JPH07282931A - Ic socket - Google Patents

Abstract

PURPOSE:To halve the whole pitch without changing a pitch of contact pins and ribs by dividing the ribs for preventing the contact between the adjacent contact pins into two groups, and alternately disposing the contact pins and the ribs. CONSTITUTION:A first and a second rib 4a, 4b are arranged at the same vertical surface at the same pitch as that of a second contact pin 3, while a third and a fourth rib 4c, 4d are arranged at the same vertical surface at the same pitch as that of a first contact pin 2. The pin 2 is located in a position not to be brought into contact with the ribs 4c. 4d. The curve portion 3e and horizontal portion 3f of the pin 3 are connected directly, and the rib 4b is positioned under the connected portion. At the time of mounting of an IC chip, a slider 4 is slid outward, to expose contacts 2b, 3b, on which the IC chip is mounted. When the slider 4 is slid toward the center after mounting, a pressing portion 4e is slid above the portions 2b, 3b so as to press them at the resilient portions 2g, 3g of the pins 2, 3, whereby an abutting portion 4f abuts against the side surface of the chip for the purpose of positioning.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting an electric component such as a thin IC chip, and more particularly to an ultra high density I
The present invention relates to an IC socket adapted to a C chip or the like.

[0002]

2. Description of the Related Art Conventionally, a socket for a high-density IC chip has a contact pin pitch of about 0.3 mm, for example. Was impossible.

[0003]

However, in order to cope with the above-mentioned ultra-high-density IC chips due to the recent higher density, the pitch of the contact pins is 0.15 m.
Although it is desired to set the value to about m, in the conventional manufacturing method, such a fine pitch is provided with a partition wall (rib) provided between the contact pins of the socket body to prevent mutual contact between the contact pins. ) Was difficult to manufacture thinly.

It is an object of the present invention to solve the above problems and provide an IC socket having an array of ultra-high density and fine pitch.

[0005]

In order to solve the above-mentioned problems, a rectangular socket body 1 and a straight line parallel to the side of the socket body 1, and each of them has a constant interval in the direction perpendicular to the side. The contact pins 5 and 6 arranged in step 1, and the slits 1c and 1d for inserting the legs 5c and 6c of the contact pins 5 and 6 into the socket body 1 and the contact pins 5 and 6.
Body ribs 1f, 1g to prevent lateral displacement of
In the IC socket having the contact pins 5, 6,
Is an upward contact portion 5 that makes elastic contact with the lower surface terminal of the IC chip.
b, 6b, and the slits 1c, 1 for inserting the leg portions 5c, 6c in the contact pin arrangement portion of the IC socket body 1
d are arranged in two rows and adjacent slits 1c and 1d are arranged in rows opposite to each other so that the contact pins 5 and 6 are arranged in a zigzag pattern in the arrangement direction.
The socket body rib 1 for maintaining the distance between the contact pins 5 and 6 arranged at regular intervals in the contact pin arrangement portion of
At least one set of f and 1g are arranged at least on the left and right for each contact pin, and one socket body rib 1f or 1g for the contact pins adjacent to each other is almost the same as the set arrangement of the other socket body rib 1g or 1f. One of the contact pins 5 and 6 arranged at the intermediate position and adjacent to each other is arranged on the array of the socket body ribs 1f and 1g for the other contact pin.

The socket body ribs 1f and 1g for maintaining the distance between the contact pins 5 and 6 are arranged near the contact portion b of the contact pin which makes elastic contact with the lower surface of the IC chip.

The contact pin contact portion 5b of the IC chip,
The elastic contact with 6b is constituted by a pressing lid 7 that engages with the socket body 1 so as to press the IC chip from above.

A square socket body 1, contact pins 2 and 3 arranged on a straight line parallel to the sides of the socket body 1 and arranged at regular intervals in a direction perpendicular to the sides, and a diagonal line of the socket body 1. In an IC socket with positioning guides 1b located inside the row of contact pins 2,3 along each other, the contact pins 2,3 are laterally U-shaped and contact the underside terminals of the IC chip. The slider 4 has upward contact portions 2b and 3b and connection portions 2d and 3d for connecting to the board, and extends substantially in a straight line parallel to the side of the socket body 1 in the substantially U-shaped inner space of the contact pin row. The slider 4 is slid by an insertion jig or a removal jig to be in elastic contact with or away from the upper surface of the IC chip, and the slider 4
At least one set of ribs 4a, 4b, 4c, 4d for maintaining the distance between the contact pins 2 and 3 arranged at regular intervals are arranged at least one on each side of the contact pin, and for adjacent contact pins. One of the ribs 4a and 4b is arranged at a substantially intermediate position of the set arrangement of the other ribs 4c and 4d, and one of the contact pins 2 and 3 adjacent to each other is the rib 4 for the other contact pin.
It is configured to be on the arrangement of a, 4b or 4c, 4d.

