JP2558736Y2 - Substrate splitting machine - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board dividing machine for cutting a board material at a predetermined position to form a board for an electronic circuit.

[0002]

2. Description of the Related Art When manufacturing a substrate 11 for an electronic circuit, a plurality of identical substrates 11 or different substrates 11 are used.
Are arranged in several types, and the adjacent substrates are cut off (connecting portions) 3
9, and the remaining piece 12 is connected to a predetermined position of the substrate 11 via a cut portion, so that the integrally formed substrate material 10 is formed first. Next, after a predetermined electronic component is attached to the substrate material 10, the substrate material 10 is divided at the cutting portion 39,
The required substrate 10 was manufactured. The cut portion 39 had perforated holes formed along the division line (FIG. 10C).

In a conventional substrate dividing machine 50 used for dividing the substrate, a cutting blade 52 is provided at a predetermined position on the upper surface of a lower die 51 in accordance with a dividing position of the substrate material. An upper die 54 is provided on the lower surface of the lower die 51. The upper die 54 has a holding projection 53 protruding from the cutting blade 52 (FIG. 10 (a)). The plate material 10 is placed, the upper die 54 is lowered, the substrate material 10 is sandwiched between the cutting blade 52 and the holding projection 53, and the substrate material 10 is pressed and cut to form the substrate 11 and the residual piece 12. (FIG. 10B).

At this time, a reference hole 13 is formed in the substrate material 10 to prevent the substrate material 10 from shifting in the horizontal direction, and a reference pin 57 that can be inserted into the reference hole 13 is installed in the lower mold 51. The substrate material 10 is placed on the substrate dividing machine 50 such that the reference hole 13 is fitted into the reference pin 57 (FIG. 11).
(A)).

[0005] Further, the pressing projection 53 in the above is cylindrical, and the shape of the lower surface 53a (the contact surface with the cutting blade) has a diameter R longer than the length L ₀ of the cutting edge of the cutting blade 52 of the lower die 51. It was circular (FIG. 10 (c)).

[0006]

SUMMARY OF THE INVENTION In the above prior art,
In order to prevent the substrate material 55 from moving in the horizontal direction, the reference pins 5
7 and the reference hole 13 are formed so that there is as little gap as possible, and there is a problem that the substrate material 10 is distorted in the direction of the arrow 58 at the time of cutting (FIG. 11B). Further, there is also a problem that the reference pin 57 and the reference hole 13 are tightened after the division, and it is difficult to separate the remaining piece 12 of the substrate material.

Further, at the time of cutting, the peripheral portion 53b of the lower surface 53a of the holding projection 53 (the portion not in contact with the cutting blade) presses the substrate material 10, so that there is a problem that the substrate material 10 is distorted (FIG. 10 (c)).

[0008]

According to the present invention, however, the pressing pin is provided or the width of the lower surface of the pressing projection is set to 3 mm to 8 mm.
mm, the above problem was solved.

That is, the present invention provides an upper mold having a first cutting means protruding from an upper surface of a lower mold and a second cutting means protruding from a lower surface of the lower mold facing the first cutting means. In a dividing machine which is installed so as to be movable up and down and divides a substrate material in cooperation with the first cutting means and the second cutting means, a reference pin which can be inserted into a reference hole of the substrate material is installed in the lower die so as to be movable up and down. And a pressing pin that can press the reference pin and can be inserted into the reference hole and has a smaller diameter than the reference pin. Further, one of the first cutting means and the second cutting means as a cutting blade,
A substrate dividing machine in which the other is a holding protrusion, the lower surface of the holding protrusion is shaped to be able to contact all the cutting edges of the cutting blade, and the width of the lower surface of the holding protrusion is 3 mm to 8 mm.

An upper die having a first cutting means protruding from an upper surface of a lower die and a second cutting means protruding from a lower surface of the lower die facing the first cutting means is vertically movable. Install,
In the division machine that divides the substrate material in cooperation with the first cutting means and the second cutting means, any one of the first cutting means and the second cutting means as a cutting blade, the other as a holding projection, The shape of the lower surface of the holding projection is made to be in contact with all the cutting edges of the cutting blade, and the width of the lower surface of the holding projection is set to 3
This is a substrate dividing machine characterized by having a thickness of 8 mm to 8 mm.

