩＰ等、多ピンで構成されるものが挙げられる。 In order to achieve the above object, the mounting structure of the single-sided board according to the invention of claim 1 is characterized in that one surface is a component mounting surface and the other surface is a solder surface on which a conductor pattern is formed, A mounting structure of a single-sided board in which a pair of jumper wire holes corresponding to each insertion hole of a connection terminal is formed, wherein the electronic component is mounted on the solder surface side, and the connection terminal is inserted into the insertion side. The protruding connecting terminal is protruded from the mounting hole to the component mounting surface side, and the protruding connection terminal is fixed to the jumper wire wired from the set of jumper wire hole portions to the component mounting surface side by solder. And
In the present invention, as in claim 2, the electronic component may be a semiconductor chip having a plurality of connection terminals. Examples of the semiconductor chip include those composed of multiple pins such as DIP and SDIP.

本発明の請求項１によれば、片面基板においてはんだ面側に電子部品を実装させたい場合であっても、挿着孔より部品実装面側に電子部品の接続端子を突出させるとともに、この突出させた接続端子を、一組のジャンパ線孔部より部品実装面側に配線させたジャンパ線にはんだで固定させることができる。
すなわち、ジャンパ線を用いることにより、部品実装面側ではんだ付けを行うことができるので、従来のように、はんだごてを電子部品の接続端子の根元にもぐりこませるような困難さを解消することができ、作業効率をよくすることできる。またはんだ付けを適確に行うことができるので、はんだ不良を防ぐことができる。更に、部品実装面側に電子部品を実装させるスペースが少ない操作パネル等の電子回路を構成する回路基板として適用可能である。 According to the first aspect of the present invention, even when the electronic component is to be mounted on the solder surface side in the single-sided board, the connection terminal of the electronic component protrudes from the insertion hole to the component mounting surface side. The connected connection terminals can be fixed by solder to jumper wires wired from the set of jumper wire holes to the component mounting surface side.
That is, by using a jumper wire, it is possible to perform soldering on the component mounting surface side, so that the difficulty of passing the soldering iron into the base of the connection terminal of the electronic component as in the past is eliminated. Can improve work efficiency. Moreover, since soldering can be performed accurately, defective solder can be prevented. Furthermore, the present invention can be applied as a circuit board constituting an electronic circuit such as an operation panel having a small space for mounting an electronic component on the component mounting surface side.

本発明の請求項２によれば、電子部品は、複数の接続端子を有する半導体チップとすることができる。よって接続端子の数が多く、そのピッチが狭小であっても、はんだ付けの作業が容易で、作業効率をよくすることができる。またはんだ付けを適確に行うことができるので、はんだ不良を防ぐことができる。更に部品実装面側に電子部品を実装させるスペースが少ない操作パネル等の電子回路を構成する回路基板として適用可能である。 According to claim 2 of the present invention, the electronic component can be a semiconductor chip having a plurality of connection terminals. Therefore, even if the number of connection terminals is large and the pitch is narrow, the soldering operation is easy and the work efficiency can be improved. Moreover, since soldering can be performed accurately, defective solder can be prevented. Furthermore, the present invention can be applied as a circuit board constituting an electronic circuit such as an operation panel having a small space for mounting an electronic component on the component mounting surface side.

以下に、本発明の実施の形態について説明する。 Embodiments of the present invention will be described below.