[0009]

As described above, the ribs for preventing contact between the contact pins and adjacent contact pins are divided into two groups,
By arranging the contact pins and ribs of each group alternately, it is possible to reduce the overall pitch to ½ without changing the pitch of the contact pins and ribs of each group.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partial sectional view of an IC socket of a first embodiment capable of producing an ultra high density IC socket. (A) is a sectional view of a plane AA parallel to a contact pin, (B) is Similarly, in the cross-sectional view of the surface BB in contact with the surface of the first contact pin, the second contact pin on the rear side is omitted,
(C) is a surface C that is also in contact with the surface of the second contact pin
In the cross-sectional view at -C, the rear side first contact pin is omitted, and FIG. 2 is a rib arrangement diagram on the slider,
(A) is an explanatory view of the relationship with the first and second contact pins,
(B) is a layout view of ribs on the upper surface, (C) is a layout view of ribs on the lower surface, FIG. 3 is a schematic plan view of an example of an IC socket, and FIG. 4 is a side view of the slider.

On a straight line parallel to the side of the socket body 1,
Further, the first contact pin 2 and the second contact pin 3 are arranged alternately on each side in the vertical direction at regular intervals.
And a positioning guide 1b located inside the row of the first and second contact pins 2 and 3 along the diagonal of the socket body 1 by the same distance. Reference numerals 2 and 3 are lateral U-shapes, and contact portions 2b and 3b are provided upward at the tips of the lower base portions 2a and 3a and leg portions 2c and 3c protruding downward.
And connecting portions 2d, 3d protruding outward at the ends of the base portions 2a, 3a on the U-shaped side, in the U-shaped inner space formed by the arrangement of the first and second contact pins 2 and 3. It consists of a slider 4 which is inserted and arranged laterally slidably along a vertical plane containing the first or second contact pin 2 or 3.

In the contact pin array portion of the socket body 1, the leg portions 2c of the first and second contact pins 2 and 3,
First slit 1c and second slit 1d arranged in two rows for fitting 3c, respectively, and contact portions 2b, 3b
The first and second contact pins 2 and 3 inserted into the concave portion 1e provided for inserting are alternately arranged so as to be fitted to positions outside and inside the socket body 1 of the concave portion 1e, respectively. The first socket body rib 1f and the second socket body rib 1g are provided, and the first and second slits 1c and 1d and the first and second socket body ribs 1f,
1g has the same pitch, and the first and second pitches are opened in a state of being displaced from each other by 1/2 pitch, and are arranged in a staggered manner as a whole.

The leg portion 2c of the first contact pin 2 is inserted into the first slit 1c, the lower side of the contact portion 2b is inserted between the first socket body ribs 1f of the recess 1e of the socket body 1, and the tip of the curved portion 2e. Constitutes a first slanted portion 2h that is slanted upward, its tip is a horizontal portion 2f, and its tip is a second slanted portion 2i that is slanted downward, and this tip is the slider 4
The downward elastic portion 2g that elastically presses the upper surface of the.

The leg portion 3c of the second contact pin 3 is inserted into the second slit 1d, the lower side of the contact portion 3b is elongated and inserted between the second socket body ribs 1g of the recess 1e,
The tip of the curved portion 3e immediately becomes the horizontal portion 3f, and the tip of this horizontal portion 3f constitutes the downward elastic pressure portion 3g.

On the slider 4, ribs for holding the first and second contact pins 2 and 3 arranged at regular intervals are alternately arranged at the same intervals as the two rows of the first and second slits 1c and 1d. It is provided. First ribs 4a arranged at the same pitch as the first or second contact pins 2 or 3 on the inner surface of the socket, third ribs 4c arranged at the same pitch on the upper surface of the middle portion, and on the outer surface of the socket Second ribs 4b arranged at the same pitch and fourth ribs 4d arranged at the same pitch are provided on the lower surface outside the socket.

Further, a tip end portion inside the socket is a downward pressing portion 4e for pressing the IC chip, and an abutting portion 4f for restricting a side surface position of the mounted IC package is substantially below the pressing portion 4e. , And a pin 5 penetrating in the longitudinal direction slightly outside the center position.