Furthermore, an upper die having a first cutting means protruding from the upper surface of the lower die and a second cutting means protruding from the lower die facing the first cutting means above the lower die can be raised and lowered. Install,
In the dividing machine cooperating with the first cutting means and the second cutting means to divide the substrate material into a substrate and a residual piece, any one of the first cutting means and the second cutting means as a cutting blade,
The other is a holding projection, and the shape of the lower surface of the holding projection is formed so as to be able to contact all the cutting edges of the cutting blade, and the distance from the center line of the cutting edge to the edge of the lower surface of the holding protrusion on the substrate side is reduced. This is a substrate dividing machine characterized by having a thickness of 1.5 mm to 4 mm.

In the above, the combination of the first cutting means and the second cutting means includes a cutting blade on the lower die, a presser projection on the upper die,
It is conceivable that the lower die has a holding projection, the upper die has a cutting blade, and the lower die and the upper die have a cutting blade.

[0013]

When the substrate material is cut, the pressing pin presses the reference pin, and the reference pin can be lowered to below the reference hole. In addition, the holding projection can cut the substrate material in cooperation with the cutting edge of the cutting blade, and has a small area other than the surface that comes into contact with the cutting blade, so that the area that presses the substrate material at a portion other than the contact surface is used. Can be reduced.

[0014]

Embodiment 1 An embodiment of the present invention will be described with reference to FIGS.

Cutting blades 3, 3 are provided at predetermined positions on the upper surface 2 of the lower mold 1.
Is projected with the cutting edge facing upward. The predetermined position in the above is adjusted according to the position of the cutting portion 39 (connection portion) of the substrate material to be cut.

Further, an upper die 4 is installed above the lower die 1 so as to be able to move up and down.
The holding projections 6, 6 facing the projection 3 are provided to project downward.

The pressing projection 6 has a columnar shape at the base end 7 side, and the shape of the lower surface (contact surface with the substrate material and the cutting blade 3) 8 is such that the length L of the long side 8a is the length of the cutting blade. Greater than L ₀ ,
There a rectangular overall width is D by D ₁ at a time on either side of the center line A of the cutting edge of the short side 8b cutting blade, 2.5mm and D _1,
D is 5 mm (FIG. 2). The substrate dividing machine 9 is formed as described above (FIGS. 1A and 1B).

Next, the use of the substrate dividing machine 9 of the present invention based on the above embodiment will be described.

The substrate 10 is placed at a predetermined position on the cutting blade 3 of the lower die 1 (so that each divided portion 39 of the substrate is aligned with the cutting blade 3), and the upper die 4 is lowered, and the cutting blade 3 The substrate material 10 is pressed with the lower surface 8 of the holding projection 6 and cut to form substrates 11, 11 having a predetermined shape and a residual piece 12.

In the above, strain gauges 14 and 14 are attached to both sides of the back surface 10b of the substrate material 10 at a predetermined interval from the cut position (FIG. 3), and the strain at the time of cutting is measured. As shown in FIG. 4, when the value obtained when no load is applied is 1, the maximum distortion is about 1300.
Doubled. Similarly, strain gauges 14, 14 are attached to both sides of the cut portion of the back surface 10b of the substrate material 10, respectively (FIG. 10).
(C)) The substrate material 10 is placed on the conventional substrate dividing machine 50 shown in FIGS. 10A and 10B, and the substrate material 10 is cut in the same manner, and the distortion at that time is measured. As shown in FIG. 4, the maximum distortion of the conventional example is about 2500 times as large as the case where the value in the state where no load is applied is 1. Therefore, in the substrate dividing machine 9 of the present invention, the distortion at the time of cutting is reduced by 3 compared with the conventional example.
It was reduced to less than two-thirds.

In the above embodiment, the lower surface 8 of the holding projection 6
Although the width D is 5 mm, other lengths can be used as long as the length is 3 mm to 8 mm. In the above, cutting is difficult when the thickness is 3 mm or less, and the effect of reducing distortion cannot be expected when the thickness is 8 mm or more.

