JP2524372B2 - Light emitting diode display - Google Patents

Light emitting diode display

Info

Publication number
JP2524372B2
JP2524372B2 JP62322718A JP32271887A JP2524372B2 JP 2524372 B2 JP2524372 B2 JP 2524372B2 JP 62322718 A JP62322718 A JP 62322718A JP 32271887 A JP32271887 A JP 32271887A JP 2524372 B2 JP2524372 B2 JP 2524372B2
Authority
JP
Japan
Prior art keywords
light
light emitting
led
exterior panel
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62322718A
Other languages
Japanese (ja)
Other versions
JPH01165182A (en
Inventor
仁 藤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62322718A priority Critical patent/JP2524372B2/en
Publication of JPH01165182A publication Critical patent/JPH01165182A/en
Application granted granted Critical
Publication of JP2524372B2 publication Critical patent/JP2524372B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F27/00Combined visual and audible advertising or displaying, e.g. for public address
    • G09F27/008Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は発光ダイオード(以下LEDと略称する)の発
光により発光表示を行なう発光ダイオード表示装置(以
下LED表示装置と略称する)に関するものである。
Description: TECHNICAL FIELD The present invention relates to a light emitting diode display device (hereinafter abbreviated as LED display device) which performs light emission display by light emission of a light emitting diode (hereinafter abbreviated as LED). .

[従来の技術] 従来のLED表示装置は通常は市販のLEDランプ、例えば
外部リードを接続したLEDの半導体チップを樹脂からレ
ンズ状に成形したケース中に封入したものを発光色が異
なるものを複数組み合わせてプリント基板上に半田付け
により実装し、LED表示装置の外装パネルに設けた発光
用の窓のそれぞれに対向して配置して構成される。そし
て発光用の窓により画成される発光面の形状、サイズを
任意のものにする場合はLEDランプの発光を前記の窓に
導きその上面が発光面を構成する樹脂からなる言わゆる
LEDレンズがLEDランプと外装パネル間に設けられる。
[Prior Art] Conventional LED display devices are usually commercially available LED lamps, for example, LED semiconductor chips connected to external leads, which are sealed in a lens-shaped case that is enclosed in a case They are combined and mounted on a printed circuit board by soldering, and are arranged so as to face each of the windows for light emission provided on the exterior panel of the LED display device. When the shape and size of the light emitting surface defined by the light emitting window are arbitrary, the light emitted from the LED lamp is guided to the window and the upper surface thereof is made of a resin that constitutes the light emitting surface.
An LED lens is installed between the LED lamp and the exterior panel.

第4図はこのような従来のLED表示装置の一例として
4箇所の発光面を有し、発光面の面積を広くするために
それぞれの発光面に対して2つのLEDランプを設けた例
を示している。
FIG. 4 shows an example of such a conventional LED display device which has four light emitting surfaces and two LED lamps are provided for each light emitting surface in order to increase the area of the light emitting surface. ing.

第4図において符号1はLED表示装置の外装パネルで
あり、樹脂等から形成される。外装パネル1には発光面
を画成する窓(開口部)1aがこの場合4つ並設されてい
る。外装パネル1の内側面にはフック1b,1bが突設され
ており、このフック1b,1bを介してプリント基板2が外
装パネル1と対向して保持されている。
In FIG. 4, reference numeral 1 is an exterior panel of the LED display device, which is made of resin or the like. In this case, the exterior panel 1 is provided with four windows (openings) 1a that define the light emitting surface side by side in this case. Hooks 1b, 1b are provided on the inner surface of the exterior panel 1, and the printed circuit board 2 is held facing the exterior panel 1 via the hooks 1b, 1b.

プリント基板2において外装パネル1の窓1aのそれぞ
れと対向する位置のそれぞれには上述したLEDランプ7
がその外部リード7aをプリント基板2に半田付けして2
つづつ4組実装されている。
The above-mentioned LED lamp 7 is provided at each of the positions on the printed circuit board 2 facing the respective windows 1a of the exterior panel 1.
Solder the external lead 7a to the printed circuit board 2 and
Four sets are implemented one by one.

