JPS61267397A - Guide rail for printed circuit board - Google Patents

Guide rail for printed circuit board

Info

Publication number
JPS61267397A
JPS61267397A JP10819085A JP10819085A JPS61267397A JP S61267397 A JPS61267397 A JP S61267397A JP 10819085 A JP10819085 A JP 10819085A JP 10819085 A JP10819085 A JP 10819085A JP S61267397 A JPS61267397 A JP S61267397A
Authority
JP
Japan
Prior art keywords
guide rail
printed circuit
circuit board
printed board
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10819085A
Other languages
Japanese (ja)
Inventor
宮本 光男
塚口 保
俊夫 森
頭士 鎮夫
哲夫 小方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP10819085A priority Critical patent/JPS61267397A/en
Publication of JPS61267397A publication Critical patent/JPS61267397A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はプリント板のガイドレールの構造に係り、特に
上・下ガイド溝間の精度向上に好適なものに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to the structure of a guide rail for a printed circuit board, and particularly to one suitable for improving the accuracy between upper and lower guide grooves.

〔発明の背景〕[Background of the invention]

従来のプリント板のガイドレール構造は、特開昭58−
33899号公報に記載のように取付板の上にガイドレ
ールが取付けられ、ガイド溝は一定の肉厚を径た上で設
けられていた。したがって、プリント板の上下ガイド溝
間寸法精度を出すために治工具を必要とし、作業性の点
で考慮されていなかった。一方、プリント板が大型化、
高密度実装化されピッチも狭くなったため、板金絞り加
工では不可能となった。
The guide rail structure of the conventional printed board was developed in Japanese Patent Application Laid-open No. 1983-
As described in Japanese Patent No. 33899, a guide rail was attached to the mounting plate, and the guide groove was provided with a constant wall thickness. Therefore, jigs and tools are required to achieve dimensional accuracy between the upper and lower guide grooves of the printed board, and workability has not been taken into consideration. On the other hand, printed boards have become larger,
Due to high-density packaging and narrower pitches, sheet metal drawing is no longer possible.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、プリント板のガイドレールの上・下問
寸法精度をガイドレール取付板側で設定可能とする構造
を提供することにある。
An object of the present invention is to provide a structure in which the upper and lower dimensional accuracy of the guide rail of a printed board can be set on the guide rail mounting plate side.

〔発明の概要〕[Summary of the invention]

電子装置の高密度化されるにしたがって、プリント板の
実装形態も従来の等間隔ピッチでは性能向上が望めない
。したがって、発熱量の少なく部品高さも低いパッケー
ジについてはプリント板の実装ピッチを2分の1にする
必要が生じた。このため従来の板金絞り加工では加工不
可能となり。
As electronic devices become more densely packed, it is no longer possible to improve the performance of printed circuit boards using conventional equidistant pitches. Therefore, for packages with low heat generation and low component height, it has become necessary to reduce the mounting pitch of the printed circuit board by half. For this reason, it cannot be processed using conventional sheet metal drawing processing.

樹脂モールドを採用することとしたが、マザーボートと
パッケージのコネクタかん合精度向上と、高密度実装と
するため上・下ガイドレール間寸法も制限された。さら
に強制空冷のためできるだけ開口部の面積を多くする必
要もあった。
Although we decided to use resin molding, the dimensions between the upper and lower guide rails were also limited in order to improve the connector mating accuracy between the motherboard and the package and to achieve high-density mounting. Furthermore, for forced air cooling, it was necessary to increase the area of the opening as much as possible.

これらの理由により、従来の実装スペース内に収才るこ
とを前提として本発明はなされた。
For these reasons, the present invention was developed with the premise that it would fit within the conventional mounting space.

すなわち、上下ガイド溝間の寸法精度を向上させるため
に、前記ガイドレール取付板と同一面でのガイド溝を設
けたことを特徴とするものである。
That is, in order to improve the dimensional accuracy between the upper and lower guide grooves, the guide groove is provided on the same surface as the guide rail mounting plate.

〔発明の実施例〕[Embodiments of the invention]

以下本発明の一実施例を第1図〜第5図により説明する
。電子部品を実装したプリント板1は、上・下のサポー
ト2に取付けられた上・下のガイドレール4にそって挿
入されるが、このガイドレール間の1寸法は、ある一定
のクリアランスを設けてプリント板1が入り易い構造と
なっている。
An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. A printed board 1 on which electronic components are mounted is inserted along upper and lower guide rails 4 attached to upper and lower supports 2, and a certain distance is provided between the guide rails. It has a structure in which the printed board 1 can be easily inserted.

″サル−820間隔は、側板5の寸法精度により決定さ
れるため精度は非常に良い。ガイドレール4の形状を第
3図〜第5図により説明すると、プリント板1の左右方
向のガイド6およびサポートとの合わせ部面取り7を設
け、スムーズにプリント「 板を挿入可能としている。さらに空冷冷却風を通すため
の冷却風穴8も設け、材質としてはプラスチックが一般
的であるが、導電性プラスチックを使用することも静電
気防止として有効であることはいうまでもない。
``The monkey-820 spacing is determined by the dimensional accuracy of the side plate 5, so the accuracy is very good.The shape of the guide rail 4 is explained with reference to FIGS. 3 to 5. A chamfer 7 is provided at the mating part with the support, allowing the printed board to be inserted smoothly.Furthermore, a cooling air hole 8 is provided to allow cooling air to pass through.The material is generally made of plastic, but conductive plastic is also used. Needless to say, its use is also effective in preventing static electricity.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、従来のプリント板の実装寸法を変える
ことなく、ガイドレールの上・下問の寸法精度を上げる
ことができるので組立精度を向上する効果がある。
According to the present invention, it is possible to improve the dimensional accuracy of the upper and lower parts of the guide rail without changing the mounting dimensions of the conventional printed circuit board, which has the effect of improving the assembly accuracy.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例のプリント板実装の正面図、
第2図は第1図の側面図、第3図は本発明の平面図、第
4図は第3図のA−A断面図、第5図は第3図のB−B
断面図である。第6図は従来のプリント板実装の正面図
、第7図は第6図の側面図である。
FIG. 1 is a front view of printed board mounting according to an embodiment of the present invention;
Fig. 2 is a side view of Fig. 1, Fig. 3 is a plan view of the present invention, Fig. 4 is a sectional view taken along line AA of Fig. 3, and Fig. 5 is a sectional view taken along line B-B of Fig. 3.
FIG. FIG. 6 is a front view of conventional printed board mounting, and FIG. 7 is a side view of FIG. 6.

Claims (1)

【特許請求の範囲】[Claims] 1、電子部品等をとう載したプリント板をマザーボード
にスムーズに装着するためのガイドレールにおいて、上
下ガイド溝間の寸法精度を向上させるために前記ガイド
レール取付板と同一面でのガイド溝を設けたことを特徴
としたプリント板のガイドレール。
1. In a guide rail for smoothly attaching a printed circuit board carrying electronic components, etc. to a motherboard, a guide groove is provided on the same surface as the guide rail mounting plate in order to improve the dimensional accuracy between the upper and lower guide grooves. A printed board guide rail with a unique feature.
JP10819085A 1985-05-22 1985-05-22 Guide rail for printed circuit board Pending JPS61267397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10819085A JPS61267397A (en) 1985-05-22 1985-05-22 Guide rail for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10819085A JPS61267397A (en) 1985-05-22 1985-05-22 Guide rail for printed circuit board

Publications (1)

Publication Number Publication Date
JPS61267397A true JPS61267397A (en) 1986-11-26

Family

ID=14478285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10819085A Pending JPS61267397A (en) 1985-05-22 1985-05-22 Guide rail for printed circuit board

Country Status (1)

Country Link
JP (1) JPS61267397A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696668A (en) * 1994-08-04 1997-12-09 Fujitsu Limited Case unit for housing printed-circuit assemblies

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696668A (en) * 1994-08-04 1997-12-09 Fujitsu Limited Case unit for housing printed-circuit assemblies
US5828556A (en) * 1994-08-04 1998-10-27 Fujitsu Limited Case unit including ring-shaped ribs made of resin as guide rails for housing printed-circuit assemblies

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