JP2526543Y2 - Heat sink structure - Google Patents
Heat sink structureInfo
- Publication number
- JP2526543Y2 JP2526543Y2 JP1989011993U JP1199389U JP2526543Y2 JP 2526543 Y2 JP2526543 Y2 JP 2526543Y2 JP 1989011993 U JP1989011993 U JP 1989011993U JP 1199389 U JP1199389 U JP 1199389U JP 2526543 Y2 JP2526543 Y2 JP 2526543Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- fins
- base plate
- sink structure
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電子機器部品の冷却用ヒートシンク構造に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heat sink structure for cooling electronic device parts.
従来、この種のヒートシンク構造は第４図に示すよう
に、ベース板７とフィン８が一体構造になっており、電
子機器部品９に取り付ける場合には最終形状品を電子機
器部品の表面に密着固定していた。Conventionally, in this type of heat sink structure, as shown in FIG. 4, a base plate 7 and a fin 8 are integrally formed, and when the heat sink structure is mounted on an electronic device component 9, the final shape product is brought into close contact with the surface of the electronic device component. It was fixed.
上述した従来のヒートシンク構造はベース板７とフィ
ン８が一体構造のため、プリント基板上に高密度にヒー
トシンクが付いた電子機器部品９が実装された後にプリ
ント基板表面上の半田付け、改造布線等の作業を実施す
る際に、高密度実装によってプリント基板表面の面積が
狭くなっている以外にさらにヒートシンクのフィン高さ
によってプリント基板面の高さ方向のエリアも束縛され
ることになり、作業ポイントが遠くなり、非常に作業が
しにくくなるという欠点があった。In the above-mentioned conventional heat sink structure, since the base plate 7 and the fins 8 are integrated, the electronic device component 9 having the heat sink with high density is mounted on the printed circuit board, and then the soldering on the surface of the printed circuit board and the modified wiring are performed. When performing work such as, in addition to reducing the area of the printed circuit board surface due to high-density mounting, the area in the height direction of the printed circuit board surface will also be bound by the height of the fins of the heat sink, work There was a drawback that the point became far away and the work became very difficult.
本考案の目的は前記課題を解決したヒートシンク構造
を提供することにある。An object of the present invention is to provide a heat sink structure that solves the above-mentioned problem.
〔課題を解決するための手段〕 本発明のヒートシンク構造は、複数のフィンをベース
板に装着させてなるヒートシンク構造であって、前記ベ
ース板は、前記フィンが装着される複数の溝と、この複
数の溝の各々にバネ構造を有するロック機構とを含み、
前記フィンは、前記ロック機構に引っかかり嵌合するロ
ック嵌合部を含むものである。Means for Solving the Problems The heat sink structure of the present invention is a heat sink structure in which a plurality of fins are mounted on a base plate, wherein the base plate has a plurality of grooves in which the fins are mounted, and A lock mechanism having a spring structure in each of the plurality of grooves,
The fin includes a lock fitting portion that engages with the lock mechanism.
次に本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本考案の一実施例を示す斜視図、第２図，第
３図は第１図のＡ−Ａ′線断面図である。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views taken along the line AA 'of FIG.
第１図，第２図，第３図において、電子機器部品３の
上面にベース板１が密着固定され、ベース板１には溝４
が複数本平行に設けられている。上記溝４にはフィン２
がサイドから装着され、装着完了時には溝４毎に設けら
れたバネ構造を有するロック機構６がフィン２のロック
嵌合部５に嵌合し、フィン２をベース板１に固定する。
又、フィン２を取り外す際には、ロック機構６を解除す
る方向に駆動し、フィン２を装着方向と反対方向にスラ
イドさせることによって、フィン２をベース板１から取
り外すことができる。従って、ヒートシンクが付いた電
子機器部品３をプリント基板上に実装後、プリント基板
表面の半田付け及び改造布線等の作業を実施する際にフ
ィン２をベース板１から上記の動作によって取り外した
後に実施し、作業完了後に再度フィン２をベース板１に
装着する。1, 2, and 3, a base plate 1 is closely fixed to an upper surface of an electronic device component 3, and a groove 4 is formed in the base plate 1.
Are provided in parallel. The groove 4 has a fin 2
Are mounted from the side, and when the mounting is completed, a lock mechanism 6 having a spring structure provided for each groove 4 is fitted into the lock fitting portion 5 of the fin 2, and fixes the fin 2 to the base plate 1.
