JP2534669Y2 - Mounting structure using cap electrodes for electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to an electronic component, for example,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a resistor, a capacitor, a semiconductor element, an electronic jumper wire, or the like on an electrode land of a circuit board using a cap electrode for electronic parts which is convenient.

[0002]

2. Description of the Related Art Mounting of electronic components in a conventional example will be described with reference to FIGS. FIG. 7 is an explanatory view of mounting a rectangular electronic component in a conventional example. In FIG.
Numeral 31 denotes a rectangular electronic component body, and rectangular cap electrodes 3 are provided at both ends.
2 are connected. Further, an electrode land 41 forming a part of a wiring pattern (not shown) is formed on the circuit board 40, and the square electronic component 3 is formed on the electrode land 41.
1 'is placed by the automatic assembly machine. When the flow or reflow soldering is performed, the square cap electrode 32 and the electrode land 41 are mechanically and electrically connected by the solder 42.

FIGS. 8A and 8B are explanatory views of a square cap electrode in a conventional example. The plate body 34 having the shape as shown in FIG. 8A is narrowed down several times by a square mold. Thereafter, the open end is trimmed into a square cap electrode 32 as shown in FIG. Then, the square electronic component body 31 (see FIG. 7) is inserted from the open portion 33 of the square cap electrode 32, and the square electronic component body 31 is formed by the friction between the two.
Connected mechanically and electrically without falling off. However, the square-shaped cap electrode 32 has a problem that the cost is high because it is necessary to perform a multi-step aperture on a portion having a small shape. In addition, if there is a slight variation in the machining accuracy of the square cap electrode 32, there is a disadvantage that the square electronic component body 31 is difficult to insert or easily fall off.

FIGS. 9A and 9B are explanatory views of another conventional square cap electrode. The one shown in FIG. 9 is conceived to eliminate the above-mentioned disadvantage.
(A) After forming the cross plate 35 as shown in the figure, the cross plate 35 is bent at a right angle according to the dotted line of the cross plate 35, and FIG.
(B) The contact portion 36 is formed as shown in the figure to form the square cap electrode 32 '. In this case, when the thickness of the cross plate body 35 is reduced, the frictional force between the rectangular electronic component body 31 and the rectangular cap electrode 32 'is weak, so that not only the electrical connection therebetween is weak, but also the mechanical strength is low. Is also weak. Conversely, the cross plate 35
When the thickness is increased, the strength of the square cap electrode 32 'and the frictional force between the square electronic component body 31 and the square cap electrode 32' increase, but the material and processing cost increase. Have.

FIGS. 10A and 10B are explanatory views of another rectangular cap electrode in the conventional example. The example is
Square electronic component body 31 and square cap electrode 3 shown in FIG.
This is conceived in order to further increase the strength of attachment to 2 'and to reduce the processing cost. That is, the cross plate 35 is pressed by a mold (not shown) as a shape having the meat portions 38 at the four corners, and
(B) A rectangular cap electrode 32 ″ having a shape as shown in the figure is formed. The rectangular cap electrode 32 ″ thus formed has a contact portion 39 that abuts on an adjacent surface near the opening 33. At the portion closer to the bottom than the open portion 33, a continuous throttle portion 39 'is formed. FIG.
(B) The aperture portion 39 'shown is a rectangular cap electrode 32 ".
Depending on the cross-sectional area of the square cap electrode 32 ", if it is made about 1/2 to 1/3 of one side of the square cap electrode 32", the square cap electrode 32 "is squeezed by a single press of the mold.

[0006]

A square electronic component has better stability when mounted on a substrate and has a larger area in contact with an electrode land than a round electronic component. However, as square or round electronic components are further miniaturized, the area of the cap electrode in contact with the electrode lands is reduced. Therefore, there is a problem that the electric resistance between the electronic component and the electrode land increases. Also, when the axial lead type electronic component is also miniaturized in the same manner as described above, the area of the welded portion between the cap electrode and the lead wire decreases,
There is a problem in reliability in this part. In addition, when the electronic component is miniaturized, the contact area with the electrode land also becomes small, and there is a problem in mechanical and electrical mounting strength.

The present invention is intended to solve the above problems, and can be used for chip-type electronic components, and has a small electric resistance between the electronic components and the electrode lands of the circuit board.
It is another object of the present invention to provide a mounting structure using an electronic component cap electrode having high mechanical mounting strength. The present invention provides a cap electrode for electronic components that has a larger contact area when mounted on an electrode land of a circuit board, has better stability when mounted, and has a higher mounting strength than a round-shaped one. It is an object of the present invention to provide a mounting structure.

