JP2528842Y2 - 半導体素子の樹脂封止装置 - Google Patents
半導体素子の樹脂封止装置Info
- Publication number
- JP2528842Y2 JP2528842Y2 JP1987117710U JP11771087U JP2528842Y2 JP 2528842 Y2 JP2528842 Y2 JP 2528842Y2 JP 1987117710 U JP1987117710 U JP 1987117710U JP 11771087 U JP11771087 U JP 11771087U JP 2528842 Y2 JP2528842 Y2 JP 2528842Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- resin
- fixed
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 64
- 239000011347 resin Substances 0.000 title claims description 64
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 238000007789 sealing Methods 0.000 title claims description 18
- 238000005452 bending Methods 0.000 claims description 17
- 230000000694 effects Effects 0.000 description 13
- 238000000465 moulding Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 8
- 230000002411 adverse Effects 0.000 description 5
- 230000013011 mating Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987117710U JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987117710U JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422033U JPS6422033U (en, 2012) | 1989-02-03 |
| JP2528842Y2 true JP2528842Y2 (ja) | 1997-03-12 |
Family
ID=31361405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987117710U Expired - Lifetime JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528842Y2 (en, 2012) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125121U (ja) * | 1984-07-19 | 1986-02-14 | 株式会社東芝 | モ−ルド成形装置 |
| JPH0410885Y2 (en, 2012) * | 1985-09-27 | 1992-03-18 | ||
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
-
1987
- 1987-07-30 JP JP1987117710U patent/JP2528842Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6422033U (en, 2012) | 1989-02-03 |
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