図１（ａ）は、図１（ｂ）のＡ−Ａ線拡大断面図、（ｂ）は本発明が採用された回路基板を部品実装面側上部からみた模式図、図２は本発明の片面基板の実装構造の例を示す部分斜視図である。なお、図２は説明のため、はんだ面側からみた実装状態を示している。また図では電子部品として、ＤＩＰ（Ｄｕａｌ
Ｉｎ−ｌｉｎｅｐａｃｋａｇｅ）型の半導体チップを示している。
回路基板１は、一方の面を抵抗、コンデンサ等の電子部品２が実装される部品実装面１ａとし、他方の面を導体パターンが形成され、フロー方式等によりはんだ付けがされるはんだ面１ｂとで構成される片面基板構造をなす。
通常は部品実装面１ａに電子部品２を実装し、その部品間を電気的に接続して電子回路を構成するが、部品実装面１ａ側に電子部品２を実装させるスペースが少ない操作パネル等の電子回路を構成する回路基板として適用する場合、回路設計上、はんだ面１ｂ側に電子部品２を実装させる場合がある。 1A is an enlarged cross-sectional view taken along line AA of FIG. 1B, FIG. 1B is a schematic view of a circuit board in which the present invention is adopted, as viewed from the upper part on the component mounting surface side, and FIG. It is a fragmentary perspective view which shows the example of the mounting structure of a single-sided board | substrate. For the sake of explanation, FIG. 2 shows a mounted state as seen from the solder surface side. In the figure, DIP (Dual (Dual) is used as an electronic component.
An in-line package type semiconductor chip is shown.
The circuit board 1 has one surface as a component mounting surface 1a on which electronic components 2 such as resistors and capacitors are mounted, and the other surface has a solder surface 1b on which a conductor pattern is formed and soldered by a flow method or the like. A single-sided substrate structure composed of
Normally, an electronic component 2 is mounted on the component mounting surface 1a, and the electronic circuit 2 is configured by electrically connecting the components. However, an operation panel or the like having a small space for mounting the electronic component 2 on the component mounting surface 1a side is used. When applied as a circuit board constituting an electronic circuit, the electronic component 2 may be mounted on the solder surface 1b side in circuit design.

そのようなはんだ面１ｂ側に実装させる電子部品２に対応して、回路基板１には、挿着孔１ｃ（スルーホール）が形成され、該挿着孔１ｃのそれぞれに対応して一組のジャンパ線孔部１ｄが設けられる。上記孔部１ｄのはんだ面１ｂ側表面周囲には、はんだ面１ｂに形成される導体パターンと電気的に導通させるためのランド４が形成されており、はんだ面１ｂに形成される導体パターンと電子部品２を電気的に接続するジャンパ線Ｊが、いずれか一方の孔部１ｄのはんだ面１ｂから部品実装面１ａ側へと引き出され、挿着孔１ｃを挟んで相対するもう一方の孔部１ｄへはんだ付けされる。図中３ははんだを示している。
上記孔部１ｄは、図１（ｂ）に示すように、挿着孔１ｃの近傍に一対に設けられており、ジャンパ線Ｊが、挿着孔１ｃを跨ぐように配線され、ジャンパ線Ｊの略中央の位置に電子部品２の接続端子２ａが位置するように形成される。 Corresponding to the electronic component 2 to be mounted on the solder surface 1b side, an insertion hole 1c (through hole) is formed in the circuit board 1, and a set corresponding to each of the insertion holes 1c. A jumper wire hole 1d is provided. Around the surface of the hole 1d on the solder surface 1b side, lands 4 are formed for electrical connection with the conductor pattern formed on the solder surface 1b. The conductor pattern and the electron formed on the solder surface 1b The jumper wire J for electrically connecting the component 2 is drawn from the solder surface 1b of one of the holes 1d to the component mounting surface 1a side, and the other hole 1d opposed to the insertion hole 1c. Soldered to In the figure, 3 indicates solder.
As shown in FIG. 1B, the hole 1d is provided in a pair near the insertion hole 1c, and the jumper wires J are wired so as to straddle the insertion holes 1c. The connection terminal 2a of the electronic component 2 is formed so as to be located at a substantially central position.