When the fins 2 are to be removed, the fins 2 can be removed from the base plate 1 by driving the lock mechanism 6 in the releasing direction and sliding the fins 2 in the direction opposite to the mounting direction. Therefore, after the electronic device component 3 with the heat sink is mounted on the printed circuit board, the fins 2 are removed from the base plate 1 by the above-described operation when performing work such as soldering of the printed circuit board surface and modified wiring. After the work is completed, the fins 2 are mounted on the base plate 1 again.
以上説明したように本考案はヒートシンクをベース板
とフィンに分割し、組立て、分解可能な構造にすること
によって、ヒートシンクが付いた電子機器部品がプリン
ト基板上に実装された後にもプリント基板表面の半田付
け及び改造布線等の作業時に、ヒートシンクのフィンを
取り外し、プリント基板表面に近い所で作業ができ、作
業性が向上できる。As described above, the present invention divides the heat sink into a base plate and fins, and assembles and disassembles the heat sink, so that even after the electronic device parts with the heat sink are mounted on the printed circuit board, the surface of the printed circuit board can be removed. At the time of work such as soldering and modified wiring, the fins of the heat sink are removed, and work can be performed at a place close to the surface of the printed circuit board, thereby improving workability.
さらにプレート基板を上下に複数段積層して高密度実
装した場合、ヒートシンクのフィン高さ方向が束縛さ
れ、フィン高さ方向にヒートシンクを抜き取ることは困
難を伴うものであるが、本考案によれば、ヒートシンク
フィン高さ方向とは異なる横方向にヒートシンクを案内
溝に誘導して抜き取ることができ、フィン高さ方向に束
縛されて高密度実装された電子機器部品用のヒートシン
クのフィンを容易に脱着することができる。In addition, when the plate substrate is stacked in a plurality of stages vertically and densely mounted, the fin height direction of the heat sink is restricted, and it is difficult to remove the heat sink in the fin height direction, but according to the present invention, The heat sink can be guided to the guide groove in the lateral direction different from the heat sink fin height direction and can be extracted, and the heat sink fins for electronic equipment components that are bound in the fin height direction and densely mounted can be easily attached and detached. can do.
第１図は本考案の一実施例を示す斜視図、第２図，第３
図は第１図のＡ−Ａ′線断面図、第４図は従来例を示す
斜視図である。 １……ベース板、２……フィン ３……電子機器部品、４……溝 ５……ロック嵌合部、６……ロック機構FIG. 1 is a perspective view showing one embodiment of the present invention, FIG.
FIG. 1 is a sectional view taken along line AA 'of FIG. 1, and FIG. 4 is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1 ... Base plate, 2 ... Fin 3 ... Electronic device parts, 4 ... Groove 5 ... Lock fitting part, 6 ... Lock mechanism
Claims (1)
ヒートシンク構造において、 前記ベース板は、前記フィンが装着される複数の溝と、
この複数の溝の各々にバネ構造を有するロック機構とを
含み、 前記フィンは、前記ロック機構に引っかかり嵌合するロ
ック嵌合部を含むことを特徴とするヒートシンク構造。1. A heat sink structure having a plurality of fins mounted on a base plate, wherein the base plate has a plurality of grooves in which the fins are mounted,
A lock mechanism having a spring structure in each of the plurality of grooves, wherein the fin includes a lock fitting portion that is hooked and fitted to the lock mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011993U JP2526543Y2 (en) | 1989-02-03 | 1989-02-03 | Heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011993U JP2526543Y2 (en) | 1989-02-03 | 1989-02-03 | Heat sink structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104695U JPH02104695U (en) | 1990-08-20 |
| JP2526543Y2 true JP2526543Y2 (en) | 1997-02-19 |
Family
ID=31221037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011993U Expired - Lifetime JP2526543Y2 (en) | 1989-02-03 | 1989-02-03 | Heat sink structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526543Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5117299B2 (en) * | 2008-06-27 | 2013-01-16 | 古河電気工業株式会社 | heatsink |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244344U (en) * | 1988-09-20 | 1990-03-27 |
-
1989
- 1989-02-03 JP JP1989011993U patent/JP2526543Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104695U (en) | 1990-08-20 |
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