JPS6012274Y2 - Plate porcelain capacitor - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a plate-shaped ceramic capacitor that is directly mounted on a circuit board.

A conventional plate-shaped ceramic capacitor has electrodes approximately halfway between one main surface and the other main surface of a dielectric ceramic substrate.

Therefore, if you attach it to the mounting hole of the printed circuit board and solder the electrode on the part that protrudes from the bottom of the board to the printed circuit,
There was a risk that a solder layer in the form of a single electrode would be formed in areas where no electrodes were formed.

If a single electrode is formed by the solder layer approaching or adhering to a region where no electrode is formed, it is not preferable because the capacitance value will change.

In addition, when manufacturing a plate-shaped porcelain capacitor or mounting it on a circuit board, it is necessary to hold the plate-shaped porcelain capacitor with some kind of device, but if the electrodes are damaged by the device, the capacitance value may change. changes occur.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a plate-shaped ceramic capacitor that can be stably coupled to a circuit conductor of a circuit board and that does not suffer from characteristic deterioration due to damage during operation.

The present invention, which is distantly related to the above object, has one electrode and the other electrode on one main surface and the other main surface of a dielectric ceramic substrate, respectively, and the one electrode is inserted into a mounting hole provided in a circuit board. and a plate-shaped ceramic capacitor formed such that the other electrode is fixed to a circuit conductor of the circuit board with solder, at least one end of the ceramic board at a position remote from the attachment part to the circuit board. The present invention relates to a plate-shaped ceramic capacitor characterized by having a portion where the one electrode is not provided.

According to the above-mentioned invention, since there is a part where no electrode is provided at one end at a position away from the part to be mounted on the circuit board, the part where no electrode is provided is held while mounting on the circuit board. You can.

Therefore, deterioration of characteristics or change in capacitance value due to damage to the electrode due to holding is prevented from occurring.

In addition, since the part where no electrode is provided is separated from the mounting part, the electrode can be fixed to the circuit conductor by soldering almost without being affected by this part where no electrode is provided.

Embodiments of the present invention will be described below with reference to the drawings.

1 to 4 show a plate-shaped porcelain capacitor and its mounting state according to a first embodiment of the present invention.

The ceramic capacitor element 1 has a first electrode 3 on one main surface 2a of a plate-shaped dielectric ceramic substrate 2, and a first electrode 3 on the other main surface 2a.
It has a second electrode 4 at b.

As is clear from FIG. 2, the second electrode 4 is formed over the entire main surface 2b of the ceramic substrate except for the peripheral edge 5.

On the other hand, the first electrode 3 is formed in a special pattern, as is clear from FIG.

That is, the first electrode 3 is formed in the entire area excluding the peripheral edge 9 of the portion of the circuit board 6 that protrudes downward when inserted into the mounting hole 7 of the printed circuit board 6. The first electrode 3 is partially formed in the upwardly projecting portion.

The non-electrode forming area 8 in the upper half of one main surface 2a corresponds to a portion held by a tool (not shown) used when manufacturing the capacitor element 1 or when mounting the capacitor element 1 on the circuit board 6. are doing.

When attaching the capacitor element 1 configured as described above to the circuit board 6, the capacitor element 1 is inserted into the mounting hole 7 while holding the electrode non-forming area 8 with an automatic or manual tool.

Since the ceramic substrate 2 is formed in an inverted trapezoidal shape, it is held where its side surface touches the edge of the mounting hole 7.

After the mounting shown in FIGS. 1 to 3 is completed, the automatic soldering device is used to immerse the lower side of the circuit board 6 in solder, and as shown in FIG. 10 and the first electrode 3 are bonded by solder 12, and at the same time, the circuit conductor 11 and the second electrode 4 are bonded by solder 13.

As a result, a circuit device electrically and mechanically coupled to the circuit board 6 is completed.

If the capacitor element 1 is formed as in the present invention, even if it is bonded with solder 12, 13 as shown in FIG. Since the first and second electrodes 3.4 are formed,
A sufficient amount of solder 12, 13 is deposited to provide a good solder bond to the circuit conductors 10 and 11.

In addition, at this time, since there is almost no area where the first and second electrodes 3 and 4 are not formed, there is almost no risk of forming a part where the solder layer acts like an electrode, that is, a raw electrode part. .