さらにLEDランプ7上には上述したLEDレンズ4が設け
られる。LEDレンズ4は透明な樹脂から全体を一体成形
されており、それぞれ4組のLEDランプ7の発光を外装
パネル1の窓1aのそれぞれに導き、その上端面がLED表
示装置の発光面を構成する4連のレンズ本体としての凸
部4aを連結した形状に形成されている。そしてLEDレン
ズ4はその両端の下部に設けられた溶着部4b,4bのそれ
ぞれをプリント基板2に溶着してプリント基板2上に固
定される。凸部4aのそれぞれは外装パネル1の窓1aのそ
れぞれに嵌合される。
Further, the LED lens 4 described above is provided on the LED lamp 7. The LED lens 4 is integrally molded from a transparent resin, and guides the light emitted from the four LED lamps 7 to each of the windows 1a of the exterior panel 1, and the upper end surface thereof constitutes the light emitting surface of the LED display device. It is formed in a shape in which convex portions 4a as four lens bodies are connected. Then, the LED lens 4 is fixed on the printed circuit board 2 by welding the welded parts 4b, 4b provided on the lower portions of both ends thereof to the printed circuit board 2. Each of the convex portions 4a is fitted into each of the windows 1a of the exterior panel 1.

このような構造のもとに表示的には2つづつ4組のLE
Dランプ7が選択的に通電されて点灯し、その発光がLED
レンズ4の凸部4aを介し発光面を構成するその上端面に
導かれ、外部から目視される。
Based on this structure, there are four LEs, two for each display.
The D lamp 7 is selectively energized and lit, and its light emission is an LED
It is guided to the upper end surface which constitutes the light emitting surface through the convex portion 4a of the lens 4 and is visually observed from the outside.

[発明が解決しようとする問題点] ところが上述のような従来のLED表示装置では以下の
ような多くの問題点があった。
[Problems to be Solved by the Invention] However, the conventional LED display device as described above has many problems as described below.

即ちまず隣り合う窓1aの発光面の間で互いに発光が漏
れることがあり、その場合LED表示装置の使用者は表示
の判別は誤る恐れがある。
That is, first, light emission may leak between the light emitting surfaces of the windows 1a adjacent to each other, in which case the user of the LED display device may make a mistake in the display determination.

また外観上の問題として一箇所の発光面に対して上記
のように2つあるいはそれ以上のLEDランプ7を使用す
る場合には、1つの発光面内においてLEDランプ間の境
界線8が見えてしまい見苦しい。またこの場合1つの発
光面において各ランプの発色及び光量の微妙な差が出て
しまう。
In addition, as a matter of appearance, when two or more LED lamps 7 are used for one light emitting surface as described above, the boundary line 8 between the LED lamps can be seen in one light emitting surface. It's unsightly. Further, in this case, there is a slight difference in color and light amount of each lamp on one light emitting surface.

次に生産性の問題としてLEDランプ7の数が多くしか
も外部リード7aの強度が弱いためプリント基板2上への
LEDランプ7の実装作業は手間がかかり、LEDランプの高
さ、位置を揃えるのが難しい。そしてLEDランプの高さ
を揃えるため第4図に符号9で示すスペーサ等が必要に
なり、さらに組み立て工数が多くなり、組み立てコスト
が高くついてしまう。
Next, as a problem of productivity, since the number of LED lamps 7 is large and the strength of the external leads 7a is weak,
The mounting work of the LED lamp 7 is troublesome, and it is difficult to align the height and position of the LED lamp. Further, in order to make the heights of the LED lamps uniform, a spacer or the like shown by reference numeral 9 in FIG.

なおこれらの問題を解決する方法として2つのLEDラ
ンプを一体化した特殊使用のランプを使用することも考
えられるが、そのようなランプは高価であるためそれを
用いると製造コストがアップしてしまう。
As a method of solving these problems, it is conceivable to use a special-purpose lamp in which two LED lamps are integrated, but since such a lamp is expensive, using it increases the manufacturing cost. .

[問題点を解決するための手段] このような問題点を解決するため本発明による発光ダ
イオード表示装置においては、発光用の窓を複数並設し
た外装パネルと、該パネルと対向して設けられ前記複数
の真田と対向する位置のそれぞれに発光ダイオードの半
導体チップが実装されたプリント基板と、該基板と前記
外装パネルの間に設けられ前記半導体チップの発光を前
記窓に導くレンズと、隣り合う前記窓どうしの間の遮光
を行なう遮光壁を備え、該遮光壁は前記外装パネルの内
側面に突設され前記レンズを貫通し前記プリント基板に
挿し込まれるように構成された構造を採用した。
[Means for Solving Problems] In order to solve such problems, the light emitting diode display device according to the present invention is provided with an exterior panel having a plurality of windows for light emission arranged side by side, and facing the panel. Adjacent to the printed board on which the semiconductor chip of the light emitting diode is mounted at each of the positions facing the plurality of Sanadas, and a lens provided between the board and the exterior panel to guide the light emitted from the semiconductor chip to the window. A light-blocking wall for blocking light between the windows is provided, and the light-blocking wall is provided so as to project from the inner surface of the exterior panel, penetrates the lens, and is inserted into the printed circuit board.

[作 用] このような構造によれば上記の遮光壁を介して隣り合
う窓どうしの遮光が完全に行なわれる。また1つの発光
面において従来の場合のようにLEDランプのケースの境
界線が目視されるようなことはない。またプリント基板
上への発光ダイオードの半導体チップの実装はIC製造技
術に用いられるワイヤボンディングなどにより自動的に
行なえる。
[Operation] According to such a structure, the adjacent windows are completely shielded from each other through the above-mentioned light shielding wall. In addition, the boundary line of the case of the LED lamp is not visible on one light emitting surface as in the conventional case. Moreover, the mounting of the semiconductor chip of the light emitting diode on the printed circuit board can be automatically performed by wire bonding used in IC manufacturing technology.

[実施例] 以下、図を参照して本発明の実施例の詳細を説明す
る。
[Examples] Hereinafter, details of examples of the present invention will be described with reference to the drawings.

第1図から第3図は本発明の実施例として4つの発光
面を有するLED表示装置の構造を説明するものであり、
第1図はLED表示装置全体の側断面を示し、第2図はプ
リント基板上の構成を示し、第3図は外装パネルの内側
面を示している。但し第3図において第1図中のフック
1b,1bは図示していない。これらの図において先述した
従来例の第4図中と対応する部分には対応する符号が付
してある。
1 to 3 are views for explaining the structure of an LED display device having four light emitting surfaces as an embodiment of the present invention.
FIG. 1 shows a side cross section of the entire LED display device, FIG. 2 shows a configuration on a printed circuit board, and FIG. 3 shows an inner surface of an exterior panel. However, in FIG. 3, the hook in FIG.
1b and 1b are not shown. In these figures, the parts corresponding to those in FIG. 4 of the conventional example described above are designated by the corresponding reference numerals.

第1図から第3図の構造において先ずLED表示装置の
外装パネル1は樹脂から形成され、前述の従来例と同様
にこの場合4つの発光用の窓1aが並設され、内側面には
フック1b,1bが突設されている。そしてフック1b,1bを介
してプリント基板2が外装パネル1と対向して保持され
る。
In the structure shown in FIGS. 1 to 3, first, the exterior panel 1 of the LED display device is made of resin, and in this case, like the above-mentioned conventional example, four windows 1a for light emission are juxtaposed, and hooks are provided on the inner surface. 1b and 1b are projected. The printed circuit board 2 is held facing the exterior panel 1 via the hooks 1b, 1b.

プリント基板2において外装パネル1の窓1aのそれぞ
れと対向する位置のそれぞれには従来例のLEDランプの
代わりにLEDの半導体チップ(以下LEDチップと呼ぶ)3
がこの場合2つづつ4組実装されている。このLEDチッ
プ3はIC制御技術に用いられるワイヤボンディングによ
りプリント基板2上に実装される。また4組のLEDチッ
プ3のそれぞれは発光色(波長)の異なるものを使用す
ることにより、異なる機能表示を明確に行なえる。
Instead of the LED lamp of the conventional example, an LED semiconductor chip (hereinafter referred to as an LED chip) 3 is provided at each of the positions on the printed circuit board 2 that face each of the windows 1a of the exterior panel 1.
In this case, four sets of two are mounted. The LED chip 3 is mounted on the printed circuit board 2 by wire bonding used in IC control technology. Further, each of the four sets of LED chips 3 having different emission colors (wavelengths) can clearly display different functions.