[0008]

In order to achieve the above object, the present invention provides an electronic component cap electrode mounting structure including a circuit board on which a wiring pattern is formed and a circuit board having the circuit pattern.
Of the wiring pattern on the circuit board
The electrode land and the electrode land
, The bottom end, opening at the other end, the bottom of the formed part the opening, a continuous portion formed on the bottom side of the ridge portion toward the open end from the bottom, and the open end side An electronic component cap electrode portion having a discontinuous portion formed and connected to both ends of the electronic component body and having a square cross-section cylindrical body, and the electronic component body and an electrode land of a circuit board, mechanically and electrically connected via the opening of Kyabbu electrode
And characterized in that it is constructed from and I do. Also book
Mounting structure according to the electronic parts cap electrodes of invention is characterized by the this <br/> which comprises a guide plate which extended a pair of facing plates of the cylindrical body.

[0009]

[Operation] When the electronic component body is inserted into the cap electrode , a ridge from the bottom to the open end of the cap electrode.
The continuous part formed on the bottom side of the wire and the open end
The electronic component body and the cap electrode are mechanically and electrically connected to each other by the spring property of the formed discontinuous portion . Further, the spring property of the continuous portion and the discontinuous portion of the cap electrode can be appropriately controlled by the length of the continuous portion, so that highly reliable mounting can be performed.
Further, the spring property of the continuous portion and the discontinuous portion of the cap electrode is further increased by providing the convex portion on each piece. Also, since an opening is provided at the bottom of the cap electrode,
When the cap electrode is placed on the electrode land of the circuit board,
Solder, and the electronic component body via an opening of the cap electrodes
Direct mechanical and electrical connection to the electrode lands. Therefore, as compared with the case where there is no opening, the mounting strength is higher, and the electrical resistance between the electronic component body and the electrode land is smaller, so that the reliability of the electrical connection is higher.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a square cap electrode according to the present invention, in which an opening 4 is formed in a portion corresponding to the bottom 2 from a cross plate like the conventional example shown in FIG. Then, the bottom portion 2 was pressed by a mold (not shown) to form a throttle portion 6 on the bottom portion 2 side of the rectangular cylindrical body 9 and a contact portion 7 on the opening portion 3 side as shown in FIG. A square cap electrode 1 is obtained. After the end of the rectangular electronic component body 10 is inserted into the rectangular cap electrode 1 manufactured in this manner, a rectangular electronic component 10 'is completed. By controlling the length of the aperture portion 6 of the rectangular cap electrode 1, the spring properties of each piece of the rectangular cap electrode 1 can be changed. The square cap electrode 1 can be applied to an electronic component such as an axial lead type or a radial lead type in addition to the chip component. That is, FIG. 2 is an explanatory view of a case where a lead wire is attached to the square cap electrode in the present invention. A swelling portion is formed in advance at the end 8 ′ of the lead wire 8, and after the lead wire 8 is inserted from the open portion 3 side of the square cap electrode 1, the swelling portion and the square cap The electrode 1 is swaged.

FIG. 3 is an explanatory view of the mounting of the square electronic component according to the present invention. In FIG. 3, on the circuit board 13, an electrode land 11 connected to a wiring pattern (not shown) is formed. Then, for example, a cream solder 12 is placed on the electrode land 11, and the rectangular electronic component 10 'is placed thereon. Thereafter, when reflow processing is performed, the square cap electrode 1 and the electrode land 11 are mechanically and electrically connected. Also, since the height of the square cap electrode 1 is usually 1 mm to several mm, the solder 1
2 causes the solder 12 to move to the square cap electrode 1
Through the opening 4 of the. As a result, the solder 12
The electrode lands 11, the square cap electrode 1, and the square electronic component body 10 are connected to each other, and the connection portion has lower resistance and higher attachment strength than the case where there is no opening 4.

FIGS. 4A and 4B are explanatory views of another embodiment of the present invention. In the rectangular cap electrode 1 shown in FIG. 4A, one opposing piece of the rectangular cylindrical body 9 is extended as shown, and a guide plate 21 is formed. In addition, the rectangular cap electrode 1 shown in FIG. 4B includes a guide plate 22 having one of the opposing pieces of the rectangular cylindrical body 9 tapered outward in an extended portion as shown in the figure. Accordingly, when the rectangular electronic component body 10 is inserted into the rectangular cap electrode 1 by an automatic assembling machine (not shown) or the like, the guide plates 21 and 22 facilitate the entrance of the rectangular electronic component body 10 and , Fixed by its spring property.

FIGS. 5A and 5B are explanatory views of another embodiment of the present invention. In the rectangular cap electrode 1 shown in FIGS. 5A and 5B, a convex portion is formed on each piece of the rectangular cylinder 9. That is, the one shown in FIG. 5A forms the concave portion 23 from the outside to the inside of the square cap electrode 1. As a result, inside the square cap electrode 1,
When the convex portion 24 is formed and the rectangular electronic component body 10 is inserted into the rectangular cap electrode 1, the above-mentioned portion cuts into the rectangular electronic component body 10 to strengthen the mechanical and electrical connection between them. 5B, a linear concave portion 25 and a linear convex portion 26 are formed, and these portions bite into the rectangular electronic component body 10.

