JP2567767Y2 - Integrated circuit socket - Google Patents

Integrated circuit socket

Info

Publication number
JP2567767Y2
JP2567767Y2 JP3940192U JP3940192U JP2567767Y2 JP 2567767 Y2 JP2567767 Y2 JP 2567767Y2 JP 3940192 U JP3940192 U JP 3940192U JP 3940192 U JP3940192 U JP 3940192U JP 2567767 Y2 JP2567767 Y2 JP 2567767Y2
Authority
JP
Japan
Prior art keywords
socket
integrated circuit
contact
pair
sliding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3940192U
Other languages
Japanese (ja)
Other versions
JPH0597081U (en
Inventor
裕司 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Tsushin Kogyo Co Ltd
Original Assignee
Honda Tsushin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Tsushin Kogyo Co Ltd filed Critical Honda Tsushin Kogyo Co Ltd
Priority to JP3940192U priority Critical patent/JP2567767Y2/en
Publication of JPH0597081U publication Critical patent/JPH0597081U/en
Application granted granted Critical
Publication of JP2567767Y2 publication Critical patent/JP2567767Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、集積回路特にPGA
(PIN GRID ARRAY)集積回路用ソケット
に関する。
BACKGROUND OF THE INVENTION The present invention relates to an integrated circuit, especially a PGA.
(PIN GRID ARRAY) relates to a socket for an integrated circuit.

【0002】[0002]

【従来の技術及び考案が解決しようとする課題】上述の
PGA集積回路は、例えば451ピンというように多数
のピン端子を有するので、これをソケットに挿入してピ
ン端子とソケットコンタクトとを所定の圧力で接触させ
るには多大の力が必要である。
2. Description of the Related Art Since the above-mentioned PGA integrated circuit has a large number of pin terminals such as 451 pins, the PGA integrated circuit is inserted into a socket and a predetermined number of pin terminals and socket contacts are formed. A great deal of force is required to make contact by pressure.

【0003】本考案は、PGA集積回路のピン端子をソ
ケットに挿入する際、ほとんど力を要せず、挿入後にピ
ン端子とソケットコンタクトとを所定の圧力で接触させ
ることができるPGA集積回路用ソケットを提供するこ
とをその目的とするものである。
According to the present invention, a socket for a PGA integrated circuit can insert a pin terminal of a PGA integrated circuit into a socket with little force, and can contact the pin terminal and the socket contact with a predetermined pressure after the insertion. The purpose is to provide.

【0004】[0004]

【課題を解決するための手段】本考案は、上記の目的を
達成するために、多数のソケットコンタクトが格子状に
配列され且つ貫通して設けられた絶縁基台と、該多数の
ソケットコンタクトが貫通し且つ前記絶縁基台上に間隙
を介して配置されて摺動可能な一対の摺動板と、該一対
の摺動板を摺動させ、該摺動板を貫通するソケットコン
タクトを変形することにより、ソケットコンタクトを、
前記一対の摺動板上に配置した集積回路のピン端子に圧
接させるコンタクト圧接部材から成り、該コンタクト圧
接部材は、内周壁が前記絶縁基台及び一対の摺動板に嵌
合する枠形に形成されて上下に移動自在であり、該内周
壁の上部は前記集積回路のガイド部として形成され、該
上部の対向壁には、コンタクト圧接部材を下動したとき
前記一対の摺動板の間隙を狭める方向に前記摺動板を摺
動させる押圧部を有することを特徴とする。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an insulating base in which a large number of socket contacts are arranged in a lattice pattern and provided therethrough, A pair of slidable sliding plates penetrating and arranged on the insulating base with a gap therebetween, and sliding the pair of sliding plates to deform socket contacts penetrating the sliding plates. By doing so, the socket contact
The contact pressure contact member is formed in a frame shape in which an inner peripheral wall is fitted to the insulating base and the pair of slide plates, the contact pressure contact member being pressed against a pin terminal of an integrated circuit disposed on the pair of slide plates. The upper part of the inner peripheral wall is formed as a guide part of the integrated circuit, and the upper opposing wall has a gap between the pair of sliding plates when the contact pressure contact member is moved downward. And a pressing portion that slides the sliding plate in a direction to narrow the distance.