またプリント基板2上でLEDチップ3上にはABS樹脂ま
たはアクリル樹脂等の透明な合成樹脂から成るLEDレン
ズ4が設けられる。LEDレンズ4は4組のLEDチップ3の
それぞれの発光を外装パネル1の窓1aのそれぞれに導き
その上端面が発光面を構成する4つのレンズ本体部分と
しての凸部4aを連結した形状に形成されている。そして
LEDレンズ4は従来例の場合と同様に両端の下部に設け
られた溶着部4b,4bをプリント基板2に溶着してプリン
ト基板上に固定され、凸部4aのそれぞれは外装パネル1
の窓1aのそれぞれに嵌合される。
An LED lens 4 made of a transparent synthetic resin such as ABS resin or acrylic resin is provided on the LED chip 3 on the printed circuit board 2. The LED lens 4 guides the light emitted from each of the four sets of LED chips 3 to each of the windows 1a of the exterior panel 1, and the upper end surface thereof is formed into a shape in which the convex portions 4a as the four lens body portions that constitute the light emitting surface are connected. Has been done. And
The LED lens 4 is fixed to the printed circuit board by welding the welded parts 4b, 4b provided at the lower portions of both ends to the printed circuit board 2 as in the case of the conventional example, and each of the convex parts 4a is provided on the exterior panel 1.
Are fitted in each of the windows 1a.

さらに第2図に示すようにプリント基板2上に各LED
チップ3の駆動電流を導く電流制限用の抵抗5やコネク
タ6等が設けられる。
Further, as shown in FIG. 2, each LED is mounted on the printed circuit board 2.
A current limiting resistor 5 for guiding the drive current of the chip 3 and a connector 6 are provided.

ところで本実施例では特に従来と異なる点として隣り
合う発光用の窓1aどうしの間の遮光を行なう遮光壁1cが
外装パネル1と一体整形されて同パネル1の内側面に突
設される。そして遮光壁1cは4つの窓1aの内の中央の2
つの四方を囲むように設けられ、LEDレンズ4を貫通し
プリント基板2に挿し込まれて隣り合う窓1aどうしの間
で外装パネル1の本体部分からプリント基板2までの間
の全領域を隙間なく遮光するように構成される。
In the present embodiment, a light shielding wall 1c that shields light between adjacent light emitting windows 1a is formed integrally with the exterior panel 1 and protrudes from the inner surface of the exterior panel 1 as a different point from the conventional one. And the light shielding wall 1c is the center 2 of the four windows 1a.
It is provided so as to surround the four sides, penetrates the LED lens 4 and is inserted into the printed circuit board 2, and the entire area between the main body part of the exterior panel 1 and the printed circuit board 2 is not gapped between the adjacent windows 1a. It is configured to block light.

このためにLEDレンズ4において隣り合う凸部4a間の
連結部分には遮光壁1cの隣り合う窓1a側の側板1dのそれ
ぞれを貫通させるための穴4cが形成されている。またプ
リント基板2でも遮光壁1cの側板1dのそれぞれを挿し込
むための穴2aが形成される。
For this reason, in the connecting portion between the adjacent convex portions 4a in the LED lens 4, holes 4c are formed for penetrating each of the side plates 1d on the side of the adjacent windows 1a of the light shielding wall 1c. The printed circuit board 2 also has holes 2a for inserting the side plates 1d of the light shielding wall 1c.

そして遮光壁1cの側板1dの高さは外装パネル1の内側
面からプリント基板2の内側面に突出する高さとされて
おり、さらに側板1dの両端部にはLEDレンズ4の下部を
またぐための切り欠き部1eが形成されている。
The height of the side plate 1d of the light shielding wall 1c is set so as to project from the inner side surface of the exterior panel 1 to the inner side surface of the printed circuit board 2. The cutout portion 1e is formed.

このような構造の遮光壁1cを介して第1図に示すよう
に隣り合う窓1aどうしの間において外装パネル1とプリ
ント基板2の間の上から下までの全領域が遮光される。
Through the light shielding wall 1c having such a structure, as shown in FIG. 1, the entire area between the exterior panel 1 and the printed circuit board 2 from the top to the bottom is shielded between adjacent windows 1a.

このような構造のもとに表示時には2つづつ4組のLE
Dチップ3が選択的に通電されて点灯し、その発光がLED
レンズ4の凸部4aを介して窓1aの発光面、即ち各凸部4a
の上端面に導かれ、外部から目視される。
With this structure, 4 LEs, 2 for each display, are displayed.
The D chip 3 is selectively energized and lit, and its light emission is an LED
Through the convex portion 4a of the lens 4, the light emitting surface of the window 1a, that is, each convex portion 4a
Is guided to the upper end surface of the and visible from the outside.

以上のような本実施例によれば上述のように外装パネ
ル1の発光面を画成する隣り合う窓1aどうしの間で外装
パネル1、プリント基板2間の全領域が遮光壁1cを介し
て隙間なく遮光されるので、隣り合う窓1aどうしの発光
面に互いの発光が漏れることがない。
According to the present embodiment as described above, the entire area between the exterior panel 1 and the printed circuit board 2 between the adjacent windows 1a that define the light emitting surface of the exterior panel 1 via the light shielding wall 1c as described above. Since light is shielded without a gap, mutual light emission does not leak to the light emitting surfaces of adjacent windows 1a.

また前述の従来の場合のように1つの発光面におい
て、複数のLEDランプのケースの間の境界線が見えるよ
うなこともない。また1つの発光面に対して2つのLED
チップ3の発光が従来の場合のようにそれぞれのケース
を介さずにLEDレンズ4のみを介して導かれるので1つ
の発光面における発光、発色がより均一になり、さらに
外観が美しく良好になる。
Further, unlike the above-described conventional case, the boundary line between the cases of the plurality of LED lamps cannot be seen on one light emitting surface. Two LEDs for one light emitting surface
Since the light emission of the chip 3 is guided through only the LED lens 4 without passing through each case as in the conventional case, the light emission and color development on one light emitting surface becomes more uniform, and the appearance becomes more beautiful and good.

なお上記の実施例のようにプリント基板2に対して遮
光壁1cを挿し込まずに当接させるだけではどうしても遮
光壁1cとプリント基板2の間に隙間が生じてしまい、そ
の隙間を介して隣り合う窓1aの発光面にLEDチップ3の
発光が漏れてしまう。そしてLED表示装置を特に薄暗い
部屋で使用した場合にはその漏れた光がはっきりと目視
されてしまう。特に金メッキされたプリント基板2にLE
Dチップ3をワイヤボンディングして実装するとその金
属部分によりプリント基板2の表面が光を反射し易く、
前記のように遮光壁をプリント基板2に当接して遮光を
完全にするためには遮光壁をプリント基板に接着する
か、または遮光壁とプリント基板の隙間にゴムやスポン
ジなどの弾性体を入れるなど他の手段を追加しなければ
ならない。これでは組み立て工数が増えたり部品点数が
増したりしてその分コストが高くついてしまう。
It should be noted that if the light shielding wall 1c is not inserted into the printed circuit board 2 and brought into contact with the printed circuit board 2 as in the above-described embodiment, a gap is inevitably formed between the light shield wall 1c and the printed circuit board 2 and the adjacent space is provided therebetween. The light emission of the LED chip 3 leaks to the light emitting surface of the matching window 1a. And when the LED display device is used especially in a dim room, the leaked light is clearly visible. LE on the gold-plated printed circuit board 2
When the D chip 3 is wire-bonded and mounted, the surface of the printed circuit board 2 easily reflects light due to its metal portion,
As described above, in order to bring the light shielding wall into contact with the printed circuit board 2 to completely shield light, the light shielding wall is adhered to the printed circuit board, or an elastic body such as rubber or sponge is inserted in the gap between the light shielding wall and the printed circuit board. Other means must be added. This increases the number of assembly steps and the number of parts, which increases the cost.

これに対して本実施例では上述のように遮光壁1cをプ
リント基板2に挿し込むことにより安価に実施できる構
造により遮光を完全に行なえる。また本実施例ではLED
チップ3のプリント基板2に対する実装は前述のように
ワイヤボンディングにより自動的な工程で安価に行なえ
る。そして従来必要としていたスペーサなども不要にな
り、全体として部品点数が少なく簡単な工程で組み立て
られ、製造コストを低減することができる。
On the other hand, in the present embodiment, the light shielding wall 1c is inserted into the printed board 2 as described above, so that the light shielding can be completely performed by the structure which can be implemented at a low cost. Also, in this embodiment, the LED
The chip 3 can be mounted on the printed circuit board 2 at low cost by an automatic process by wire bonding as described above. Further, a spacer or the like which has been conventionally required is not necessary, and the number of parts is small as a whole, and the assembly is performed in a simple process, and the manufacturing cost can be reduced.

なお本実施例では1つの発光面に対して2つのLEDチ
ップ3を使用したが、使用個数はもちろん2個に限られ
るものではなく、発光面の面積や形状等に対応して適当
な数を選択するとともにその配置を選択することにより
所望の発光面の明るさ均一さを得ることができる。また
発光面の数も4つに限らないことも勿論である。
In this embodiment, two LED chips 3 are used for one light emitting surface, but the number of used LEDs is not limited to two, and an appropriate number may be selected according to the area and shape of the light emitting surface. By selecting and arranging the arrangement, it is possible to obtain desired brightness uniformity of the light emitting surface. Of course, the number of light emitting surfaces is not limited to four.

またLEDレンズ4は完全に透明に構成すると発光時にL
EDチップ3自体の輝度が高くて見る角度によって発光面
の明るさが変わってしまうことがある。これに対してLE
Dレンズ4の樹脂に拡散材料を混入してLEDレンズ4を半
透明に構成すれば、その発光面全体がより均一に発光、
発色し、さらに外観が美しく良好になる。
If the LED lens 4 is made completely transparent, it will be L when emitting light.
Since the brightness of the ED chip 3 itself is high, the brightness of the light emitting surface may change depending on the viewing angle. On the other hand, LE
If the LED lens 4 is made semitransparent by mixing a diffusion material into the resin of the D lens 4, the entire light emitting surface of the LED lens 4 emits light more uniformly
Color develops, and the appearance is beautiful and good.

[発明の効果] 以上の発明から明らかなように本発明による発光ダイ
オード表示装置においては、発光用の窓を複数並設した
外装パネルと、該パネルと対向して設けられ前記複数の
窓と対向する位置のそれぞれに発光ダイオードの半導体
チップが実装されたプリント基板と、該基板と前記外装
パネルの間に設けられ前記半導体チップの発光を前記窓
に導くレンズと、隣り合う前記窓どうしの間の遮光を行
なう遮光壁を備え、該遮光壁は前記外装パネルの内側面
に突設され前記レンズを貫通し前記プリント基板に挿し
込まれるように構成された構造を採用したので、隣り合
う発光用の窓の発光面への光洩れがなく、発光面の発
光、発色が均一で美しい良好な外観が得られ、また構造
が簡単で部品点数が少なく簡単な工程で組み立てられ、
製造コストを低減できるなどの優れた効果がある。
[Effects of the Invention] As is apparent from the above invention, in the light emitting diode display device according to the present invention, an exterior panel having a plurality of windows for light emission arranged side by side, and a panel provided opposite to the panel and facing the plurality of windows. A printed circuit board on which a semiconductor chip of a light emitting diode is mounted at each position, a lens that is provided between the substrate and the exterior panel and guides light emitted from the semiconductor chip to the window, and between adjacent windows. Since a light shielding wall for shielding light is provided, and the light shielding wall is provided so as to project on the inner surface of the exterior panel and penetrates the lens and is inserted into the printed circuit board, the light shielding wall for adjacent light emission is used. There is no light leakage to the light emitting surface of the window, the light emitting surface emits light and color is uniform, and a beautiful good appearance is obtained.The structure is simple, the number of parts is small, and it is assembled in a simple process.
It has excellent effects such as reduction in manufacturing cost.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の実施例によるLED表示装置の構造を示
す側断面図、第2図は第1中のプリント基板上の構成を
示す斜視図、第3図は第1図中の外装パネルの内側面を
示す斜視図、第4図は従来のLED表示装置の構成を示す
側断面図である。 1……外装パネル、1c……遮光壁 2……プリント基板、3……LEDチップ 4……LEDレンズ、5……抵抗 6……コネクタ
FIG. 1 is a side sectional view showing a structure of an LED display device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a structure on a printed board in FIG. 1, and FIG. 3 is an exterior panel in FIG. FIG. 4 is a perspective view showing the inner side surface of FIG. 4, and FIG. 4 is a side sectional view showing the structure of a conventional LED display device. 1 ... Exterior panel, 1c ... Shading wall 2 ... Printed circuit board, 3 ... LED chip 4 ... LED lens, 5 ... Resistor 6 ... Connector

