JP2530901Y2 - Chip type electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component, and more particularly, to a structure for stabilizing a step size between a lower surface of a standoff of an exterior resin material and a lower surface of an external lead member.

[0002]

2. Description of the Related Art As a specific example of a chip-type electronic component, the structure of a chip-type diode is shown in FIG. As shown in the figure, a chip type diode 5 is configured such that a semiconductor chip 2 which is an electronic component body bonded to an external lead member 1a and an external lead member 1b are connected to a lead wire 3 by wire bonding.
Then, the external lead members 1a and 1b are formed by bending the external lead members 1a and 1b so as to have the outer shape of the external resin material 4.

The lead forming step will be described. After cutting the above-mentioned external lead members 1a and 1b extending in opposite directions and projecting on the side end surfaces of the exterior resin material 4 to a predetermined length, FIG. A), (B), and (C) show the external lead member 1 in accordance with the molding order shown in the front view in partial cross section.
The lead forming operation is performed such that a and 1b are bent along the side end surface and the back surface of the exterior resin material 4.

More specifically, first, as shown in FIG. 5 (A), the external lead members 1a, 1b are led out in opposite directions and cut along predetermined cutting lines 6, 6 to form the external lead members 1a. , 1b are cut off. Next, as shown in FIG. 5B, the external lead members 1a, 1b of the chip type diode 5, whose distal end portions are cut off, are separated from the side end surface of the exterior resin material 4 by a predetermined distance. It is bent in an L-shape at distant positions (first bending portions) P, P. Finally, as shown in FIG. 5C, the external lead members 1a and 1b bent in an L shape are bent downward by about 90 ° at the second bent portions Q and Q near the side surface of the exterior resin material 4. As a result, the tip portions of the external lead members 1a and 1b wrap around the back surface side of the exterior resin material 4 to form the mounting surface of the printed board.

[0005]

When the chip type diode 5 is mounted on a printed board, an adhesive is applied to the printed board in order to fix the chip type diode 5 and the printed board. Chip type diode 5
The lower surfaces of the external lead members 1a and 1b and the standoff 7 are securely bonded to the lower surface of the standoff 7 on the rear surface of
The standard of the step (hereinafter abbreviated as Q1 dimension) with respect to the lower surface is set to, for example, 0.00 to 0.10 mm. However, as described above, the shape of the external lead members 1a and 1b is When the lead members 1a and 1b are formed by bending them at two places, inaccuracies in bending angle due to springback or the like at the time of bending the external lead members 1a and 1b are accumulated. Maintenance was difficult.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the height of the stand-off formed on the lower surface of the exterior resin material is changed from the thickness of the external lead member to the standard step size of Q1. The present invention provides a chip-type electronic component characterized by having an external lead member which is a value obtained by subtraction and which is bent and molded so as to be in close contact with a side surface portion and a bottom surface portion of an exterior resin material.

Further, this invention is a Sejo and cylindrical projections at which position or in contact away from the standoffs and it on the back outer resin material provided, the standoff and collision
Characterized in that the difference between the electromotive force of the height is a value obtained by subtracting the standard in level difference between the external lead member lower surface and standoff lower surface, and has the external lead member bending and shaping so as to be in close contact on the projection And a chip-type electronic component.

[0008]

[Function] Height of stand-off or stand-off
By setting the difference between the height dimension of the
1 If the dimension is the height of the standoff or the standoff
In addition, only the difference between the heights of the protrusions and the thickness of the external lead member can be regulated and stabilized. In addition, by making the bending angle slightly acute when bending the external lead member,
Back surface of the tip portion of the external lead member exterior resin material or
Because folded in close contact with the projections, the Q1 dimensions, without being influenced by the slight variations in the precision folding of the spring-back or the like, can be easily placed in the standard. If it is bent over the projection, the printed wiring board
When soldering, solder is applied to the tip of the external lead member (soldering
Surface), it is easy to get around to the back surface, and soldering strength is increased.
You .

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a chip type diode showing a first embodiment of the present invention. In the figure, reference numeral 70 denotes a stand-off formed on the lower surface of the exterior resin material 40, whose height dimension is within the standard value of the Q1 dimension (for example, 0.00 to 0.10 m) from the thickness of the plate of the external lead members 10a and 10b.
m) is subtracted. In addition, the external lead members 10a and 10b are bent and formed so as to be in close contact with the side and bottom portions of the exterior resin material 40.
In this case, the bending angle of the first bent portions P, P is 90 °.
If the angle is set to be slightly more acute, the lower ends of the external lead members 10a and 10b are more likely to adhere to the lower surface of the exterior resin material 40 when bent at the second bending portions Q and Q.

With this configuration, the thickness of the external lead members 10a and 10b minus the height of the standoff 70 is constant. That is, the Q1 dimension is regulated only by the dimensions of those members and becomes constant, so that a chip type diode 50 having a stable Q1 dimension can be obtained.

[0012] Figure 2 is a perspective view from the back surface of the chip-type diode which is the second embodiment of this invention, the stand-off 71 on the back surface of the exterior resin material 41 in this embodiment
In addition, ridge-shaped projections 81a and 81b are formed in a direction orthogonal to the lead-out direction of the external lead members 11a and 11b . The height of the ridge-shaped projections 81a and 81b is set to be smaller than the height of the stand-off 71, and the difference between the height and the thickness of the external lead members 11a and 11b indicates the value within the standard of the Q1 dimension. The value is subtracted. Although not shown, the external lead member 1
1a, 11b is a side section and Sejo projections 81a of the outer resin member 41 is bent shaped so as to be in close contact with the 81b.

In this way, the Q1 dimension is stabilized in the same manner as in the first embodiment, and the solder is mounted on the back surface of the tips (soldering surfaces) of the external lead members 11a and 11b during mounting on the printed wiring board. In order to make it easy to go around, the soldering strength is increased.

[0014] Figure 3 is a perspective view from the back surface of the chip-type diode showing a third embodiment of this invention, the back surface of the outer resin material 42 in this embodiment in addition to standoffs 72, the cylindrical projections 82a and 82b are formed. As in the second embodiment, the height of the columnar projections 82a and 82b is smaller than the height of the stand-off 72, and the difference between the heights is smaller than the thickness of the external lead members 12a and 12b by Q1. It is set to the value obtained by subtracting the numerical value in the standard.

According to this embodiment, solderability is further improved in addition to stabilization of the Q1 dimension.

The ridge-shaped projections 81a and 81b and the column-shaped projections 82a and 82 in the second and third embodiments are used.
Although b is formed separately from the stand-offs 71 and 72, it can be formed integrally. In addition, the shape may be arbitrary, as long as it has a predetermined height.

[0017]

As described above, as described above, the height of the stand-off of the exterior resin material or the stand-off and the protrusion
The difference in height and standard within the numerical thickness -Q1 dimensions of the plate of the external lead member, and also the external lead member exterior resin surface
By bending and forming in close contact with the protrusion, the Q1 dimension of the chip-type electronic component has been stabilized, contributing to the improvement of non-defective products in production and the stable operation of equipment in the bending process of external lead members. In addition, there is an effect that the mountability of the chip-type electronic component on a printed board can be improved. Also, bend the external lead member in close contact with the protrusion
If molded, the solder will not be removed when mounted on the printed circuit board.
Wrap around the back of the tip (soldering surface) of the lead
And soldering strength increases.

[Brief description of the drawings]

FIG. 1 is a front view of a chip-type electronic component according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the chip-type electronic component according to the second embodiment as viewed from the back surface.

FIG. 3 is a perspective view of the chip-type electronic component according to the third embodiment as viewed from the back surface.

FIG. 4 is a front sectional view of a chip diode which is an example of a conventional chip electronic component.

FIGS. 5A, 5B, and 5C are front views for explaining a forming order of an external lead member in a chip-type electronic component.

[Explanation of symbols]

2 Electronic component body (semiconductor chip) 10a, 10b, 11a, 11b, 12a, 12b External lead member 40, 41, 42 Outer resin material 50, 51, 52 Chip type electronic component (chip type diode) 70, 71, 72 Stand Off 81a , 81b Ridge-shaped projection 82a, 82b Column-shaped projection

Claims (2)

(57) [Scope of request for utility model registration] An electronic component main body and an exterior of the electronic component main body.
And an exterior resin material with a standoff on the back
Lead out from the side of the resin material and fold it along the back.
A chip-type electronic component having a bent external lead member, wherein a projection is provided on the back surface , and the stand-off and the projection are provided.
The difference in height dimension, a value obtained by subtracting the standard in level difference between the lower surface of the external lead member lower surface and standoff from the thickness of the external lead member, and the projection of the external lead member
A chip-type electronic component characterized by being bent and formed so as to be in close contact with the top . 2. The chip-type electronic component according to claim 1, wherein said projection has a ridge shape or a column shape.