The above-mentioned first and second ribs 4a and 4b have the same pitch as the second contact pin 3 and are located on the same vertical plane, and the third and fourth ribs 4c and 4d are the same as the first contact pin 2. They are arranged at the pitch and on the same vertical plane.

In this case, with respect to the third rib 4c, the horizontal portion 2f of the first contact pin 2 has a positional relationship in which it passes above, and the fourth rib 4d has a positional relationship in which it does not overlap the curved portion 2e. Therefore, the first contact pin 2 is arranged at a position where it does not contact the third and fourth ribs 4c and 4d at all.

Further, since the curved portion 3e of the second contact pin 3 and the horizontal portion 3f are directly connected to each other, the second rib 4b is provided.
Should be in contact with the first rib 4a because the elastic pressure portion 3g is located rearward of the elastic pressure portion 2g of the first contact pin 2 with respect to the first rib 4a. There is no.

When the IC chip is mounted on the above-mentioned IC socket, first, the both ends of the pin 5 are slid in the outer direction of the socket by the sliders 4 for exclusive use, and the contact portion 2 is moved.
b, 3b are exposed, and an IC chip is placed on this. In this case, if the positioning guide 1b is provided separately,
By mounting along this, the contact portions 2b, 3b and I
It is possible to previously match the position with the terminal of the C chip.

After mounting the IC chip, when the slider 4 is slid toward the center of the socket with a dedicated insertion jig, the pressing portion 4e slides to a position above the contact portions 2b, 3b, and each contact pin 2 The IC chip is pressed against the contact portions 2b, 3b from above by the elastic pressure portions 2g, 3g of 3 and the contact portion 4
The f is brought into contact with the side surface of the IC chip to accurately perform positioning. When removing the IC chip, the reverse operation to the above may be performed.

FIG. 5 is a partial sectional view of an IC socket of another embodiment capable of producing the ultra-high density IC socket of the present invention, which is a sectional view of a plane DD parallel to the contact pin, and FIG. In the side view, (a) is the third contact pin,
(B) is a side view of the fourth contact pin, and FIG. 7 is a partial plan view of the socket as viewed from above the contact pin.

As shown in FIGS. 5, 6 and 7, the third contact pin 5 is a short contact pin, the leg portion 5c projects downward in the central portion of the base portion 5a, and the tip portion inside the socket has a socket body 1 Of the socket 1e is inserted into the recessed portion 1e of the socket, and the tip portion of the recessed portion 1e is formed with an upward contact portion 5b at the center of the recessed portion 1e. The insertion portion 5j is formed at a right angle as described above. A connection portion 5d for connecting to an external circuit outside the socket is formed at the outer end portion.

The fourth contact pin 6 is an elongated contact pin, and the leg portion 6c has a connecting portion 6 outside the central portion of the base portion 6a.
On the d-side, the tip portion inside the socket is configured to be fully inserted into the recess 1e of the socket body 1, and the tip portion further has an upward contact portion 6b.
An insertion portion 6j formed at a right angle is formed below the contact portion 6b so as to be inserted between the socket body ribs 1g. Further, the leg portion side of the insertion portion is formed so as to form an inclined surface portion 6k and pass above the socket body rib 1f.

The above-mentioned socket body ribs 1f and 1g are, as shown in FIGS. 5 and 7, 1 g inside the recess 1e inside the socket.
However, 1f is formed in a triangle over the side surface and a part of the bottom surface, 1g is located on the extension of the third contact pin 5, and 1f is the lower side of the slope 6k of the fourth contact pin 6. Is located in.

FIG. 8 shows a schematic example of the overall configuration of this socket. In this example, the IC chip is placed on the contact pins 5 and 6 arranged in the socket body 1, the pressing lid 7 is pushed down from the upper side, the pressing lid 7 is engaged with the socket body 1, and the IC chip is directed downward. The electrodes are pressed against the contact portions 5b and 6b of the contact pins.

[0027]

EFFECTS OF THE INVENTION At least one set of at least one rib for maintaining the distance between contact pins arranged at regular intervals is arranged in the contact pin arranging portion, one for each contact pin, and at least one rib is provided for adjacent contact pins. Since one rib is arranged substantially at an intermediate position of the set arrangement of the other rib, and one of the contact pins adjacent to each other is on the rib arrangement for the other contact pin, the arrangement interval of the contact pins is narrowed. The influence of the rib thickness, which was restricted above, can be suppressed as much as possible, and the contact pins can be arranged in a very high density.