はんだ面１ｂ側に実装させた電子部品２の接続端子２ａは、挿着孔１ｃよりはんだ面１ｂ側から部品実装面１ａ側へ突出させるとともに、この突出させた接続端子２ａを、上記孔部１ｄより部品実装面１ａ側に突出させた１本のジャンパ線Ｊとはんだ５で固定される。
このように、ジャンパ線Ｊがはんだ面１ｂに形成される導体パターンと電気的に導通されているので、電子部品２の接続端子２ａは、ジャンパ線Ｊを通じて接続すべき導体パターンと導通し、電子回路を構成することができる。
この実装構造によれば、電子部品２のはんだ付けを部品実装面１ａ側で行うことができるので、従来のように、はんだごてを電子部品２の接続端子２ａの根元にもぐりこませるような困難さを解消することができ、作業効率をよくすることできる。またはんだ付けを適確に行うことができるので、はんだ不良を防ぐことができる。
更にこの実装構造によれば、部品実装面１ａ側に電子部品２を実装させるスペースが少ない操作パネル等に適用される場合、大型のものや高さのある電子部品２をはんだ面１ｂに実装させることが可能となる。 The connection terminal 2a of the electronic component 2 mounted on the solder surface 1b side protrudes from the insertion hole 1c from the solder surface 1b side to the component mounting surface 1a side, and the protruded connection terminal 2a is connected to the hole 1d. Further, it is fixed with one jumper wire J and solder 5 which are projected to the component mounting surface 1a side.
As described above, since the jumper wire J is electrically connected to the conductor pattern formed on the solder surface 1b, the connection terminal 2a of the electronic component 2 is electrically connected to the conductor pattern to be connected through the jumper wire J. A circuit can be constructed.
According to this mounting structure, since the electronic component 2 can be soldered on the component mounting surface 1a side, the soldering iron can be pulled into the base of the connection terminal 2a of the electronic component 2 as in the prior art. Difficulty can be eliminated and work efficiency can be improved. Moreover, since soldering can be performed accurately, defective solder can be prevented.
Furthermore, according to this mounting structure, when applied to an operation panel or the like having a small space for mounting the electronic component 2 on the component mounting surface 1a side, a large or tall electronic component 2 is mounted on the solder surface 1b. It becomes possible.

はんだ面１ｂ側に実装可能な電子部品２としては、スルーホール実装方式にて実装されるＤＩＰ、ＰＧＡ等の半導体チップとすることができる。
例えば、図１、２に示すＤＩＰのように、接続端子２ａの数が多く、そのピッチが狭小でなるものであっても、本発明の実装構造によれば、はんだ面１ｂに電子部品２を実装させる構成であっても、部品実装面１ａ側で電子部品２のはんだ付けができるので、作業を容易にすることができる。 The electronic component 2 that can be mounted on the solder surface 1b side can be a semiconductor chip such as DIP or PGA mounted by a through-hole mounting method.
For example, even if the number of connection terminals 2a is large and the pitch is narrow as in the DIP shown in FIGS. 1 and 2, according to the mounting structure of the present invention, the electronic component 2 is provided on the solder surface 1b. Even in the configuration to be mounted, the electronic component 2 can be soldered on the component mounting surface 1a side, so that the operation can be facilitated.

（ａ）は図１（ｂ）のＡ−Ａ線拡大断面図、（ｂ）は本発明が採用された回路基板を部品実装面側上部からみた模式図である。(A) is the AA expanded sectional view of FIG.1 (b), (b) is the schematic diagram which looked at the circuit board by which this invention was employ | adopted from the component mounting surface side upper part. 本発明の片面基板の実装構造の例を示す部分斜視図であるIt is a fragmentary perspective view which shows the example of the mounting structure of the single-sided board | substrate of this invention. 従来の片面基板の実装構造を示す部分断面図である。It is a fragmentary sectional view which shows the mounting structure of the conventional single-sided board | substrate.

Explanation of symbols

１回路基板
１ａ部品実装面
１ｂはんだ面
１ｃ挿着孔
１ｄジャンパ線孔部
２電子部品
２ａリード（接続端子）
４ランド
３、５はんだ DESCRIPTION OF SYMBOLS 1 Circuit board 1a Component mounting surface 1b Solder surface 1c Insertion hole 1d Jumper wire hole part 2 Electronic component 2a Lead (connection terminal)
4 Land 3, 5 Solder

Claims

One surface is a component mounting surface and the other surface is a solder surface on which a conductor pattern is formed, and a pair of jumper wire holes corresponding to each insertion hole of a connection terminal of an electronic component to be mounted is formed A single-sided board mounting structure,
The electronic component is mounted on the solder surface side, and the connection terminal protrudes from the insertion hole to the component mounting surface side, and the protruding connection terminal is connected to the set of jumper wire holes from the pair of jumper wire holes. A mounting structure for a single-sided board, which is fixed to a jumper wire wired on the component mounting surface side with solder.

In claim 1,
The electronic component is a semiconductor chip having a plurality of connection terminals.