FIGS. 6A to 6C are explanatory views of another embodiment of the present invention. As shown in FIG. 6A, a cutout 27 is formed in the square cap electrode 1 by cutting out the contact portion 7 with which each piece of the rectangular cylindrical body 9 is in contact. And
As shown in FIG. 6B, the rectangular electronic component body 10 is inserted into the rectangular cap electrode 1. When the rectangular electronic component body 10 is easily chipped, for example, as in a multilayer ceramic capacitor, the square electronic component body 10 is prevented from being chipped because it is avoided at the cutout portion 27. FIG.
As shown in (c), when the square cap electrode 1 is connected to the circuit board 13, the solder enters the square electronic component body 10 from the cutout 27,
Strengthens mechanical and electrical connections. At this time, the solder also enters from the opening 4 via the square cap electrode 1,
The electrode lands 11 are connected to the square electronic component body 10.

Although the embodiment of the present invention has been described in detail, the present invention is not limited to the embodiment. And
Various design changes can be made without departing from the present invention described in the utility model registration claims. In the embodiment shown in FIG. 1, the aperture is circular, but arbitrarily sized or shaped is a problem in the design of the square cap electrode. For example, the opening may have a similar shape such as an ellipse, an ellipse, a slit, a triangle, and a square. Further, in the embodiment shown in FIG. 5, the convex portion is shown as having a circular shape and a linear shape, but it is optional to have the same shape as described above. Further, also in the embodiment shown in FIG. 6, the shape of the notch can be arbitrarily changed in consideration of the elasticity and the contact area of each piece of the square cap electrode. Further, in the embodiment of the present invention, the square electronic component has been described, but it goes without saying that the present invention can be similarly applied to a round electronic component.

[0016]

[Effect of the Invention] According to the present invention, in the cap electrode,
Formed on the bottom side of the ridge line from the bottom to the open end
Continuous unit, and by properly controlling the length of the discontinuous portion formed at the open end side, communicating the cap electrodes
The reliability of the mechanical and electrical connection between the electronic component element and the cap electrode is enhanced by the spring property generated at the connection part and the discontinuous part . According to the present invention, since the opening is provided at the bottom of the cap electrode, the solder directly connects the electronic component body and the electrode land through the opening of the cap electrode.
And the reliability of the mounting strength can be further improved. According to the present invention,
Attached to the electrode lands on the circuit board compared to electronic components
When mounting, the contact area is increased and the automatic mounting device
Stability when electronic components are placed on electrode lands by
The cap electrode for electronic parts has good
Mounting structure can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of a square cap electrode according to the present invention.

FIG. 2 is an explanatory view of a case where a lead wire is attached to a square cap electrode according to the present invention.

FIG. 3 is an explanatory view of mounting a square electronic component according to the present invention.

FIGS. 4A and 4B are explanatory views of another embodiment of the present invention.

FIGS. 5A and 5B are explanatory views of another embodiment of the present invention.

FIGS. 6A to 6C are explanatory views of another embodiment of the present invention.

FIG. 7 is an explanatory view of mounting a rectangular electronic component in a conventional example.

FIGS. 8A and 8B are explanatory diagrams of a square cap electrode in a conventional example.

FIGS. 9A and 9B are explanatory views of another rectangular cap electrode in a conventional example.

FIGS. 10A and 10B are explanatory views of another rectangular cap electrode in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Square-shaped cap electrode 2 ... Bottom part 3 ... Open part 4 ... Opening 5 ... Open end part 6 ... Narrow part 7 ... Contact part 8 ... Lead Wire 9: Square cylinder 10: Square electronic component element 11: Electrode land 12: Solder 13: Circuit board

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A 62-37913 (JP, U) JP-A 1-1115210 (JP, U) JP-A 57-154133 (JP, U) JP-A 50- 75058 (JP, U)

Claims (2)

(57) [Scope of request for utility model registration] 1. A circuit board on which a wiring pattern is formed.
13 and a part of the wiring pattern on the circuit board 13.
The electrode lands 11 which are, with being mounted on the said electrode lands 11, bottom 2 at one end, the other end to the opening 3, the bottom 2 of the formed part the opening 4, said bottom A continuous part 6 formed on the bottom part 2 side of the ridge part from the end 2 toward the open end part 5 and a discontinuous part 7 formed on the open end part 5 side , and both ends of the electronic component body An electronic component cap electrode portion having a rectangular cross section connected to the portion, and the electronic component body and the electrode land 11 of the circuit board 13 are mechanically and electrically connected to each other through the opening 4 of the cap electrode. And a solder 12 connected to the electronic component cap electrode. 2. A mounting structure according to the electronic parts cap electrode according to claim 1, characterized in that it comprises a guide plate 21 which extends a pair of facing plates of the cylindrical body.