Furthermore, even if the capacitor element 1 is strongly held with a tool when it is mounted on the substrate 6, it is held in the electrode-free region 8, so there is no risk of capacitance change due to damage to the electrodes.

Although the second electrode 4 on the main surface 2b may be damaged by holding the instrument, since no counter electrode is provided on the main surface 2a, this does not affect the capacitance.

Next, a second embodiment of the present invention will be explained based on FIG.

However, in this second embodiment and the following embodiments, those designated by numerals 1 to 13 have substantially the same structure or the same function as those with the same numerals in the first embodiment. Therefore, its explanation will be omitted.

In this second embodiment, the ceramic substrate 2 is not formed into a trapezoid.

A stepped portion 21 is provided, and the depth of insertion into the mounting hole 7 is limited by this stepped portion 21.

Other points are the same as the first embodiment.

FIG. 6 shows a third embodiment of the present invention, in which the capacitor element 1 is formed into a disk shape with a protrusion 31, and the protrusion 31 is supported by a circuit board 6. ing.

Other points are the same as the first embodiment.

7 and 8 show a fourth embodiment of the present invention.

In this embodiment, the ceramic substrate 2 is formed into a disk shape, and a synthetic resin coating 41 is formed on half of the surface thereof.

The lower end of this synthetic resin coating 41 is formed to determine the depth at which the element is inserted into the mounting hole 7.

Other points are the same as the first embodiment.

9 to 11 show a fifth embodiment of the present invention.

In this embodiment, the ceramic board 2 is provided with a slot 51, the lower part of the ceramic board 2 is divided into a first part 52a and a second part 52b, and two mounting holes provided in the circuit board 6 are provided. ? a.

7b, respectively.

The separating portion 53 between the mounting holes 7a and 7b is the slot 51.
The position of the element 1 is determined by entering the position.

This makes positioning easier.

Furthermore, since the first portion 52a and the second portion 52b are each soldered to the circuit conductor, stable attachment can be achieved.

Other points are the same as the first embodiment.

FIG. 12 shows a sixth embodiment of the present invention.

In this embodiment, the element of the fifth embodiment has a circular shape.

The other points are the same as the fifth embodiment.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments and can be further modified.

For example, in the fifth and sixth embodiments, a plurality of slots 51 may be provided to divide the ceramic substrate into a plurality of pieces.

Furthermore, the pattern of the electrode 3 may be modified in all embodiments.

Further, the pattern of the second electrode 4 may be the same as the pattern of the first electrode 3.

However, it is more convenient to provide the second electrode 4 over the entire surface in order to obtain a predetermined capacitance.

[Brief explanation of the drawing]

Fig. 1 is a partially longitudinal front view showing a ceramic capacitor and its installation according to the first embodiment of the present invention, Fig. 2 is a rear view of Fig. 1, and Fig. 3 is a line - - - of Fig. 1. A sectional view, FIG. 4 is a sectional view showing the state shown in FIG. 3 soldered together,
FIG. 5 is a partial vertical sectional view showing a second embodiment of the invention, FIG. 6 is a partial vertical sectional front view showing a third embodiment of the invention, and FIG. 7 is a partial longitudinal sectional view showing a fourth embodiment of the invention. FIG. 8 is a partially vertical front view showing the embodiment, FIG. 8 is a sectional view taken along the line ■-■ in FIG. 7, and FIG.
FIG. 10 is a rear view of FIG. 9, FIG. 11 is a plan view of the circuit board of FIG. 9, and FIG. 12 is a sixth embodiment of the present invention. It is a partially longitudinal front view. In the symbols used in the drawings, 1 is a ceramic capacitor element, 2 is a ceramic substrate, 2a and 2b are main surfaces, 3 is a first electrode, 4 is a second electrode, 6 is a circuit board, and 7 8 is a mounting hole, 8 is an electrode non-forming area, 10.11 is a circuit conductor, 12.
13 is solder.

Claims (1)

[Scope of utility model registration request] One and the other electrodes are respectively provided on one and the other main surfaces of the dielectric ceramic substrate, and the one and the other electrodes are connected to the circuit conductors of the circuit board by being inserted into mounting holes provided in the circuit board. A plate-shaped ceramic capacitor formed to be fixed with solder, which has a portion where at least one of the electrodes is not provided at one end of the ceramic substrate at a position remote from a portion where the circuit board is attached. A plate-shaped porcelain capacitor characterized by: