JP2544459Y2 - プリント回路板 - Google Patents

プリント回路板

Info

Publication number
JP2544459Y2
JP2544459Y2 JP1990115175U JP11517590U JP2544459Y2 JP 2544459 Y2 JP2544459 Y2 JP 2544459Y2 JP 1990115175 U JP1990115175 U JP 1990115175U JP 11517590 U JP11517590 U JP 11517590U JP 2544459 Y2 JP2544459 Y2 JP 2544459Y2
Authority
JP
Japan
Prior art keywords
conductor
conductor pattern
pattern
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990115175U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0472675U (US06653308-20031125-C00199.png
Inventor
好博 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec America Corp
Original Assignee
Nidec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Corp filed Critical Nidec Corp
Priority to JP1990115175U priority Critical patent/JP2544459Y2/ja
Publication of JPH0472675U publication Critical patent/JPH0472675U/ja
Application granted granted Critical
Publication of JP2544459Y2 publication Critical patent/JP2544459Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1990115175U 1990-10-31 1990-10-31 プリント回路板 Expired - Fee Related JP2544459Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990115175U JP2544459Y2 (ja) 1990-10-31 1990-10-31 プリント回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990115175U JP2544459Y2 (ja) 1990-10-31 1990-10-31 プリント回路板

Publications (2)

Publication Number Publication Date
JPH0472675U JPH0472675U (US06653308-20031125-C00199.png) 1992-06-26
JP2544459Y2 true JP2544459Y2 (ja) 1997-08-20

Family

ID=31862918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990115175U Expired - Fee Related JP2544459Y2 (ja) 1990-10-31 1990-10-31 プリント回路板

Country Status (1)

Country Link
JP (1) JP2544459Y2 (US06653308-20031125-C00199.png)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961566U (ja) * 1982-10-14 1984-04-23 三洋電機株式会社 印刷配線基板

Also Published As

Publication number Publication date
JPH0472675U (US06653308-20031125-C00199.png) 1992-06-26

Similar Documents

Publication Publication Date Title
US4494172A (en) High-speed wire wrap board
US20040125577A1 (en) Low loss, high density array interconnection
US6548766B2 (en) Printed wiring board for attachment to a socket connector, having recesses and conductive tabs
DE10117239A1 (de) Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat, und zum Anordnen auf einem Substrat angepaßte Halbleitervorrichtung
EP1942711B1 (en) Method of manufacturing a wiring board including electroplating
DE102004060935A1 (de) Leistungshalbleitervorrichtung
DE102008012256A1 (de) Elektronik-Komponenten-Montageplatte
JP3420706B2 (ja) 半導体装置、半導体装置の製造方法、回路基板、回路基板の製造方法
JP2544459Y2 (ja) プリント回路板
JPH11233531A (ja) 電子部品の実装構造および実装方法
DE10333315B4 (de) Leistungshalbleitermodul
US6055725A (en) Method for reducing shorts on a printed circuit board edge connector
JPH0563346A (ja) チツプ型電子部品を搭載した装置
JPH0747897Y2 (ja) プリント基板
JPH10233563A (ja) プリント配線基板及びその製造方法
EP1647051B1 (de) Leistungshalbleitermodul mit vom substrat gelösten leiterbahnenden als externe anschlüsse
DE102014203310A1 (de) Elektronikmodul
CN215581909U (zh) 一种镀金电路板
JPH02166790A (ja) プリント基板のメッキ方法
CA2162941A1 (en) Method and apparatus to contact plating bar without exposing contact copper or rework of the contact pad plating
JPH10233568A (ja) プリント配線基板の製造方法及びこれに用いるメッキ用治具
JPH05196953A (ja) 配線フィルムの接続方法
JP2005072482A (ja) ランドパターン構造および電気部品搭載用基板
JP3929302B2 (ja) 大型回路基板
JPS62208691A (ja) 両面実装型混成集積回路

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees