JP2527673Y2 - Joint plate of strip-shaped continuous member having feed holes for conveyance - Google Patents
Joint plate of strip-shaped continuous member having feed holes for conveyanceInfo
- Publication number
- JP2527673Y2 JP2527673Y2 JP1990118640U JP11864090U JP2527673Y2 JP 2527673 Y2 JP2527673 Y2 JP 2527673Y2 JP 1990118640 U JP1990118640 U JP 1990118640U JP 11864090 U JP11864090 U JP 11864090U JP 2527673 Y2 JP2527673 Y2 JP 2527673Y2
- Authority
- JP
- Japan
- Prior art keywords
- joint plate
- strip
- conveyance
- shaped continuous
- continuous member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Replacement Of Web Rolls (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は搬送用送り孔を有する帯状連続部材の継手板
に関し、特に半導体装置製造用リードフレームの継手板
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a joint plate of a strip-shaped continuous member having a feed hole for conveyance, and more particularly to a joint plate of a lead frame for manufacturing a semiconductor device.
従来、例えば複数個の半導体装置製造用リードフレー
ムを連続に接続して連結使用する場合は、通常、継手板
を介する接続手法が採用される。2. Description of the Related Art Conventionally, for example, when a plurality of lead frames for manufacturing a semiconductor device are continuously connected and used, a connection method via a joint plate is usually employed.
第３図は半導体装置製造用リードフレームを連結使用
する際用いられる従来継手板の構造図を示すもので、２
つのリードフレーム4a,4bは連結後の自動機による連続
マウント工程作業が円滑に行え得るように、連結部位を
挾む位置決め孔ピッチP1をリードフレーム上の他の位置
決め孔ピッチＰに等しく設定して、継手板５にそれぞれ
の端部がスポット接続される。ここで、6a（または6b）
はリードフレーム上の送り孔を兼ねる位置決め孔を示
す。FIG. 3 is a structural view of a conventional joint plate used when connecting and using a lead frame for manufacturing a semiconductor device.
One of the lead frame 4a, 4b is as continuous mounting process work by automatic machines after coupling can proceed smoothly, set equal to the positioning hole pitch P 1 sandwiching a connection portion to another positioning hole pitch P of the lead frame Thus, each end is spot-connected to the joint plate 5. Where 6a (or 6b)
Indicates a positioning hole also serving as a feed hole on the lead frame.
しかしながら、このように２つの母材間の接続機能の
みに着眼して考案された従来の継手板は、連結部位を挾
んだ位置決め孔ピッチP1と母材上の位置決め孔のピッチ
Ｐとが等しくなるようにしなければならないので必然的
に短冊状のものとなる。しかも、その横幅Ｗは配列搭載
する半導体装置７の搭載間隔Ａよりも挾い必要があるの
で、一度接続してしまうと連結部位が判別しにくくなる
現在の状況では工程管理上きわめて不都合なことが起こ
る。すなわち、自動機によって連続作業が行われている
場合では、自動機による検出が困難なため、連結部位に
誤ってプレス加工機を下降させたりすることがおこり、
連結箇所における付帯作業や検査の能率を低下させる。
従って、半導体装置７に対してプレス加工を必要とする
場合では、半導体装置７の周囲にプレスのための押さえ
しろを確保する必要が生じ、また、連結部位を母材4a,4
b上の位置決め孔6a,6bを避けて設ける必要があるなどの
制約を受けるので、母材4a,4bの位置決め孔パターン設
計上の自由度を低め、母材の使用効率の低下を招いてい
る。However, in this way two matrix between the conventional joint plates devised by paying attention only to the connection function of, sandwiching the connecting portion and the positioning hole pitch P 1 and the pitch P of the positioning holes on the base material Since they must be equal, they are necessarily strip-shaped. Moreover, the width W of the semiconductor devices 7 must be narrower than the mounting interval A of the semiconductor devices 7 to be mounted. Therefore, once connected, it is difficult to determine the connection portion. Occur. In other words, when continuous work is performed by an automatic machine, it is difficult to detect by the automatic machine, so that the press machine may be erroneously lowered to the connection site,
It reduces the efficiency of incidental work and inspections at connection points.
Therefore, when the semiconductor device 7 needs to be press-worked, it is necessary to secure a pressing margin around the semiconductor device 7 for pressing.
Since there are restrictions such as the necessity of providing the positioning holes 6a and 6b on b, the degree of freedom in positioning hole pattern design of the base materials 4a and 4b is reduced, and the use efficiency of the base material is reduced. .
本考案の目的は、上記の情況に鑑み、生産管理が必要
とする連結部位の位置情報および作業工程制御情報を発
生することのできる搬送用送り孔を有する帯状連続部材
連結のための継手板を提供することである。SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a joint plate for connecting a belt-shaped continuous member having a feed hole for conveyance capable of generating positional information of a connection part required for production management and work process control information. To provide.
本考案によれば、搬送用送り孔を有する帯状連続部材
の継手板の一つは、搬送用送り孔を有する複数個の帯状
連続部材を互いに連結する継手板において、該継手板は
連結部位識別情報発生手段と共に前記帯状連続部材上の
位置決め孔と同一形状の一つの位置決め孔を表面に備
え、連結部位を挾む位置決め孔ピッチを前記帯状連続部
材上の位置決め孔をピッチと等しく設定して連結するこ
とを含んで構成され、また、他の一つは、前記帯状連続
部材上の位置決め孔ピッチと等しいピッチ間隔をもつ少
なくとも２つの位置決め孔と、複数個の定点孔の組合わ
せからなる作業工程管理情報発生手段とを継手板上に備
えて構成される。According to the present invention, one of the joint plates of the strip-shaped continuous member having the feed hole for transfer is a joint plate for connecting a plurality of strip-shaped continuous members having the feed hole for transfer to each other. A positioning hole having the same shape as the positioning hole on the strip-shaped continuous member is provided on the surface together with the information generating means, and the pitch of the positioning holes sandwiching the connecting portion is set by setting the positioning hole on the strip-shaped continuous member equal to the pitch. The other is a work process comprising a combination of at least two positioning holes having a pitch interval equal to the pitch of the positioning holes on the strip-shaped continuous member, and a plurality of fixed-point holes. The management information generating means is provided on the joint plate.
本考案によれば、継手板上には少なくとも一つの位置
決め孔と連続部位の位置その他自動生産機械が必要とす
る各種の工程制御情報の発生手段とが設けられるので、
搬送用送り孔を有する帯状連続部材を無駄なく効率的に
連結できる外、ロットまたは品種識別等を充分に管理し
つつ効率的な生産を行うことができる。According to the present invention, at least one positioning hole and a position of a continuous part and other means for generating various process control information required by the automatic production machine are provided on the joint plate.
In addition to efficiently connecting the belt-shaped continuous members having the transporting feed holes without waste, efficient production can be performed while sufficiently managing the lot or product type identification.
次に本考案について図面を参照して詳細に説明する。 Next, the present invention will be described in detail with reference to the drawings.
第１図は本考案を半導体装置製造用リードフレームに
実施した場合の一実施例を示す連結状態図である。本実
施例によれば、継手板１は連結すべき２つのリードフレ
ーム4a,4bが備える位置決め孔6a,6bと同一形状の位置決
め孔2a,2bおよび連結部位識別情報孔３とをその板上に
備え、位置決め孔6a,6bおよび2a,2b間の距離をリードフ
レーム上の位置決め孔ピッチＰと等しく設定されてリー
ドフレームの端部にスポット接続される。ここで、７は
従来と同じく半導体装置である。継手板１をリードフレ
ーム4a,4bにスポット溶接する場合には、位置決め孔の
ピッチＰを数十ミクロンの精度で備えられるように勘合
ピンを有する溶接治具を用いる。この際、少なくとも３
本のピンをリードフレーム4a,4bの位置決め孔6a（また
は6b）と継手板１上の位置決め孔2a（または2b）にそれ
ぞれ挿入して３者の位置関係を固定し、この状態でスポ
ット溶接する。連結後、継手板１上の位置決め孔2a,2b
は半導体装置の製造工程中リードフレーム4a,4b上の位
置決め孔6a,6bと同様に機能すると共に、光学的センサ
による連結部位識別情報孔３の検出により継手板１の存
在位置を他と容易に区別できるので、例えば、継手板の
所ではプレス加工機を下降させない等といった工程制御
を効率的に行うことができる。FIG. 1 is a connection diagram showing an embodiment in which the present invention is applied to a lead frame for manufacturing a semiconductor device. According to the present embodiment, the joint plate 1 has positioning holes 6a and 6b provided in the two lead frames 4a and 4b to be connected, positioning holes 2a and 2b having the same shape, and a connection portion identification information hole 3 on the plate. The distance between the positioning holes 6a, 6b and 2a, 2b is set to be equal to the pitch P of the positioning holes on the lead frame, and is spot-connected to the end of the lead frame. Here, 7 is a semiconductor device as in the prior art. When the joint plate 1 is spot-welded to the lead frames 4a and 4b, a welding jig having a fitting pin is used so that the pitch P of the positioning holes is provided with an accuracy of several tens of microns. At least 3
The three pins are inserted into the positioning holes 6a (or 6b) of the lead frames 4a and 4b and the positioning holes 2a (or 2b) on the joint plate 1 to fix the positional relationship between the three members, and spot welding is performed in this state. . After connection, positioning holes 2a, 2b on joint plate 1
Functions in the same manner as the positioning holes 6a and 6b on the lead frames 4a and 4b during the manufacturing process of the semiconductor device, and the position of the joint plate 1 can be easily determined by detecting the connection site identification information hole 3 by an optical sensor. Since it can be distinguished, for example, the process control such that the press machine is not lowered at the joint plate can be efficiently performed.
