JP2901164B2 - Electronic component soldering structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a soldering structure of an electronic component, in particular, fixing the tubular electronic part having a conductive portion as the outside peripheral surface of the feedthrough capacitor via solder pins provided on the base To a soldering structure for electronic components.

[0002]

2. Description of the Related Art Hitherto, a header has been used as a kind of connector for passing electric signals between circuit boards. In the header, a plurality of pins for signal transmission are attached to the board, solder paste is transferred or applied to each pin in advance, and a through capacitor for removing noise with electrodes on the inner and outer peripheral surfaces is at the root of the pin. Is fitted to. Thereafter, the solder paste is melted to electrically connect the pins to the inner peripheral surface electrodes of the feedthrough capacitor.

However, in the soldering structure, when the feedthrough capacitor is fitted to the root of the pin, the solder paste is pressed between the end face of the feedthrough capacitor and the substrate surface of the header, and the solder paste protrudes around the feedthrough capacitor. Had the problem that In this case, solder paste necessary for connection between the inner peripheral surface electrode and the pin is almost extruded to the outside, which not only reduces the reliability of soldering,
There is a possibility that the solder paste protruding into the surroundings may come into contact with other electronic components or a pattern on a substrate, thereby causing a short circuit or the like.

[0004]

Object, structure and operation of the present invention
An object of the present invention is to provide an electronic component soldering structure having high reliability in soldering without the molten solder paste protruding around the electronic component. To achieve the above object, the soldering structure of an electronic component according to the present invention, a tubular electronic part having a conductive portion on the inner outer circumferential surface, its a pin attached to the base
In the structure in which the inner peripheral surface conductive portion is fixed by soldering , the electronic portion is provided at a base portion supporting the base pin.
It is characterized in that a recess for a solder pool having a smaller diameter than the outer diameter of the product is provided.

The solder paste previously transferred or applied to the pins is pushed into the recesses at the roots of the pins by fitting the cylindrical electronic component to the pins, and is melted in the recesses by heating, and is caused by capillary action and surface tension. It is sucked up between the pin and the conductive part on the inner peripheral surface of the cylindrical electronic component. That is, the soldering between the pins and the inner peripheral surface conductive portion of the electronic component is ensured without the molten solder protruding around the electronic component , particularly, the outer peripheral surface conductive portion .

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a soldering structure for an electronic component according to the present invention will be described below with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a base of a header (a type of inter-board connector), reference numeral 3 denotes a signal transmission pin, and reference numeral 5 denotes a feedthrough capacitor. The base 1 is made of a heat-resistant resin material, and a plurality of pins 3 (only one is shown in the figure) are attached by insert molding or press fitting. Further, a circular concave portion 2 is formed at a base portion of the base 1 supporting the pin 3. This recess 2
Is smaller than the outer diameter of the feedthrough capacitor 5. The feedthrough capacitor 5 is conventionally known, and has electrodes 6a and 6b formed on its inner and outer peripheral surfaces by a thin film forming method such as sputtering or vapor deposition.

In the feedthrough capacitor 5, a solder paste is transferred or applied to the tip of the pin 3 in advance, and is inserted from the tip of the pin 3 and fitted to the root. At this time, the solder paste is pushed by the through capacitor 5 and is pushed into the recess 2 of the base 1. Next, when the solder paste 8 is heated to a predetermined temperature, the solder paste 8 is melted in the concave portion 2 and sucked up between the pin 3 and the inner peripheral surface electrode 6a of the feedthrough capacitor 5 by capillary action and surface tension (see FIG. 2). . This allows pin 3
And the electrode 6a are securely soldered. Further, the concave portion 2 functions as a solder pool, and the molten solder does not protrude to the periphery of the feedthrough capacitor 5, and the outer peripheral surface electrode
There is no danger of contact with 6b or other electronic components not shown.

[0008] The soldering structure of the electronic component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist. For example, electronic components attached to the pin 3 may be any one having a conductive portion on the inner outer circumferential surface other than the feedthrough capacitor 5. Further, the concave portion 2 may have a rectangular shape instead of a circular shape, and the pin 3 may have a rectangular cross-sectional shape instead of a round pin.

Further, at the time of assembling, the solder paste 8 may be directly applied to the recess 2 without being transferred or applied to the pins 3.

[0010]

As is apparent from the above description, according to the present invention, the outer diameter of the electronic component is provided at the base supporting the pins of the base.
Since the solder paste recess with a smaller diameter is provided, the molten solder paste does not protrude around the electronic component attached to the pin, and a sufficient amount of solder paste is provided between the pin and the conductive portion on the inner peripheral surface of the electronic component. Solder is filled, and the reliability of soldering is improved. Moreover, the solder paste protrudes and the outer peripheral surface
There is no contact with conductive parts or other electronic components.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an electronic component soldering structure according to the present invention.

FIG. 2 is a sectional view showing a state where the soldering structure shown in FIG. 1 is assembled.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Concave part 3 ... Pin 5 ... Penetration capacitor 6a ... Inner peripheral surface electrode 6b ... Outer peripheral surface electrode 8 ... Solder paste

────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yoshio Hanato 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (56) References JP-A-3-222313 (JP, A) Hei 3-109320 (JP, U) Japanese Utility Model Showa 60-94861 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 7/06 Z H05K 1/18 A H01G 4/42 301

Claims (1)

(57) [Claims] 1. A within outside tubular electronic part having a conductive portion on the peripheral surface, with the inner peripheral surface conductive part to a pin attached to the base solder
In the soldering structure of the electronic component fixed by fixing, the base of the base supporting the pin is provided with the outside of the electronic component.
A concave portion for a solder pool having a diameter smaller than the diameter is provided;