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】発光用の窓を複数並設した外装パネルと、 該パネルと対向して設けられ前記複数の窓と対向する位
置のそれぞれに発光ダイオードの半導体チップが実装さ
れたプリント基板と、 該基板と前記外装パネルの間に設けられた前記半導体チ
ップの発光を前記窓に導くレンズと、 隣り合う前記窓どうしの間の遮光を行なう遮光壁を備
え、 該遮光壁は前記外装パネルの内側面に突設され前記レン
ズを貫通し前記プリント基板に挿し込まれるように構成
されたことを特徴とする発光ダイオード表示装置。
1. An exterior panel in which a plurality of windows for light emission are arranged in parallel, and a printed board on which a semiconductor chip of a light emitting diode is mounted at a position facing the panel and facing each of the plurality of windows. A lens provided between the substrate and the exterior panel to guide light emitted from the semiconductor chip to the window, and a light-shielding wall for shielding light between adjacent windows, the light-shielding wall being inside the exterior panel A light emitting diode display device characterized in that the light emitting diode display is provided so as to project from a side surface, penetrate the lens, and be inserted into the printed circuit board.
【請求項2】前記遮光壁は前記外装パネルと一体に構成
されたことを特徴とする特許請求の範囲第1項に記載の
発光ダイオード表示装置。
2. The light emitting diode display device according to claim 1, wherein the light shielding wall is formed integrally with the exterior panel.
JP62322718A 1987-12-22 1987-12-22 Light emitting diode display Expired - Fee Related JP2524372B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62322718A JP2524372B2 (en) 1987-12-22 1987-12-22 Light emitting diode display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62322718A JP2524372B2 (en) 1987-12-22 1987-12-22 Light emitting diode display

Publications (2)

Publication Number Publication Date
JPH01165182A JPH01165182A (en) 1989-06-29
JP2524372B2 true JP2524372B2 (en) 1996-08-14

Family

ID=18146848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62322718A Expired - Fee Related JP2524372B2 (en) 1987-12-22 1987-12-22 Light emitting diode display

Country Status (1)

Country Link
JP (1) JP2524372B2 (en)

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* Cited by examiner, † Cited by third party
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DE102005020908A1 (en) 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Lighting device for back lighting of liquid crystal display, has optical unit with radiation emission surface which has convex curved partial region that partially surrounds concave curved partial region in distance to optical axis
JP2008071919A (en) * 2006-09-14 2008-03-27 Sharp Corp Light leakage preventive structure of led and display unit
JP2008096745A (en) * 2006-10-12 2008-04-24 Pioneer Electronic Corp Lens group having several light guide lenses connected
JP4315986B2 (en) 2007-02-08 2009-08-19 富士通株式会社 Electronic device with light emitting diode
CN101645221A (en) * 2009-08-12 2010-02-10 苏州市春和电器有限公司 Display module with induction buttons
US9222645B2 (en) 2010-11-29 2015-12-29 RTC Industries, Incorporated LED lighting assembly and method of lighting for a merchandise display
US11274808B2 (en) 2010-06-17 2022-03-15 Rtc Industries, Inc. LED lighting assembly and method of lighting for a merchandise display
CN103354068A (en) * 2013-07-02 2013-10-16 王鹏 Method for manufacturing LED displayer and LED displayer
TWI506605B (en) * 2014-03-28 2015-11-01 Macroblock Inc Display structure
DE102016109041A1 (en) 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh MODULE FOR A VIDEO WALL
CN107152614A (en) * 2017-07-06 2017-09-12 山东中微光电子有限公司 A kind of LED area light source
WO2020213556A1 (en) * 2019-04-15 2020-10-22 日本精機株式会社 Waterproof mechanism and electronic apparatus

Also Published As

Publication number Publication date
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