【0005】[0005]

【作用】本考案の上記構成において、PGA集積回路
を、枠形に形成されたコンタクト圧接部材の内周壁の上
部に嵌合し、一対の摺動板上に載置する。この状態にお
いてピン端子はソケットコンタクト無圧力で接触する。
次いでコンタクト圧接部材を下動すると、その内周壁の
対向壁に設けた押圧部により一対の摺動板が夫々その間
隙が狭まる方向に絶縁基台上を摺動し、摺動板を貫通す
るソケットコンタクトは集積回路のピン端子に圧接す
る。
In the above configuration of the present invention, the PGA integrated circuit is fitted on the upper part of the inner peripheral wall of the frame-shaped contact pressure contact member and mounted on a pair of sliding plates. In this state, the pin terminals come in contact with the socket contacts without pressure.
Next, when the contact pressure contact member is moved downward, a pair of sliding plates slide on the insulating base in a direction in which the gap is narrowed by a pressing portion provided on the opposing wall of the inner peripheral wall, and a socket penetrating the sliding plate. The contacts are in pressure contact with the pin terminals of the integrated circuit.

【0006】[0006]

【実施例】以下本考案の実施例を図面に従って説明す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

【0007】図1において、符号1は絶縁基台、21
び22は夫々摺動板、3はコンタクト圧接部材である。
[0007] In FIG. 1, reference numeral 1 denotes an insulating base, 2 1 and 2 2 are each slide plate, 3 is the contact pressing member.

【0008】絶縁基台1は、上板11と下板12とから成
り、上板11と下板12を上下に貫通して格子状に配列さ
れた多数のソケットコンタクト4を有する。5は上板1
1の下面の凹部と下板12の上面との間に封入されたシリ
コン樹脂で、これは下板12の下面から突出したソケッ
トコンタクト4を配線基板(図示せず)に半田付けした
とき、半田がソケットコンタクト4を通って上板11
上面に出ないようにするためのものである。一対の摺動
板21及び22は、前記多数のソケットコンタクト4を貫
通する多数の透孔6を有し、透孔6にソケットコンタク
ト4を挿通した状態において間隙7を介して絶縁基台1
上に配置され、間隙7を形成する部分を除いて周縁部に
は突出した集積回路載置部8を有する。コンタクト圧接
部材3は枠形に形成され、その内周壁の下部は、前記絶
縁基台1の外周壁に嵌合して上下に移動可能になってお
り、その内周壁の上部はPGA集積回路9のガイド部と
して形成され、前記間隙7を挾んで対向辺部には、左右
に各一対の押圧部10が形成されている。この押圧部1
0は、絶縁基台1の上板11に形成された凹部11に嵌
合し、コンタクト圧接部材3が、図2に示すような上方
位置から図1の(B)に示す位置まで下降したとき肉厚
部12で摺動板21、22を間隙7が狭まる方向に押圧す
る。
[0008] The insulating base 1 is made of the upper plate 1 1 and the lower plate 1 2 which includes a top plate 1 1 and a number of socket contacts 4 which are arranged in a grid of lower plate 1 2 through vertically . 5 is the upper plate
A silicon resin is sealed between the first bottom surface of the recess and the upper surface of the lower plate 1 2 time, which was soldered socket contact 4 projecting from the lower surface of the lower plate 1 2 to the wiring board (not shown) , solder is used to avoid out on the upper surface of the upper plate 1 1 through the socket contact 4. The pair of sliding plates 2 1 and 2 2 have a large number of through holes 6 penetrating the large number of socket contacts 4. 1
Except for the part that is disposed above and forms the gap 7, the peripheral part has an integrated circuit mounting part 8 that protrudes. The contact pressure contact member 3 is formed in a frame shape, and the lower part of the inner peripheral wall is fitted to the outer peripheral wall of the insulating base 1 so as to be movable up and down. A pair of pressing portions 10 are formed on the left and right sides of the opposing sides with the gap 7 interposed therebetween. This pressing part 1
0 fitted in a recess 11 formed in the upper plate 1 1 of the insulating base 1, a contact pressing member 3 has lowered from the upper position as shown in FIG. 2 to the position shown in FIG. 1 (B) when pressing the sliding plate 2 1, 2 2 at the thick portion 12 in the direction in which the gap 7 is narrowed.