Further, this makes it possible to mount an ultra-high-density IC chip, which has been impossible in the past, on a printed circuit board or the like in a replaceable state.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view of an IC socket according to a first embodiment capable of manufacturing an ultra-high-density IC socket, where (A) is a cross-sectional view of a plane AA parallel to a contact pin, and (B) is the same. In the cross-sectional view of the surface BB in contact with the surface of the contact pin, the second contact pin on the rear side is omitted, and (C) is the surface CC in contact with the surface of the second contact pin. The first contact pin on the rear side is omitted in the sectional view of FIG.

2A and 2B are rib arrangement diagrams on a slider, FIG. 2A is an explanatory view of the relationship with the first and second contact pins, FIG. 2B is an upper rib arrangement diagram, and FIG. 2C is a lower rib arrangement diagram.

FIG. 3 is a schematic plan view of an example IC socket.

FIG. 4 is a side view of a slider.

FIG. 5 is a partial cross-sectional view of an IC socket of another embodiment capable of manufacturing the ultra high density IC socket of the present invention.

FIG. 6 is a side view of a contact pin, in which (a) is a third contact pin and (b) is a fourth contact pin.

FIG. 7 is a partial plan view of the socket seen from the upper side of the contact pin.

FIG. 8 is a schematic example of the overall configuration of an IC socket of another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket body 1c 1st slit 1d 2nd slit 1e Recessed part 1f 1st socket body rib 1g 2nd socket body rib 2 1st contact pin 2a Base part 2b Contact part 2c Leg part 2e Curved part 2f Horizontal part 2g Repressed part 2h 1st Inclined part 2i Second inclined part 3 Second contact pin 3a Base part 3b Contact part 3c Leg part 3e Curved part 3f Horizontal part 3g Repression part 4 Slider 4a First rib 4b Second rib 4c Third rib 4d Fourth rib 4e Pressing part 4f Contact part 5 Third contact pin 5a Base part 5b Contact part 5c Leg part 5j Insertion part 6 Fourth contact pin 6a Base part 6b Contact part 6c Leg part 6j Insert part 6k Slope part 7 Pressing lid

Claims (4)

[Claims] 1. A rectangular socket main body, contact pins arranged on a straight line parallel to the sides of the socket main body, and arranged at regular intervals in a direction perpendicular to the sides, and a leg of the contact pin on the socket main body. In an IC socket having a slit for inserting a portion and a rib for preventing lateral displacement of the contact pin, the contact pin has an upward contact portion that makes elastic contact with a lower surface terminal of an IC chip, and a contact of the IC socket body. Slits into which the legs of the contact pins are fitted are arranged in two rows in the pin array portion, and the adjacent slits are arranged in rows opposite to each other so as to be arranged in a zigzag pattern in the arrangement direction of the contact pins. Further, in the contact pin arranging portion of the IC socket body, a socket book in which the intervals of the contact pins arranged at regular intervals are maintained. At least one set of at least one body rib is arranged on each of the left and right sides of each contact pin, and one socket body rib for the contact pins adjacent to each other is arranged at a substantially middle position of the set arrangement of the other socket body ribs, and An IC socket, wherein one of the contact pins adjacent to each other is on an array of socket body ribs for the other contact pin. 2. The IC socket according to claim 1, wherein the socket main body rib for maintaining the space between the contact pins is arranged in the vicinity of a contact portion of the contact pin that elastically contacts the lower surface of the IC chip. 3. The IC according to claim 1, wherein the elastic contact of the IC chip with the contact pin contact portion is a pressing lid that engages with the socket body so as to press the IC chip from above. socket. 4. The rectangular socket body, contact pins arranged on a straight line parallel to the sides of the socket body and arranged at regular intervals in a direction perpendicular to the sides, and along diagonal lines of the socket body, respectively. In an IC socket provided with a positioning guide located inside the row of contact pins by the same distance, the contact pins are substantially U-shaped in a horizontal direction, and an upward contact portion for contacting a lower surface terminal of an IC chip and a substrate. A slider that integrally extends along a straight line parallel to the side of the socket body is inserted in the substantially U-shaped inner space of the contact pin row having a connecting portion to be connected, and the slider is an insertion jig or a removal jig. Of the contact pins which are slidably contacted with or separated from the upper surface of the IC chip and arranged on the slider at regular intervals. At least one set of at least one rib for maintaining the contact pin is disposed on each of the left and right sides, and one rib for the contact pins adjacent to each other is disposed at an approximately middle position of the set arrangement of the other rib, and 2. The IC socket according to claim 1, wherein one of the adjacent contact pins is on an array of ribs for the other contact pin.