JP2533174B2 - Parts testing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention relates to an improvement of a component testing apparatus, which aims to efficiently and simultaneously test a large number of components under the same precise test temperature. And a test board comprising a plurality of sockets each having a contact, and a connection terminal drawn from the contact to a predetermined position by a lead wire, and a supply robot for inserting the component under test into the socket of the test board. A chamber in which the test board into which the component under test is inserted can be inserted and removed, and a pin terminal corresponding to the connection terminal, and the connection terminal and the pin terminal are brought into contact with each other And a test head having a connection means for inputting and outputting an electric signal between the test head and the test board, and the test board is transferred to the test board by the connection means. While being connected to the head for testing, transfer means for transferring the test board after the test to the storage position outside the chamber, and removing the component under test from the test board transferred to the storage position, and based on the test result It is configured to have a classification storage robot for storing classification.

[Industrial applications]

 The present invention relates to improvement of a component testing device.

For example, in a unit test (measurement) of an integrated circuit (hereinafter referred to as an IC), particularly a memory IC, the IC under test is supplied to the test head, the IC terminal and the test terminal are connected, the test is performed, and then the Handling devices for sorting and storing are widespread.

The test period of memory ICs is relatively long, and simultaneous measurement of multiple ICs is desirable.However, in conventional handling devices, a method of individually supplying ICs to the test head with a loader equipped with rails and setting them was adopted. If it is configured to be set individually, the structure becomes complicated, and only about 1 to 4 simultaneous tests are realized.

In addition, due to the same structural reason, since the parts that have been heated and cooled to the test temperature in advance are supplied, there is a problem that the accurate test temperature cannot be given or the load must be replaced when the IC shape changes. .

Therefore, there is a demand for a simple component testing device that simultaneously measures a large number of devices.

[Conventional technology]

FIG. 5 is a diagram showing a conventional example (No. 1), and FIG. 6 is a diagram showing a conventional example (No. 2).

FIG. 5 shows an example in which the IC 5 under test is supplied to and stored in the test head 16 by a loader with a rail.

In the figure, the IC under test 5 mounted on the supply loader 12
Is the reversing mechanism 13 after being set to a predetermined temperature in the heating / cooling unit 20.
Are supplied to the rail 17 after being turned upside down.

The IC 5 under test that has dropped the rail 17 is stopped at a predetermined position by the positioning mechanism 14 composed of a cylinder, etc., and after the IC terminals and the test head 16 are connected by the contactors 15 on the left and right, the test signal is output from the test head 16. Are provided and the output signals are acquired and tested.

The tested IC 5 that has completed the test is released from the positioning mechanism 14, and is sorted by the sorting mechanism 18 based on the test result and mounted and stored on each rail of the sorting storage unloader 19 including a plurality of rails.

FIG. 6 shows a structure in which the robot 21 inserts and removes the IC 5 to be tested into and out of the socket 22 which is connected to and fixed to the test head 16.

[Problems to be Solved by the Invention]

In the former method of supplying a single IC to the test head by a rail and storing it, the mechanism for setting a large number of ICs in the test head becomes extremely complicated, and only about four simultaneous tests are realized.

In addition, if the IC shape is different, the loader and unloader must be replaced, and in addition, the parts that have been heated and cooled in advance must be supplied, so the test temperature cannot be set precisely.

In the latter method, if a large number of sockets are provided, a large number of sockets can be tested at the same time, but it takes time to contend for parts on the test head. Since it exists near the test head, there is a problem that it is particularly difficult to install the cooling mechanism.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a simple component testing apparatus capable of simultaneously testing a large number of components.

[Means for solving the problem]