【0009】前記摺動板11を貫通するソケットコンタ
クト4は、図3に明示するように、先端の中央部に切断
されて彎曲された舌片13を有し、図2に示すようにコ
ンタクト圧接部材3が上方に位置するとき、コンタクト
圧接部材3の内周壁の上部に嵌合して摺動板21及び22
の集積回路載置部8に載置したPGA集積回路9のピン
端子14は、ソケットコンタクト4の先端の舌片13の
ある部分に無圧力で接触する。前記摺動板12を貫通す
るソケットコンタクト4も図3に示すものと同じである
が、その向きとピン端子14の位置は、図3と反対であ
る。
[0009] socket contact 4 that penetrates the sliding plate 1 1, as best shown in FIG. 3 has a tongue 13 which is bent is cut in the central portion of the tip, the contact as shown in FIG. 2 When the press contact member 3 is located at the upper position, the press contact member 3 is fitted on the upper part of the inner peripheral wall of the contact press contact member 3 and slides on the sliding plates 2 1 and 2 2.
The pin terminal 14 of the PGA integrated circuit 9 mounted on the integrated circuit mounting portion 8 of the first embodiment contacts the portion of the tip of the socket contact 4 where the tongue piece 13 exists without pressure. The sliding plate 1 2 socket contact 4 through the well is the same as that shown in FIG. 3, the position of the direction and the pin terminal 14 is opposite to FIG.

【0010】図1の(B)に示すように、コンタクト圧
接部材3を押し下げると、摺動板21及び22は押圧部1
0の肉厚部12によって間隙7が狭まる方向に摺動し、
ソケットコンタクト4はピン端子14に所定の圧力で接
触する。
[0010] As shown in the FIG. 1 (B), the depressing of the contact pressing member 3, the sliding plate 2 1 and 2 2 are pressing portion 1
The gap 7 is slid in the direction in which the gap 7 is reduced by the thick portion 12 of 0,
The socket contact 4 contacts the pin terminal 14 with a predetermined pressure.

【0011】図1及び図2において、15はコンタクト
圧接部材3の外周壁に中間部が固着されたロック部材
で、これはコンタクト圧接部材3を押し下げた状態にお
いて、絶縁基台1の外周壁に設けた突起16に係合し、
コンタクト圧接部材3をこの状態にロックする。
In FIGS. 1 and 2, reference numeral 15 denotes a lock member having an intermediate portion fixed to the outer peripheral wall of the contact pressure contact member 3, which is fixed to the outer peripheral wall of the insulating base 1 when the contact pressure contact member 3 is pushed down. Engage with the projection 16 provided,
The contact pressing member 3 is locked in this state.

【0012】[0012]

【考案の効果】本考案は、前述のように構成されている
から、PGA集積回路のピン端子をソケットに挿入する
際ほとんど力を必要とせず、挿入後にピン端子とソケッ
トコンタクトとを所定の圧力で接触させることができ、
また、コンタクト圧接部材がPGA集積回路のソケット
への挿脱時のガイドを兼ね、その構成が簡単である等の
効果を有する。
According to the present invention, since the present invention is constructed as described above, almost no force is required when inserting the pin terminal of the PGA integrated circuit into the socket, and after the insertion, the pin terminal and the socket contact are pressed at a predetermined pressure. Can be contacted with
In addition, the contact pressure contact member also serves as a guide when inserting and removing the PGA integrated circuit from the socket, and has effects such as a simple configuration.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 (A)は、PGA集積回路の挿入時の状態を
示す本考案の実施例の平面図、(B)は、その一部截断
側面図
FIG. 1A is a plan view of an embodiment of the present invention showing a state when a PGA integrated circuit is inserted, and FIG. 1B is a partially cutaway side view thereof.