In the above embodiment, the shape of the lower surface of the presser projection 6 is rectangular. However, if the lower surface of the presser protrusion 6 can be brought into contact with all the cutting edges and the width D is formed in the above range, an oval or the like can be obtained. (Not shown).

In the above-described embodiment, the shape of the lower surface 8 of the holding projection 6 is not adversely affected in the division where the substrate material 10 is divided into the substrate 11 and the remaining piece 12 even if the remaining one side is distorted. The shape as shown in FIG. 5 can also be used.
That is, the base end of the presser projection 6 is formed in a columnar shape, and the lower surface (the surface in contact with the substrate material and the cutting blade) 8 is formed as a partial circle formed by cutting only the substrate side, and the center line of the cutting edge of the cutting blade 3. the distance D ₂ from a to the edge 6a of the substrate 11 side of the retaining projections 6 may be about 5 mm (Figure 5 (a)). Further, the lower surface 8 of the pressing projections 6 which is circular, is placed in the upper mold eccentrically from the cutting edge of the cutting blade 3 only residual piece 12 side L _1, and the center line A of the cutting edge of the cutting blade 3 the distance D ₃ to the edge of the substrate 11 side of the retaining projections 6 may be about 2.5 mm (Fig. 5
(B)). Furthermore, the distance D ₂ and was a D ₃ is about 2.5 mm, as in the example, can be other distances as long as 1.5mm to 4 mm.

In the above-described embodiment, the cutting blade 3 is provided on the lower die 1 and the holding projection 6 is provided on the upper die 4. However, the holding protrusion 6 is provided on the lower die 1 and the cutting blade is provided on the upper die 4. 3 can also be installed.

[0025]

Embodiment 2 Another embodiment of the present invention will be described with reference to FIGS.

Cutting blades 17, 17 are provided at predetermined positions on the upper surface 15a of the lower die 15 so as to protrude with their cutting edges facing upward. The predetermined position is adjusted in accordance with the shape of the substrate material to be cut and the position of the division (FIG. 6 (a)).

The lower die 15 has a vertical hole 18 formed at a predetermined position of the lower die body 15b, and a metal plate 16 having a vertical hole 16a and a vertical hole 19 formed on the lower die body 15b. The support plates 20 are fixed in order. The vertical hole 18, the vertical hole 1
6a and the vertical hole 19 are communicated so that their centers may coincide. The cutting blades 17, 17 are embedded in the support plate 20, and the lower end thereof is in contact with the upper surface of the metal plate 16.

A support cylinder 21 having a collar 22 at the upper end is inserted into the vertical hole 19, and the collar 22 is engaged with an edge of the vertical hole 19. A reference pin 23 having a large diameter portion 24 at the lower end is inserted into the support cylinder 21 so as to be able to move up and down. The reference pin 23 is formed so that the upper end 25 protrudes a predetermined length at the highest position, and the large-diameter portion 24 is hooked on the support cylinder 21 and cannot protrude outside the support cylinder 21. A helical spring 26 is interposed in the support cylinder 21, and a plug 27 is fitted and fixed to the lower end of the support cylinder 21. Further, a thread portion is formed at the lower portion of the outer wall of the support cylinder 21, a washer 28 is fitted into the thread portion from the lower surface side of the vertical hole 18, and a nut 29 is screwed and fastened.
The support cylinder 21 is fixed to the support plate 20 (FIG. 7). In the above, the reference pin 24 is urged upward by the helical spring 26.

An upper die 30 is installed above the lower die 15 so as to be able to move up and down. On the lower surface 31 of the upper die 30, the holding projections 32 facing the cutting blades 17 are directed downward. To protrude. Further, pressing pins 34, 34 facing the reference pins 23, 23 are protruded from the lower surface 31 of the upper die 30. The center of the holding pin 34 is the reference pin 2.
3, and the diameter thereof is smaller than the diameter of the reference pin 23. The position of the tip 35 of the holding pin 34 is located lower than the tip 33 of the holding projection 32.

The substrate dividing machine 36 is formed as described above (FIG. 6A). In the above, the mounting position of the reference pin 23 and the holding pin 34 is determined according to the position of the reference hole of the substrate material to be divided.

Next, the use of the board dividing machine 36 of the present invention based on the above embodiment will be described.

The substrate material 10 is placed on the lower die 15 of the substrate dividing machine 36. At this time, the reference holes 13, 13 of the substrate material 10 are fitted into the lower reference pins 23. In this state, the substrate material 10
The back surface 10b of the base member abuts on the cutting blade 17, and the tip 25 of the reference pin 23 protrudes from the front surface 10a of the substrate material 10 (the positions indicated by solid lines in FIGS. 6A and 7).

Next, the upper mold 30 is lowered, and as shown by the chain line in FIG. 7, the holding pin 34 is located at the position of the chain line 34a, and the tip thereof contacts the upper surface 25 of the reference pin 23. At this time, the holding projection 32 is at the position of the chain line 32a,
Not touching 0.

The upper die 30 is further lowered, and the lower surface 33 of the holding projection 32 contacts the surface 10a of the substrate material 10. At this time,
The position of the lower end 35 of the presser pin 34 (the upper end 25 of the reference pin 23) of the presser pin 34 that has been lowered while pressing the reference pin 23 is at the same height as the rear surface 10b of the substrate 10 (FIG. 8).
Subsequent to this state, there is no risk of the substrate material 10 coming off.

Further, the upper die 30 continues to descend, and accordingly, the holding pin 34 keeps pushing the reference pin 23 downward, and the substrate material 10 is pressed by the cutting blade 17 and the holding projection 32, and the lower surface of the holding projection 32. 33 is in contact with the cutting blade 17,
The cutting of the substrate material 10 is completed, and the substrate material 10 is divided into the substrate 11 and the remaining pieces 12 (FIGS. 6B and 9).

In the above, the holding projection 32 is
Since the reference pin 13 is inserted into the reference hole 13 until the substrate material 10 contacts the state shown in FIG. 8, there is no possibility that the substrate material 10 is displaced in the horizontal direction. Further, during the cutting after the pressing projection 32 contacts the substrate material 10 (the state shown in FIGS. 8 to 9), the substrate material 1
Since the holding pin 34 is loosely fitted in the reference hole 13 of the zero, the substrate 11 separated from the substrate material 10 moves in the direction of arrow 38 in FIG. Can be reduced. Therefore, breakage of components attached to the substrate 11, cracks in the solder fillet, separation of the pattern from the substrate, and the like can be prevented.

In the above embodiment, the lower end 35 of the holding pin 34 (the upper end 25 of the reference pin 23) in the state of FIG. 8 (the state in which the lower surface 33 of the holding protrusion 32 is in contact with the surface 10a of the substrate material 10). The position is set at the same height as the back surface 10b of the substrate material 10. However, the position of the lower end 35 of the holding pin 34 is set to be lower than the position of the center of the reference hole 13 in the depth direction (the thickness direction of the substrate material 10). Other positions can also be used if they are located below (not shown). Even in this case,
During cutting, only the reference hole 13 side is raised during cutting, and the holding pin 34 is loosely fitted in the reference hole 13, so that distortion generated in the substrate material 10 can be reduced.

In the above embodiment, the reference pin 23
Has a structure in which it is inserted into the support cylinder 21 in which the spiral spring 26 is interposed. However, another structure may be used as long as the reference pin 23 can be moved up and down and urged upward.

In the above embodiment, the holding pin 34
Can also press the reference pin 23, and
Other structures can be used if the diameter is smaller.

In the above embodiment, the holding projection 32
Has been a regular shape, as shown in Example 1, the shape of the lower surface (contact surface with the substrate material and the cutting blade 3), the length L of the long side is greater than the length L ₁ of the cutting blade There a rectangular is D ₁ by one full width D on either side of the center line a of the cutting edge of the short side 8b cutting blade, the D ₁ 2.5 mm, may be a 5mm to D (Fig. 2). Further, the shape of the holding projection 32 can be the same as the shape of the other holding projection shown in the first embodiment. When the holding projections 32 are the same as those in the first embodiment, the distortion generated in the substrate material 10 can be further reduced.

In the above-described embodiment, the cutting blade 17 is protruded from the lower die 15 and the pressing protrusion 32 of the upper die 30 is protruded. The cutting blade 17 can be protruded from 30. Further, both the upper die 15 and the lower die 30 may be provided with the cutting blades 17 protruding therefrom.