In order to achieve the above object, the component testing apparatus of the present invention,
FIG. 1 As shown in the principle diagram of the present invention, a plurality of parts under test 5 are mounted on the test board 1 and transferred to the test head 10, and the test board 1 is connected to the test head 10 for testing and then tested. A component testing apparatus that transfers the board 10 to the storage position, removes the component under test 5 and sorts and stores it according to the test result, and has a plurality of sockets 2 with contacts for inserting the terminals of the component under test 5. , And the test board 1 composed of the connection terminal 12 drawn out from the contactor to a predetermined position by a lead wire, the supply robot 30 for inserting the part under test 5 into the socket 2 of the test board 1, and the part under test. A chamber 34 configured so that the test board 1 into which the 5 is inserted can be inserted and removed, and a pin terminal 13 corresponding to the contact terminal 12.
The test head 10 and the test board 1 provided with a connecting means 31 for bringing the connection terminal 12 and the pin terminal 13 into contact with each other to input / output an electric signal to / from the component under test 5.
A transfer means 33 for transferring the test board 1 to the inside of the chamber 34 and connecting the test board 1 to the test head 10 by the connecting means 31 for testing, and transferring the tested test board 1 to the storage position outside the chamber, and the storage position. The component to be tested 5 is removed from the test board 1 transferred to, and a classification storage robot 32 for sorting and storing based on the test result is provided.

[Action]

"The component 5 to be tested is mounted on the test board 1 by the supply robot 30, and the test board 1 is transferred into the high and low temperature chamber by the transfer means 33. In the chamber, for example, the connecting means 31 of the test head 10 moves up and down. And pin terminals
13 and the connection terminal 12 of the test board 1 are connected and tested.

After the test is completed, the transfer means 33 transfers the test board 1 to the outside of the chamber, and the classification storage robot 32 removes the parts under test 5 from the test board 1 and classifies the parts under test 5 in accordance with the test result. Store in the storage box.

As a result, multiple components are mounted on the test board 1,
Since the test pieces are transferred into the chamber and tested, a plurality of parts can be tested under a precise test temperature and simultaneously, and the efficiency of the test can be achieved. Further, since the components are mounted on the test board 1, it is possible to deal with the tests of the components having various shapes.

〔Example〕

 Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a top view of the component testing apparatus of the embodiment, FIG. 3 is a diagram showing a test head portion, and FIG. 4 is a handling processing flowchart.

In FIG. 2, reference numeral 1 is a test board, which mounts a large number of sockets 2 for inserting and removing the IC 5 to be tested, and which has a connection terminal 12 of the socket 2, that is, a lead-out terminal of the IC 5 to be tested on the back surface, 2 is a socket, 3 is a supply robot for mounting the IC 5 to be tested transferred by the supply loader 4 to each socket 2 of the test board 1, 4 is a supply loader, and a supply rail corresponding to the shape of the IC 5 to be tested is provided. What is provided, 5 is an IC to be tested, 6 is a chamber, which is provided on the test head and heats and cools to a specified test temperature in test board units. 7 is a classification storage robot, which is stored from inside the chamber 6. Tested from the tested test board 1 transferred to C
The IC5 is removed and mounted on a predetermined rail of the classification storage unloader 7 based on the test results. 8 is a classification storage unloader, which is equipped with a plurality of storage rails corresponding to the test results. The mounting means 30 corresponds to the supply robot 3 and the supply loader 4, and the classification storage means 32 corresponds to the classification storage robot 7 and the classification storage unloader 8, respectively.

Further, in FIG. 3, reference numeral 9 denotes a fixture, which is provided with a plurality of pin terminals 13 (test terminals) corresponding to the lead-out terminals of the test board 1 and is connected to the test board 1 transferred to a predetermined position B in the chamber 6. A terminal 12 is brought into contact with a pin terminal 13 to supply a test signal and take out an output signal. Reference numeral 10 is a test head, which is a means for simultaneously supplying and collecting a test signal to a plurality of ICs 5 under test. What is provided, 23 is a transfer means, which is composed of an XY table, a transfer rail, and the like.

The connecting means 31 in FIG. 1 corresponds to the fixture 9. The above-mentioned test head unit includes the test head 10,
It represents a part constituted by the fixture 9 and the chamber 6.

With the component testing apparatus having the above configuration, the test of the IC under test 5 is performed in the following procedure.

Processing procedure (1) The test board 1 is transferred and fixed to a predetermined mounting position A, and the plurality of ICs 5 to be tested carried by the supply robot 3 by the supply loader 4 are inserted into the sockets 2 of the test board 1, respectively.

Processing procedure (2) After the insertion is completed, the test board 1 is transferred to a predetermined position B on the test head 10.

It should be noted that the chamber 6 is provided with a window 11 that can be opened and closed, and the window 11 is opened so that the test board 1 is placed in the chamber 6.
Transported in

Further, the test board 1 transferred to the predetermined position B is fixed by a fixing mechanism (not shown) so as not to move due to positioning and pressing by the fixture 9.