第２図は本考案を半導体装置製造用リードフレームに
実施した場合の他の実施例を示す継手板の構造図であ
る。FIG. 2 is a structural view of a joint plate showing another embodiment in which the present invention is applied to a lead frame for manufacturing a semiconductor device.
本実施例によれば、継手板１はリードフレーム上の位
置決め孔ピッチＰと等しく配置された２組の位置決め孔
2a,2bと、定点孔８の複数個の組合わせからなる作業工
程制御情報孔とを含む。ここ、複数個の定点孔８はそれ
ぞれ位置座標をもつもので、その組合わせによって連結
部位の識別を含む多数の作業工程管理情報を発生するこ
とができる。例えば、定点数が５個ならば25＝32通りの
情報を持たせることができるのでロットまたは品種識別
等各種の工程管理情報を継手板上に盛り込むことが可能
となる。According to this embodiment, the joint plate 1 is provided with two sets of positioning holes arranged at the same pitch P as the positioning holes on the lead frame.
2a and 2b, and a work process control information hole composed of a plurality of combinations of fixed point holes 8. Here, the plurality of fixed point holes 8 each have position coordinates, and a large number of operation process management information including the identification of the connection portion can be generated by combining the fixed point holes 8. For example, if the number of fixed points is 5, 2 5 = 32 kinds of information can be provided, so that various process management information such as lot or product type identification can be included on the joint plate.
以上は本考案をリードフレームに実施した場合につい
て、また継手板上にリードフレームの位置決め孔と同形
の位置決め孔を設けた場合を説明したが、その他の技術
分野における生産補助材に対して実施することも可能で
ある。また、位置決め孔の形状も送りと位置決めの機能
をもつ限り、母材上の位置決め孔と完全に同形状である
必要はない。また、連結部位識別情報孔および定点孔に
関しても、例えば、突起，切欠き，インクマークその他
の識別可能手段に代えることもできる。The above describes the case where the present invention is applied to a lead frame, and the case where a positioning hole having the same shape as the positioning hole of a lead frame is provided on a joint plate. However, the present invention is applied to a production auxiliary material in other technical fields. It is also possible. Further, the shape of the positioning hole does not need to be completely the same as the shape of the positioning hole on the base material, as long as it has the functions of feeding and positioning. Also, the connection site identification information hole and the fixed point hole can be replaced with, for example, protrusions, cutouts, ink marks, and other identifiable means.
以上詳細に説明したように、本考案によれば、例えば
リードフレームの如き生産補助部材を複数個連結して使
用する場合、生産管理が必要とする連結部位に対する作
業工程制御その他の工程管理情報を継手板上に含ませる
ことができるので、生産効率の向上に顕著な効果をあげ
ることができる。また、継手板上の位置決め孔は全て母
材上の位置決め孔に合わせて設けることができるので、
母材設計がきわめて自由となる。すなわち、母材の位置
決め孔パターン設計に制約を受けることがなくなるの
で、その使用効率を高めることが可能となる。As described above in detail, according to the present invention, when a plurality of production auxiliary members such as lead frames are connected and used, work process control and other process management information for a connection part required for production management are used. Since it can be included on the joint plate, a remarkable effect can be obtained for improving the production efficiency. Also, since all the positioning holes on the joint plate can be provided according to the positioning holes on the base material,
Extremely flexible base material design. In other words, since the positioning hole pattern design of the base material is not restricted, the usage efficiency can be improved.