[0042]

According to the present invention, since the distortion generated in the substrate material during cutting can be reduced, there is no adverse effect due to the distortion on the substrate formed by division, so that an accurate substrate can be manufactured. Further, when the holding pin is provided, there is an effect that the substrate after the substrate material is divided and the remaining pieces can be easily removed from the substrate dividing machine.

[Brief description of the drawings]

FIG. 1 is a front view of an embodiment of the present invention, FIG.
Is a front view at the time of completion of cutting.

FIGS. 2A and 2B are enlarged front views, FIG. 2B is an enlarged side view, and FIG. 2C is a bottom view of the holding projection used in the embodiment of the present invention.

FIG. 3 is a partially enlarged plan view of a divided portion of the substrate material of the present invention.

FIG. 4 is a graph comparing distortion between the present invention and a conventional example.

FIG. 5 is a partially enlarged plan view of a divided portion of a substrate material showing another holding projection of the embodiment of the present invention.

FIG. 6A is a front view of another embodiment of the present invention.
(B) is a front view at the time of completion of cutting.

FIG. 7 is also a partially enlarged longitudinal sectional view before cutting.

FIG. 8 is also a partially enlarged longitudinal sectional view at the start of cutting.

FIG. 9 is a partially enlarged longitudinal sectional view of the same when the cutting is completed.

10A is a front view, FIG. 10B is a front view of a substrate material being cut, and FIG. 10C is a partially enlarged plan view of the substrate material.

11A is a front view of another conventional example, and FIG. 11B is a partially enlarged cross-sectional view of a state where a substrate material is cut.

[Explanation of symbols]

 1, 15 Lower die 2, 15a Upper surface (lower die) 3, 17 Cutting blade 4, 30 Upper die 5, 31 Lower surface (upper die) 6, 32 Holding projection 8, 33 Lower surface (of holding projection) 9, 36 Substrate divider 10 Substrate material 11 Substrate 13 Reference hole 23 Reference pin

Claims (4)

(57) [Scope of request for utility model registration] 1. An upper mold having a first cutting means protruding from an upper surface of a lower mold and a second cutting means protruding from a lower surface of the lower mold facing the first cutting means. Installed, in the dividing machine that divides the substrate material in cooperation with the first cutting means and the second cutting means, the lower die is provided with a reference pin that can be inserted into a reference hole of the substrate material in a vertically movable manner, A board dividing machine, wherein a presser pin capable of pressing the reference pin and being inserted into the reference hole and having a smaller diameter than the reference pin is provided on the upper die. 2. One of the first cutting means and the second cutting means is a cutting blade, and the other is a holding projection, and the lower surface of the holding projection is shaped so as to be able to contact all cutting edges of the cutting blade. 2. The substrate dividing apparatus according to claim 1, wherein the width of the lower surface of the holding projection is 3 mm to 8 mm. 3. An upper die having a first cutting means protruding from an upper surface of a lower die and a second cutting means protruding from a lower surface of the lower die facing the first cutting means. In the dividing machine which is installed and divides the substrate material in cooperation with the first cutting means and the second cutting means, one of the first cutting means and the second cutting means is used as a cutting blade and the other is pressed. The shape of the lower surface of the presser projection is such that it can contact the entire cutting edge of the cutting blade, and the width of the lower surface of the presser protrusion is 3 mm to 8 mm.
Substrate dividing machine characterized by mm. 4. An upper mold having a first cutting means protruding from an upper surface of a lower mold and a second cutting means protruding from a lower surface of the lower mold facing the first cutting means. In the dividing machine which is installed and divides the substrate material into the substrate and the remaining piece in cooperation with the first cutting means and the second cutting means, one of the first cutting means and the second cutting means is cut. With the blade, the other as a presser projection, the shape of the lower surface of the presser protrusion is a shape that can be in contact with all the cutting edges of the cutting blade, and from the center line of the cutting edge to the edge of the lower surface of the presser protrusion on the substrate side. Distance of 1.
A substrate dividing machine having a thickness of 5 mm to 4 mm.