【図2】 PGA集積回路の挿入前の状態を示す上記実
施例の要部断面図
FIG. 2 is a sectional view of a main part of the embodiment, showing a state before insertion of the PGA integrated circuit;

【図3】 (A)はソケットコンタクトの正面図、
(B)はその平面図
FIG. 3A is a front view of a socket contact,
(B) is the plan view

【符号の説明】[Explanation of symbols]

1 絶縁基台 21、22 摺動板 3 コンタクト圧接部材 4 ソケットコン
タクト 7 間隙 8 集積回路載置
部 9 PGA集積回路 10 押圧部 14 ピン端子
DESCRIPTION OF SYMBOLS 1 Insulation base 2 1 and 2 2 Sliding plate 3 Contact pressure contact member 4 Socket contact 7 Gap 8 Integrated circuit mounting part 9 PGA integrated circuit 10 Pressing part 14 Pin terminal

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 多数のソケットコンタクトが格子状に配
列され且つ貫通して設けられた絶縁基台と、該多数のソ
ケットコンタクトが貫通し且つ前記絶縁基台上に間隙を
介して配置されて摺動可能な一対の摺動板と、該一対の
摺動板を摺動させ、該摺動板を貫通するソケットコンタ
クトを変形することにより、ソケットコンタクトを、前
記一対の摺動板上に配置した集積回路のピン端子に圧接
させるコンタクト圧接部材から成り、該コンタクト圧接
部材は、内周壁が前記絶縁基台及び一対の摺動板に嵌合
する枠形に形成されて上下に移動自在であり、該内周壁
の上部は前記集積回路のガイド部として形成され、該上
部の対向壁には、コンタクト圧接部材を下動したとき前
記一対の摺動板の間隙を狭める方向に前記摺動板を摺動
させる押圧部を有することを特徴とする集積回路用ソケ
ット。
An insulating base provided with a plurality of socket contacts arranged in a grid pattern and penetrating therethrough; and a sliding member having the plurality of socket contacts penetrating and disposed on the insulating base with a gap therebetween. A pair of movable sliding plates and a socket contact are arranged on the pair of sliding plates by sliding the pair of sliding plates and deforming a socket contact penetrating the sliding plate. A contact pressure contact member for pressing against the pin terminal of the integrated circuit; the contact pressure contact member is formed in a frame shape in which an inner peripheral wall is fitted to the insulating base and the pair of sliding plates, and is movable up and down; The upper portion of the inner peripheral wall is formed as a guide portion of the integrated circuit, and the upper opposing wall slides the sliding plate in a direction to narrow the gap between the pair of sliding plates when the contact pressure contact member is moved downward. Has a pressing part to move A socket for an integrated circuit.
JP3940192U 1992-06-09 1992-06-09 Integrated circuit socket Expired - Lifetime JP2567767Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3940192U JP2567767Y2 (en) 1992-06-09 1992-06-09 Integrated circuit socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3940192U JP2567767Y2 (en) 1992-06-09 1992-06-09 Integrated circuit socket

Publications (2)

Publication Number Publication Date
JPH0597081U JPH0597081U (en) 1993-12-27
JP2567767Y2 true JP2567767Y2 (en) 1998-04-02

Family

ID=12551974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3940192U Expired - Lifetime JP2567767Y2 (en) 1992-06-09 1992-06-09 Integrated circuit socket

Country Status (1)

Country Link
JP (1) JP2567767Y2 (en)

Also Published As

Publication number Publication date
JPH0597081U (en) 1993-12-27

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