Processing procedure (3) The fixture 9 is pushed upward, and the pin terminals 13 of the fixture 9 are pushed against the connection terminals 12 of the test board 1.

As a result, the test head 10 and the IC under test 5 are electrically connected.

Processing procedure (4) Air of a predetermined temperature is supplied into the chamber 6, and the test temperature of the IC under test 5 is set for each test board 1.

Processing procedure (5) A predetermined test signal is simultaneously supplied from the test head 10 to a plurality of ICs under test 5, and an output signal is taken out.

Processing procedure (6) After the test, the test board (1) is transferred to the storage position C, and the classification storage robot 7 is tested IC5.
Are sequentially removed and mounted on predetermined rails of the classification storage unloader 8 based on the test results notified by a test device (not shown).

When testing a large number of ICs, the next IC5 to be tested is scheduled to be inserted into the test board 1 during the above test.

In addition, the supply loader 4 and the classification storage unloader 8 corresponding to the IC shape are arranged in the operation range of the robot so that different ICs can be tested.

As described above, when the IC 5 to be tested is mounted on the test board 1 and transferred to the test head 10 for testing, the IC 5 to be tested can be inserted and removed outside the test head portion, and only the transfer time of the test board 1 is required. The handling time is substantially improved, and the efficiency of a large number of simultaneous tests is greatly improved.

Further, because the structure is connected to the test head 10 and the test temperature can be set for each test board, precise temperature setting is possible.

As a transfer method, when the XY table is used, the position of the test board 1 may be controlled to insert / remove components without using a robot, and the chamber 6 may be moved up and down when the test board 1 is transferred. It may be structured.

The present invention is not limited to the above-mentioned IC test, and it is needless to say that the present invention can be applied when a large number of parts that require a relatively long test time are tested.

〔The invention's effect〕

The present invention provides a component testing apparatus that mounts a component under test on a test board and transfers it to a test head for testing. It is not necessary to replace the supply loader and the unloader according to the shape of the component, and the versatility is high. Extremely high, the structure of the load storage loader is simple and the occurrence of component clogging is reduced, high-accuracy temperature setting is easy, the handling time is short compared to the test time, and the test efficiency is high. The effect of simultaneous individual testing is enormous.

[Brief description of drawings]

FIG. 1 is a principle view of the present invention, FIG. 2 is a top view of a component testing apparatus of an embodiment, FIG. 3 is a view showing a test head portion, FIG. 4 is a handling processing flowchart, and FIG. 5 is a conventional example ( FIG. 6 is a diagram showing (1), and FIG. 6 is a diagram showing a conventional example (2). In the figure, 1 is a test board, 2 is a socket, 3 is a supply robot, 4 is a supply loader, 5 is a component under test, IC under test, 6
Is a chamber, 7 is a classification storage robot, 8 is a classification storage unloader, 9 is a fixture, 10 is a test head, 11
Is a window, 12 is a connection terminal, 13 is a pin terminal, 30 is a supply robot, 30 is a supply robot, 31 is a connection means, 32 is a classification storage robot, 33 is a transfer means, and 34 is a chamber.

Claims (1)

(57) [Claims] 1. A plurality of parts to be tested are mounted on a test board and transferred to a test head, the test board is connected to the test head for testing, and then the test board is transferred to a storage position to transfer the parts to be tested. A parts tester for removing test parts and classifying and accommodating them according to test results. The socket has a plurality of sockets with contacts for inserting the terminals of the parts under test, and leads from the contacts to predetermined positions. The test board composed of the drawn-out connection terminals, the feeding robot for inserting the component under test into the socket of the test board, and the chamber configured so that the test board with the component under test inserted therein can be inserted and removed. And a pin terminal corresponding to the contact terminal, the contact terminal being in contact with the pin terminal to input and output an electrical signal to and from the component under test. The test head provided with a connecting means and the test board are transferred into the chamber and the connecting means connects the test board to the test head for testing, and the test board after the test is placed outside the chamber. A parts testing apparatus comprising: a transfer means for transferring to a storage position; and a classification storage robot for removing the parts under test from the test board transferred to the storage position and classifying and storing based on the test result.