第１図は本考案を半導体装置製造用リードフレームに実
施した場合の一実施例を示す連結状態図、第２図は本考
案を半導体装置製造用リードフレームに実施した場合の
他の実施例を示す継手板の構造図、第３図は半導体装置
製造用リードフレームを連結使用する際用いられる従来
継手板の構造図である。 １……継手板、2a,2b……継手板上の位置決め孔、３…
…連結部位識別情報孔、4a,4b……リードフレーム、6a,
6b……リードフレーム上の位置決め孔、７……半導体装
置、８……定点孔。FIG. 1 is a connection state diagram showing an embodiment in which the present invention is applied to a lead frame for manufacturing a semiconductor device, and FIG. 2 is another embodiment in which the present invention is applied to a lead frame for manufacturing a semiconductor device. FIG. 3 is a structural view of a conventional joint plate used when connecting and using a lead frame for manufacturing a semiconductor device. 1 ... joint plate, 2a, 2b ... positioning holes on joint plate, 3 ...
… Connection site identification information holes, 4a, 4b …… lead frame, 6a,
6b: Positioning hole on lead frame, 7: Semiconductor device, 8: Fixed point hole
Claims (2)
続部分であって一定離間距離開いている部分に前記一定
離間距離より長い継手板を重ねて接続することにより連
結する搬送用送り孔を有する帯状連続部材の継手板にお
いて、前記継手板に搬送用送り孔を有し、前記帯状連結
部材に有する前記搬送用送り孔のピッチに等しくなるよ
うに前記継手板に有する前記搬送用送り孔が設定されて
いることを特徴とする搬送用送り孔を有する帯状連続部
材の継手板。1. A transporting feed hole which is connected to a discontinuous portion of a continuous strip member having a transporting feed hole which is open at a fixed distance by overlapping and connecting a joint plate longer than the predetermined distance. In the joint plate of the strip-shaped continuous member having a feed hole for conveyance in the joint plate, the feed hole for conveyance provided in the joint plate so as to be equal to the pitch of the feed holes for conveyance in the band-shaped connecting member Is set, and a joint plate of a strip-shaped continuous member having a feed hole for conveyance.
孔が複数配列していることを特徴とする請求項１記載の
搬送用送り孔を有する帯状連続部材の継手板。2. The joint plate according to claim 1, wherein a plurality of said feed holes are arranged at a constant pitch in said joint plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118640U JP2527673Y2 (en) | 1990-11-13 | 1990-11-13 | Joint plate of strip-shaped continuous member having feed holes for conveyance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118640U JP2527673Y2 (en) | 1990-11-13 | 1990-11-13 | Joint plate of strip-shaped continuous member having feed holes for conveyance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0474456U JPH0474456U (en) | 1992-06-30 |
| JP2527673Y2 true JP2527673Y2 (en) | 1997-03-05 |
Family
ID=31866587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990118640U Expired - Lifetime JP2527673Y2 (en) | 1990-11-13 | 1990-11-13 | Joint plate of strip-shaped continuous member having feed holes for conveyance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527673Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640638B2 (en) * | 1984-08-29 | 1994-05-25 | 日本電気ホームエレクトロニクス株式会社 | Synchronization method and device in spread spectrum communication |
| JPH0671960B2 (en) * | 1987-10-26 | 1994-09-14 | オタリ株式会社 | Tape joining device with printing function |
-
1990
- 1990-11-13 JP JP1990118640U patent/JP2527673Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0474456U (en) | 1992-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106061108B (en) | A kind of anti-welding aligning structure of printed circuit board | |
| JP2527673Y2 (en) | Joint plate of strip-shaped continuous member having feed holes for conveyance | |
| JP2001138291A (en) | System and method for setting of punch | |
| CN212727594U (en) | SMT welding tool carrier | |
| JPH11898A (en) | Punching machine for printed circuit board | |
| CN215991815U (en) | A tool for accurate paster of FPC | |
| JP3212368B2 (en) | Automatic reference drilling machine for printed circuit boards | |
| CN207219145U (en) | A kind of periphery holes fool proof printed circuit board (PCB) | |
| JPH045184B2 (en) | ||
| JPH0546282Y2 (en) | ||
| CN110058496A (en) | A kind of circuit board exposure equipment and exposure technology | |
| CN211222605U (en) | Automatic riveting full-detection and code printing automation equipment | |
| JPH01287937A (en) | Film carrier tape | |
| JPH056867U (en) | Printed circuit board | |
| JPS6369293A (en) | Method of aligning electronic parts | |
| JP2542930Y2 (en) | Dummy wafer | |
| JPH0135503B2 (en) | ||
| JPS60152433U (en) | Holding device for screen plate in screen printing machine | |
| JPS63311798A (en) | Alignment mark | |
| JP2512687Y2 (en) | Printed board | |
| JP2578360Y2 (en) | Card holder for printing equipment | |
| JPH0440921Y2 (en) | ||
| JP2556383Y2 (en) | connector | |
| JP2894303B2 (en) | Marking device | |
| JPH0585044U (en) | Pattern structure of TAB substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |