CN212727594U - SMT welding tool carrier - Google Patents
SMT welding tool carrier Download PDFInfo
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- CN212727594U CN212727594U CN202021616606.5U CN202021616606U CN212727594U CN 212727594 U CN212727594 U CN 212727594U CN 202021616606 U CN202021616606 U CN 202021616606U CN 212727594 U CN212727594 U CN 212727594U
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Abstract
The utility model discloses a SMT welding frock carrier, include: the PCB positioning device comprises a first carrier plate, a second carrier plate and a positioning mechanism, wherein the first carrier plate is provided with a plurality of positioning pins for positioning a PCB and buckles for fixing the PCB; the pressing plate assembly is fixedly connected with the first carrier plate through a fastening piece and is pressed on the PCB of the first carrier plate in a pressing mode; the pressure plate assembly comprises a cover plate and a second carrier plate fixedly connected with the cover plate; be equipped with on the second support plate with the relative spacing groove of equipment position on the PCB board including on the apron at least with the relative jump ring round pin in spacing groove, the jump ring round pin is used for will being located the potsherd on the piece pah in the spacing groove is pressed in equipment position on the PCB board. The tool carrier can ensure accurate alignment of the PCB and the ceramic wafer, and improves the yield and the processing efficiency of products.
Description
Technical Field
The utility model relates to a SMT welding field especially relates to a SMT welding frock carrier.
Background
With the continuous exploration of the communication industry, the design and production of the dielectric and the PCB of the 5G filter are basically solved at present. The processing of the product can be influenced by the following points in the welding process of the medium and the PCB: 1. aligning the PCB with the ceramic before welding; 2. absorbing heat and dissipating heat of the product in the process of passing the furnace; 3. quick assembly and disassembly of the product and the carrier, and the like. In the prior art, there is no effective method for combining the two reasonably.
Disclosure of Invention
In order to overcome the defect among the prior art, the embodiment of the utility model provides a SMT welding tool carrier can guarantee the accurate counterpoint of PCB board and potsherd through using this tool carrier, improves the yield and the machining efficiency of product.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a SMT welding frock carrier, includes:
the PCB positioning device comprises a first carrier plate, a second carrier plate and a positioning mechanism, wherein the first carrier plate is provided with a plurality of positioning pins for positioning a PCB and buckles for fixing the PCB;
the pressing plate assembly is fixedly connected with the first carrier plate through a fastening piece and is pressed on the PCB of the first carrier plate in a pressing mode;
the pressure plate assembly comprises a cover plate and a second carrier plate fixedly connected with the cover plate; be equipped with on the second support plate with the relative spacing groove of equipment position on the PCB board including on the apron at least with the relative jump ring round pin in spacing groove, the jump ring round pin is used for will being located the potsherd on the piece pah in the spacing groove is pressed in equipment position on the PCB board.
Among the above-mentioned technical scheme, the spacing groove includes a plurality ofly, be the permutation and arrange in on the second support plate, the spacing groove with pah piece looks adaptation.
In the above technical scheme, each of the limiting grooves is opposite to the two snap spring pins, and the two snap spring pins are arranged along the extending direction of the limiting groove.
In the technical scheme, a plurality of first positioning holes are formed in the periphery of the first carrier plate, and first positioning columns matched with the first positioning holes are arranged on the cover plate.
In the above technical scheme, the first carrier plate is provided with a plurality of second positioning columns, and the second carrier plate is provided with second positioning holes matched with the second positioning columns.
In the above technical scheme, the first carrier plate, the second carrier plate and the cover plate are uniformly provided with a plurality of air holes.
In the technical scheme, a first flanging is arranged on the outer edge of the first carrier plate, a second flanging opposite to the first flanging is arranged on the outer edge of the second carrier plate, and the first flanging and the second flanging form a guide rail for chain transmission.
In the above technical solution, the fastening member is U-shaped and connected to the cover plate and two sides of the first carrier plate.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the utility model discloses in be equipped with on the second support plate with the PCB board on the equipment position relative spacing groove, be equipped with the jump ring round pin relative with the spacing groove on the apron, the even atress of potsherd and PCB board on printing and pah piece can be guaranteed to the jump ring round pin, improves the processingquality of product.
2. The first support plate is provided with a positioning pin for positioning the PCB, a first positioning hole for positioning the cover plate, and a second positioning column for positioning the second support plate, so that the PCB and the ceramic plate are accurately aligned through the matching of the positioning hole, the positioning column and the like, and the yield of products is improved.
3. The first support plate, the second support plate and the cover plate are uniformly provided with air holes, so that the heat absorption efficiency and the heat dissipation efficiency of the product passing through the furnace can be improved through the arrangement of the air holes.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a SMT welding tool carrier assembly of the present invention;
fig. 2 is a schematic view of a first carrier plate structure in the present invention;
fig. 3 is a schematic view of the middle pressure plate assembly of the present invention;
FIG. 4 is a schematic diagram of the structure of the middle cover plate of the present invention;
fig. 5 is a schematic diagram of a second carrier structure of the present invention.
Reference numerals of the above figures: 1. a first carrier plate; 2. buckling; 3. a platen assembly; 4. a fastener; 5. a cover plate; 6. a second carrier plate; 7. a limiting groove; 8. a circlip pin; 9. a pah member; 10. a first positioning hole; 11. a first positioning post; 12. a second positioning column; 13. a second positioning hole; 14. air holes are formed; 15. a first flanging; 16. second flanging; 17. positioning pins; 18. and (7) a PCB board.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1-5, an SMT welding tool carrier comprises:
the PCB fixing device comprises a first carrier plate 1, wherein a plurality of positioning pins 17 used for positioning a PCB 18 and a buckle 2 used for fixing the PCB 18 are arranged on the first carrier plate 1;
the pressing plate component 3 is fixedly connected with the first carrier plate 1 through a fastener 4 and is pressed on the PCB 18 of the first carrier plate 1;
the pressure plate assembly 3 comprises a cover plate 5 and a second carrier plate 6 fixedly connected with the cover plate 5; be equipped with on the second carrier plate 6 with the relative spacing groove 7 in the equipment position on the PCB board 18 including on the apron 5 at least with the relative jump ring round pin 8 of spacing groove 7, jump ring round pin 8 is used for will being located the potsherd on the pah piece 9 in the spacing groove 7 is pressed in on the equipment position on the PCB board 18.
A plurality of fixing positions are arranged on the first carrier 1, and each fixing position can fix a makeup formed by a plurality of PCB boards 18. Referring to fig. 2, two fixing positions may be disposed on the first carrier 1, and a positioning pin 17 is disposed on a peripheral side of each fixing position for defining a placement position of the imposition. The periphery of each fixing position is further provided with a buckle 2, and the buckle 2 is rotated to press the PCB 18 placed on the fixing position, so that the PCB 18 is fixed on the first carrier plate 1. By means of the makeup mode, the welding efficiency of the product can be improved.
Referring to fig. 5, cooperating with the PCB that sets up on first carrier plate 1, spacing groove 7 on the second carrier plate 6 includes a plurality ofly, and it is the permutation and arrangement in on the second carrier plate 6, spacing groove 7 with piece 9 looks adaptation pah, thereby make piece 9 inlay in spacing groove 7 pah.
In order to ensure that the ceramic chip and the PCB 18 are stressed uniformly in the pressing process, each limiting groove 7 is opposite to two clamp spring pins 8, and the two clamp spring pins 8 are arranged along the extending direction of the limiting groove 7.
Referring to fig. 1, in order to ensure that the ceramic wafer on the pah member 9 can be opposite to the assembly position on the PCB 18 on the first carrier plate 1 in the assembly process of the platen assembly 3 and the first carrier plate 1, a plurality of first positioning holes 10 are formed in the periphery of the first carrier plate 1, and first positioning posts 11 matched with the first positioning holes 10 are formed in the cover plate 5. A plurality of second positioning columns 12 are disposed on the first carrier 1, and second positioning holes 13 matched with the second positioning columns 12 are disposed on the second carrier 6.
In a preferred embodiment, a plurality of ventilation holes 14 are uniformly distributed on the first carrier plate 1, the second carrier plate 6 and the cover plate 5. The arrangement of the air holes 14 can improve the heat absorption efficiency and the heat dissipation efficiency of the product when the product passes through the furnace.
In a preferred embodiment, the outer edge of the first carrier 1 is provided with a first flange 15, the outer edge of the second carrier 6 is provided with a second flange 16 opposite to the first flange 15, and the first flange 15 and the second flange 16 form a guide rail for chain transmission.
Referring to fig. 1, the fastening members are U-shaped, at least two of the fastening members are oppositely arranged, and the fastening members are connected to the cover plate 5 and two sides of the first carrier plate 1.
The specific installation steps are as follows:
the pressing plate assembly 3 is placed in a state that the cover plate 5 is positioned below and the second carrier plate 6 is positioned above;
the pah piece 9 is embedded in the limit groove 7;
printing the ceramic on the pah piece 9 to form a ceramic sheet;
transferring the printed PCB 18 onto the first carrier plate 1, positioning by the positioning pin 17, and fixing by the buckle 2;
covering the first carrier plate 1 fixed with the PCB 18 on the second carrier plate 6 printed with the ceramic plate, and positioning through the positioning column and the positioning hole;
and turning over the combined first carrier plate 1 and the pressing plate assembly 3, and fixing the first carrier plate 1 and the pressing plate assembly by utilizing a fastener 4.
The present invention has been explained by using specific embodiments, and the explanation of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (8)
1. The utility model provides a SMT welding frock carrier which characterized in that includes:
the PCB positioning device comprises a first carrier plate, a second carrier plate and a positioning mechanism, wherein the first carrier plate is provided with a plurality of positioning pins for positioning a PCB and buckles for fixing the PCB;
the pressing plate assembly is fixedly connected with the first carrier plate through a fastening piece and is pressed on the PCB of the first carrier plate in a pressing mode;
the pressure plate assembly comprises a cover plate and a second carrier plate fixedly connected with the cover plate; be equipped with on the second support plate with the relative spacing groove of equipment position on the PCB board including on the apron at least with the relative jump ring round pin in spacing groove, the jump ring round pin is used for will being located the potsherd on the piece pah in the spacing groove is pressed in equipment position on the PCB board.
2. An SMT welding tool carrier according to claim 1, wherein: the spacing groove includes a plurality ofly, is the permutation and arranges in on the second support plate, the spacing groove with piece looks adaptation pah.
3. An SMT welding tool carrier according to claim 1, wherein: each limiting groove is opposite to the two clamp spring pins, and the two clamp spring pins are arranged along the extending direction of the limiting groove.
4. An SMT welding tool carrier according to claim 1, wherein: the periphery of first support plate is equipped with a plurality of first locating holes be equipped with on the apron with first locating hole matched with first locating post.
5. An SMT welding tool carrier according to claim 1, wherein: the first support plate is provided with a plurality of second positioning columns, and the second support plate is provided with second positioning holes matched with the second positioning columns.
6. An SMT welding tool carrier according to claim 1, wherein: a plurality of air holes are uniformly distributed on the first carrier plate, the second carrier plate and the cover plate.
7. An SMT welding tool carrier according to claim 1, wherein: the outer edge of the first carrier plate is provided with a first flanging, the outer edge of the second carrier plate is provided with a second flanging opposite to the first flanging, and the first flanging and the second flanging form a guide rail for chain transmission.
8. An SMT welding tool carrier according to claim 1, wherein: the buckling pieces are U-shaped and connected to the two sides of the cover plate and the first carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021616606.5U CN212727594U (en) | 2020-08-06 | 2020-08-06 | SMT welding tool carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021616606.5U CN212727594U (en) | 2020-08-06 | 2020-08-06 | SMT welding tool carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212727594U true CN212727594U (en) | 2021-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021616606.5U Active CN212727594U (en) | 2020-08-06 | 2020-08-06 | SMT welding tool carrier |
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| Country | Link |
|---|---|
| CN (1) | CN212727594U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305385A (en) * | 2021-05-25 | 2021-08-27 | 中国电子科技集团公司第二十九研究所 | Welding device and welding method based on inter-board vertical interconnection printed board assembly |
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
-
2020
- 2020-08-06 CN CN202021616606.5U patent/CN212727594U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305385A (en) * | 2021-05-25 | 2021-08-27 | 中国电子科技集团公司第二十九研究所 | Welding device and welding method based on inter-board vertical interconnection printed board assembly |
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
| CN116364563B (en) * | 2023-03-17 | 2023-10-24 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
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